CN103036221B - Bus capacitance module and power unit - Google Patents
Bus capacitance module and power unit Download PDFInfo
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- CN103036221B CN103036221B CN201210512221.8A CN201210512221A CN103036221B CN 103036221 B CN103036221 B CN 103036221B CN 201210512221 A CN201210512221 A CN 201210512221A CN 103036221 B CN103036221 B CN 103036221B
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Abstract
The invention provides a bus capacitance module and a power unit. The bus capacitance module comprises a busbar, at least one capacitor and at least one bleeder resistor. The busbar is a printed circuit board (PCB). At least one layer of metal foil circuit is laid on the PCB. Each layer of metal foil circuit comprises circuit patterns which mutually insulate. The capacitor is electrically connected with the bleeder resistor through the metal foil circuit. The power unit comprises the bus capacitance module. The bus capacitance module and the power unit provided by the embodiment of the invention can be used for solving the problems that in the prior art, the power unit is too big in size due to the fact that the bus capacitance module is too big in size.
Description
Technical field
The embodiment of the present invention relates to electrical technology, particularly relates to a kind of bus capacitor module and power cell.
Background technology
In electrical technology, power cell, as the core component of high-power frequency conversion equipment, can be completed complete power transfer function, comprise rectification, inversion and frequency conversion etc., meanwhile, can be played the effect of extended power grade by each cascade of power units mode.And bus capacitor module is the main element of power cell, in the circuit topology of power cell internal, need by bus capacitor module composition DC link, and play the effect of energy storage and filtering.
Bus capacitor module generally comprises multiple electric capacity, busbar and multiplely all presses bleeder resistance, connects between each electric capacity by busbar; All press the voltage inequality that bleeder resistance causes because capacitance parameter is incomplete same for preventing two electric capacity of series connection mutually, and the energy of DC bus of releasing when may be used for electricity under power cell.
The structure of busbar is good and bad and all press the volume of the form of bleeder resistance to bus capacitor module to have a significant impact.Current busbar structure, the general multiple layer metal that uses is arranged, and such as copper bar or aluminium are arranged.Each layer metal row connects the heterogeneous networks in the required power cell connected of each electric capacity respectively.Isolate with insulating material between every layer of metal row, such as epoxy plate.All press bleeder resistance generally to adopt wire wound resistor, cement resistor or metalfilmresistor etc., will all press bleeder resistance to be directly installed on busbar in use, or use cable to lead to other positions.
Because metal row itself is thicker, the mode of multiple-layer stacked makes the thickness of busbar at least in a few millimeter.And the device itself of all pressing bleeder resistance to use belongs to bulky type, and can generate heat due to resistance, if be directly installed on busbar, then need away from electric capacity pin when installing, cause the volume of bus capacitor module to increase further; If use cable to be fixed on other positions by all pressing bleeder resistance to draw, then can reduce the integrated level of bus capacitor module, need to increase the cable tray in power cell, the framework complexity of whole power cell can be improved.
Summary of the invention
The embodiment of the present invention provides a kind of bus capacitor module and power cell, with the problem that the bus capacitor module volume solving prior art power cell volume that is excessive and that cause thus is excessive.
First aspect, the embodiment of the present invention provides a kind of bus capacitor module, comprising: busbar, and described busbar is printed circuit board (PCB), and described printed circuit board (PCB) is laid with at least one deck metal-foil circuits, and every layer of metal-foil circuits comprises the circuit pattern of mutually insulated; At least one electric capacity and at least one bleeder resistance, described electric capacity and described bleeder resistance are electrically connected by described metal-foil circuits.
In the first possible implementation of first aspect, the metal-foil circuits of described printed circuit board (PCB) is multilayer, is arranged on the upper surface of printed circuit board (PCB), lower surface and/or inside.
In conjunction with the first possible implementation of first aspect or first aspect, in the implementation that the second is possible, be provided with through hole in the metal-foil circuits of described printed circuit board (PCB), the pin of described electric capacity inserts in described through hole, realizes the electrical connection with described metal-foil circuits.
In conjunction with the implementation that the second of first aspect is possible, in the implementation that the third is possible, also comprise: structural member, for the electric capacity in described bus capacitor module is fixed in power cell.
In conjunction with the third possible implementation of first aspect, in the 4th kind of possible implementation, described structural member comprises: at least one substrate, for being fixedly connected on the wall of power cell; At least one fixture, is fixedly connected with each described electric capacity respectively, and is fixedly connected with on the substrate, for fixed capacity.
In conjunction with the 4th kind of possible implementation of first aspect, in the 5th kind of possible implementation, the quantity of described busbar is polylith, the metal-foil circuits of described busbar is provided with through hole or pad, by screwing togather, welding or connector mode is electrically connected to each other between each piece of described busbar.
In conjunction with the 5th kind of possible implementation of first aspect, in the 6th kind of possible implementation, described bleeder resistance is Chip-R array, is welded in described printed circuit board surface layer metal-foil circuits and is electrically connected with electric capacity.
In conjunction with the 6th kind of possible implementation of first aspect, in the 7th kind of possible implementation, also comprise: divider resistance, be electrically connected with described metal-foil circuits, to arrange or antarafacial is arranged at the coplanar of printed circuit board (PCB) with described electric capacity.
Second aspect, the embodiment of the present invention provides a kind of power cell, comprises rectification module, inversion module or frequency-variable module, and described rectification module, inversion module or frequency-variable module comprise: the bus capacitor module that any embodiment of the present invention provides.
Embodiment of the present invention bus capacitor module and power cell, by using printed circuit board (PCB) as busbar, by the circuit using the metal forming of printed circuit board (PCB) to lay bus capacitor module, and at least one electric capacity and at least one bleeder resistance are connected in the metal forming of printed circuit board (PCB) according to the circuit structure of bus capacitor module, by utilizing the isolation of the dielectric layer of printed circuit board (PCB) realization to circuit network different in bus capacitor module, thus the circuit pattern of mutually insulated by the same layer metal-foil circuits of printed circuit board (PCB), form the circuit of the mutually insulated needed for bus capacitor module, overcome in prior art the defect needing the bus capacitor module volume caused of multiple busbar multi-laminate adduction fill insulant between the layers excessive, thus also overcome the excessive defect of the power cell volume that causes thus.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the plan structure schematic diagram of bus capacitor module embodiments one of the present invention;
Fig. 2 is the main TV structure schematic diagram of bus capacitor module embodiments two of the present invention;
Fig. 3 is the structural representation of bus capacitor module embodiments three of the present invention;
Fig. 4 is the structural representation of power cell embodiment of the present invention.
Embodiment
For making the object of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Fig. 1 is the plan structure schematic diagram of bus capacitor module embodiments one of the present invention, as shown in Figure 1, the bus capacitor module of the present embodiment can comprise: busbar 1, at least one electric capacity 2 and at least one bleeder resistance 3, wherein, busbar 1 is printed circuit board (PCB) (Printed Circuit Board, be called for short: PCB), this PCB is laid with at least one deck metal-foil circuits, and every layer of metal-foil circuits comprises the circuit pattern of mutually insulated; At least one electric capacity 2 is the bus capacitor of power cell, can be arranged on busbar 1 and to be electrically connected with the metal-foil circuits of busbar 1, for stored energy and filtering in the circuit of this bus capacitor module; At least one bleeder resistance 3, can be arranged on busbar 1 and to be electrically connected with the metal-foil circuits of busbar 1, for the electric energy of bus of releasing during electricity under this bus capacitor module.In addition, if there is the electric capacity of series connection mutually in circuit, can design accordingly bleeder resistance 3, such as, adopt Chip-R array to adjust the resistance sizes of bleeder resistance 3, be used for balancing voltage on mutual each electric capacity of connecting, make the voltage in each series capacitance equal.
When specific implementation, can according to the designing requirement of power cell, the index such as maximum bus current, maximum voltage of such as power cell, the circuit of design bus capacitor module, such as need the electric capacity that four groups in parallel mutually, with the power of load power unit, often in group, have three electric capacity of connecting mutually, to share the voltage on bus, and corresponding bleeder resistance.Again according to the circuit fabrication PCB of designed bus capacitor module, this PCB can reserve the pad of through hole and the welding bleeder resistance 3 needing the pin connecting electric capacity 2, so that install electric capacity 2 and bleeder resistance 3.
Herein, due to the characteristic of PCB self, namely, can realize isolating the insulation of different circuit network by the dielectric layer of PCB, and in every layer of metal-foil circuits, can by the composition to metal forming, form the circuit pattern of mutually insulated, so that the connection of the electric capacity needed for realizing and resistance.Therefore can be implemented in the circuit that on one piece of PCB, processing is comparatively complicated, such as, containing multiple electric capacity of complicated connection in series-parallel relation and the circuit of multiple resistance.And if the metal row of use prior art is as busbar, due to metal, row does not comprise dielectric, metal row each point upper conducts electricity mutually, therefore need to use multiple layer metal row, and the mode of fill insulant could form this comparatively complicated circuit between each layer metal row.And, the thickness of the metal forming of PCB is less than the thickness of metal row, the thickness of the insulating medium layer of PCB inside is also less than the dielectric of filling between multiple layer metal row, therefore, use the circuit module that PCB is formed as busbar, must be less than the thickness of the circuit module using metal row to form as busbar.
The bus capacitor module of the present embodiment, by using PCB as busbar, the metal forming of PCB is used to lay the circuit of bus capacitor module, and at least one electric capacity and at least one bleeder resistance are connected in the metal forming of printed circuit board (PCB) according to the circuit structure of bus capacitor module, by utilizing the isolation of the dielectric layer of PCB realization to circuit network different in bus capacitor module, thus the circuit pattern of mutually insulated by the same layer metal-foil circuits of PCB, form the circuit of the mutually insulated needed for bus capacitor module, thus the defect needing the bus capacitor module volume caused of polylith busbar multi-laminate adduction fill insulant between the layers excessive can be overcome in prior art.
In addition, use PCB as busbar, compared to prior art, because impurity is not easily introduced in PCB inside, avoid impurity to the damage of dielectric, thus the reliability of bus capacitor module can be improved; And the dielectric thickness of PCB can control, thus can control the parasitic parameter of busbar better, such as, in circuit, stray inductance is less, and make due to voltage spikes few, current ripples is less, and therefore, the performance of circuit is better, and reliability is higher; And Material Cost and processing cost are also lower; Because one piece of PCB gets final product forming circuit, avoid loaded down with trivial details superposition or cable connection, be therefore more convenient for installing.
The present embodiment is when specific implementation, the size of the bus current required by power cell, the metal-foil circuits of PCB can be set to multilayer, such as 2 layers, 4 layers, 6 layers, 8 layers etc., and the upper surface of printed circuit board (PCB), lower surface and/or inside can be arranged on; Meanwhile, also can according to the current capacity of the size of bus current and metal forming, the thickness of adjustment metal-foil circuits, such as, can select the metal forming of 1 ounce, 2 ounces or 3 ounces.Generally speaking, the metal forming number of plies is more, thickness is larger, and its current capacity is stronger.
Further, in the metal-foil circuits of PCB, can through hole being set, for inserting in through hole by the pin of electric capacity or bleeder resistance, realizing the electrical connection with described metal-foil circuits.
Fig. 2 is the main TV structure schematic diagram of bus capacitor module embodiments two of the present invention, as shown in Figure 2, on the basis of the module embodiments of bus capacitor shown in Fig. 1, the bus capacitor module of the present embodiment can also comprise: structural member 4, for being fixed in power cell by the electric capacity in described bus capacitor module.Particularly, this structural member 4 can comprise: at least one substrate 41, for being fixedly connected on the wall of power cell place rack, and for being supported and fixed on the weight of the electric capacity on this substrate; At least one fixture 42, is fixedly connected with each electric capacity 2 respectively, and is fixedly connected on substrate 41, for fixed capacity 2.
It should be noted that, the embodiment shown in Fig. 1, be the circuit of small-sized electric capacity for electric capacity 2, the intensity of PCB and electric capacity pin is enough to the weight of Support Capacitor, therefore can directly use PCB as the load-bearing carrier of electric capacity; And the present embodiment is the circuit for needing to use large-scale capacitor (electric capacity weight is larger), and the preferred version proposed.
Particularly, fixture 42 can be fixedly connected on substrate 41 by the mode such as welding or screw togather, and the quantity of fixture 42 can be equal to the quantity of electric capacity 2, that is, fix an electric capacity 2 with a fixture 42.
Actual when realizing, the fixing implementation of electric capacity is not limited to this mode shown in the present embodiment, such as, directly can also be fixedly attached to stud on the mounting panel of this bus capacitor module in the bottom of electric capacity, also can according to layout actual in rack, design other fixed form, as long as structurally can fixed capacity the pin keeping each electric capacity is in height consistent, the PCB being unlikely to make to be connected with electric capacity be out of shape impaired.
Further, if the circuit of bus capacitor module is more complicated, required electric capacity or resistance more and when causing being connected to same busbar; Or the structure of certain power cell is special, require the cross section of bus capacitor module to be less than common pcb board and unrestricted to the thickness of bus capacitor module time; And in order to meet other particular/special requirement; The quantity of busbar 1 can be polylith, and the metal-foil circuits of busbar 1 can be provided with through hole or pad, by screwing togather, welding or connector mode is electrically connected to each other between each piece of described busbar.Particularly, can through hole be set, two busbars 1 are connected by screw; Can pad be set, the two ends of cable be welded in respectively on two busbars, to realize connecting; Also can on busbar solder connector, as socket, the two ends of connection cable are inserted respectively on the socket of two busbars, with realize connect.
During specific implementation, the electric capacity 2 in bus capacitor module and bleeder resistance 3 can also be connected to the both sides of each PCB, to save the cross-sectional area of bus capacitor module further.
Further, bleeder resistance 3 can be Chip-R array, can arrange pad with soldering surface mounted resistance on PCB surface, is electrically connected with electric capacity to be connected to by Chip-R in PCB superficial layer metal-foil circuits.Because the volume of Chip-R needs much smaller than metal row in prior art the such as aluminum hull wire resistor, cement resistor, the resistance that metalfilmresistor equal-volume is large that use, and, the two sides of PCB can arrange Chip-R array, thus can reduce the volume of bus capacitor module further.
The present embodiment, by the setting of structural member, realize by the mode of pure machinery, electric capacity being fixed on the rack at power cell place, alleviate the burden of busbar, make to only have electrical connection between busbar and electric capacity, thus the circuit performance of bus capacitor module can be ensured; By the flexible setting of polylith busbar, make the bus capacitor module of the present embodiment can meet requirement and other special space requirements of Various Complex circuit; By using Chip-R array as bleeder resistance, reduce the volume of bus capacitor module further, and Chip-R caloric value is low, thus circuit reliability is high, in addition, Chip-R is with low cost, easy for installation, further reduces Material Cost and the manufacturing cost of bus capacitor module.
Fig. 3 is the structural representation of bus capacitor module embodiments three of the present invention, and as shown in Figure 3, on the basis of the module embodiments of bus capacitor shown in Fig. 2, the bus capacitor module of the present embodiment can also comprise: busbar voltage detects interface 5 and divider resistance 6.Wherein, busbar voltage detects the cable of interface 5 for connection bus voltage detecting; Divider resistance 6 can be electrically connected with metal-foil circuits, can according to circuit design requirements and the space requirement to bus capacitor module, to arrange or antarafacial is arranged at the coplanar of PCB with electric capacity 2.
Power cell, when specific implementation, can comprise busbar voltage testing circuit, detects the voltage on bus for timing, and for judging whether this bus capacitor module and this power cell normally work.And busbar voltage is usually comparatively large, therefore, divider resistance can be used to the voltage on the cable reducing busbar voltage detection.As shown in Figure 3, the mode that can increase through hole or pad on PCB provides busbar voltage to detect interface 5, and can divider resistance 6 be connected on PCB by the mode welded or screw togather, this divider resistance 6 also can according to the anatomical connectivity of physical circuit on the arbitrary correct position on PCB two sides.
The present embodiment, is connected with the metal-foil circuits of PCB by divider resistance, realizes the element in busbar voltage testing circuit to be also integrated in bus capacitor module, adds solution integration degree, is more conducive to the architecture design of whole power cell; By divider resistance being arranged on the both sides of PCB, further reduce the volume of bus capacitor module.
Fig. 4 is the structural representation of power cell embodiment of the present invention, as shown in Figure 4, the power cell of the present embodiment comprises rectification module, inversion module and frequency-variable module, and this rectification module, this inversion module and this frequency-variable module include the bus capacitor module that any embodiment of the present invention provides.
Embodiment illustrated in fig. 4 is a kind of implementation of power cell, and when actual realization, power cell also can comprise the combination of any one or any two of rectification module, inversion module and frequency-variable module.
The operation principle of this power cell is consistent with prior art, owing to have employed the busbar of PCB as bus capacitor module, therefore can effectively reduce volume.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (8)
1. a bus capacitor module, is characterized in that, comprising:
Busbar, described busbar is printed circuit board (PCB), and described printed circuit board (PCB) is laid with at least one deck metal-foil circuits, and every layer of metal-foil circuits comprises the circuit pattern of mutually insulated;
At least one electric capacity and at least one bleeder resistance, described electric capacity and described bleeder resistance are electrically connected by described metal-foil circuits, be provided with through hole in the metal-foil circuits of described printed circuit board (PCB), the pin of described electric capacity inserts in described through hole, realizes the electrical connection with described metal-foil circuits;
Divider resistance, is electrically connected with described metal-foil circuits, the voltage on the cable that described divider resistance detects for reducing busbar voltage.
2. bus capacitor module according to claim 1, is characterized in that:
The metal-foil circuits of described printed circuit board (PCB) is multilayer, is arranged on the upper surface of printed circuit board (PCB), lower surface and/or inside.
3. bus capacitor module according to claim 1 and 2, is characterized in that, also comprise: structural member, for being fixed in power cell by the electric capacity in described bus capacitor module.
4. bus capacitor module according to claim 3, is characterized in that, described structural member comprises:
At least one substrate, for being fixedly connected on the wall of power cell;
At least one fixture, is fixedly connected with each described electric capacity respectively, and is fixedly connected with on the substrate, for fixed capacity.
5. bus capacitor module according to claim 4, is characterized in that:
The quantity of described busbar is polylith, the metal-foil circuits of described busbar is provided with through hole or pad, by screwing togather, welding or connector mode is electrically connected to each other between each piece of described busbar.
6. bus capacitor module according to claim 5, is characterized in that: described bleeder resistance is Chip-R array, is welded in described printed circuit board surface layer metal-foil circuits and is electrically connected with electric capacity.
7. bus capacitor module according to claim 6, is characterized in that:
Described divider resistance and described electric capacity to be arranged or antarafacial is arranged at the coplanar of printed circuit board (PCB).
8. a power cell, comprises at least one in rectification module, inversion module and frequency-variable module, it is characterized in that, described rectification module, inversion module or frequency-variable module comprise: the arbitrary described bus capacitor module of claim 1-8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210512221.8A CN103036221B (en) | 2012-12-04 | 2012-12-04 | Bus capacitance module and power unit |
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| CN201210512221.8A CN103036221B (en) | 2012-12-04 | 2012-12-04 | Bus capacitance module and power unit |
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| CN103036221A CN103036221A (en) | 2013-04-10 |
| CN103036221B true CN103036221B (en) | 2015-07-08 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103277563B (en) * | 2013-06-06 | 2016-08-10 | 贵州师范大学 | A kind of fast opening and closing method of high-speed solenoid valve |
| CN103618306A (en) * | 2013-11-23 | 2014-03-05 | 冶金自动化研究设计院 | Low-voltage servo driver distributed hybrid direct current bus energy storage filter |
| RU169173U1 (en) * | 2016-05-04 | 2017-03-09 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Рязанский государственный радиотехнический университет" | Frequency-dependent inductive-resistive element based on composite conductors for protection against surge surges and high-frequency interference |
| CN110492758A (en) * | 2019-09-26 | 2019-11-22 | 苏州英威腾电力电子有限公司 | A kind of high-voltage power unit and high-voltage frequency converter |
| CN112701878B (en) * | 2020-12-08 | 2022-07-08 | 日立电梯（中国）有限公司 | Bus capacitor structure and elevator frequency converter |
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| CN1176571A (en) * | 1993-06-25 | 1998-03-18 | 富士电机株式会社 | Multilayer metallized printing plate and its forming module |
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| CN202135072U (en) * | 2011-08-05 | 2012-02-01 | 南京国睿新能电子有限公司 | Inverted power supply main circuit unit device with module parallelly connected |
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| JPH077994A (en) * | 1993-06-17 | 1995-01-10 | Matsushita Electric Ind Co Ltd | Controlling device for driving servomotor |
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| CN1176571A (en) * | 1993-06-25 | 1998-03-18 | 富士电机株式会社 | Multilayer metallized printing plate and its forming module |
| CN101248498A (en) * | 2005-07-25 | 2008-08-20 | 伦策驱动系统有限公司 | Holding device for encased high-protective capacitors |
| CN201536261U (en) * | 2009-06-02 | 2010-07-28 | 深圳市禾望电气有限公司 | Electrolytic capacitors voltage-sharing discharge circuit of power-supply device with high-power and high voltage bus bar |
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Effective date of registration: 20211117 Address after: 518043 No. 01, 39th floor, building a, antuoshan headquarters building, No. 33, antuoshan Sixth Road, Xiang'an community, Xiangmihu street, Futian District, Shenzhen, Guangdong Province Patentee after: Huawei Digital Energy Technology Co.,Ltd. Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Patentee before: HUAWEI TECHNOLOGIES Co.,Ltd. |