CN210957404U - Electric energy quality control device - Google Patents
Electric energy quality control device Download PDFInfo
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- CN210957404U CN210957404U CN201922064222.0U CN201922064222U CN210957404U CN 210957404 U CN210957404 U CN 210957404U CN 201922064222 U CN201922064222 U CN 201922064222U CN 210957404 U CN210957404 U CN 210957404U
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Abstract
The application discloses an electric energy quality treatment device, which comprises a case, a partition plate and a cooling fan, wherein the partition plate and the cooling fan are arranged in the case; the inner space of the case is divided into an upper space and a lower space by a partition plate; the power board is arranged in the upper space, and the radiator and the cooling fan are arranged in the lower space; the radiator is arranged below the power plate; an air inlet, a first air outlet and a second air outlet are arranged on the panel of the case; the heat radiation fan is fixedly arranged at the air inlet, one part of air flow flowing out of the heat radiation fan flows out through the first air outlet, and the other part of air flow flows into the upper space from the lower space through the air flow channel and flows out from the second air outlet. According to the air-cooling fan, the installation space in the case is divided into an upper layer and a lower layer through the partition plate, and the air channels are automatically distributed by airflow flowing out of the cooling fan through the airflow channel, so that the cooling requirements of the upper space and the lower space are met; the heat dissipation effect is good, and the cost of the whole machine is reduced.
Description
Technical Field
The application relates to the technical field of power electronics, in particular to a device for controlling electric energy quality.
Background
In order to improve the power supply quality of a power grid and stabilize the power grid, an active filter and an SVG (Static Var Generator) are widely used as an electric energy quality management device in a power system. The basic principle of the SVG is that a self-commutation bridge circuit is connected in parallel to a power grid through a reactor or directly, and the phase and amplitude of the output voltage at the ac side of the bridge circuit are appropriately adjusted or the current at the ac side is directly controlled, so that the circuit can absorb or emit reactive current meeting the requirements, and the purpose of dynamic reactive compensation is achieved.
The existing electric energy quality control device has the defects that power components are large in size, heat dissipation is needed, the quantity is large, the layout and the structural design of the components are unreasonable, the power flowing direction inside reactive compensation equipment is complicated, the installation and maintenance performances of a circuit board, a fan, an inductor and the like are poor, the size of the whole machine is large, and the cost is high.
SUMMERY OF THE UTILITY MODEL
In view of this, an object of the present application is to provide an electric energy quality management device to solve the heat dissipation problem of the existing electric energy quality management device.
The technical scheme adopted by the application for solving the technical problems is as follows:
according to one aspect of the application, a power quality management device is provided, which comprises a case, a partition plate and a cooling fan arranged in the case, and a power plate and a radiator arranged on the partition plate;
the inner space of the case is divided into an upper space and a lower space by the partition plate; the power board is arranged in the upper space, and the radiator and the radiating fan are arranged in the lower space; the radiator is arranged below the power plate;
an air inlet is formed in the part, located in the lower space, of the first side panel of the case, a first air outlet is formed in the part, located in the lower space, of the second side panel of the case, and a second air outlet is formed in the part, located in the upper space, of the second side panel of the case; or the part of the front panel of the case, which is positioned in the lower space, is provided with the air inlet, the part of the rear panel of the case, which is positioned in the lower space, is provided with the first air outlet, and the part of the rear panel of the case, which is positioned in the upper space, is provided with the second air outlet; or the part of the rear panel of the case, which is positioned in the lower space, is provided with the air inlet, the part of the front panel of the case, which is positioned in the lower space, is provided with the first air outlet, and the part of the front panel of the case, which is positioned in the upper space, is provided with the second air outlet;
the heat radiation fan is fixed at the air inlet, one part of airflow flowing out of the heat radiation fan flows out through the first air outlet, and the other part of airflow flows into the upper space from the lower space through the airflow channel and flows out from the second air outlet.
According to the electric energy quality control device, the installation space in the case is divided into an upper layer and a lower layer through the partition plate, and the airflow flowing out of the cooling fan realizes automatic distribution of air channels through the airflow channel, so that the cooling requirements of an upper space and a lower space are met; the heat dissipation effect is good, and the cost of the whole machine is reduced.
Drawings
FIG. 1 is a schematic structural diagram of an electric energy quality management device according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a power board and an interface board in the power quality management device according to the embodiment of the present application;
fig. 3 is a schematic diagram of a power plate structure in the power quality management device according to the embodiment of the present application;
fig. 4 is a schematic diagram of an interface plate structure in the power quality management device according to the embodiment of the present application;
fig. 5 is a schematic diagram of a filter plate structure in the power quality management device according to the embodiment of the present application;
fig. 6 is a schematic structural diagram of another filter plate in the power quality control device according to the embodiment of the present application.
The implementation, functional features and advantages of the objectives of the present application will be further explained with reference to the accompanying drawings.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer and clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In the description of the present invention, it is to be understood that the terms "central", "upper" and "lower" are used herein,
The directional or positional relationships indicated by "lower", "front", "rear", "left", "right", etc. are based on the directional or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1-2, an embodiment of the present application provides an electric energy quality management device, which includes a chassis 10, a heat dissipation fan 70, a partition 20 fixed in the chassis 10, a power board 30 mounted on the partition 20, an interface board 40, a filter board 50, a control board 80, a power board 90, and a heat sink 60;
the installation space in the cabinet 10 is divided into an upper space and a lower space by the partition 20; the control board 80 and the power board 90 are disposed between the power board 30 and the interface board 40, the power board 30, the interface board 40, the control board 80, and the power board 90 are disposed in the upper space, and the filter board 50, the heat sink 60, and the heat dissipation fan 70 are disposed in the lower space; the heat sink 60 is disposed below the power board 30, and the filter board 50 is disposed below the interface board 40.
An air inlet is formed in the part, located in the lower space, of the left side panel of the case 10, a first air outlet is formed in the part, located in the lower space, of the right side panel of the case, and a second air outlet is formed in the part, located in the upper space, of the right side panel of the case; the heat dissipation fan 70 is fixedly installed at the air inlet, and a gap is formed between the partition plate 20 and the left side panel of the chassis 10 (the partition plate 20 is not in contact with the left side panel), so that a part of the airflow (shown by an arrow in the figure) flowing out from the heat dissipation fan 70 passes through the heat sink 60 and the filter plate 50, and then flows out through the first air outlet; the other part of the air flows out of the second air outlet after passing through the gap between the partition board 20 and the left panel of the chassis 10, the power board 30 and the interface board 40.
In an example, the partition 20 and the front panel of the chassis 10 may be in non-contact, that is, a gap is formed between the partition 20 and the front panel of the chassis 10, so that a part of the airflow flowing out of the heat dissipation fan 70 passes through the heat sink 60 and the filter plate 50 and then flows out through the first air outlet; the other part of the air flows out of the second air outlet after passing through the gap between the partition board 20 and the front panel of the chassis 10, the power board 30 and the interface board 40.
In an example, the partition 20 and the rear panel of the chassis 10 may be in non-contact, that is, a gap is formed between the partition 20 and the rear panel of the chassis 10, so that a part of the airflow flowing out of the heat dissipation fan 70 passes through the heat sink 60 and the filter plate 50 and then flows out through the first air outlet; the other part of the air flows out of the second air outlet after passing through the gap between the partition board 20 and the rear panel of the chassis 10, the power board 30 and the interface board 40.
In an example, the partition 20 may be in contact with or fixedly connected to the rear panel of the chassis 10, and the partition 20 may be provided with a vent hole, so that a part of the airflow flowing out from the heat dissipation fan 70 passes through the heat sink 60 and the filter plate 50 and then flows out through the first air outlet; the other part of the air flows out of the second air outlet after passing through the vent hole, the power board 30 and the interface board 40.
In the above example, the air is supplied from the left side panel and the air is supplied from the right side panel. Conceivably, in other examples, front panel air inlet and rear panel air outlet can be arranged; air is supplied to the rear panel and air is discharged from the front panel; or the air is fed into the right side panel and is discharged out from the left side panel, and the air conditioner is also feasible. Correspondingly, the vent may be any one or a combination of a gap between the partition 20 and the left side panel of the chassis 10, a gap between the partition 20 and the right side panel of the chassis 10, a gap between the partition 20 and the front panel of the chassis 10, a gap between the partition 20 and the rear panel of the chassis 10, and a vent on the partition 20.
It should be noted that the size of the gap is not limited herein, and the size and position of the vent hole are not limited herein.
As will be understood with reference to fig. 2 and 3, in the present example, the power board 30 includes a first PCB substrate (not shown in the drawings), a first capacitor 31, a power electronic fully-controlled device 32, and a current detection component 33;
the first capacitor 31 and the current detection component 33 are soldered on the first surface of the first PCB substrate, the power electronic fully-controlled device 32 is soldered on the second surface of the first PCB substrate, and the power electronic fully-controlled device 32 is placed on the heat sink 60; wherein a first side of the first PCB substrate faces away from the partition 20 and a second side of the first PCB substrate faces toward the partition 20.
The first capacitor 31 is adjacent to a side panel in the chassis 10, and the current detection component 33 is adjacent to the interface board 40.
The power electronic full-control device 3 includes but is not limited to an Insulated Gate Bipolar Transistor (IGBT) and a Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET).
The current detection component 4 includes but is not limited to a hall, a transformer, and a shunt.
In one example, the power board 30 further includes a power electronics fully-controlled device driver board (not shown in the figures);
the power electronic full-control type device driving board is welded on the first surface of the first PCB substrate and is arranged between the first capacitor 31 and the current detection component 33.
In this example, the orientation of the packaged devices on the interface board 40 is opposite to the orientation of the packaged devices on the filter board 50.
Specifically, as will be understood in conjunction with fig. 2 and 4, the interface board 40 includes a second PCB substrate (not shown in the drawings), a relay 41, a fuse 42, and a conductive port 43;
the relay 41, the fuse 42 and the conductive port 43 are soldered to a first surface of the second PCB substrate; wherein a first side of the second PCB substrate faces away from the partition 20 and a second side of the second PCB substrate faces toward the partition 20.
In this example, the relay 41 is proximate to the power board 30, the fuse 42 is disposed between the relay 41 and the conductive port 43, and the conductive port 43 is proximate to a side panel within the enclosure 10.
As will be understood in conjunction with fig. 5, the filter plate 50 includes a third PCB substrate (not shown), a first inductor 53, a first power interface 54, and a second power interface 55; the third PCB substrate is a double-layer board, and copper is coated inside or on the surface of the third PCB substrate.
The first inductor 53 is welded on the first surface of the PCB substrate; the first power interface 54 and the second power interface 55 are mounted or soldered on the second side of the third PCB substrate; wherein a first face of the third PCB substrate faces away from the partition 20 and a second face of the third PCB substrate faces toward the partition 20;
the first power interface 54 and the second power interface 55 are disposed on an edge side of the PCB substrate, and the first inductor 53 is disposed between the first power interface 54 and the second power interface 55.
Referring to fig. 6, in another example, different from fig. 5, the first power interface 54 and the second power interface 55 are disposed on an edge side of the PCB substrate, and the first inductor 53 is disposed on one side of the first power interface 54 and the second power interface 55.
In this example, the first power interface 54 and the second power interface 55 are disposed on the edge side of the third PCB substrate, so that the diversion path is shortened to the maximum extent, and the overall machine cost is reduced.
In an example, the filter plate 50 further comprises a second inductor 51;
the second inductor 51 is soldered on the first surface of the third PCB substrate and is adjacent to the side panel in the chassis.
In this example, the second inductors 51 may be divided into a plurality of rows or columns and soldered on the third PCB substrate with a misalignment or coaxially.
In one example, the filter plate 50 further includes a second capacitor 52;
the second capacitor 52 is soldered to the first surface of the third PCB substrate and is disposed between the first inductor 53 and the second inductor 51.
In this embodiment, the second capacitors 52 may be divided into a plurality of rows or a single row and soldered on the third PCB substrate in a staggered manner or coaxially and horizontally.
In one example, the filter board further includes a resistor 56;
the resistor 56 is soldered to the first side of the third PCB substrate and is disposed between the second inductor 51 and the second capacitor 52.
In this embodiment, the resistors 56 may be divided into a plurality of rows or columns and soldered on the third PCB substrate in a staggered or coaxial manner.
According to the electric energy quality control device, the installation space in the case is divided into an upper layer and a lower layer through the partition plate, and the airflow flowing out of the cooling fan realizes automatic distribution of air channels through the airflow channel, so that the cooling requirements of an upper space and a lower space are met; the heat dissipation effect is good, and the cost of the whole machine is reduced.
The preferred embodiments of the present application have been described above with reference to the accompanying drawings, and are not intended to limit the scope of the claims of the application accordingly. Any modifications, equivalents and improvements which may occur to those skilled in the art without departing from the scope and spirit of the present application are intended to be within the scope of the claims of the present application.
Claims (9)
1. The electric energy quality control device is characterized by comprising a case, a partition plate and a cooling fan which are arranged in the case, and a power plate and a radiator which are arranged on the partition plate;
the inner space of the case is divided into an upper space and a lower space by the partition plate; the power board is arranged in the upper space, and the radiator and the radiating fan are arranged in the lower space; the radiator is arranged below the power plate;
an air inlet is formed in the part, located in the lower space, of the first side panel of the case, a first air outlet is formed in the part, located in the lower space, of the second side panel of the case, and a second air outlet is formed in the part, located in the upper space, of the second side panel of the case; or the part of the front panel of the case, which is positioned in the lower space, is provided with the air inlet, the part of the rear panel of the case, which is positioned in the lower space, is provided with the first air outlet, and the part of the rear panel of the case, which is positioned in the upper space, is provided with the second air outlet; or the part of the rear panel of the case, which is positioned in the lower space, is provided with the air inlet, the part of the front panel of the case, which is positioned in the lower space, is provided with the first air outlet, and the part of the front panel of the case, which is positioned in the upper space, is provided with the second air outlet;
the heat radiation fan is fixed at the air inlet, one part of airflow flowing out of the heat radiation fan flows out through the first air outlet, and the other part of airflow flows into the upper space from the lower space through the airflow channel and flows out from the second air outlet.
2. The power quality remediation device of claim 1 wherein the airflow channel is at least one of:
a gap between the baffle plate and the first side panel;
a gap between the separator and the second side panel;
a gap between the bulkhead and the front panel;
a gap between the bulkhead and the rear panel;
the baffle is provided with a vent hole.
3. The electric energy quality governance device of claim 1, wherein the power board comprises a first PCB substrate, a first capacitor, a power electronic full-control device and a current detection device;
the first capacitor and the current detection component are welded on the first surface of the first PCB substrate, the power electronic full-control device is welded on the second surface of the first PCB substrate, and the power electronic full-control device is placed on the radiator; wherein the first side of the first PCB substrate faces away from the partition plate, and the second side of the first PCB substrate faces toward the partition plate.
4. The power quality remediation device of claim 3 wherein the power board further comprises a power electronics fully-controlled device driver board;
the power electronic full-control type device driving board is welded on the first surface of the first PCB substrate and arranged between the first capacitor and the current detection component.
5. The power quality governance device of any one of claims 1-4, wherein the power quality governance device further comprises an interface board and a filter board;
the interface board is arranged in the upper space, and the filter plate is arranged in the lower space; the filtering plate is arranged below the interface plate.
6. The power quality remediation device of claim 5 wherein the interface board comprises a second PCB substrate, a relay, a fuse, and a conductive port;
the relay, the fuse and the conductive port are all welded on the first surface of the second PCB substrate; wherein the first face of the second PCB substrate faces away from the spacer.
7. The power quality governance device of claim 5, wherein the filter plate comprises a third PCB substrate, a first inductor, a first power interface, and a second power interface;
the first inductor is welded on the first surface of the third PCB substrate; the first power interface and the second power interface are mounted or welded on the second surface of the third PCB substrate; wherein the first face of the third PCB substrate faces away from the partition plate and the second face of the third PCB substrate faces toward the partition plate;
the first power interface and the second power interface are arranged on the edge side of the PCB substrate, and the first inductor is arranged on one side of the first power interface and the second power interface; or the first power interface and the second power interface are arranged on the edge side of the PCB substrate, and the first inductor is arranged between the first power interface and the second power interface.
8. The power quality remediation device of claim 7 wherein the filter plate further comprises a second inductor and/or a second capacitor;
the second inductor is welded on the first surface of the third PCB substrate and is close to the side panel in the case;
the second capacitor is welded on the first surface of the third PCB substrate and is close to the side panel in the case.
9. The power quality governance device of claim 5, further comprising a control panel and a power panel;
the control board and the power board are arranged in the upper space and positioned between the power board and the interface board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922064222.0U CN210957404U (en) | 2019-11-26 | 2019-11-26 | Electric energy quality control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922064222.0U CN210957404U (en) | 2019-11-26 | 2019-11-26 | Electric energy quality control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210957404U true CN210957404U (en) | 2020-07-07 |
Family
ID=71380989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922064222.0U Active CN210957404U (en) | 2019-11-26 | 2019-11-26 | Electric energy quality control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210957404U (en) |
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2019
- 2019-11-26 CN CN201922064222.0U patent/CN210957404U/en active Active
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