CN105792500A - Multi-layer circuit board - Google Patents
Multi-layer circuit board Download PDFInfo
- Publication number
- CN105792500A CN105792500A CN201410776951.8A CN201410776951A CN105792500A CN 105792500 A CN105792500 A CN 105792500A CN 201410776951 A CN201410776951 A CN 201410776951A CN 105792500 A CN105792500 A CN 105792500A
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- CN
- China
- Prior art keywords
- layer
- circuit board
- prepreg
- copper foil
- metal substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a multi-layer circuit board. The multi-layer circuit board is characterized by comprising a basis layer, an insulation layer and a conductive layer, wherein the basis layer adopts a metal substrate 1, the metal substrate 1 can be an aluminum plate, an aluminum alloy plate or a copper plate, the above insulation layer adopts a prepreg 2, the above conductive layer adopts a copper foil layer 3, an oxide insulation layer 11 is formed on each of the upper surface and the lower surface of the metal substrate 1, the oxide insulation layer 11 on the upper surface of the metal substrate 1 is laminated with the copper foil layer 3 through the prepreg 2, and the prepreg 2 is arranged between the metal substrate 1 and the copper foil layer 2 after lamination. With the adoption of the above scheme, the multi-layer circuit board has favorable electromagnetic shielding performance, is simple and convenient to fabricate, has high cooling effect, and is low in raw material cost.
Description
Technical field
The present invention relates to field of circuit boards, particularly a kind of multilayer circuit board.
Background technology
Its basic unit of existing printed circuit board (PCB) is generally adopted ceramic substrate, the heat-conductive characteristic of this material is poor, and the heat that electronic devices and components produce because of power consumption can not distribute in time, therefore, components and parts easily cause because own temperature is too high that service behaviour is unstable, and components and parts sometimes even can be damaged.
Summary of the invention
For the problems referred to above, the technical problem to be solved is to provide a kind of simple in construction, the convenient multilayer circuit board used.
A kind of multilayer circuit board, it is characterised in that include basic unit, insulating barrier and conductive layer, above-mentioned basic unit adopts metal basal board 1, and said metal substrates 1 can be aluminium sheet, aluminium alloy plate or copper coin；Above-mentioned insulating barrier adopts prepreg 2；Above-mentioned conductive layer adopts copper foil layer 3；The upper and lower surface of metal basal board 1 forms one layer of oxidation insulating layer 11, and the oxidation insulating layer 11 of metal basal board 1 upper surface is by prepreg 2 and copper foil layer 3 pressing, and after pressing, prepreg 2 is between metal basal board 1 and copper foil layer 3.
The invention has the beneficial effects as follows:
Adopting such scheme, the present invention has good capability of electromagnetic shielding, its simple for production, good heat dissipation effect, and the cost of raw material is low.
Accompanying drawing explanation
Below in conjunction with drawings and the embodiments, the present invention is further detailed explanation.
Fig. 1 is the structural representation of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is further explained.
A kind of multilayer circuit board, it is characterised in that include basic unit, insulating barrier and conductive layer, above-mentioned basic unit adopts metal basal board 1, and said metal substrates 1 can be aluminium sheet, aluminium alloy plate or copper coin；Above-mentioned insulating barrier adopts prepreg 2；Above-mentioned conductive layer adopts copper foil layer 3.
Further illustrating, the upper and lower surface of metal basal board 1 forms one layer of oxidation insulating layer 11, and the oxidation insulating layer 11 of metal basal board 1 upper surface is by prepreg 2 and copper foil layer 3 pressing.
Further illustrating, after described pressing, prepreg 2 is between metal basal board 1 and copper foil layer 3.
Foregoing, is only presently preferred embodiments of the present invention, is not intended to limit embodiment of the present invention, those skilled in the art's design according to the present invention, done appropriate adaptation or amendment, all should within protection scope of the present invention.
Claims (3)
1. a multilayer circuit board, it is characterised in that include basic unit, insulating barrier and conductive layer, described basic unit adopts metal basal board 1, and described metal basal board 1 can be aluminium sheet, aluminium alloy plate or copper coin；Described insulating barrier adopts prepreg 2；Described conductive layer adopts copper foil layer 3.
2. multilayer circuit board according to claim 1, it is characterised in that the upper and lower surface of described metal basal board 1 forms one layer of oxidation insulating layer 11, the oxidation insulating layer 11 of described metal basal board 1 upper surface is by prepreg 2 and copper foil layer 3 pressing.
3. multilayer circuit board according to claim 1 and 2, it is characterised in that after described pressing, prepreg 2 is between metal basal board 1 and copper foil layer 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410776951.8A CN105792500A (en) | 2014-12-17 | 2014-12-17 | Multi-layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410776951.8A CN105792500A (en) | 2014-12-17 | 2014-12-17 | Multi-layer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105792500A true CN105792500A (en) | 2016-07-20 |
Family
ID=56373963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410776951.8A Pending CN105792500A (en) | 2014-12-17 | 2014-12-17 | Multi-layer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105792500A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI795865B (en) * | 2021-08-10 | 2023-03-11 | 蘇憲強 | Circuit board structure capable of shielding and heat dissipation and its manufacturing method |
-
2014
- 2014-12-17 CN CN201410776951.8A patent/CN105792500A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI795865B (en) * | 2021-08-10 | 2023-03-11 | 蘇憲強 | Circuit board structure capable of shielding and heat dissipation and its manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160720 |