CN213305840U - Flexible circuit board of multiply wood - Google Patents
Flexible circuit board of multiply wood Download PDFInfo
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- CN213305840U CN213305840U CN202021756879.XU CN202021756879U CN213305840U CN 213305840 U CN213305840 U CN 213305840U CN 202021756879 U CN202021756879 U CN 202021756879U CN 213305840 U CN213305840 U CN 213305840U
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Abstract
The utility model relates to a multilayer flexible line way board technical field just discloses a flexible line way board of multiply wood, including the polyimide substrate, the upper surface of polyimide substrate bonds and has a polyimide thin layer, the upper surface on polyimide thin layer bonds and has a copper foil circuit layer. This flexible line way board of multiply wood, through increase first organosilicon encapsulating glue layer and second organosilicon encapsulating glue layer in the upper and lower protective layer of multilayer flexible line way board, because the coefficient of heat conductivity of organosilicon encapsulating glue can reach 3.0w/m.K, use when the circuit board is worked for a long time and make, when the heat of production passes through organosilicon encapsulating glue layer, because its heat conductivity makes the heat evenly spread out at organosilicon encapsulating glue layer by the transmission, increase heat radiating area, prevent that certain temperature is too high, the heat transmits to the extexine through organosilicon encapsulating glue layer, the thermal diffusivity and the stability of long-time use of flexible line way board have been improved, and life has also been prolonged simultaneously.
Description
Technical Field
The utility model relates to a multilayer flexible line way board technical field specifically is a flexible line way board of multiply wood.
Background
Flexible circuit boards, also known as "flexible boards," are printed circuits made from flexible, insulating substrates. Flexible circuits provide excellent electrical performance, meet design requirements for smaller and higher density packaging, and also help reduce assembly processes and enhance reliability. The flexible circuit board is the only solution to meet the miniaturization and movement requirements of electronic products. The flexible connector can be freely bent, wound and folded, can bear millions of dynamic bending without damaging the lead, can be randomly arranged according to the space layout requirement, and can be randomly moved and stretched in a three-dimensional space, so that the integration of component assembly and lead connection is realized. The flexible circuit board is divided into a single-sided board, a double-sided board and a multilayer board. The adopted base material is mainly a polyimide copper clad laminate. The material has high heat resistance and good dimensional stability, and is pressed with a covering film with mechanical protection and good electrical insulation performance to form a final product. The surface layer and the inner layer conductor of the double-sided and multi-layer printed circuit board are electrically connected with the inner and outer layer circuits through metallization.
The temperature of the existing multilayer flexible circuit board can be gradually increased in the long-time use process, but the heat conductivity is poor due to the wrapping of the internal protection material layer of the circuit board, the heat dissipation is blocked, the heat dissipation performance of the flexible circuit board is poor, and the stability and the service life of the flexible circuit board in the use process are influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a flexible line way board of multiply wood to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a flexible circuit board of a multilayer board comprises a polyimide substrate, wherein a first polyimide film layer is bonded on the upper surface of the polyimide substrate, a first copper foil circuit layer is bonded on the upper surface of the polyimide film layer, a first organic silicon potting adhesive layer is bonded on the upper surface of the first copper foil circuit layer, a first epoxy resin waterproof coating layer is bonded on the upper surface of the first organic silicon potting adhesive layer, a second polyimide film layer is bonded on the upper surface of the first epoxy resin waterproof coating layer, a third polyimide film layer is bonded on the bottom of the polyimide substrate, a second epoxy resin circuit layer is bonded on the bottom of the third polyimide film layer, a second organic silicon potting adhesive layer is bonded on the bottom of the second copper foil circuit layer, and a second epoxy resin waterproof coating layer is bonded on the bottom of the second organic silicon potting adhesive layer, and a fourth polyimide film layer is bonded at the bottom of the second epoxy resin waterproof coating layer.
Preferably, an adhesive layer is bonded between the polyimide substrate and the first polyimide film layer, and an adhesive layer is also bonded between the polyimide substrate and the second polyimide film layer.
Preferably, a transparent adhesive layer is bonded between the first copper foil circuit layer and the first organic silicon potting adhesive layer.
Preferably, the thickness of the first organic silicon pouring sealant layer and the second organic silicon pouring sealant layer is 120-200 micrometers, the organic silicon pouring sealant has very good performances in the aspects of shock resistance, electrical performance, waterproof performance, high and low temperature resistance, anti-aging performance and the like, the circuit board can be protected in a reinforced mode, meanwhile, the heat conductivity coefficient of the organic silicon pouring sealant can reach 3.0w/m.K, and the heat dissipation performance of the flexible circuit board is improved.
Preferably, the thickness of the first polyimide film layer and the third polyimide film layer is 50-100 micrometers, the thickness of the second polyimide film layer and the fourth polyimide film layer is 100-150 micrometers, and the polyimide film has excellent thermal stability, chemical corrosion resistance and flame retardance, so that the service life of the flexible circuit board is prolonged.
Preferably, the thickness of the first epoxy resin waterproof coating layer and the second epoxy resin waterproof coating layer is 60-110 microns, and the epoxy resin waterproof coating layer has a good waterproof effect and can prevent the influence of moisture on the circuit board.
Compared with the prior art, the utility model provides a flexible line way board of multiply wood. The method has the following beneficial effects:
this flexible line way board of multiply wood, through increase first organosilicon potting adhesive layer and second organosilicon potting adhesive layer in the upper and lower protective layer of multilayer flexible line way board, because the coefficient of heat conductivity of organosilicon potting adhesive can reach 3.0w/m.K, use when the circuit board is long-time working, when the heat of production passes through organosilicon potting adhesive layer, because its heat conductivity makes the heat be shared out at organosilicon potting adhesive layer by the transmission, increase heat radiating area, prevent that certain temperature is too high, the heat transmits to the extexine through organosilicon potting adhesive layer, the thermal diffusivity and the stability of long-time use of multilayer flexible line way board have been improved, and the life has also been prolonged simultaneously.
Drawings
FIG. 1 is a schematic sectional view of the present invention;
FIG. 2 is a schematic diagram of a polyimide substrate structure according to the present invention;
fig. 3 is a schematic view of the lower surface structure of the first copper foil circuit layer of the present invention.
In the figure: the waterproof coating comprises a polyimide substrate 1, a first polyimide film layer 2, a first copper foil circuit layer 3, a first organic silicon encapsulating adhesive layer 4, a first epoxy resin waterproof coating layer 5, a second polyimide film layer 6, a third polyimide film layer 7, a second copper foil circuit layer 8, a second organic silicon encapsulating adhesive layer 9, a second epoxy resin waterproof coating layer 10, a fourth polyimide film layer 11, a transparent adhesive layer 12 and a bonding adhesive layer 13.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a flexible circuit board of a multilayer board comprises a polyimide substrate 1, wherein a first polyimide film layer 2 is bonded on the upper surface of the polyimide substrate 1, a first copper foil circuit layer 3 is bonded on the upper surface of the polyimide film layer 2, a first organic silicon encapsulating adhesive layer 4 is bonded on the upper surface of the first copper foil circuit layer 3, a transparent adhesive layer 12 is bonded between the first copper foil circuit layer 3 and the first organic silicon encapsulating adhesive layer 4, a first epoxy resin waterproof coating layer 5 is bonded on the upper surface of the first organic silicon encapsulating adhesive layer 4, a second polyimide film layer 6 is bonded on the upper surface of the first epoxy resin waterproof coating layer 5, a third polyimide film layer 7 is bonded at the bottom of the polyimide substrate 1, a bonding adhesive layer 13 is bonded between the polyimide substrate 1 and the first polyimide film layer 2, and a bonding adhesive layer is bonded between the polyimide substrate 1 and the second polyimide film layer 6, the bottom of the third polyimide film layer 7 is bonded with a second copper foil circuit layer 8, the bottom of the second copper foil circuit layer 8 is bonded with a second organic silicon potting adhesive layer 9, the thickness of the first organic silicon potting adhesive layer 4 and the second organic silicon potting adhesive layer 9 is 120-200 micrometers, the organic silicon potting adhesive has very good performances in the aspects of shock resistance, electrical property, waterproof property, high and low temperature resistance, anti-aging property and the like, the circuit board can be protected in a reinforced way, meanwhile, the heat conductivity coefficient of the organic silicon potting adhesive can reach 3.0w/m.K, the heat dissipation performance of the flexible circuit board is improved, the bottom of the second organic silicon potting adhesive layer 9 is bonded with a second epoxy resin waterproof coating layer 10, the thickness of the first epoxy resin waterproof coating layer 5 and the second epoxy resin waterproof coating layer 10 is 60-110 micrometers, and the epoxy resin waterproof coating layer has a good waterproof effect, the influence of moisture on a circuit board can be prevented, the bottom of the second epoxy resin waterproof coating layer 10 is bonded with a fourth polyimide film layer 11, the thicknesses of the first polyimide film layer 2 and the third polyimide film layer 7 are 50-100 micrometers, the thicknesses of the second polyimide film layer 6 and the fourth polyimide film layer 11 are 100-150 micrometers, the polyimide films have excellent thermal stability, chemical corrosion resistance and flame retardance, the service life of the flexible circuit board is prolonged, the first organic silicon encapsulating adhesive layer 4 and the second organic silicon encapsulating adhesive layer 9 are added in the upper protective layer and the lower protective layer of the multilayer flexible circuit board, as the heat conductivity coefficient of the organic silicon encapsulating adhesive can reach 3.0w/m.K, when the circuit board works for a long time, and generated heat passes through the organic silicon encapsulating adhesive layer, the heat is transferred and evenly spread on the organic silicon encapsulating adhesive layer due to the heat conductivity, increase heat radiating area, prevent that a certain temperature from too high, the heat passes through organosilicon casting glue layer and transmits to the extexine, has improved the stability of multilayer flexible line way board's thermal diffusivity and long-time use, has also prolonged life simultaneously.
In the actual operation process, when this circuit board is using, through increase first organosilicon encapsulating glue layer 4 and second organosilicon encapsulating glue layer 9 in the upper and lower protective layer of multilayer flexible line way board, because the coefficient of heat conductivity of organosilicon encapsulating glue can reach 3.0w/m.K, use when the circuit board is long-time work, when the heat of production passes through organosilicon encapsulating glue layer, because its heat conductivity makes the heat evenly spread out by the transmission at organosilicon encapsulating glue layer, increase heat radiating area, prevent that certain temperature is too high, the heat transmits to the extexine through organosilicon encapsulating glue layer, the thermal diffusivity and the long-time stability of using of multilayer flexible line way board have been improved, the life has also been prolonged simultaneously.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising", without further limitation, means that the element so defined is not excluded from the group consisting of additional identical elements in the process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A flexible wiring board of multiply wood, includes polyimide substrate (1), its characterized in that: the polyimide substrate is characterized in that a first polyimide thin film layer (2) is bonded on the upper surface of the polyimide substrate (1), a first copper foil circuit layer (3) is bonded on the upper surface of the polyimide thin film layer (2), a first organic silicon encapsulating adhesive layer (4) is bonded on the upper surface of the first copper foil circuit layer (3), a first epoxy resin waterproof coating layer (5) is bonded on the upper surface of the first organic silicon encapsulating adhesive layer (4), a second polyimide thin film layer (6) is bonded on the upper surface of the first epoxy resin waterproof coating layer (5), a third polyimide thin film layer (7) is bonded on the bottom of the polyimide substrate (1), a second copper foil circuit layer (8) is bonded on the bottom of the third polyimide thin film layer (7), a second organic silicon encapsulating adhesive layer (9) is bonded on the bottom of the second copper foil circuit layer (8), and a second epoxy resin waterproof coating layer (10) is bonded to the bottom of the second organic silicon encapsulating adhesive layer (9), and a fourth polyimide film layer (11) is bonded to the bottom of the second epoxy resin waterproof coating layer (10).
2. The multilayer board flexible wiring board according to claim 1, characterized in that: a bonding glue layer (13) is bonded between the polyimide substrate (1) and the first polyimide film layer (2), and a bonding glue layer is also bonded between the polyimide substrate (1) and the second polyimide film layer (6).
3. The multilayer board flexible wiring board according to claim 1, characterized in that: and a transparent adhesive layer (12) is bonded between the first copper foil circuit layer (3) and the first organic silicon potting adhesive layer (4).
4. The multilayer board flexible wiring board according to claim 1, characterized in that: the thickness of the first organic silicon encapsulating adhesive layer (4) and the second organic silicon encapsulating adhesive layer (9) is 120-200 micrometers.
5. The multilayer board flexible wiring board according to claim 1, characterized in that: the thickness of the first polyimide film layer (2) and the third polyimide film layer (7) is 50-100 micrometers, and the thickness of the second polyimide film layer (6) and the fourth polyimide film layer (11) is 100-150 micrometers.
6. The multilayer board flexible wiring board according to claim 1, characterized in that: the thickness of the first epoxy resin waterproof coating layer (5) and the second epoxy resin waterproof coating layer (10) is 60-110 micrometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021756879.XU CN213305840U (en) | 2020-08-20 | 2020-08-20 | Flexible circuit board of multiply wood |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021756879.XU CN213305840U (en) | 2020-08-20 | 2020-08-20 | Flexible circuit board of multiply wood |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213305840U true CN213305840U (en) | 2021-05-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021756879.XU Active CN213305840U (en) | 2020-08-20 | 2020-08-20 | Flexible circuit board of multiply wood |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213305840U (en) |
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2020
- 2020-08-20 CN CN202021756879.XU patent/CN213305840U/en active Active
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