CN209882242U - Filtering single board and power quality control equipment - Google Patents

Abstract

The application discloses a filtering single board and electric energy quality treatment equipment, wherein the filtering single board comprises a PCB (printed circuit board) substrate, a first power interface, a second power interface and a first inductor; the first power interface and the second power interface are welded on the first surface of the PCB substrate; the first inductor is welded or installed on the second surface of the PCB substrate; the first power interface and the second power interface are arranged on the edge side of the PCB substrate; or the first power interface and the second power interface are arranged on the edge side of the PCB substrate, and the first inductor is arranged between the first power interface and the second power interface. The filtering single board is composed of a PCB substrate, a first power interface, a second power interface and a first inductor; the device layout on the single board is simple, the cost of the single board is low, and the maintainability is high.

Description

Filtering single board and power quality control equipment

Technical Field

The application relates to the technical field of power electronics, in particular to a filtering single plate and power quality treatment equipment.

Background

In order to improve the power supply quality of a power grid, an active filter and an SVG (Static Var Generator) are widely adopted in a power system as power quality management equipment. The basic principle of the SVG is that a self-commutation bridge circuit is connected in parallel to a power grid through a reactor or directly, and the phase and amplitude of the output voltage at the ac side of the bridge circuit are appropriately adjusted or the current at the ac side is directly controlled, so that the circuit can absorb or emit reactive current meeting the requirements, and the purpose of dynamic reactive compensation is achieved.

The existing electric energy quality treatment equipment usually concentrates power devices (such as capacitors, IGBTs and the like), filtering devices (such as capacitors, inductors, power connecting conductors and the like) and the like on the same single board, so that the devices on the single board are arranged in a staggered mode, the single board has larger volume, and the single board has higher processing and installation cost; in addition, after problems are found in the testing and maintaining processes, the positioning cannot be carried out quickly, the testing and maintaining efficiency of the whole machine is affected, and the testing and maintaining cost of the product is increased.

SUMMERY OF THE UTILITY MODEL

In view of this, an object of the present application is to provide a filtering single board and an electric energy quality management device, so as to solve the problems of the existing electric energy quality management device that devices on the single board are arranged in a staggered manner, the size of the single board is large, and the cost for processing and installing the single board is high.

The technical scheme adopted by the application for solving the technical problems is as follows:

according to an aspect of the present application, a filtering single board is provided, where the filtering single board includes a PCB substrate, a first power interface, a second power interface, and a first inductor;

the first power interface and the second power interface are welded on the first surface of the PCB substrate; the first inductor is welded or installed on the second surface of the PCB substrate;

the first power interface and the second power interface are arranged on the edge side of the PCB substrate; or the first power interface and the second power interface are arranged on the edge side of the PCB substrate, and the first inductor is arranged between the first power interface and the second power interface.

In one embodiment, the first power interface or the second power interface is one of a conductive body and a copper pillar packaged on or in the PCB substrate and mounted or soldered on the PCB substrate.

In one embodiment, the first power interface and the second power interface are divided into a plurality of rows or a column and are welded on the PCB substrate in a staggered manner or coaxially.

In one embodiment, the first inductors are divided into a plurality of rows or a column and are soldered on the PCB substrate in a staggered manner or coaxially.

In one embodiment, the PCB substrate is internally or externally coated with an electrical conductor.

In an embodiment, the filtering single board further includes a second inductor;

the second inductor is welded on the second surface of the PCB substrate and arranged on the edge side of the PCB substrate.

In one embodiment, the filter single board further includes a resistor and a third inductor;

the resistor and the third inductor are both welded on the second surface of the PCB substrate and are arranged on the edge side of the PCB substrate.

In one embodiment, the filter single board further comprises a capacitor;

the capacitor is arranged between the first inductor and the edge side of the PCB substrate, and is divided into a plurality of rows or a column and is welded on the PCB substrate in a staggered or coaxial horizontal mode.

According to another aspect of the present application, there is provided a power quality management device, where the power quality management device includes the above-mentioned filtering board.

The filtering single board and the electric energy quality control device provided by the embodiment of the application are formed by a PCB substrate, a first power interface, a second power interface and a first inductor; the problems of staggered arrangement of devices on the single plates, large single plate volume and high single plate processing and mounting cost of the existing power quality treatment equipment are solved; the device layout on the single board is simple, the cost of the single board is low, and the maintainability is high.

Drawings

Fig. 1 is a front view of a filtering single-board structure according to an embodiment of the present application;

FIG. 2 is a side view of a filtering veneer structure according to an embodiment of the present application;

fig. 3 is a side view of another structure of a single filter plate according to an embodiment of the present application.

The implementation, functional features and advantages of the objectives of the present application will be further explained with reference to the accompanying drawings.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer and clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

First embodiment

As shown in fig. 1 and fig. 2, a first embodiment of the present application provides a filtering single board, where the filtering single board includes a PCB substrate 1, a first power interface 2, a second power interface 3, and a first inductor 4.

The first power interface 2 and the second power interface 3 are welded on the first surface of the PCB substrate 1; the first inductor 4 is welded or mounted on the second surface of the PCB substrate 1;

the first power interface 2 and the second power interface 3 are arranged on the edge side of the PCB substrate 1; or, the first power interface 2 and the second power interface 3 are disposed on an edge side of the PCB substrate 1, and the first inductor 4 is disposed between the first power interface 2 and the second power interface 3.

Illustratively, the first power interface 2 and the second power interface 3 are soldered on the reverse side of the PCB substrate 1; the first inductor 4 is soldered on the front surface of the PCB substrate 1.

In this embodiment, the first power interface 2 or the second power interface 3 is one of a conductor and a copper pillar packaged on or in the PCB substrate and mounted or soldered on the PCB substrate.

In this embodiment, the first power interface 2 and the second power interface 3 are divided into a plurality of rows or a single row, and are soldered on the PCB substrate 1 in a staggered manner or coaxially.

Illustratively, the first power interface 2 and the second power interface 3 are coaxially soldered on the PCB substrate 1 in a row (in a straight line).

In this embodiment, the first inductors 4 are divided into a plurality of rows or a single row, and are soldered on the PCB substrate in a staggered manner or coaxially.

It should be noted that, when the first inductor 4 is divided into multiple rows, one or more of the multiple rows may be disposed between the first power interface 2 and the second power interface 3, and the specific configuration is not limited herein.

In this embodiment, the PCB substrate is an internal or surface-coated conductor.

Referring to fig. 1 again, in an embodiment, the filtering single board further includes a second inductor 6;

the second inductor 6 is soldered to the second surface of the PCB substrate 1 and disposed at an edge side of the PCB substrate 1.

In this embodiment, the second inductors 6 may be separated into a plurality of rows or a single row and soldered on the PCB substrate 1 with a misalignment or coaxially.

Referring to fig. 1 again, in an embodiment, the filter board further includes a resistor 7 and a third inductor 8;

the resistor 7 and the third inductor 8 are both soldered on the second surface of the PCB substrate 1 and disposed on the edge side of the PCB substrate 1.

In this embodiment, the resistors 7 and the third inductors 8 may be divided into a plurality of rows or columns and soldered on the PCB substrate 1 with a misalignment or coaxially.

Referring to fig. 1 again, in an embodiment, the filter board further includes a capacitor 5;

the capacitors 5 are disposed between the first inductor 4 and the edge side of the PCB substrate, and are divided into a plurality of rows or a column and are soldered on the PCB substrate 1 in a staggered manner or in a coaxial horizontal manner.

Referring to fig. 2, in one embodiment, the first power interface 2 and the second power interface 3 are disposed on an edge side of the PCB substrate 1. In this embodiment, the first power interface 2 and the second power interface 3 are disposed on the edge side of the PCB substrate 1 by using a double-layer board and coating copper on the inner or surface thereof, so as to maximally shorten a current-guiding path and reduce the overall cost.

Referring to fig. 3, in another embodiment, the first power interface 2 and the second power interface 3 are disposed on an edge side of the PCB substrate 1, and the first inductor 4 is disposed between the first power interface 2 and the second power interface 3.

It should be noted that, in this embodiment, the first inductor 4 is coaxially soldered on the PCB substrate 1 in 2 rows, wherein one row of the first inductor is disposed between the first power interface 2 and the second power interface 3.

The filtering single board of the embodiment of the application is formed by a PCB substrate, a first power interface, a second power interface and a first inductor; the problems of staggered arrangement of devices on the single plates, large single plate volume and high single plate processing and mounting cost of the existing power quality treatment equipment are solved; the device layout on the single board is simple, the cost of the single board is low, and the maintainability is high.

Second embodiment

A second embodiment of the present application provides a power quality management device, where the power quality management device includes a filtering single board. The filtering board may refer to the first embodiment, which is not described herein.

It should be noted that the power quality management device includes, but is not limited to, an active filter and SVG.

According to the electric energy quality treatment equipment, the filtering single board is composed of the PCB substrate, the first power interface, the second power interface and the first inductor; the problems of staggered arrangement of devices on the single plates, large single plate volume and high single plate processing and mounting cost of the existing power quality treatment equipment are solved; the device layout on the single board is simple, the cost of the single board is low, and the maintainability is high.

The preferred embodiments of the present application have been described above with reference to the accompanying drawings, and are not intended to limit the scope of the claims of the application accordingly. Any modifications, equivalents and improvements which may occur to those skilled in the art without departing from the scope and spirit of the present application are intended to be within the scope of the claims of the present application.

Claims (9)

1. A filtering single board is characterized in that the filtering single board comprises a PCB substrate, a first power interface, a second power interface and a first inductor;

the first power interface and the second power interface are welded on the first surface of the PCB substrate; the first inductor is welded or installed on the second surface of the PCB substrate;

the first power interface and the second power interface are arranged on the edge side of the PCB substrate; or the first power interface and the second power interface are arranged on the edge side of the PCB substrate, and the first inductor is arranged between the first power interface and the second power interface.

2. The filter veneer according to claim 1, wherein the first power interface or the second power interface is one of a conductor and a copper pillar encapsulated on or in the PCB substrate, mounted on or soldered to the PCB substrate.

3. The filter veneer according to claim 1, wherein the first power interface and the second power interface are divided into a plurality of rows or a column, and are soldered on the PCB substrate in a staggered manner or coaxially.

4. The filter veneer according to claim 1, wherein the first inductors are divided into a plurality of rows or a plurality of columns, and are soldered on the PCB substrate in a staggered manner or coaxially.

5. The filtering veneer according to claim 1, wherein the PCB substrate is an internal or surface-coated electrical conductor.

6. The filtering single board according to any one of claims 1 to 5, wherein the filtering single board further includes a second inductor;

the second inductor is welded on the second surface of the PCB substrate and arranged on the edge side of the PCB substrate.

7. The filtering single board according to any one of claims 1 to 5, wherein the filtering single board further includes a resistor and a third inductor;

the resistor and the third inductor are both welded on the second surface of the PCB substrate and are arranged on the edge side of the PCB substrate.

8. The filtering single board according to any one of claims 1 to 5, wherein said filtering single board further comprises a capacitor;

the capacitor is arranged between the first inductor and the edge side of the PCB substrate, and is divided into a plurality of rows or a column and is welded on the PCB substrate in a staggered or coaxial horizontal mode.

9. An electric energy quality governance device, characterized in that the electric energy quality governance device comprises the filtering veneer according to any one of claims 1 to 8.