KR102279152B1 - Interposer for wiring and electric module having the same - Google Patents

Abstract

The present invention relates to an interposer for wiring, which can improve performance by forming a wiring layer in the interposer, and to facilitate circuit design and pattern implementation, and an electronic module having the same.
An interposer for wiring according to the present invention is positioned between electronic devices to electrically connect the electronic devices, and the interposer includes: a first conductive layer electrically connected to a first electric device; a second conductive layer electrically connected to the second electrical device; and a wiring layer positioned between the first and second conductive layers to electrically connect the first and second electric devices, and to have a multilayer structure.

Description

Interposer for wiring and electronic module having same {Interposer for wiring and electric module having the same}

The present invention relates to an electronic module having an interposer, and more particularly, to an interposer for wiring that can improve performance by forming a wiring layer in the interposer, and facilitates circuit design and pattern implementation, and an electronic module having the same will be.

In general, an electronic module is formed by mounting an electronic component on a base substrate, and an SMT (Surface Mount Technology) method is used to mount the electronic component on the base substrate.

In the case of the SMT method, the solder that connects the electronic component and the base board is formed while the solder ball formed on the electronic component and the solder paste printed on the base board go through a reflow process. will form

Recently, between the electronic component and the base substrate, an interposer having a low coefficient of thermal expansion, such as silicon (Si), glass or ceramic, is interposed to connect the electronic component and the base substrate to form an electronic module. A method of forming is being used.

1 shows a structure of an electronic module using a conventional interposer. Referring to FIG. 1 , the electronic module 100 includes a base substrate 110 , an electronic component 120 , and a base substrate 110 and an electronic component. An interposer 130 interposed between 120 and connecting the base substrate 110 and the electronic component 120 is provided.

In this case, the interposer 130 includes upper and lower layers 132 and 133 respectively formed on both sides of the insulating layer 131 . That is, the interposer 130 has a structure (two-layer structure) in which one layer is formed on both surfaces based on the insulating layer 131 .

Accordingly, in the conventional interposer having a two-layer structure, since the upper layer 132 and the lower layer 133 are 1:1 through a via hole, the upper electrode 141 and the lower electrode 142 are matched. The arrangement of the positions is limited, and the size of the upper electrode 141 and the lower electrode 142 has to be formed to have a size similar to that of the electronic component.

Accordingly, when an electronic component is mounted on a base substrate using a conventional interposer, there is a problem in that it is difficult to design a circuit and implement a pattern due to design constraints.

Accordingly, the present invention has been devised to solve the problems of the prior art as described above, and an object of the present invention is to improve performance by forming a wiring layer in an interposer, and to facilitate circuit design and pattern implementation. To provide a poser and an electronic module having the same.

The interposer for wiring according to an aspect of the present invention for achieving the above object is an interposer for wiring that is located between electronic devices and electrically connects the electronic devices, wherein the interposer includes a first electric a first conductive layer in electrical connection with the device; a second conductive layer electrically connected to the second electrical device; and a wiring layer positioned between the first and second conductive layers to electrically connect the first and second electric devices, and to have a multilayer structure.

the wiring layer includes a wiring electrode, the first conductive layer includes a first electrode electrically connected to the first electrical device and the wiring electrode, and the second conductive layer includes the second electrical device and the wiring and a second electrode electrically connected to the electrode.

The wiring layer may include a wiring insulating layer; an upper wiring layer positioned on the wiring insulating layer; and a lower wiring layer positioned under the inter-wiring insulating layer, wherein the wiring electrode is formed through the wiring insulating layer, the upper wiring layer, and the lower wiring layer.

The first conductive layer is made of an insulating material, the first electrode is located in a via hole formed in the first conductive layer, and an upper portion of the first electrode is exposed to the outside of the first conductive layer to the first electric device is connected with

The second conductive layer is made of an insulating material, the second electrode is located in a via hole formed in the second conductive layer, and a lower portion of the second electrode is exposed to the outside of the second conductive layer to communicate with the second electric device Connected.

The first electrode is connected to the wiring electrode through a wiring formed between the first conductive layer and the wiring layer, and the second electrode is connected to the wiring electrode through a wiring formed between the wiring layer and the second conductive layer. is connected with

The second electrode is formed in a land grid array.

A plurality of the first electrodes and a plurality of the second electrodes are respectively formed, and the plurality of first electrodes are densely located in a predetermined region of the first conductive layer, and a plurality of second electrodes electrically connected to the plurality of first electrodes, respectively. The electrodes are distributed over the entire area of the second conductive layer.

An electronic module according to another aspect of the present invention is an electronic module implemented by sequentially stacking a base substrate, an interposer, and an electronic component, wherein the interposer includes: a wiring layer; an upper conductive layer provided on the wiring layer and electrically connected to the wiring layer and the electronic component; and a lower conductive layer provided under the wiring layer and electrically connected to the wiring layer and the base substrate.

The wiring layer includes a wiring electrode, the upper conductive layer includes an upper electrode electrically connected to the electronic component and the wiring electrode, and the lower conductive layer includes a lower portion electrically connected to the base substrate and the wiring electrode including electrodes.

The wiring layer may include a wiring insulating layer; an upper wiring layer positioned on the wiring insulating layer; and a lower wiring layer positioned below the inter-wiring insulating layer, wherein the wiring electrode is positioned in a via hole formed through the wiring insulating layer, the upper wiring layer, and the lower wiring layer.

The upper conductive layer is made of an insulating material, the upper electrode is located in a via hole formed in the upper conductive layer, and an upper portion of the upper electrode is exposed to the outside of the upper conductive layer to be connected to the electronic component.

The lower conductive layer is made of an insulating material, the lower electrode is located in a via hole formed in the lower conductive layer, and a lower portion of the lower electrode is exposed to the outside of the lower conductive layer to be connected to the base substrate.

The upper electrode is connected to the wiring electrode through a wiring formed between the upper conductive layer and the wiring layer, and the lower electrode is connected to the wiring electrode through a wiring formed between the wiring layer and the lower conductive layer.

The lower electrode is formed in a land grid array.

A plurality of upper electrodes and a plurality of lower electrodes are formed, respectively, a plurality of upper electrodes are densely located in a predetermined region of the upper conductive layer, and a plurality of lower electrodes electrically connected to the plurality of upper electrodes, respectively, are formed in the lower conductive layer. distributed over the entire area of

According to the above configuration, since the interposer is formed in a multi-layered structure and includes a wiring layer therein, it is possible to freely design a wiring inside the interposer.

Therefore, although the size and position of the upper electrode positioned above the interposer is limited according to the size and position of the electronic component, the lower electrode located below the interposer is not limited to the position and size of the electronic component and is not limited to the size and position of the interposer. Since they may be disposed in various positions, the size of the lower electrode and the gap between the lower electrodes may be increased, thereby improving heat dissipation performance.

In addition, when the size of the lower electrode is increased, the contact area with the base substrate is increased, so that adhesion and reliability can be improved.

In addition, since free wiring design is possible, line impedance matching for input/output patterns closely related to RF performance is easy, so that the RF performance of the electronic module can be improved.

1 is a diagram illustrating a structure of an electronic module having an interposer in the related art.
2 and 3 are partial cross-sectional views illustrating the structure of an electronic module having an interposer according to an embodiment of the present invention.
4 is a plan view illustrating an upper surface and a lower surface of an interposer according to an embodiment of the present invention.

Advantages and features of the present invention, and a method for achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the art to which the present invention pertains. It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

In describing the embodiments of the present invention, if it is determined that a detailed description of a well-known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. In addition, the terms to be described later are terms defined in consideration of functions in an embodiment of the present invention, which may vary according to intentions or customs of users and operators. Therefore, the definition should be made based on the content throughout this specification.

Hereinafter, a structure of an interposer for wiring and an electronic module having the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 and 3 are partial cross-sectional views illustrating a structure of an electronic module having an interposer for wiring according to an embodiment of the present invention.

Referring to FIG. 2 , an electronic module 200 according to an embodiment of the present invention includes a base substrate 210 , an electronic component 220 , and an interposer 230 having a multilayer structure.

At this time, according to the structure of the electronic module 200 according to the embodiment of the present invention, the base substrate 210 forms the base of the electronic module 200 and is provided in the lowest layer of the electronic module 200, and the base substrate ( The interposer 230 is stacked on the 210 , and the electronic component 220 is stacked on the interposer 230 .

Accordingly, the electronic module 200 according to an embodiment of the present invention has a structure in which a base substrate 210 , an interposer 230 , and an electronic component 220 are sequentially stacked.

In this case, the connection between the base substrate 210 and the interposer 230 and the connection between the interposer 230 and the electronic component 220 may be made by various methods, for example, in a SMT (Surface Mount Technology) method. can be done by

Meanwhile, the interposer 230 includes a wiring layer 231 , an upper conductive layer 232 and a lower conductive layer 233 positioned on both sides of the wiring layer 231 , respectively.

In this case, a wiring electrode 234 is provided on the wiring layer 231 , an upper electrode 235 is provided on the upper conductive layer 232 , and a lower electrode 236 is provided on the lower conductive layer 233 . .

Also, the wiring electrode 234 is electrically connected to the upper electrode 235 and the lower electrode 236 , the upper electrode 235 is electrically connected to the electronic component 220 , and the lower electrode 236 is electrically connected to the lower electrode 236 . is electrically connected to the base substrate 210 .

Meanwhile, the wiring layer 231 has a three-layer structure and may include a wiring insulating layer 231a and upper and lower wiring layers 231b and 231c positioned on both sides of the wiring insulating layer 231a.

A via hole is formed in the wiring layer 231 through the wiring insulating layer 231a, the upper wiring layer 231b, and the lower wiring layer 231c, and the wiring electrode 234 is positioned in the via hole formed in the wiring layer 231 . do.

The upper conductive layer 232 is formed of an insulating material, a via hole is formed in the upper conductive layer 232 , and an upper electrode 235 is positioned in the via hole formed in the upper conductive layer 232 .

An upper portion of the upper electrode 235 is exposed to the outside of the upper conductive layer 232 to be connected to the electronic component 220 , and a lower portion of the upper electrode 235 is disposed between the wiring layer 231 and the upper conductive layer 232 . It is connected to the upper portion of the wiring electrode 234 through the formed wiring.

The lower conductive layer 233 is formed of an insulating material, a via hole is formed in the lower conductive layer 233 , and a lower electrode 236 is positioned in the via hole formed in the lower conductive layer 233 .

An upper portion of the lower electrode 236 is connected to a lower portion of the wiring electrode 234 through a wiring formed between the wiring layer 231 and the lower conductive layer 233 , and a lower portion of the lower electrode 236 is exposed to the outside. to be connected to the base substrate 210 .

Accordingly, according to the structure of the electronic module 200 according to the first embodiment of the present invention, the base substrate 210 - the lower electrode 236 - the wiring electrode 234 - the upper electrode 235 - the electronic component 220 An electrical path leading to

Meanwhile, although FIG. 2 shows a structure in which the wiring layer 231 is composed of three layers 231a to 231c, the wiring layer 231 according to an embodiment of the present invention has five layers 231a as shown in FIG. 3 . ~ 231e), may have various structures in order to adjust the distance between the base substrate 210 and the electronic component 220, and the use of each layer may also be set in various ways.

4 is a plan view illustrating an upper surface and a lower surface of an interposer according to an embodiment of the present invention.

4 (a) is a plan view showing the upper surface of the interposer according to an embodiment of the present invention, as shown in Figure 4 (a), a plurality of upper electrodes 235 are formed on the upper surface of the interposer 230, In this case, FIG. 4A shows an example of a structure in which the upper electrodes 235 are densely formed in a predetermined area according to the arrangement of electronic components.

Meanwhile, FIG. 4(b) is a plan view illustrating the lower surface of the interposer according to an embodiment of the present invention, and in contrast to the plurality of upper electrodes 235 being densely formed in a predetermined area of the upper surface of the interposer, 4(b) ), the plurality of lower electrodes 236 formed on the lower surface of the interposer 230 are distributed over the entire area of the lower surface of the interposer. In this case, the plurality of upper electrodes 235 may be formed in a land grid array (LGA).

Accordingly, the lower electrode 236 is formed to have a larger area than the upper electrode 235 , and the distance between the lower electrodes 236 is wider than that of the upper electrode 235 .

According to the above configuration, since the interposer is formed in a multi-layered structure and includes a wiring layer therein, it is possible to freely design a wiring inside the interposer.

Therefore, although the size and position of the upper electrode positioned above the interposer is limited according to the size and position of the electronic component, the lower electrode located below the interposer is not limited to the position and size of the electronic component and is not limited to the size and position of the interposer. Since they may be disposed in various positions, the size of the lower electrode and the gap between the lower electrodes may be increased, thereby improving heat dissipation performance.

In addition, when the size of the lower electrode is increased, the contact area with the base substrate is increased, so that adhesion and reliability can be improved.

In addition, since free wiring design is possible, line impedance matching for input/output patterns closely related to RF performance is easy, so that the RF performance of the electronic module can be improved.

On the other hand, although the interposer for wiring according to the present invention and an electronic module having the same have been described according to embodiments, the scope of the present invention is not limited to a specific embodiment, and it is obvious to those skilled in the art in relation to the present invention. Various alternatives, modifications, and changes can be implemented within one scope.

Accordingly, the embodiments and the accompanying drawings described in the present invention are for explanation rather than limiting the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments and the accompanying drawings. . The protection scope of the present invention should be construed by the claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

200: electronic module 210: base board
220: electronic component 230: interposer
231: wiring layer 232: upper conductive layer
233: lower conductive layer 234: wiring electrode
235: upper electrode 236: lower electrode

Claims (16)

An interposer for wiring that is located between electronic devices and electrically connects the electronic devices, the interposer comprising:
a first conductive layer electrically connected to the first electrical device;
a second conductive layer electrically connected to a second electrical device; and
a wiring layer positioned between the first and second conductive layers to electrically connect the first and second electrical devices, and a wiring layer having a multilayer structure;
The wiring layer includes a wiring electrode disposed through the wiring layer,
The first conductive layer includes a first electrode that passes through the first conductive layer but is disposed to be spaced apart from the wiring electrode in a direction perpendicular to a penetration direction of the wiring electrode;
and a second electrode passing through the second conductive layer, the second conductive layer being spaced apart from the wiring electrode in a direction perpendicular to a penetration direction of the wiring electrode. According to claim 1,
The first electrode electrically connects the first electric device and the wiring electrode,
The second electrode is an interposer for wiring that electrically connects the second electric device and the wiring electrode. According to claim 1,
The wiring layer is
wiring insulation layer;
an upper wiring layer positioned on the wiring insulating layer; and
a lower wiring layer located under the wiring insulating layer;
The wiring electrode is an interposer for wiring positioned in a via hole formed through the wiring insulating layer, the upper wiring layer, and the lower wiring layer. According to claim 1,
The first conductive layer is made of an insulating material, the first electrode is located in a via hole formed in the first conductive layer, and an upper portion of the first electrode is exposed to the outside of the first conductive layer to the first electric device Interposer for wiring connected to According to claim 1,
The second conductive layer is made of an insulating material, the second electrode is located in a via hole formed in the second conductive layer, and a lower portion of the second electrode is exposed to the outside of the second conductive layer to communicate with the second electrical device. Interposer for wiring to be connected. According to claim 1,
The first electrode is connected to the wiring electrode through a wiring formed between the first conductive layer and the wiring layer, and the second electrode is connected to the wiring electrode through a wiring formed between the wiring layer and the second conductive layer. Interposer for wiring connected to According to claim 1,
The second electrode is an interposer for wiring formed in a land grid array. According to claim 1,
A plurality of the first electrode and the second electrode are respectively formed,
A plurality of first electrodes are densely located in a predetermined region of the first conductive layer, and a plurality of second electrodes electrically connected to the plurality of first electrodes are distributed over the entire region of the second conductive layer. Interposer for wiring. In the electronic module implemented by sequentially stacking a base substrate, an interposer, and an electronic component, the interposer comprises:
wiring layer;
an upper conductive layer provided on the wiring layer and electrically connected to the wiring layer and the electronic component; and
a wiring layer provided under the wiring layer and having a lower conductive layer electrically connected to the wiring layer and the base substrate;
The wiring layer includes a wiring electrode disposed through the wiring layer,
The upper conductive layer includes an upper electrode that passes through the upper conductive layer and is disposed to be spaced apart from the wiring electrode in a direction perpendicular to the penetration direction of the wiring electrode,
and a lower electrode passing through the lower conductive layer and spaced apart from the wiring electrode in a direction perpendicular to a penetration direction of the wiring electrode. 10. The method of claim 9,
The upper electrode electrically connects the electronic component and the wiring electrode,
The lower electrode is an electronic module for electrically connecting the base substrate and the wiring electrode. 10. The method of claim 9,
The wiring layer is
wiring insulation layer;
an upper wiring layer positioned on the wiring insulating layer; and
a lower wiring layer located under the wiring insulating layer;
The wiring electrode is positioned in a via hole formed through the wiring insulating layer, the upper wiring layer, and the lower wiring layer. 10. The method of claim 9,
The upper conductive layer is made of an insulating material, the upper electrode is located in a via hole formed in the upper conductive layer, and an upper portion of the upper electrode is exposed to the outside of the upper conductive layer to be connected to the electronic component. 10. The method of claim 9,
The lower conductive layer is made of an insulating material, the lower electrode is located in a via hole formed in the lower conductive layer, and a lower portion of the lower electrode is exposed to the outside of the lower conductive layer to be connected to the base substrate. 10. The method of claim 9,
The upper electrode is connected to the wiring electrode through a wiring formed between the upper conductive layer and the wiring layer, and the lower electrode is connected to the wiring electrode through a wiring formed between the wiring layer and the lower conductive layer. module. 10. The method of claim 9,
The lower electrode is an electronic module formed in a land grid array (Land Grid Array). 10. The method of claim 9,
A plurality of the upper electrode and the lower electrode are respectively formed,
The plurality of upper electrodes are densely located in a predetermined area of the upper conductive layer, and the plurality of lower electrodes electrically connected to the plurality of upper electrodes are distributed over the entire area of the lower conductive layer.

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