CN108391384A - A kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process - Google Patents
A kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process Download PDFInfo
- Publication number
- CN108391384A CN108391384A CN201810408037.6A CN201810408037A CN108391384A CN 108391384 A CN108391384 A CN 108391384A CN 201810408037 A CN201810408037 A CN 201810408037A CN 108391384 A CN108391384 A CN 108391384A
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- Prior art keywords
- circuit board
- flexible circuit
- laser
- layer
- substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process, includes the following steps, S1：Prepare for the substrate of flexible circuit board of laser processing processing, and cleaning working process is carried out to the substrate of flexible circuit board surface；The substrate of flexible circuit board includes flexible circuit board conductor copper foil protective layer/solder mask, the first bonding colloid layer, line conductor copper foil layer, the second bonding colloid layer and insulating layer successively from top to bottom；S2：Using ready substrate of flexible circuit board lower part the second knot colloid layer and insulating layer in laser ablation step S1, at least one opening is formed；And the opening portion of removal is made to extend to line conductor copper foil layer position；The depth bounds of laser ablation line conductor copper foil layer are controlled between 0.05um 2000um, heat dissipation performance has been greatly enhanced in the application effective solution heat dissipation problem of traditional fabrication mode.
Description
[technical field]
It can meet product the present invention relates to flexible circuit board technical field of manufacturing process more particularly to one kind height is led
The high-thermal conductive metal reinforcing flexible circuit board manufacturing process of hot cooling requirements.
[background technology]
Existing high heat-radiating substrate PCB is main common for metal-based copper-clad plate, because it is with good thermal conductivity, electrical
Insulating properties and dimensional stability, have been widely used at present, and wherein aluminum substrate/copper base is a kind of with good heat radiating function
Metal-based copper-clad plate, general single sided board are made of three-decker, are circuit layer (copper foil), insulating layer and metal-based layer respectively
(Metal Substrate is mainly：Aluminium and copper), for it is high-end use be also designed as dual platen, structure is circuit layer, insulating layer, aluminium
Base, insulating layer, circuit layer, it is multi-layer board that only a few, which is applied, can be bonded with insulating layer, aluminium base by common multi-layer board.
But it is due to being metal material, and the bending that carries out that cannot be random carries out moulding with matching mechanism, and in bending,
Insulating layer and metal substrate layer are susceptible to layering and fracture in bending place, and then influence the performance of product.
Traditional flexible FPC wiring boards, due to copper foil conductor layer, there are the insulation such as PI (polyimides Polyimide) in lower section
Layer, and the bonding glue with high heat conduction is overlying on heat radiating metal reinforcing block (aluminium flake or copper sheet), and attach in flexibilities such as PI
The lower section of wiring board insulating material layer causes line pattern conductor copper foil that cannot directly be connect with the heat conduction glue on metal reinforcement block
It touches, causes the speed of its heat conduction well below traditional heat dissipation metal substrate (aluminum substrate and copper base), product pair cannot be met
In the requirement of high heat conduction heat dissipation.
Based on this, those skilled in the art has carried out a large amount of research and development and experiment, and achieves preferable achievement.
[invention content]
To overcome the problems of prior art, the present invention, which provides one kind and can meet product, wants high heat conduction heat dissipation
The high-thermal conductive metal reinforcing flexible circuit board manufacturing process asked.
The scheme that the present invention solves technical problem is to provide a kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process, wraps
Include following steps,
S1：Prepare for the substrate of flexible circuit board of laser processing processing, and the substrate of flexible circuit board surface is carried out
Clean working process；The substrate of flexible circuit board from top to bottom successively include flexible circuit board conductor copper foil protective layer/solder mask,
First bonds colloid layer, line conductor copper foil layer, the second bonding colloid layer and insulating layer；
S2：Using ready substrate of flexible circuit board lower part the second knot colloid layer and insulation in laser ablation step S1
Layer forms at least one opening；And the opening portion of removal is made to extend to line conductor copper foil layer position；Control laser
The depth bounds of circuit conductive copper layers of foil are etched between 0.05um-2000um；
S3：Conducting adhesive glue is added in the opening that laser-induced thermal etching is formed in step s 2, forms conducting adhesive glue layer；
It by hot pressing, presses, pastes, coat, print, conducting adhesive glue layer is adhered to flexible circuit by dipping or immersion way
On the line conductor copper foil layer that plate base material is exposed by laser ablation or with heat dissipation and (aluminium on the metal reinforcement block of heat conduction function
Piece or copper sheet), again by hot pressing, pressing or manual applying method so that metal reinforcement block and substrate of flexible circuit board knot
It closes, while conducting adhesive glue layer can be carried out with the line conductor copper foil layer exposed by laser ablation in substrate of flexible circuit board
Closely combine；
S4：Cleaning treatment is carried out to the substrate of flexible circuit board machined in step S3；
S5：Working process finishes.
Preferably, the laser employed in the step S2 be subnanosecond, picosecond, nanosecond, femtosecond or excimer laser
Device.
Preferably, it is 492nm to the green light light between 577nm that the laser employed in the step S2, which is wave-length coverage,
Source laser device, wave-length coverage be 300nm to the UV purple lights light source laser between 400nm, wave-length coverage be 622nm to 2500nm
Between CO2Infrared light supply laser either wave-length coverage be 200nm between 299nm the dark purple radiant lasers of UV,
Wave-length coverage is 10nm to the EUV light source laser between 199nm.
Preferably, in the step S2, the depth bounds of laser ablation the second knot colloid layer and insulating layer be 1um extremely
5000um。
Preferably, the laser can be flat-top light or Gauss light；And the spot diameter of laser 1um to 2000um it
Between, the shape of laser facula can be circle, rectangular, the irregular shapes such as quadrangle or diamond shape.
Preferably, the opening formed in the step S2 be circular port, square orifice or quadrangle mouth, etc. irregular shapes.
Preferably, the conducting adhesive glue used in the step S3 is that semi-solid preparation, solidification, liquid or paste heat conduction are viscous
Gum deposit water.
Preferably, the temperature of hot pressing controls between room temperature or 1 DEG C to 400 DEG C in the step S3；Pressing when
Between be：Between 1 second to 10800 seconds；And the thickness of conducting adhesive glue layer in 2um between 2000um.
Compared with prior art, a kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process of the present invention is by using laser
Working process substrate of flexible circuit board, and conducting adhesive glue layer is adhered to what substrate of flexible circuit board was exposed by laser ablation
With on the metal reinforcement block of heat conduction function (aluminium flake or copper sheet) on line conductor copper foil layer or with heat dissipation, reach metal reinforcement
The effect of flexible circuit board in effective solution traditional fabrication mode, causes the line pattern conductor copper foil cannot to be mended with metal
Heat conduction glue on strong block is in direct contact, the speed of heat conduction well below traditional heat dissipation metal substrate (aluminum substrate with it is copper-based
Plate), the problem of product is for high heat conduction cooling requirements cannot be met, heat dissipation performance has been greatly enhanced.
[description of the drawings]
Fig. 1 is a kind of flow diagram of high-thermal conductive metal reinforcing flexible circuit board manufacturing process of the present invention.
[specific implementation mode]
To make the purpose of the present invention, technical solution and advantage be more clearly understood, with reference to the accompanying drawings and embodiments, to this
Invention is further elaborated.It should be appreciated that specific embodiment described herein is used only for explaining the present invention, not
For limiting the invention.
Referring to Fig. 1, a kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process 1 of the present invention, includes the following steps,
S1：Prepare for the substrate of flexible circuit board of laser processing processing, and the substrate of flexible circuit board surface is carried out
Clean working process；The substrate of flexible circuit board from top to bottom successively include flexible circuit board conductor copper foil protective layer/solder mask,
First bonds colloid layer, line conductor copper foil layer, the second bonding colloid layer and insulating layer；
S2：Using ready substrate of flexible circuit board lower part the second knot colloid layer and insulation in laser ablation step S1
Layer forms at least one opening；And the opening portion of removal is made to extend to line conductor copper foil layer position；Control laser
The depth bounds of circuit conductive copper layers of foil are etched between 0.05um-2000um；
S3：Conducting adhesive glue is added in the opening that laser-induced thermal etching is formed in step s 2, forms conducting adhesive glue layer；
It by hot pressing, presses, pastes, coat, print, conducting adhesive glue layer is adhered to flexible circuit by dipping or immersion way
On the line conductor copper foil layer that plate base material is exposed by laser ablation or with heat dissipation and (aluminium on the metal reinforcement block of heat conduction function
Piece or copper sheet), again by hot pressing, pressing or manual applying method so that metal reinforcement block and substrate of flexible circuit board knot
It closes, while conducting adhesive glue layer can be carried out with the line conductor copper foil layer exposed by laser ablation in substrate of flexible circuit board
Closely combine；
S4：Cleaning treatment is carried out to the substrate of flexible circuit board machined in step S3；
S5：Working process finishes.
The application handles substrate of flexible circuit board by using laser processing, and conducting adhesive glue layer is adhered to flexibility
On the line conductor copper foil layer that board substrate is exposed by laser ablation or with the metal reinforcement block to radiate with heat conduction function
Upper (aluminium flake or copper sheet), achieve the effect that metal reinforcement flexible circuit board, in effective solution traditional fabrication mode, causes line
Road figure conductor copper foil cannot be in direct contact with the heat conduction glue on metal reinforcement block, and the speed of heat conduction is well below traditional gold
Belong to heat-radiating substrate (aluminum substrate and copper base), the problem of product is for high heat conduction cooling requirements cannot be met, be greatly enhanced
Heat dissipation performance.
Preferably, the laser employed in the step S2 be subnanosecond, picosecond, nanosecond, femtosecond or excimer laser
Device.
Preferably, it is 492nm to the green light light between 577nm that the laser employed in the step S2, which is wave-length coverage,
Source laser device, wave-length coverage be 300nm to the UV purple lights light source laser between 400nm, wave-length coverage be 622nm to 2500nm
Between CO2Infrared light supply laser either wave-length coverage be 200nm between 299nm the dark purple radiant lasers of UV,
Wave-length coverage is 10nm to the EUV light source laser between 199nm.
Preferably, in the step S2, the depth bounds of laser ablation the second knot colloid layer and insulating layer be 1um extremely
5000um。
Preferably, the laser can be flat-top light or Gauss light；And the spot diameter of laser 1um to 2000um it
Between, the shape of laser facula can be circle, rectangular, the irregular shapes such as quadrangle or diamond shape.
Preferably, the opening formed in the step S2 be circular port, square orifice or quadrangle mouth, etc. irregular shapes.
Preferably, the conducting adhesive glue used in the step S3 is that semi-solid preparation, solidification, liquid or paste heat conduction are viscous
Gum deposit water.
Preferably, the temperature of hot pressing controls between room temperature or 1 DEG C to 400 DEG C in the step S3；Pressing when
Between be：Between 1 second to 10800 seconds；And the thickness of conducting adhesive glue layer in 2um between 2000um.
Compared with prior art, a kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process of the present invention 1 is by using swashing
Light working process substrate of flexible circuit board, and conducting adhesive glue layer is adhered to substrate of flexible circuit board and is exposed by laser ablation
Line conductor copper foil layer on or with heat dissipation and (aluminium flake or copper sheet) on the metal reinforcement block of heat conduction function, reach metal benefit
The effect of strong flexible circuit board in effective solution traditional fabrication mode, causes line pattern conductor copper foil cannot be with metal
Heat conduction glue on reinforcing block is in direct contact, the speed of heat conduction well below traditional heat dissipation metal substrate (aluminum substrate with it is copper-based
Plate), the problem of product is for high heat conduction cooling requirements cannot be met, heat dissipation performance has been greatly enhanced.
The embodiments of the present invention described above are not intended to limit the scope of the present invention.It is any in the present invention
Spirit and principle within made by modifications, equivalent substitutions and improvements etc., should be included in the claim protection model of the present invention
Within enclosing.
Claims (8)
1. a kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process, it is characterised in that：Include the following steps,
S1：Prepare for the substrate of flexible circuit board of laser processing processing, and the substrate of flexible circuit board surface is cleaned
Working process；The substrate of flexible circuit board includes flexible circuit board conductor copper foil protective layer/solder mask, first successively from top to bottom
Bond colloid layer, line conductor copper foil layer, the second bonding colloid layer and insulating layer；
S2：Using ready substrate of flexible circuit board lower part the second knot colloid layer and insulating layer in laser ablation step S1,
Form at least one opening；And the opening portion of removal is made to extend to line conductor copper foil layer position；Control laser incising
The depth bounds of corrosion line road conductor copper foil layer are between 0.05um-2000um；
S3：Conducting adhesive glue is added in the opening that laser-induced thermal etching is formed in step s 2, forms conducting adhesive glue layer；Pass through
Hot pressing presses, and pastes, and coats, printing, and conducting adhesive glue layer is adhered to flexible PCB base by dipping or immersion way
On the line conductor copper foil layer that material is exposed by laser ablation or with heat dissipation on the metal reinforcement block of heat conduction function (aluminium flake or
Copper sheet), again by hot pressing, pressing or manual applying method so that metal reinforcement block is combined with substrate of flexible circuit board, together
When conducting adhesive glue layer can be carried out with the line conductor copper foil layer exposed by laser ablation in substrate of flexible circuit board it is close
Combination；
S4：Cleaning treatment is carried out to the substrate of flexible circuit board machined in step S3；
S5：Working process finishes.
2. a kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process as described in claim 1, it is characterised in that：The step
Laser employed in rapid S2 be subnanosecond, picosecond, nanosecond, femtosecond or excimer laser.
3. a kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process as claimed in claim 1 or 2, it is characterised in that：Institute
It is 492nm to the green-light source laser between 577nm, wave-length coverage that state the laser employed in step S2, which be wave-length coverage,
It is 622nm to CO between 2500nm for 300nm to the UV purple lights light source laser between 400nm, wave-length coverage2Infrared light supply
Laser either wave-length coverage be 200nm to the dark purple radiant lasers of UV between 299nm, wave-length coverage be 10nm extremely
EUV light source laser between 199nm.
4. a kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process as described in claim 1, it is characterised in that：The step
In rapid S2, the depth bounds of laser ablation the second knot colloid layer and insulating layer are 1um to 5000um.
5. a kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process as described in claim 1 or 3, it is characterised in that：Institute
It can be flat-top light or Gauss light to state laser；And the spot diameter of laser in 1um between 2000um, the shape of laser facula can
Think circle, rectangular, the irregular shapes such as quadrangle or diamond shape.
6. a kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process as described in claim 1, it is characterised in that：The step
The opening formed in rapid S2 is circular port, the irregular shapes such as square orifice or quadrangle mouth.
7. a kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process as described in claim 1, it is characterised in that：The step
Conducting adhesive glue used in rapid S3 is semi-solid preparation, solidification, liquid or paste conducting adhesive glue.
8. a kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process as claimed in claim 1 or 7, it is characterised in that：Institute
The temperature for stating hot pressing in step S3 controls between room temperature or 1 DEG C to 400 DEG C；The time of pressing is：1 second to 10800
Between second；And the thickness of conducting adhesive glue layer in 2um between 2000um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810408037.6A CN108391384A (en) | 2018-05-02 | 2018-05-02 | A kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810408037.6A CN108391384A (en) | 2018-05-02 | 2018-05-02 | A kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process |
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| Publication Number | Publication Date |
|---|---|
| CN108391384A true CN108391384A (en) | 2018-08-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810408037.6A Pending CN108391384A (en) | 2018-05-02 | 2018-05-02 | A kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112130383A (en) * | 2019-06-25 | 2020-12-25 | 三星显示有限公司 | Display device |
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| CN105684559A (en) * | 2014-09-04 | 2016-06-15 | 东洋油墨Sc控股株式会社 | Printed wiring board, printed wiring board manufacturing method, and electronic apparatus |
| CN107734846A (en) * | 2017-10-12 | 2018-02-23 | 安捷利电子科技（苏州）有限公司 | A kind of double-faced flexible wiring board based on separable copper foil and preparation method thereof |
| CN107889339A (en) * | 2016-09-29 | 2018-04-06 | 东洋油墨Sc控股株式会社 | Printing distributing board and electronic equipment |
| CN107949164A (en) * | 2017-11-27 | 2018-04-20 | 深圳光韵达激光应用技术有限公司 | A kind of circuit substrate coil line etch process with higher rate |
-
2018
- 2018-05-02 CN CN201810408037.6A patent/CN108391384A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101287328A (en) * | 2007-04-10 | 2008-10-15 | 鸿富锦精密工业（深圳）有限公司 | Flexible circuit board, processing method of said flexible circuit board and electronic device |
| CN203748107U (en) * | 2014-03-24 | 2014-07-30 | 上海温良昌平电器科技有限公司 | Double-layer wiring high-heat-conducting flexible printed circuit board |
| CN105684559A (en) * | 2014-09-04 | 2016-06-15 | 东洋油墨Sc控股株式会社 | Printed wiring board, printed wiring board manufacturing method, and electronic apparatus |
| CN107889339A (en) * | 2016-09-29 | 2018-04-06 | 东洋油墨Sc控股株式会社 | Printing distributing board and electronic equipment |
| CN107734846A (en) * | 2017-10-12 | 2018-02-23 | 安捷利电子科技（苏州）有限公司 | A kind of double-faced flexible wiring board based on separable copper foil and preparation method thereof |
| CN107949164A (en) * | 2017-11-27 | 2018-04-20 | 深圳光韵达激光应用技术有限公司 | A kind of circuit substrate coil line etch process with higher rate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112130383A (en) * | 2019-06-25 | 2020-12-25 | 三星显示有限公司 | Display device |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180810 |
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| RJ01 | Rejection of invention patent application after publication |