CN210805747U

CN210805747U - IC encapsulation is with base plate that radiating efficiency is high

Info

Publication number: CN210805747U
Application number: CN201921667010.5U
Authority: CN
Inventors: 谢云云; 闫世亮
Original assignee: Shanghai Bei Xin Semiconductor Technology Co ltd
Current assignee: Shanghai Bei Xin Semiconductor Technology Co ltd
Priority date: 2019-10-08
Filing date: 2019-10-08
Publication date: 2020-06-19
Anticipated expiration: 2029-10-08

Abstract

The utility model discloses a base plate that IC encapsulation is high with radiating efficiency, including first contact, second contact, base plate body and backplate, the base plate body adopts copper clad laminate to make, the welding has the connecting plate in the middle of the upper surface of base plate body, first contact welding is at the upper surface of base plate body, second contact welding is located one side of connecting plate at the upper surface of base plate body, the second contact is equipped with four altogether, and four second contacts are the rectangular array about the connecting plate and distribute, the backplate welding is at the lower surface of base plate body, the backplate adopts the polymer heat dissipation metal to make. The utility model discloses the radiating effect is good.

Description

IC encapsulation is with base plate that radiating efficiency is high

Technical Field

The utility model relates to a technical field of base plate specifically is a base plate that IC encapsulation is with high radiating efficiency.

Background

The substrate is a basic material for manufacturing the PCB, generally, the substrate is a copper clad laminate, and the single-sided and double-sided printed boards are manufactured by selectively performing processes such as hole processing, chemical copper plating, electro-coppering, etching and the like on the substrate material copper clad laminate to obtain a desired circuit pattern. In the manufacture of another type of multilayer printed board, an inner core thin copper clad laminate is also used as a base, and the conductive pattern layers and the prepregs are alternately laminated and bonded together at one time to form interconnection among more than 3 conductive pattern layers. It has the functions of conducting electricity, insulating and supporting.

At present, for high-power IC packaging, heat dissipation is a problem which is difficult to overcome all the time, a packaging body is a whole, and the traditional process is an RF4 plate, which is a disadvantage for high-power IC heat dissipation.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a base plate that radiating efficiency is high for IC encapsulation possesses the good advantage of radiating effect, has solved present to powerful IC encapsulation, and the heat dissipation is a problem that is difficult to overcome always, and the packaging body is a whole, and just traditional handicraft all is RF4 panel, and the IC heat dissipation to high-power consumption is the problem of an drawback.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a base plate that IC encapsulation is with radiating efficiency is high, includes first contact, second contact, base plate body and backplate, the welding has the connecting plate in the middle of the upper surface of base plate body, first contact welding is at the upper surface of base plate body, second contact welding is located one side of connecting plate at the upper surface of base plate body, the backplate welding is at the lower surface of base plate body.

Preferably, the substrate body is made of a copper clad laminate.

Preferably, the number of the second contacts is four, and the four second contacts are distributed in a rectangular array with respect to the connecting plate.

Preferably, the back plate is made of high-molecular heat dissipation metal.

Compared with the prior art, the beneficial effects of the utility model are as follows: the utility model discloses a set up backplate, first contact and second contact, reached the good effect of radiating effect, the backplate adopts polymer heat dissipation metal to make, and the radiating effect is better, and the position homodisperse of first contact and second contact, and the welding IC encapsulation of being convenient for can select the suitable contact to weld according to concrete actual conditions, and the distribution is even also can increase the radiating efficiency, and it is more convenient to use, and the practicality is stronger.

Drawings

Fig. 1 is a schematic top view of the present invention;

fig. 2 is a schematic bottom view of the present invention;

fig. 3 is a schematic view of the structure of the present invention.

In the figure: 1. a first contact; 2. a second contact; 3. a connecting plate; 4. a substrate body; 5. a back plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1 to fig. 3, the present invention provides an embodiment: a kind of IC capsulates and uses the base plate with high heat-dissipating efficiency, including the first contact 1, the second contact 2, body 4 of the base plate and slab 5, the body 4 of the base plate is made of the clad laminate, weld the joint plate 3 in the middle of the upper surface of the body 4 of the base plate, the first contact 1 welds the upper surface of the body 4 of the base plate, the second contact 2 welds the upper surface of the body 4 of the base plate and locates at one side of the joint plate 3, there are four second contacts 2 totally, and four second contacts 2 are distributed in rectangular array with respect to the joint plate 3, the slab 5 welds the lower surface of the body 4 of the base plate, the slab 5 is made of high polymer heat-dissipating metal, the heat-dissipating effect is better, and the positions of the first contact 1 and second contact 2 are dispersed evenly, easy to weld IC encapsulation, can choose the appropriate, the use is more convenient, and the practicality is stronger.

The working principle is as follows: the backboard 5 is made of high-molecular heat dissipation metal, the heat dissipation effect is better, the positions of the first connecting points 1 and the second connecting points 2 are uniformly dispersed, the IC package is convenient to weld, suitable connecting points can be selected to weld according to specific practical conditions, and the heat dissipation efficiency can be increased due to uniform distribution.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a base plate that IC encapsulation is with radiating efficiency is high, includes first contact (1), second contact (2), base plate body (4) and backplate (5), its characterized in that: the welding has connecting plate (3) in the middle of the upper surface of base plate body (4), first contact (1) welding is on the upper surface of base plate body (4), second contact (2) welding is located one side of connecting plate (3) at the upper surface of base plate body (4), backplate (5) welding is on the lower surface of base plate body (4).

2. The substrate with high heat dissipation efficiency for IC package according to claim 1, wherein: the substrate body (4) is made of a copper clad laminate.

3. The substrate with high heat dissipation efficiency for IC package according to claim 1, wherein: the number of the second connecting points (2) is four, and the four second connecting points (2) are distributed in a rectangular array relative to the connecting plate (3).

4. The substrate with high heat dissipation efficiency for IC package according to claim 1, wherein: the back plate (5) is made of high-molecular heat-dissipation metal.