CN211210033U

CN211210033U - Aluminum substrate with anti-interference capability

Info

Publication number: CN211210033U
Application number: CN202020181816.XU
Authority: CN
Inventors: 孙文静; 杜春承
Original assignee: Ningbo Gongniu Optoelectronics Technology Co Ltd
Current assignee: Ningbo Gongniu Optoelectronics Technology Co Ltd
Priority date: 2020-02-18
Filing date: 2020-02-18
Publication date: 2020-08-07
Anticipated expiration: 2030-02-18

Abstract

The utility model provides an aluminium base board with interference killing feature belongs to electrical apparatus technical field, from top to bottom, includes in proper order: the circuit comprises a circuit layer, an insulating layer and a metal base layer, wherein a plurality of blind holes are formed in the thickness direction of the aluminum base plate, penetrate through the circuit layer and the insulating layer and are filled with soldering tin; and the patch elements are in one-to-one correspondence with the blind holes respectively and are connected to the circuit board in a welding mode. The utility model provides a pair of aluminium base board with interference killing feature realizes switching on of circuit board and metal substrate through filling soldering tin, has solved among the prior art through the problem of the bad switch on of fastener violence connection switch on and production, improves and switches on the effect to improve the interference killing feature, and reduction in production cost improves work efficiency.

Description

Aluminum substrate with anti-interference capability

Technical Field

The utility model belongs to the technical field of electrical apparatus, a aluminium base board, especially an aluminium base board with interference killing feature is related to.

Background

The metal-based printed circuit board is a special printed circuit board and is widely applied to various fields of household appliances, automobiles, aviation, medical treatment, military and the like. The metal-based printed circuit board can be divided into a copper substrate, an aluminum substrate, a stainless steel substrate and the like according to the metal base, and the manufacturing processes of the copper substrate, the aluminum substrate, the stainless steel substrate and the like have certain differences due to different substrates, for example, the aluminum substrate can not realize the conduction between the aluminum substrate and a circuit layer through a conventional electroplating process, but many products are designed with local circuit layers to be conducted with the aluminum substrate so as to achieve various required effects, such as grounding, electric conduction and the like.

At present, current aluminium base conduction technology is comparatively cruder and violent, adopts screw-up's mode, realizes that circuit layer and aluminium base layer switch on, and this mode needs to carry out later stage processing, wastes time and energy, and manufacturing cost is high, and produces easily and switch on bad scheduling problem, like the too big or fastener such as screw of trompil size not adaptation, makes circuit connection not smooth and easy and lead to the phenomenon such as circuit board disqualification.

In summary, in order to solve the structural defects of the conventional aluminum substrate, it is necessary to design an aluminum substrate with good conductivity so as to improve the anti-interference capability.

Disclosure of Invention

The utility model aims at having the above-mentioned problem to current technique, provided one kind and had good conductivity to improve the aluminium base board of interference killing feature.

The purpose of the utility model can be realized by the following technical proposal: the utility model provides an aluminium base board with interference killing feature, from top to bottom, includes in proper order: the circuit comprises a circuit layer, an insulating layer and a metal base layer, wherein a plurality of blind holes are formed in the thickness direction of the aluminum base plate, penetrate through the circuit layer and the insulating layer and are filled with soldering tin; and the patch elements are in one-to-one correspondence with the blind holes respectively and are connected to the circuit board in a welding mode.

In the aluminum substrate with the anti-interference capability, a paint screen printing layer is covered on the circuit layer.

In the aluminum substrate with the anti-interference capability, a mounting area is formed above the position of each blind hole on the circuit layer, and a paint silk-screen layer is not coated in the mounting area, wherein the mounting area is used as the mounting position of the patch element.

In the aluminum substrate with interference resistance, the mounting region has an enclosed structure, wherein the enclosed structure may be a polygon or a circle.

In the aluminum substrate with the anti-interference capability, when the mounting region is arranged in a circular shape, the mounting region and the blind hole are coaxially arranged.

In the aluminum substrate with the anti-interference capability, the circuit layer and the insulating layer, and the insulating layer and the metal base layer are connected in a pressing mode.

Compared with the prior art, the utility model provides a pair of aluminium base board with interference killing feature realizes switching on of circuit board and metal substrate through filling soldering tin, has solved among the prior art through the poor problem that switches on of fastener violence connection switch on and production, improves and switches on the effect to improve interference killing feature, and reduction in production cost improves work efficiency.

Drawings

Fig. 1 is a cross-sectional view of an aluminum substrate with anti-interference capability according to the present invention.

In the figure, 100, the line layer; 200. an insulating layer; 300. a metal base layer; 400. blind holes; 500. a patch element; 600. and (5) painting a silk screen layer.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

As shown in fig. 1, the utility model provides a pair of aluminium base board with interference killing feature from top to bottom includes in proper order: the circuit comprises a circuit layer 100, an insulating layer 200 and a metal base layer 300, wherein a plurality of blind holes 400 are formed in the thickness direction of an aluminum substrate, the blind holes 400 penetrate through the circuit layer 100 and the insulating layer 200, and solder is filled in the blind holes 400; the patch elements 500 are in one-to-one correspondence with the blind holes 400 respectively, and are connected to the circuit board by welding.

The utility model provides a pair of aluminium base board with interference killing feature realizes switching on of circuit board and metal substrate through filling soldering tin, has solved among the prior art through the problem of the bad switch on of fastener violence connection switch on and production, improves and switches on the effect to improve the interference killing feature, and reduction in production cost improves work efficiency.

Preferably, as shown in fig. 1, a paint screen layer 600 is coated on the circuit layer 100 to protect the surface of the circuit board.

Further preferably, a mounting area is formed on the wiring layer 100 above the position of each blind hole 400, and the paint-screen layer 600 is not coated in the mounting area, wherein the mounting area serves as the mounting position of the patch element 500.

Further preferably, the mounting area has an enclosed structure, wherein the enclosed structure may be polygonal or circular.

It is further preferred that the mounting area is coaxially disposed with the blind hole 400 when the mounting area is circularly disposed.

Preferably, as shown in fig. 1, the circuit layer 100 and the insulating layer 200, and the insulating layer 200 and the metal base layer 300 are connected by pressing, so that the connection between the circuit layer 100 and the insulating layer 200, and the connection between the insulating layer 200 and the metal base layer 300 are tighter and firmer, and the heat dissipation effect can be improved.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Claims

1. The utility model provides an aluminium base board with interference killing feature which from top to bottom includes in proper order: the circuit comprises a circuit layer (100), an insulating layer (200) and a metal base layer (300), wherein a plurality of blind holes (400) are formed in the thickness direction of the aluminum base plate, the blind holes (400) penetrate through the circuit layer (100) and the insulating layer (200), and soldering tin is filled in the blind holes (400); and the patch elements (500) are in one-to-one correspondence with the blind holes (400) respectively and are connected to the circuit board in a welding mode.

2. The aluminum substrate with interference rejection capability of claim 1, wherein a paint screen printing layer (600) is covered on the circuit layer (100).

3. The aluminum substrate with interference rejection capability of claim 2, wherein a mounting region is formed on the wiring layer (100) above the position of each blind hole (400), wherein the mounting region serves as a mounting position of the chip element (500).

4. A tamper-resistant aluminum substrate according to claim 3, wherein the mounting region is of a closed structure.

5. The aluminum substrate with interference rejection capability of claim 4, wherein the enclosed structure is polygonal or circular.

6. The aluminum substrate with interference rejection capability of claim 5, wherein when the mounting region is disposed in a circular shape, the mounting region is disposed coaxially with the blind hole (400).

7. The aluminum substrate with interference rejection capability of claim 1, wherein the circuit layer (100) and the insulating layer (200), and the insulating layer (200) and the metal base layer (300) are connected by pressing.