CN207625863U - FPC plates - Google Patents
FPC plates Download PDFInfo
- Publication number
- CN207625863U CN207625863U CN201721610797.2U CN201721610797U CN207625863U CN 207625863 U CN207625863 U CN 207625863U CN 201721610797 U CN201721610797 U CN 201721610797U CN 207625863 U CN207625863 U CN 207625863U
- Authority
- CN
- China
- Prior art keywords
- fpc
- substrates
- lead wire
- plates
- electroplate lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a kind of FPC plates, it includes FPC substrates, the FPC substrates include FPC main bodys and the ends FPC that are connected with the FPC main bodys, the pad for including electroplate lead wire on the FPC substrates, being connect with the electroplate lead wire, notch section is set on the FPC substrates, every the ipsilateral penumbra of the electroplated lead and the FPC substrates, the notch section formed the barbed portion by etching the electroplated lead;It is equipped with isolation material layer at the back side of the ends FPC.The FPC plates of the utility model can prevent from drawing the electroplate lead wire of the outline edge of FPC plates and the metal component of FPC backs and surrounding etc. to be in direct contact and cause the problem of short circuit;Reduce the fraction defective of product;Product function is improved, to extend the service life of FPC panel products.
Description
【Technical field】
The utility model is related to field of circuit boards, a kind of particularly FPC plates preventing electroplate lead wire short circuit.
【Background technology】
It is with insulation base flexible that flexible PCB (Flexible Printed Circuit Board), which is also known as " soft board ",
Printed circuit made of material has the advantages that many rigid printed circuit boards do not have.In addition, flexible print circuit board has list
Face, two-sided and multi-layer board point, mainly using polyimides or mylar as base material, the material thermal resistance is high, dimensional stability
It is good, final products are formed by compacting with the cover film for having mechanical protection and good electrical insulation performance concurrently.With general circuit plate
It compares, FPC plates have a height reliability, excellent pliability, with high, the light-weight and thin thickness characteristic of Distribution density, extensively
In the general connection applied to electronic device.
Traditional FPC designs and manufacturing field, when the FPC substrate sides of flexible circuit board have electronic device or structure device
It, can be at the back side of FPC substrates by joint adhesive lamination reinforcement piece, to increase FPC hardness and planarization, convenient for welding when part.Mesh
The preceding supporting material mainly used has:Polyimides (Polyimide, initialism PI), epoxy glass cloth laminated board (FR 4)
Or the metal reinforcement of steel disc, aluminium flake etc., but mainly plane supporting material.Existing FPC passes through metal pad and other work(
Energy module is connected, and the easy metal component with FPC backs and surrounding etc. of electroplate lead wire for drawing FPC plate shapes is contacted and caused
Short circuit influences product function, and influences the service life of FPC panel products.
Therefore, it is necessary to provide a kind of new FPC plates.
【Utility model content】
The electroplate lead wires of FPC plate shapes, the electroplate lead wire meeting are drawn because the pad on FPC plates is surface-treated
It is contacted with FPC backs even surrounding metal component, causes FPC plates short-circuit, to solve the above-mentioned problems, the utility model
Providing a kind of FPC plates comprising FPC substrates, the FPC substrates include FPC main bodys and the ends FPC that are connected with the FPC main bodys,
The pad for including electroplate lead wire on the FPC substrates, being connect with the electroplate lead wire, is arranged notch section on the FPC substrates,
The barbed portion is every the ipsilateral penumbra of the electroplated lead and the FPC substrates, and the notch section is by etching the plating
Conducting wire and formed;It is equipped with isolation material layer at the back side of the ends FPC.
As an improvement the isolation material layer is polyimide layer.
As an improvement the connecting place of the FPC main bodys and the ends FPC includes rounded corner.
As an improvement the pad is by surface treatment.
As an improvement the pad includes the coat of metal.
The utility model has the beneficial effects that:The FPC plates of the utility model can prevent from drawing the outline edge of FPC plates
Electroplate lead wire and the metal component of FPC backs and surrounding etc. are in direct contact and cause the problem of short circuit;Reduce product not
Yield;Product function is improved, to extend the service life of FPC panel products.
【Description of the drawings】
Fig. 1 is the structural schematic diagram of the FPC plates of the prior art.
Fig. 2 is the structural schematic diagram of the FPC plates of the utility model.
【Specific implementation mode】
The utility model is described in further detail below by specific implementation mode combination Fig. 1 and Fig. 2, so as to
The advantages of more fully understanding the embodiment of the utility model and its various aspects.Below in an example, it provides real in detail below
The purpose for applying mode is easy for becoming apparent from thorough explanation to the content of the utility model, rather than to the limit of the utility model
System.
As shown in Figure 1, the FPC plates of the prior art include FPC plate substrates, which includes FPC main bodys 10 and and FPC
The connected ends FPC 20 of main body 10, wherein including electroplate lead wire 30 and the weldering being connect with electroplate lead wire 30 on the FPC substrates
Disk 40.Due to including multiple pads 40 on the FPC substrates, pad 40 is surface-treated, such as tin plating, gold-plated etc. table
Surface treatment, therefore, electroplate lead wire 30 need to draw the outline edge of FPC.It is electroplated and draws because pad 40 is surface-treated
Line draws the outline edge of FPC plates, and the electroplate lead wire for drawing the outline edge of FPC plates is caused to be easy and FPC backs and surrounding
Deng metal component be in direct contact and cause short circuit problem.
Embodiment 1
With reference to Fig. 2, the utility model provides a kind of FPC plates preventing electroplate lead wire short circuit, especially solves to need to draw
The short circuit problem of the outline edge of FPC plates or the electroplate lead wire flushed with the outline edge of FPC plates, the FPC plates include FPC bases
Plate, the FPC substrates include FPC main bodys 10 and the ends FPC 20 that are connected with the FPC main bodys 10, and specifically, FPC plates include plating
Notch section 50 is arranged in lead 30, the pad 40 being connect with electroplate lead wire 30 on FPC substrates, which, which separates plating, leads
The ipsilateral penumbra of line 30 and FPC substrates, notch section 50 are formed by etching electroplated lead 30;It is set at the back side of the ends FPC 20
There is isolation material layer;The connecting place of FPC main bodys 10 and the ends FPC 20 includes rounded corner.
Specifically, FPC substrates are the circuit board of bending, include electroplate lead wire 30 on FPC substrates, and electroplate lead wire 30 accords with
Close the trace arrangements rule of circuit board;Further include multiple pads 40, multiple pads 40 and the company of electroplate lead wire 30 on FPC substrates
It connects, pad 40 is surface-treated, such as tin plating, gold-plated etc. surface treatment so that pad 40 includes the coat of metal.
In the case that pad 40 is surface-treated, electroplate lead wire 30 is needed to draw the outline edge of FPC plates.For this plating
Lead needs the case where drawing the outline edge of FPC plates, and notch section 50 is formed by etching electroplated lead 30, the notch section 50
Separate the ipsilateral penumbra of electroplated lead 30 and FPC substrates, in the present embodiment, the shape of the notch section 50 is semicircle, but
It is not limited to this, can also be the other shapes such as rectangle.It should be noted that the method that notch section is formed is not limited to aforesaid way, may be used also
It is handled with the conventional method for example, by chemical etching etc., to form notch section.Notch section 50 makes the outer of electroplate lead wire 30
The outline edge of lateral edges and FPC plates is spaced apart, therefore prevents from drawing the electroplate lead wire 30 and FPC plates of the outline edge of FPC plates
The metal component contact of the back side and surrounding etc. and the problem for causing short circuit, and improve product function, to extend FPC plates
The service life of product.
In addition, the back side of the ends FPC 20 is equipped with insulating materials, for example, polyimide layer PI, insulation P I make the ends FPC
The back side in portion 20 and the metal component being in direct contact with the back side insulate.Insulation PI further prevents FPC plates directly
The short circuit problem of the metal component of contact, and there is reinforcing function, therefore product function is improved, to extend FPC plates
The service life of product.
In the FPC plates with above structure for example for motor when, which is attached on steel disc support plate, the four of FPC plates
Week is all the component of metal class, and in the case where circuit needs to guide to electroplate lead wire 30 except FPC plates, i.e., electroplate lead wire 30 arrives
Reach or the outline edge beyond FPC plates in the case of, the utility model on FPC substrates by etching electroplated lead 30 by shape
At notch section 50, which can avoid FPC plates from thus being reduced with the risk of the metal component short circuit of its back side and surrounding
Open circuit and functionality are bad, and reduce the fraction defective of product.
It should be noted that the position and shape of electroplate lead wire 30 and pad 40 can be set according to actual needs and voluntarily
It is fixed.
Compared with prior art, the FPC plates of the utility model can prevent from drawing the electroplate lead wire of the outline edge of FPC plates
The problem of short circuit is in direct contact and caused with the metal component of FPC backs and surrounding etc.;Reduce the fraction defective of product;It improves
Product function, to extending the service life of FPC panel products.
It should be noted here that for those of ordinary skill in the art, not departing from the concept of the present invention
Under the premise of, various modifications and variations can be made, but these belong to the scope of protection of the utility model.
Claims (5)
1. a kind of FPC plates comprising FPC substrates, the FPC substrates include FPC main bodys and the ends FPC that are connected with the FPC main bodys,
The pad for including electroplate lead wire on the FPC substrates, being connect with the electroplate lead wire, which is characterized in that on the FPC substrates
Notch section is set, and for the barbed portion every the ipsilateral penumbra of the electroplated lead and the FPC substrates, the notch section passes through erosion
It carves the electroplated lead and is formed;It is equipped with isolation material layer at the back side of the ends FPC.
2. FPC plates according to claim 1, which is characterized in that the isolation material layer is polyimide layer.
3. FPC plates according to claim 1, which is characterized in that the connecting place packet of the FPC main bodys and the ends FPC
Include rounded corner.
4. FPC plates according to claim 1, which is characterized in that the pad is by surface treatment.
5. FPC plates according to claim 4, which is characterized in that the pad includes the coat of metal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721610797.2U CN207625863U (en) | 2017-11-27 | 2017-11-27 | FPC plates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721610797.2U CN207625863U (en) | 2017-11-27 | 2017-11-27 | FPC plates |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207625863U true CN207625863U (en) | 2018-07-17 |
Family
ID=62824519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201721610797.2U Active CN207625863U (en) | 2017-11-27 | 2017-11-27 | FPC plates |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN207625863U (en) |
-
2017
- 2017-11-27 CN CN201721610797.2U patent/CN207625863U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102500436B1 (en) | Flexible Substrate | |
TW511264B (en) | Semiconductor device, mounting substrate and its manufacturing method, circuit substrate and electronic machine | |
CN105228343A (en) | A kind of Rigid Flex and preparation method thereof | |
CN106304607B (en) | Rigid-flex combined board and preparation method thereof | |
CN102083272B (en) | Circuit board with grounding structure | |
CN207625863U (en) | FPC plates | |
JP2019145765A (en) | Printed circuit board | |
CN100521878C (en) | Method for producing multilayer printed wiring board | |
CN207625864U (en) | FPC plates | |
CN202121857U (en) | Multilayer flexible printed circuit | |
CN207869495U (en) | Circuit board assemblies | |
CN207604001U (en) | FPC plates and the electronic equipment with the FPC plates | |
CN206790781U (en) | Printed substrate is with covering copper composite plate | |
CN205902196U (en) | Flexible printed -circuit board | |
CN201717256U (en) | Passive device and circuit board embedded with same | |
CN208434179U (en) | A kind of circuit board | |
CN110072346B (en) | Gold plating method for key sheet | |
CN210579421U (en) | Flexible circuit board | |
CN207505217U (en) | A kind of novel Enhanced circuit plate | |
CN208490034U (en) | A kind of soft or hard combination core plate of projector | |
CN202679795U (en) | Flexible printed circuit board and electronic component adopting same | |
CN101616534A (en) | Multi-layer printed circuit board and manufacture method thereof | |
JP2012227404A (en) | Flexible printed wiring board | |
CN107634078B (en) | Bottom plate of camera module and camera module | |
CN206212409U (en) | A kind of reinforced copper clad flexible circuit board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |