CN115942636A - Circuit board processing method and circuit board - Google Patents
Circuit board processing method and circuit board Download PDFInfo
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- CN115942636A CN115942636A CN202111107272.8A CN202111107272A CN115942636A CN 115942636 A CN115942636 A CN 115942636A CN 202111107272 A CN202111107272 A CN 202111107272A CN 115942636 A CN115942636 A CN 115942636A
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Abstract
The application discloses a circuit board processing method and a circuit board, comprising the following steps: obtaining a to-be-processed plate, wherein the to-be-processed plate comprises at least one step groove, and the groove bottom of the step groove comprises an insulating layer and a copper layer; attaching adhesive tapes to the bottom and the edge of the step groove; ablating the set position of the insulating layer by using laser to remove the adhesive tape at the set position and form a set pattern at the set position; acquiring a printing template, and filling ink in the step groove by using an ink-jet mode based on the printing template; and removing the adhesive tape in the step groove to obtain the circuit board. Through the mode, the ink can be filled at the designated position in the stepped groove.
Description
Technical Field
The application relates to the field of circuit board processing, in particular to a circuit board processing method and a circuit board.
Background
With the development of 5G technology and electronic products, the demand for circuit boards is higher and higher. In order to improve the product performance, the product assembly density and reduce the weight and the volume of a product, a novel process is a step groove process in the manufacturing process of the current PCB (Printed Circuit Board), namely, a groove is dug on the surface of the PCB so as to increase the heat dissipation area or improve the safety of surface components.
Among the prior art, when welding resistance processing is carried out to the step groove, use traditional silk screen printing technology usually, however, because the face in the step groove is uneven, and there is difference in height in step groove and outer face, the silk screen printing can't be at the step inslot assigned position filling printing ink, and the silk screen printing can lead to the step inslot to be piled up with printing ink to lead to the inslot circuit to be filled up totally, can't effectively weld, then can't satisfy customer's demand.
Disclosure of Invention
The technical problem mainly solved by the application is to provide a circuit board processing method and a circuit board, and the problem that ink cannot be filled in a designated position in a step groove can be solved by attaching adhesive tapes to the bottom and the edge of the step groove, removing the adhesive tapes at the position needing to be covered with ink through laser, and completely removing the residual adhesive tapes after filling the ink.
In order to solve the above technical problem, a first technical solution adopted by the present application is to provide a circuit board processing method, including: obtaining a to-be-processed plate, wherein the to-be-processed plate comprises at least one step groove, and the groove bottom of the step groove comprises an insulating layer and a copper layer; attaching adhesive tapes to the bottom and the edge of the step groove; ablating the set position of the insulating layer by using laser to remove the adhesive tape at the set position and form a set pattern at the set position; acquiring a printing template, and filling ink in the step groove by using an ink-jet mode based on the printing template; and removing the adhesive tape in the step groove to obtain the circuit board.
The step of obtaining a printing template and filling ink in the step groove by using an ink-jet mode based on the printing template specifically comprises the following steps: and manufacturing a printing template according to the size of the step groove, and filling the step groove with ink in an ink-jet mode based on the printing template.
Wherein the ink is liquid ink.
Wherein the filling thickness of the ink is 15 to 25 μm.
Wherein the laser comprises a UV laser.
Wherein the adhesive tape is an adhesive tape resistant to high temperature of 260 ℃.
The method comprises the steps of obtaining a to-be-treated plate, wherein the to-be-treated plate comprises at least one step groove, and the step of forming an insulating layer and a copper layer at the bottom of the step groove comprises the following steps: obtaining a first plate to be processed, and drilling a through hole at a first preset position on the first plate to be processed; obtaining a second plate to be processed, and ablating part of the copper layer at a second preset position on the second plate to be processed by using laser to expose the insulating layer; and carrying out pressing treatment on the first plate to be processed and the second plate layer to be processed so as to obtain the plate to be processed.
And after the pressing, the insulating layer and the residual copper layer at the second preset position on the second plate to be processed are exposed to form a step groove.
Wherein, to first waiting to process plate and the second and waiting to process the plate layer and carry out pressfitting treatment to before the step of obtaining the panel that waits to process, still include: and carrying out brown oxidation treatment on the first plate to be processed and the second plate to be processed.
In order to solve the technical problem, a second technical scheme adopted by the application is to provide a circuit board, wherein the circuit board is manufactured by the circuit board processing method.
The beneficial effect of this application is: different from the prior art, the application provides a circuit board processing method and a circuit board, through attaching adhesive tapes to the bottom and the edge of a step groove, and ablating the set position of an insulating layer in the step groove by using laser, the adhesive tapes at the set position can be removed, the set pattern is formed at the set position, then, through obtaining a printing template, and ink is filled in the step groove by using an ink-jet mode based on the printing template, so that the influence on the surface of an outer layer can be avoided, and the adhesive tapes are removed after the ink is filled, so that the ink can be isolated, and the ink can be covered only at the set pattern at the set position, thereby realizing the purpose of filling the ink at the specified position in the step groove.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart of an embodiment of a method for processing a circuit board according to the present application;
FIG. 2 is a schematic flow chart of an embodiment of a method for obtaining a sheet to be processed in S11;
FIG. 3 is a schematic structural diagram of an embodiment of a plate to be processed provided in the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plural" includes at least two in general, but does not exclude the presence of at least one.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be understood that the terms "comprises," "comprising," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of another like element in a process, method, article, or apparatus that comprises the element.
In the prior art, when the step groove is subjected to solder mask processing, a traditional silk-screen process is usually used, however, because the surface in the step groove is uneven, and the step groove and the outer layer surface have a height difference, the silk-screen process cannot fill ink at a specified position in the step groove, and the silk-screen process can lead to the step groove being filled with ink, so that the lines in the groove are completely filled, the welding cannot be effectively carried out, and then the customer requirements cannot be met.
Based on the situation, the application provides a circuit board processing method and a circuit board, and the problem that in the prior art, ink cannot be filled in the designated position in the step groove can be solved by attaching adhesive tapes to the bottom and the edge of the step groove, removing the adhesive tapes at the position needing to be covered with ink through laser, and completely removing the residual adhesive tapes after filling with ink.
Referring to fig. 1, fig. 1 is a schematic flow chart of an embodiment of a method for processing a circuit board according to the present application. As shown in fig. 1, in the present embodiment, the method includes:
s11: and obtaining a to-be-processed plate, wherein the to-be-processed plate comprises at least one step groove, and the groove bottom of the step groove comprises an insulating layer and a copper layer.
In this embodiment, the board to be treated is obtained by lamination.
Here, lamination refers to a method of integrally combining two or more layers of the same or different materials by heat and pressure with or without an adhesive.
Specifically, referring to fig. 2, fig. 2 is a schematic flow chart of an embodiment of a method for obtaining the board to be processed in S11. As shown in fig. 2, in the present embodiment, the method includes:
s21: the method comprises the steps of obtaining a first plate to be processed, and drilling a through hole at a first preset position on the first plate to be processed.
In the embodiment, through hole drilling processing is performed at a first preset position on the first plate to be processed in a mechanical processing or laser ablation mode.
The number of the first preset positions and the number of the through holes can be determined according to the number of the required step grooves, which is not limited in the present application.
The first plate to be processed is a copper-clad plate, the copper-clad plate comprises an insulating layer (a dielectric layer) and a copper layer, and one side of the insulating layer can be covered with the copper layer, and the two sides of the insulating layer can also be covered with the copper layer. In this embodiment, the copper layer is covered on both sides of the insulating layer of the copper-clad plate.
In this embodiment, before drilling the through hole in the first plate to be processed, the first plate to be processed needs to be browned.
Specifically, the surface of a copper layer of a first plate to be processed is subjected to microetching by using a browning liquid to generate an extremely thin and uniform organic metal conversion film, so that the surface of the copper is enabled to obtain a stable and micro-uneven surface shape, meanwhile, an organic additive in the browning liquid and the surface of the copper generate an organic metal conversion film, and the film can be effectively embedded into the surface of the copper to form a brown gridding conversion layer, so that the bonding force between the plates can be increased, the plates can be browned, and the absorption of the surface of the copper to laser can be increased.
S22: and obtaining a second plate to be processed, and ablating part of the copper layer at a second preset position on the second plate to be processed by using laser to expose the insulating layer.
In this embodiment, the second plate to be processed and the first plate to be processed are the same core board medium and are also copper-clad plates with copper layers covered on both sides.
In this embodiment, before a part of the copper layer at the second preset position on the second plate to be processed is ablated by laser, the plate to be processed needs to be browned, and the specific actions are as described above and will not be described herein.
In this embodiment, the laser includes a UV laser.
Specifically, the ultraviolet ray has a wavelength ranging from 10 to 400nm and is an electromagnetic wave between an X-ray and visible light. The cleavage method is to directly break the molecular bond with short wavelength and high energy, thereby achieving the cleavage effect. Because the UV laser is mainly used for cutting glass/metal/macromolecules, the power is low, and the local heat effect is not obvious, the UV laser is adopted to ablate the copper layer, and part of the copper layer at the second preset position on the second plate to be processed can be directly ablated by controlling the diameter and the position of the UV laser beam so as to expose the insulating layer.
S23: and carrying out pressing treatment on the first plate to be processed and the second plate layer to be processed so as to obtain the plate to be processed.
In this embodiment, the first preset position on the first board to be processed corresponds to the second preset position on the second board to be processed, and the insulating layer and the residual copper layer at the second preset position on the second board to be processed are exposed after pressing, so as to form the step groove.
In this embodiment, the first plate to be processed and the second plate to be processed are sequentially stacked, and the two layers are combined into a whole by heating and pressurizing, so as to expose the insulating layer and the residual copper layer at the second predetermined position on the second plate to be processed, thereby forming the step groove.
In other embodiments, the first plate to be processed and the second plate to be processed may also be bonded together by a bonding layer, which is not limited in this application. Specifically, can wait to process the plate with first plate, tie coat, the second and laminate in proper order, after the hot melt, riveting is fixed again, then wait to process plate pressfitting with first plate, tie coat, the second and be in the same place, expose the insulating layer and the surplus copper layer of second default position department on the second waits to process the plate to form the step groove.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an embodiment of a plate to be processed according to the present application.
As shown in fig. 3, the plate to be processed 30 includes a first plate to be processed 10 and a second plate to be processed 20. The first plate 10 to be processed and the second plate 20 to be processed are sequentially stacked, and the first plate 10 to be processed and the second plate 20 to be processed are completely overlapped.
The first board 10 to be processed includes a through hole 13, a first copper layer 11, and a first insulating layer 12, and the first insulating layer 12 is exposed by ablating a portion of the first copper layer 11.
The position of the through hole 13 corresponds to a first preset position on the first plate to be processed 10 and a second preset position on the second plate to be processed 20.
The second board 20 to be processed includes a second copper layer 21 and a second insulating layer 22, and the second insulating layer 22 is exposed by ablating a portion of the second copper layer 22. The second board 20 to be processed further includes a setting position 23 where the solder resist process is to be performed.
In this embodiment, it is necessary to fill the ink with a set pattern accurately at the set position 23, and it is not possible to fill the ink on the second copper layer 22 around the set position 23.
S12: and attaching adhesive tapes to the bottom and the edge of the step groove.
Because there is the difference in height in the step groove, set up step groove tank bottom on the second treats that the processing plate is kept away from the second with first one side face of treating that the processing plate is waited to process and have the difference in height promptly, follow-up printing ink can appear unable location problem at the in-process of spouting the seal, and printing ink can spout the seal at the step groove edge, so not only need be at the attached sticky tape of the tank bottom in step groove, the edge in step groove also needs attached sticky tape.
Wherein the adhesive tape is an adhesive tape resistant to high temperature of 260 ℃.
Specifically, the high-temperature-resistant adhesive tapes are attached to the bottom and the edge of the step groove, so that the direct laser ablation of the bottom of the step groove in the subsequent laser ablation step can be avoided, and the pollution of the bottom copper layer and the surface of the edge of the step groove by ink in the subsequent process can be avoided.
S13: and ablating the set position of the insulating layer by using laser to remove the adhesive tape at the set position and form a set pattern on the set position.
In this embodiment, the set position is a processing solder resist region, the set position of the insulating layer is ablated with laser light to remove the tape in the region, and then the ablation is continued at the set position with laser light to form a set pattern.
Wherein the laser comprises a UV laser.
In the present embodiment, the adhesive tapes in the step groove are all retained except for the set position.
S14: and acquiring a printing template, and filling ink in the step groove by using an ink-jet mode based on the printing template.
In the present embodiment, a printing stencil is manufactured according to the size of the stepped groove, and the ink is filled in the stepped groove by an ink jet method based on the printing stencil.
Specifically, due to the large ink jetting range, in order to control the ink jetting range, corresponding printing data is drawn on the intelligent terminal according to the size of the step groove before ink jetting, a printing template is printed according to the printing data, and the step groove is filled with ink by using an ink jet printer based on the printing template.
Wherein the ink is liquid ink.
Wherein the filling thickness of the ink is 15-25 μm.
In a preferred embodiment, the ink has a fill thickness of 20 μm.
In the present embodiment, ink having a predetermined thickness is applied to the bottom of the step groove, and ink at the remaining positions is adhered to the tape.
S15: and removing the adhesive tape in the step groove to obtain the circuit board.
In the embodiment, after the adhesive tapes at the bottom and the edge of the stepped groove are removed, ink is still remained in the stepped groove except for the set position, and the ink at the rest positions is stripped along with the removal of the adhesive tapes, so that the subsequent welding is not influenced.
Different from the prior art, the embodiment attaches the adhesive tape to the bottom and the edge of the step groove, ablates the set position of the insulating layer in the step groove by using laser, can remove the adhesive tape at the set position, forms the set pattern on the set position, then fills the ink in the step groove by using an ink-jet mode based on the printing template by obtaining the printing template, can avoid the influence of the outer plate surface, removes the adhesive tape after filling the ink, can isolate the ink, can cover the ink only at the set pattern at the set position, and accordingly achieves the purpose of filling the ink at the specified position in the step groove.
Correspondingly, the application provides a circuit board, and the circuit board is manufactured by the processing method.
Different from the prior art, the circuit board of the embodiment has the advantages that the ink is only filled in the designated position of the bottom of the step groove, and the ink is isolated at other positions, so that subsequent welding is not influenced, and the problem that the ink cannot be filled in the designated position in the step groove in the prior art is solved.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A circuit board processing method is characterized by comprising the following steps:
obtaining a plate to be processed, wherein the plate to be processed comprises at least one step groove, and the groove bottom of the step groove comprises an insulating layer and a copper layer;
attaching adhesive tapes to the bottom and the edge of the step groove;
ablating the set position of the insulating layer by using laser to remove the adhesive tape at the set position and form a set pattern at the set position;
acquiring a printing template, and filling ink in the step groove by using an ink-jet mode based on the printing template;
and removing the adhesive tape in the step groove to obtain the circuit board.
2. The method for processing the circuit board according to claim 1, wherein the step of obtaining a printing template and filling the ink in the step groove by an ink jet method based on the printing template specifically comprises:
and manufacturing the printing template according to the size of the step groove, and filling the ink in the step groove by using an ink-jet mode based on the printing template.
3. The method for processing a wiring board according to claim 2, wherein the ink is a liquid ink.
4. The method for processing a wiring board according to claim 3, wherein the filling thickness of the ink is 15 to 25 μm.
5. The wiring board processing method of claim 1, wherein the laser comprises a UV laser.
6. The method for processing the circuit board according to claim 1, wherein the adhesive tape is an adhesive tape resistant to a high temperature of 260 ℃.
7. The circuit board processing method according to claim 1, wherein the step of obtaining a board to be processed, the board to be processed including at least one step groove, and the step of obtaining a groove bottom including an insulating layer and a copper layer includes the steps of:
the method comprises the steps of obtaining a first plate to be processed, and drilling a through hole at a first preset position on the first plate to be processed;
obtaining a second plate to be processed, and ablating part of the copper layer at a second preset position on the second plate to be processed by using laser to expose the insulating layer;
and carrying out pressing treatment on the first plate to be processed and the second plate layer to be processed to obtain the plate to be processed.
8. The method according to claim 7, wherein the first predetermined position on the first board to be processed corresponds to the second predetermined position on the second board to be processed, and the insulating layer and the remaining copper layer at the second predetermined position on the second board to be processed are exposed after pressing to form the step groove.
9. The method for processing a circuit board according to claim 9, wherein before the step of performing press-fitting treatment on the first board to be processed and the second board to be processed to obtain the board to be processed, the method further comprises:
and carrying out brown oxidation treatment on the first plate to be processed and the second plate to be processed.
10. A wiring board produced by the wiring board processing method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111107272.8A CN115942636A (en) | 2021-09-22 | 2021-09-22 | Circuit board processing method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111107272.8A CN115942636A (en) | 2021-09-22 | 2021-09-22 | Circuit board processing method and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115942636A true CN115942636A (en) | 2023-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111107272.8A Pending CN115942636A (en) | 2021-09-22 | 2021-09-22 | Circuit board processing method and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115942636A (en) |
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2021
- 2021-09-22 CN CN202111107272.8A patent/CN115942636A/en active Pending
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