CN201160339Y

CN201160339Y - Screw structure of printed circuit board

Info

Publication number: CN201160339Y
Application number: CNU2008200790255U
Authority: CN
Inventors: 贾继书; 刘再洋; 侯成双
Original assignee: Beijing BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Beijing BOE Optoelectronics Technology Co Ltd
Priority date: 2008-02-28
Filing date: 2008-02-28
Publication date: 2008-12-03
Anticipated expiration: 2018-02-28

Abstract

The utility model relates to a screw hole structure of printing circuit board, which comprises a basic material and a screw hole, a conductive layer is respectively arranged at corresponding positions of the upper surface and the lower surface of the screw hole, the conductive layer is provided with a through-hole penetrating through the basic material, moreover the through-hole is not contacted with the edge of the screw hole, the through-hole is filled with metals. In the screw hole structure of printing circuit board, the conductive layer is plated on the surface of the screw hole, so that the contact area between the surface of the PCB screw hole and the frame GND is added so as to improve conduction performance of frame, thereby avoiding EMI radiation; the conductive layer is provided with the through-hole that penetrates through the PCB basic material and full of metals, so as to improve conductivity of top layer and bottom layer of PCB; simultaneously the inner wall of the screw hole has no metal coating, no metal chips are generated during production, thereby avoiding short-circuiting of components on the PCB.

Description

The printed substrate Screw hole structure

Technical field

The utility model relates to a kind of printed substrate Screw hole structure, belongs to printed substrate and makes the field.

Background technology

Printed substrate (Printed Circuit Board, be called for short: PCB) be widely used in electronic manufacturing field as base components, wherein the screw on the PCB base material is used to connect the top layer and the bottom of printed substrate, ground wire (GROUND with conducting PCB, be called for short: GND) with the ground wire (GROUND of frame, be called for short: GND), therefore, the structure of PCB screw has material impact to the conduction property of PCB.Figure 11 is a PCB screw floor map in the prior art, Figure 12 be among Figure 11 F-F to cutaway view.As Figure 11 and shown in Figure 12, the upper surface of the screw of PCB base material 1 and lower surface (not shown) are the planar structure that is coated with copper layer 5, be coated with metallic copper on the screw inwall 4, in order to the upper surface of conducting screw and the copper layer 5 of lower surface, reaching the purpose of connection PCB top layer and bottom, and then the GND of the GND of conducting PCB and frame.

There is following defective in prior art: the copper layer of the upper surface of PCB screw and lower surface is planar structure, be used for the GND of conducting PCB and the GND of frame, contact point was few when the copper layer of PCB screw was connected with the GND of frame, cause contact area little, thereby make PCB and frame to contact effect bad, make PCB and frame can not carry out good conducting, cause easily electromagnetic interference (ElectromagneticInterference, be called for short: EMI) radiation exceeds standard; The copper facing of PCB screw inwall is easy to generate copper scale in process of production and causes device short circuit on the PCB.

The utility model content

The purpose of this utility model is the defective at prior art, and a kind of printed substrate Screw hole structure is provided, with the conduction property that improves PCB and avoid the PCB device to be short-circuited.

For achieving the above object, the utility model provides a kind of printed substrate Screw hole structure, comprise base material and screw, be respectively arranged with conductive layer on the correspondence position of described screw upper surface and lower surface, described conductive layer is provided with the through hole of penetrating described base material, and described through hole does not contact with the edge of described screw, is full of metal in the described through hole.

Printed substrate Screw hole structure among the utility model embodiment by being coated with conductive layer on the screw surface, increases PCB screw surface and the contact area of the GND of frame, thereby has improved the conduction property of PCB and frame, has avoided the EMI radiation; By penetrating PCB base material being set on conductive layer and being full of the through hole of metal, to improve the conduction property of PCB top layer and bottom; Do not have the coat of metal because of the screw inwall simultaneously, can not produce metal fillings in the production process, be short-circuited thereby avoided PCB to go up device.

Below by drawings and Examples, the technical solution of the utility model is described in further detail.

Description of drawings

Fig. 1 is the floor map of the utility model embodiment one described printed substrate Screw hole structure;

Fig. 2 be among Fig. 1 A-A to cutaway view;

Fig. 3 be among Fig. 1 B-B to cutaway view;

Fig. 4 is the floor map of the utility model embodiment two described printed substrate Screw hole structures;

Fig. 5 is the floor map of the utility model embodiment three described printed substrate Screw hole structures;

Fig. 6 be among Fig. 5 C-C to cutaway view;

Fig. 7 be among Fig. 5 D-D to cutaway view;

Fig. 8 is the floor map of the utility model embodiment four described printed substrate Screw hole structures;

Fig. 9 is the floor map of the utility model embodiment five described printed substrate Screw hole structures;

Figure 10 be among Fig. 9 E-E to cutaway view;

Figure 11 is a PCB screw floor map in the prior art;

Figure 12 be among Figure 11 F-F to cutaway view.

Description of reference numerals

The 1-base material; The 2-bus; The 3-through hole;

4-screw inwall; 5-copper layer; The 6-sheet metal;

7-conducts electricity attachment.

Embodiment

Fig. 1 is the floor map of the utility model embodiment one described printed substrate Screw hole structure, Fig. 2 be among Fig. 1 A-A to cutaway view, Fig. 3 be among Fig. 1 B-B to cutaway view.Shown in Fig. 1,2 and 3, the PCB Screw hole structure comprises base material 1, it is made for macromolecular material, do not have conductivity, base material 1 is provided with screw, this screw cross section is circular, this screw upper surface and lower surface (not shown in figure 1) correspondence position are coated with bus 2, for example can be the tin bus, be shaped as rectangle, its length is that 5mm, width are 0.5mm, and is that the center radially distributes and is arranged on around the screw with the screw, the side edge of one end and screw, screw upper surface and lower surface respectively have eight buss 2 in the present embodiment; Wherein, be provided with the through hole 3 of penetrating base material 1 on four buss 2 of upper surface and four buss 2 of lower surface correspondence position apart from screw 1mm place, its length is 1.5mm, width is 0.5mm, be full of metal in the through hole 3, for example this metal can be tin or copper, does not wherein have the coat of metal on the screw inwall 4.

Fig. 4 is the floor map of the utility model embodiment two described printed substrate Screw hole structures, as shown in Figure 4, present embodiment is respectively eight rectangular buss 2 of upper surface and lower surface (not shown) to be connected by conduction attachment 7 on the basis of embodiment one, the material of conduction attachment 7 can be tin, and conduction attachment 7 can make between the bus 2 of screw upper surface and mutual conduction between the bus 2 of lower surface.Bus 2 is the structure of projection, in the actual fabrication process, it is equal fully that the height of its projection is difficult to reach, when bus 2 contacts with the GND of frame, because the height of its projection is unequal, cause the little bus of rising height 2 not contact with the GND of frame, thereby reduced the contact area of screw surface with the GND of frame, present embodiment connects by conduction attachment 7 by the bus 2 with the screw surface, make the bus 2 that can not directly contact with the GND of frame, GND realization by conduction attachment 7 and frame is electrically connected, thereby has solved the problem because of the conduction property of the little PCB of influence of GND contact area of bus and frame and frame.

Fig. 5 is the floor map of the utility model embodiment three described printed substrate Screw hole structures, Fig. 6 be among Fig. 5 C-C to cutaway view, Fig. 7 be among Fig. 5 D-D to cutaway view.Shown in Fig. 5,6 and 7, the PCB Screw hole structure comprises base material 1, it is made for macromolecular material, does not have conductivity, and base material 1 is provided with screw, this screw cross section is circular, this screw upper surface and lower surface (not shown in figure 1) correspondence position are coated with bus 2, for example can be shaped as annular for the tin bus, be concentric circles with screw and distribute and to be arranged on around the screw, screw upper surface and lower surface respectively have three buss 2 in the present embodiment; Wherein, a bus 2 of bus 2 of upper surface and lower surface correspondence position is provided with the through hole 3 of four penetrating base materials 1, is full of metal in the through hole 3, and for example this metal can be tin or copper, does not wherein have the coat of metal on the screw inwall 4.

Fig. 8 is the floor map of the utility model embodiment four described printed substrate Screw hole structures, as shown in Figure 8, present embodiment is respectively upper surface to be connected by conduction attachment 7 with three of the lower surface (not shown) circular buss 2 on the basis of embodiment three, the material of conduction attachment 7 can be tin, and conduction attachment 7 can make between the bus 2 of screw upper surface and mutual conduction between the bus 2 of lower surface.Bus 2 is the structure of projection, in the actual fabrication process, it is equal fully that the height of its projection is difficult to reach, when bus 2 contacts with the GND of frame, because the height of its projection is unequal, cause the little bus of rising height not contact with the GND of frame, thereby reduced the contact area of screw surface with the GND of frame, present embodiment connects by conduction attachment 7 by the bus 2 with the screw surface, make the bus 2 that can not directly contact with the GND of frame, GND realization by conduction attachment 7 and frame is electrically connected, thereby has solved the problem because of the conduction property of the little PCB of influence of GND contact area of bus and frame and frame.

In above-mentioned four embodiment of the present utility model, can on each bus, through hole be set, also can on the partially conductive bar, through hole be set, the conduction property that through hole can not influence PCB wherein is set on the partially conductive bar, and can save cost.

Fig. 9 is the floor map of the utility model embodiment five described printed substrate Screw hole structures, Figure 10 be among Fig. 9 E-E to cutaway view, as shown in Figures 9 and 10, the PCB Screw hole structure comprises base material 1, it is a macromolecular material, do not have conductivity, base material 1 is provided with screw, this screw cross section is circular, this screw upper surface and lower surface (not shown) correspondence position are coated with sheet metal 6, its material can be tin, is shaped as annular, and is that the center is arranged on around the screw with the screw, the inward flange of the sheet metal 6 of this annular and the edge of screw can contact also and can not contact, the situation of contact only is shown in the present embodiment, is provided with the through hole 3 of penetrating described base material on the sheet metal 6 of the sheet metal 6 of upper surface and lower surface, through hole 3 can be for a plurality of, in the present embodiment four through holes 3, be full of metal in the through hole, for example this metal can be tin or copper, wherein the no coat of metal in the screw inwall 4.

In the technical scheme of the utility model embodiment by be coated with the conductive layer of projection at PCB screw upper surface and lower surface, the GND contact area of PCB screw and frame is increased, improved the conduction property of PCB and frame, reduced the impedance between the GND of the GND of PCB and frame simultaneously, when the device on the PCB is worked, can high-frequency current be led back to power supply by the GND of frame, thereby prevent that the EMI radiation from exceeding standard; By the through hole that is full of metal of penetrating PCB base material is set on conductive layer, make the top layer of PCB and bottom can be good at conducting; Simultaneously,, can not produce metal fillings in the production, be short-circuited thereby avoided PCB to go up device because the screw inwall does not have the coat of metal.

It should be noted that at last: above embodiment only in order to the explanation the technical solution of the utility model, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of each embodiment technical scheme of the utility model.

Claims

1, a kind of printed substrate Screw hole structure, comprise base material and screw, it is characterized in that, be respectively arranged with conductive layer on the correspondence position of described screw upper surface and lower surface, described conductive layer is provided with the through hole of penetrating described base material, and described through hole does not contact with the edge of described screw, is full of metal in the described through hole.

2, printed substrate Screw hole structure according to claim 1 is characterized in that, the cross section of described screw is circular.

3, printed substrate Screw hole structure according to claim 1 is characterized in that, described conductive layer is a bus.

4, printed substrate Screw hole structure according to claim 3 is characterized in that, described bus is a rectangle, and is that the center radially distributes and is arranged on around the described screw end of described bus and the side edge of described screw with described screw.

5, printed substrate Screw hole structure according to claim 4 is characterized in that, the number of described bus is 6 to 12.

6, printed substrate Screw hole structure according to claim 3 is characterized in that, described bus is an annular, is concentric circles with described screw and distributes and to be arranged on around the screw.

7, printed substrate Screw hole structure according to claim 6 is characterized in that, the number that is arranged at the described bus of described screw upper surface and lower surface is respectively 3 to 5.

According to the described printed substrate Screw hole structure of claim 7, it is characterized in that 8, the number of described through hole is 3 to 8 altogether.

9, according to the described printed substrate Screw hole structure of the arbitrary claim of claim 3 to 8, it is characterized in that, connect by the conduction attachment between the described bus.

10, printed substrate Screw hole structure according to claim 1 is characterized in that, described conductive layer is a sheet metal.