CN103036221A - Bus capacitance module and power unit - Google Patents

Bus capacitance module and power unit Download PDF

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Publication number
CN103036221A
CN103036221A CN2012105122218A CN201210512221A CN103036221A CN 103036221 A CN103036221 A CN 103036221A CN 2012105122218 A CN2012105122218 A CN 2012105122218A CN 201210512221 A CN201210512221 A CN 201210512221A CN 103036221 A CN103036221 A CN 103036221A
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China
Prior art keywords
bus capacitor
capacitor module
pcb
metal
electric capacity
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Granted
Application number
CN2012105122218A
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Chinese (zh)
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CN103036221B (en
Inventor
王豫川
姚凯
耿晓静
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Huawei Digital Energy Technology Co.,Ltd.
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Huawei Technologies Co Ltd
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Priority to CN201210512221.8A priority Critical patent/CN103036221B/en
Publication of CN103036221A publication Critical patent/CN103036221A/en
Application granted granted Critical
Publication of CN103036221B publication Critical patent/CN103036221B/en
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Abstract

The invention provides a bus capacitance module and a power unit. The bus capacitance module comprises a busbar, at least one capacitor and at least one bleeder resistor. The busbar is a printed circuit board (PCB). At least one layer of metal foil circuit is laid on the PCB. Each layer of metal foil circuit comprises circuit patterns which mutually insulate. The capacitor is electrically connected with the bleeder resistor through the metal foil circuit. The power unit comprises the bus capacitance module. The bus capacitance module and the power unit provided by the embodiment of the invention can be used for solving the problems that in the prior art, the power unit is too big in size due to the fact that the bus capacitance module is too big in size.

Description

Bus capacitor module and power cell
Technical field
The embodiment of the invention relates to electrical technology, relates in particular to a kind of bus capacitor module and power cell.
Background technology
In electrical technology, power cell can be finished complete power transfer function as the core component of high-power frequency conversion equipment, comprises rectification, inversion and frequency conversion etc., simultaneously, can play by each cascade of power units mode the effect of extended power grade.And the bus capacitor module is the main element of power cell, in the circuit topology of power cell inside, need to be by bus capacitor module composition DC link, and play the effect of energy storage and filtering.
The bus capacitor module generally comprises a plurality of electric capacity, busbar and a plurality of bleeder resistance of all pressing, and can connect by busbar between each electric capacity; All press bleeder resistance to be used to prevent two electric capacity of mutually series connection because the incomplete same voltage that causes of capacitance parameter is uneven, and the energy of the dc bus of releasing can be used under power cell electricity the time.
The good and bad form with all pressing bleeder resistance of the structure of busbar has a significant impact the volume of bus capacitor module.Present busbar structure, normal operation multiple layer metal row, for example copper bar or aluminium row.Each layer metal arranged the heterogeneous networks in the power cell that connects respectively the required connection of each electric capacity.Isolate with insulating material between every layer of metal row, for example epoxy plate.All press bleeder resistance generally to adopt wire wound resistor, cement resistor or metalfilmresistor etc., will all press in use bleeder resistance to be directly installed on the busbar, perhaps use cable to lead to other positions.
Because metal row itself is thicker, the mode of multiple-layer stacked so that the thickness of busbar at least in several millimeter.And all press the employed device of bleeder resistance itself to belong to bulky type, and because resistance can generate heat, if be directly installed on the busbar, need to away from the electric capacity pin, cause the volume of bus capacitor module further to increase when then installing; Be fixed on other positions, then can reduce the integrated level of bus capacitor module if use cable all to press bleeder resistance to draw, need to increase the cable tray in the power cell, can improve the framework complexity of whole power cell.
Summary of the invention
The embodiment of the invention provides a kind of bus capacitor module and power cell, and the power cell volume excessive problem that thus cause excessive with the bus capacitor module volume that solves prior art.
First aspect, the embodiment of the invention provide a kind of bus capacitor module, comprising: busbar, described busbar are printed circuit board (PCB), and described printed circuit board (PCB) is laid with at least one deck metal-foil circuits, and every layer of metal-foil circuits comprises the circuit pattern of mutually insulated; At least one electric capacity and at least one bleeder resistance, described electric capacity and described bleeder resistance are electrically connected by described metal-foil circuits.
In the possible implementation of the first of first aspect, the metal-foil circuits of described printed circuit board (PCB) is multilayer, is arranged on upper surface, lower surface and/or the inside of printed circuit board (PCB).
In conjunction with the possible implementation of the first of first aspect or first aspect, in the possible implementation of the second, be provided with through hole in the metal-foil circuits of described printed circuit board (PCB), the pin of described electric capacity inserts in the described through hole, and realization is electrically connected with described metal-foil circuits.
In conjunction with the possible implementation of the second of first aspect, in the third possible implementation, also comprise: structural member is used for the electric capacity of described bus capacitor module is fixed in the power cell.
In conjunction with the third possible implementation of first aspect, in the 4th kind of possible implementation, described structural member comprises: at least one substrate, for the wall that is fixedly connected on power cell; At least one anchor clamps is fixedly connected with each described electric capacity respectively, and is fixedly connected on the described substrate, is used for fixed capacity.
The 4th kind of possible implementation in conjunction with first aspect, in the 5th kind of possible implementation, the quantity of described busbar is polylith, is provided with through hole or pad on the metal-foil circuits of described busbar, between the described busbar of each piece by screw togather, welding or connector mode be electrically connected mutually.
In conjunction with the 5th kind of possible implementation of first aspect, in the 6th kind of possible implementation, described bleeder resistance is the Chip-R array, is welded on the described printed circuit board surface layer metal-foil circuits to be electrically connected with electric capacity.
The 6th kind of possible implementation in conjunction with first aspect in the 7th kind of possible implementation, also comprises: divider resistance is electrically connected with described metal-foil circuits, with coplanar setting or the antarafacial setting of described electric capacity at printed circuit board (PCB).
Second aspect, the embodiment of the invention provide a kind of power cell, comprise rectification module, inversion module or frequency-variable module, and described rectification module, inversion module or frequency-variable module comprise: the bus capacitor module that any embodiment of the present invention provides.
Embodiment of the invention bus capacitor module and power cell, by using printed circuit board (PCB) as busbar, lay the circuit of bus capacitor module by the metal forming of using printed circuit board (PCB), and at least one electric capacity and at least one bleeder resistance circuit structure according to the bus capacitor module is connected on the metal forming of printed circuit board (PCB), realize isolation to different circuit networks in the bus capacitor module by the dielectric layer that utilizes printed circuit board (PCB), thereby the circuit pattern with the mutually insulated of the same layer metal-foil circuits of printed circuit board (PCB), consist of the circuit of the required mutually insulated of bus capacitor module, overcome need a plurality of busbar multiple-layer stackeds in the prior art and between each layer the excessive defective of bus capacitor module volume that causes of fill insulant, thereby also overcome the excessive defective of power cell volume that causes thus.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, the below will do one to the accompanying drawing of required use in embodiment or the description of the Prior Art and introduce simply, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the plan structure schematic diagram of bus capacitor module embodiment one of the present invention;
Fig. 2 is the main TV structure schematic diagram of bus capacitor module embodiment two of the present invention;
Fig. 3 is the structural representation of bus capacitor module embodiment three of the present invention;
Fig. 4 is the structural representation of power cell embodiment of the present invention.
Embodiment
For the purpose, technical scheme and the advantage that make the embodiment of the invention clearer, below in conjunction with the accompanying drawing in the embodiment of the invention, technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
Fig. 1 is the plan structure schematic diagram of bus capacitor module embodiment one of the present invention, as shown in Figure 1, the bus capacitor module of present embodiment can comprise: busbar 1, at least one electric capacity 2 and at least one bleeder resistance 3, wherein, busbar 1 is printed circuit board (PCB) (Printed Circuit Board, be called for short: PCB), this PCB is laid with at least one deck metal-foil circuits, and every layer of metal-foil circuits comprises the circuit pattern of mutually insulated; At least one electric capacity 2 is the bus capacitor of power cell, can be installed on the busbar 1 and with the metal-foil circuits of busbar 1 to be electrically connected, and is used for circuit stored energy and filtering in this bus capacitor module; At least one bleeder resistance 3 can be installed on the busbar 1 and with the metal-foil circuits of busbar 1 and be electrically connected the electric energy of the bus of releasing during for electricity under this bus capacitor module.In addition, if the electric capacity of mutual series connection is arranged in the circuit, can design accordingly bleeder resistance 3, for example adopt the Chip-R array to adjust the resistance sizes of bleeder resistance 3, be used for mutually voltage on each electric capacity of series connection of balance, the voltage on each series capacitance is equated.
When specific implementation, can be according to the designing requirement of power cell, such as indexs such as the maximum bus current of power cell, maximum voltages, the circuit of design bus capacitor module, for example need four groups of mutually electric capacity in parallel, with the power of load power unit, three mutually electric capacity of series connection are arranged in every group, sharing the voltage on the bus, and corresponding bleeder resistance.According to the circuit fabrication PCB of designed bus capacitor module, can reserve the through hole of the pin that needs connection electric capacity 2 and the pad of welding bleeder resistance 3 on this PCB, so that electric capacity 2 and bleeder resistance 3 are installed again.
Herein, because the characteristic of PCB self, namely, can realize the insulation of different circuit networks is isolated by the dielectric layer of PCB, and in every layer of metal-foil circuits, can be by the composition to metal forming, form the circuit pattern of mutually insulated, be connected connection with resistance in order to realize required electric capacity.Therefore can be implemented in the comparatively complicated circuit of the upper processing of a PCB, for example contain a plurality of electric capacity of complicated connection in series-parallel relation and the circuit of a plurality of resistance.And if the metal row of use prior art is as busbar, because metal row does not comprise dielectric, upper each point of metal row is to conduct electricity mutually, therefore needs to use multiple layer metal row, and the mode of fill insulant could consist of this comparatively complicated circuit between each layer metal arranged.And, the thickness of the metal forming of PCB is less than metal row's thickness, the thickness of the insulating medium layer of PCB inside is also less than the dielectric of filling between the multiple layer metal row, therefore, the circuit module that uses PCB to consist of as busbar must be less as the thickness of the circuit module of busbar formation than using metal row.
The bus capacitor module of present embodiment, by using PCB as busbar, use the circuit of the metal forming laying bus capacitor module of PCB, and at least one electric capacity and at least one bleeder resistance circuit structure according to the bus capacitor module is connected on the metal forming of printed circuit board (PCB), realize isolation to different circuit networks in the bus capacitor module by the dielectric layer that utilizes PCB, thereby the circuit pattern with the mutually insulated of the same layer metal-foil circuits of PCB, consist of the circuit of the required mutually insulated of bus capacitor module, need polylith busbar multiple-layer stacked in the prior art and the excessive defective of bus capacitor module volume that causes of fill insulant between each layer thereby can overcome.
In addition, use PCB as busbar, than prior art, because the inner introducing impurity that is difficult for of PCB is avoided impurity to the damage of dielectric, thereby can be improved the reliability of bus capacitor module; And the dielectric thickness of PCB can be controlled, thereby can control better the parasitic parameter of busbar, and for example stray inductance is less in the circuit, makes due to voltage spikes few, and current ripples is less, and therefore, the performance of circuit is better, and reliability is higher; And Material Cost and processing cost are also lower; Because a PCB gets final product forming circuit, avoided loaded down with trivial details stack or cable to connect, therefore be more convenient for installing.
Present embodiment is when specific implementation, size according to the desired bus current of power cell, metal-foil circuits that can PCB is set to multilayer, such as 2 layers, 4 layers, 6 layers, 8 layers etc., and can be arranged on upper surface, lower surface and/or the inside of printed circuit board (PCB); Simultaneously, also can adjust the thickness of metal-foil circuits according to the current capacity of size and the metal forming of bus current, for example can select the metal forming of 1 ounce, 2 ounces or 3 ounces.Generally speaking, the metal forming number of plies is more, thickness is larger, and its current capacity is stronger.
Further, in the metal-foil circuits of PCB through hole can be set, be used for the pin of electric capacity or bleeder resistance is inserted through hole, realization is electrically connected with described metal-foil circuits.
Fig. 2 is the main TV structure schematic diagram of bus capacitor module embodiment two of the present invention, as shown in Figure 2, on the basis of bus capacitor module embodiment shown in Figure 1, the bus capacitor module of present embodiment can also comprise: structural member 4 is used for the electric capacity of described bus capacitor module is fixed in the power cell.Particularly, this structural member 4 can comprise: at least one substrate 41 is used for being fixedly connected on the wall of power cell place rack, and is used for being supported and fixed on the weight of the electric capacity on this substrate; At least one anchor clamps 42 is fixedly connected with each electric capacity 2 respectively, and is fixedly connected on the substrate 41, is used for fixed capacity 2.
Need to prove, at embodiment shown in Figure 1, be to be the circuit of small-sized electric capacity for electric capacity 2, and the intensity of PCB and electric capacity pin is enough to the weight of Support Capacitor, therefore can directly use PCB as the load-bearing carrier of electric capacity; And present embodiment is the circuit that uses large-scale capacitor (electric capacity weight is larger) for needs, and the preferred version that proposes.
Particularly, anchor clamps 42 can be fixedly connected on the substrate 41 by welding or the mode such as screw togather, and the quantity of anchor clamps 42 can be equal to the quantity of electric capacity 2,, fixes an electric capacity 2 with anchor clamps 42 that is.
During actual the realization, the fixedly implementation of electric capacity is not limited to this mode shown in the present embodiment, for example, can also directly be fixedly attached on the mounting panel of this bus capacitor module with double-screw bolt in the bottom of electric capacity, also can be according to layout actual in the rack, design other fixed form, as long as structurally can fixed capacity and keep the pin of each electric capacity in height consistent, be unlikely to make the PCB that is connected with electric capacity to be out of shape impaired getting final product.
Further, if the circuit of bus capacitor module is more complicated, needed electric capacity or resistance are more and when causing being connected to same busbar; Perhaps the structure of certain power cell is special, when requiring the cross section of bus capacitor module unrestricted to the thickness of bus capacitor module less than common pcb board; And in order to satisfy other specific (special) requirements; The quantity of busbar 1 can be polylith, can be provided with through hole or pad on the metal-foil circuits of busbar 1, between the described busbar of each piece by screw togather, welding or connector mode be electrically connected mutually.Particularly, through hole can be set, two busbars 1 are connected by screw; Pad can be set, the two ends of cable are welded in respectively on two busbars, connect realizing; Also can be on busbar solder connector, as socket, the two ends of connection cable are inserted respectively on the socket of two busbars, connect realizing.
During specific implementation, the electric capacity 2 in the bus capacitor module and bleeder resistance 3 can also be connected to the both sides of each PCB, with the cross-sectional area of further saving bus capacitor module.
Further, bleeder resistance 3 can be the Chip-R array, can pad be set with soldering surface mounted resistance on the PCB surface, is electrically connected with electric capacity in order to Chip-R is connected on the PCB superficial layer metal-foil circuits.Because for example aluminum hull wire resistor that the volume of Chip-R metal row in the prior art needs to use, cement resistor, the resistance that the metalfilmresistor equal-volume is large, and, the two sides of PCB can arrange the Chip-R array, thereby can further reduce the volume of bus capacitor module.
Present embodiment, by the setting of structural member, realize with the mode of pure machinery electric capacity being fixed on the rack at power cell place, alleviated the burden of busbar, make between busbar and the electric capacity and only have electrical connection, thereby can guarantee the circuit performance of bus capacitor module; By the flexible setting of polylith busbar, make the bus capacitor module of present embodiment can satisfy requirement and other special space requirements of Various Complex circuit; By using the Chip-R array as bleeder resistance, further reduce the volume of bus capacitor module, and the Chip-R caloric value is low, thereby circuit reliability is high, in addition, Chip-R is with low cost, easy for installation, has further reduced Material Cost and the manufacturing cost of bus capacitor module.
Fig. 3 is the structural representation of bus capacitor module embodiment three of the present invention, and as shown in Figure 3, on the basis of bus capacitor module embodiment shown in Figure 2, the bus capacitor module of present embodiment can also comprise: busbar voltage detects interface 5 and divider resistance 6.Wherein, busbar voltage detects the cable that interface 5 is used for the connection bus voltage detecting; Divider resistance 6 can be electrically connected with metal-foil circuits, can require and to the space requirement of bus capacitor module, with coplanar setting or the antarafacial setting of electric capacity 2 at PCB according to circuit design.
Power cell can comprise the busbar voltage testing circuit when specific implementation, be used for regularly detecting the voltage on the bus, and be used for judging whether this bus capacitor module and this power cell work.And busbar voltage is usually larger, therefore, can reduce voltage on the cable that busbar voltage detects with divider resistance.As shown in Figure 3, can provide busbar voltage to detect interface 5 in the mode of PCB increase through hole or pad, and divider resistance 6 can be connected on the PCB by the mode of welding or screw togather, this divider resistance 6 also can be connected to according to the structure of physical circuit on the arbitrarily correct position on PCB two sides.
Present embodiment is connected with the metal-foil circuits of PCB by divider resistance, realizes the element in the busbar voltage testing circuit also is integrated in the bus capacitor module, has increased the solution integration degree, is more conducive to the architecture design of whole power cell; By divider resistance being arranged on the both sides of PCB, further reduced the volume of bus capacitor module.
Fig. 4 is the structural representation of power cell embodiment of the present invention, as shown in Figure 4, the power cell of present embodiment comprises rectification module, inversion module and frequency-variable module, and this rectification module, this inversion module and this frequency-variable module include the bus capacitor module that any embodiment of the present invention provides.
Embodiment illustrated in fig. 4 is a kind of implementation of power cell, and when reality realized, power cell also can comprise any one or any two combination of rectification module, inversion module and frequency-variable module.
The operation principle of this power cell is consistent with prior art, owing to adopted the busbar of PCB as the bus capacitor module, therefore can effectively reduce volume.
It should be noted that at last: above each embodiment is not intended to limit only in order to technical scheme of the present invention to be described; Although with reference to aforementioned each embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment puts down in writing, and perhaps some or all of technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the scope of various embodiments of the present invention technical scheme.

Claims (9)

1. a bus capacitor module is characterized in that, comprising:
Busbar, described busbar are printed circuit board (PCB), and described printed circuit board (PCB) is laid with at least one deck metal-foil circuits, and every layer of metal-foil circuits comprises the circuit pattern of mutually insulated;
At least one electric capacity and at least one bleeder resistance, described electric capacity and described bleeder resistance are electrically connected by described metal-foil circuits.
2. bus capacitor module according to claim 1 is characterized in that:
The metal-foil circuits of described printed circuit board (PCB) is multilayer, is arranged on upper surface, lower surface and/or the inside of printed circuit board (PCB).
3. bus capacitor module according to claim 1 and 2 is characterized in that:
Be provided with through hole in the metal-foil circuits of described printed circuit board (PCB), the pin of described electric capacity inserts in the described through hole, and realization is electrically connected with described metal-foil circuits.
4. bus capacitor module according to claim 3 is characterized in that, also comprises: structural member is used for the electric capacity of described bus capacitor module is fixed in the power cell.
5. bus capacitor module according to claim 4 is characterized in that, described structural member comprises:
At least one substrate is for the wall that is fixedly connected on power cell;
At least one anchor clamps is fixedly connected with each described electric capacity respectively, and is fixedly connected on the described substrate, is used for fixed capacity.
6. bus capacitor module according to claim 5 is characterized in that:
The quantity of described busbar is polylith, is provided with through hole or pad on the metal-foil circuits of described busbar, between the described busbar of each piece by screw togather, welding or connector mode be electrically connected mutually.
7. bus capacitor module according to claim 6, it is characterized in that: described bleeder resistance is the Chip-R array, is welded on the described printed circuit board surface layer metal-foil circuits to be electrically connected with electric capacity.
8. bus capacitor module according to claim 7 is characterized in that, also comprises:
Divider resistance is electrically connected with described metal-foil circuits, with coplanar setting or the antarafacial setting of described electric capacity at printed circuit board (PCB).
9. a power cell comprises at least one in rectification module, inversion module and the frequency-variable module, it is characterized in that, described rectification module, inversion module or frequency-variable module comprise: the arbitrary described bus capacitor module of claim 1-8.
CN201210512221.8A 2012-12-04 2012-12-04 Bus capacitance module and power unit Active CN103036221B (en)

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CN103036221B CN103036221B (en) 2015-07-08

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103277563A (en) * 2013-06-06 2013-09-04 贵州师范大学 Quick opening and closing method of high-speed electromagnetic switch valve
CN103618306A (en) * 2013-11-23 2014-03-05 冶金自动化研究设计院 Low-voltage servo driver distributed hybrid direct current bus energy storage filter
RU169173U1 (en) * 2016-05-04 2017-03-09 Федеральное государственное бюджетное образовательное учреждение высшего образования "Рязанский государственный радиотехнический университет" Frequency-dependent inductive-resistive element based on composite conductors for protection against surge surges and high-frequency interference
CN112701878A (en) * 2020-12-08 2021-04-23 日立电梯(中国)有限公司 Bus capacitor structure and elevator frequency converter

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JPH077994A (en) * 1993-06-17 1995-01-10 Matsushita Electric Ind Co Ltd Controlling device for driving servomotor
CN1176571A (en) * 1993-06-25 1998-03-18 富士电机株式会社 Multilayer metallized printing plate and its forming module
CN101248498A (en) * 2005-07-25 2008-08-20 伦策驱动系统有限公司 Holding device for encased high-protective capacitors
CN201536261U (en) * 2009-06-02 2010-07-28 深圳市禾望电气有限公司 Electrolytic capacitors voltage-sharing discharge circuit of power-supply device with high-power and high voltage bus bar
CN202135072U (en) * 2011-08-05 2012-02-01 南京国睿新能电子有限公司 Inverted power supply main circuit unit device with module parallelly connected

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077994A (en) * 1993-06-17 1995-01-10 Matsushita Electric Ind Co Ltd Controlling device for driving servomotor
CN1176571A (en) * 1993-06-25 1998-03-18 富士电机株式会社 Multilayer metallized printing plate and its forming module
CN101248498A (en) * 2005-07-25 2008-08-20 伦策驱动系统有限公司 Holding device for encased high-protective capacitors
CN201536261U (en) * 2009-06-02 2010-07-28 深圳市禾望电气有限公司 Electrolytic capacitors voltage-sharing discharge circuit of power-supply device with high-power and high voltage bus bar
CN202135072U (en) * 2011-08-05 2012-02-01 南京国睿新能电子有限公司 Inverted power supply main circuit unit device with module parallelly connected

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103277563A (en) * 2013-06-06 2013-09-04 贵州师范大学 Quick opening and closing method of high-speed electromagnetic switch valve
CN103618306A (en) * 2013-11-23 2014-03-05 冶金自动化研究设计院 Low-voltage servo driver distributed hybrid direct current bus energy storage filter
RU169173U1 (en) * 2016-05-04 2017-03-09 Федеральное государственное бюджетное образовательное учреждение высшего образования "Рязанский государственный радиотехнический университет" Frequency-dependent inductive-resistive element based on composite conductors for protection against surge surges and high-frequency interference
CN112701878A (en) * 2020-12-08 2021-04-23 日立电梯(中国)有限公司 Bus capacitor structure and elevator frequency converter

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