CN206790768U - Double-side copper foil baseplate structure - Google Patents
Double-side copper foil baseplate structure Download PDFInfo
- Publication number
- CN206790768U CN206790768U CN201720468029.1U CN201720468029U CN206790768U CN 206790768 U CN206790768 U CN 206790768U CN 201720468029 U CN201720468029 U CN 201720468029U CN 206790768 U CN206790768 U CN 206790768U
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- Prior art keywords
- copper foil
- metal substrate
- foil layer
- hole
- double
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Abstract
The utility model discloses a kind of double-side copper foil baseplate structure, including metal substrate, copper foil layer and the epoxy glue adhesion coating between metal substrate and copper foil layer, several horizontal through hole are provided with the middle part of the metal substrate and along its in-plane, several this horizontal through hole are parallel and arranged at equal intervals, the adjacent horizontal through hole at intervals of 10 ~ 30mm, the thickness of upper copper foil layer and lower copper foil layer is 5 ~ 70 microns, and the metal substrate is aluminium base, copper base or iron substrate.The utility model double-side copper foil baseplate structure is advantageous to increase area of dissipation, be advantageous to quickly transmit the heat from copper foil layer device, so as to be advantageous to improve the service life of device, improve the reliability of product, secondly, towards the fan on PCB, the air-flow be advantageous in metal substrate quickly flows several horizontal through hole, so as to which more heats be taken out of.
Description
Technical field
A kind of copper clad laminate, more particularly to double-side copper foil baseplate structure are the utility model is related to, belongs to printed substrate neck
Domain.
Background technology
Printed substrate is the supplier of electronic component electrical connection, and the major advantage using wiring board is that integration is various
The set of electronic component and functional module, greatly reduce hand layouts and assembling mistake, improve electronic product assembling from
Dynamicization level and production efficiency.Wiring board is cut into certain size using insulation board as base material, thereon with multiple conductive patterns, and
Via hole is furnished with, realizes the interconnection between electronic component.
In the prior art because miniaturization of electronic products, the arranging density of device are stepped up, the radiating of heat is increasingly
Seriously, so as to influence the service life of electronic product, therefore, how on the premise of board area is not increased as far as possible, effectively
Heat dispersion is improved, turns into the direction of those of ordinary skill in the art's effort.
The content of the invention
The utility model purpose is to provide a kind of double-side copper foil baseplate structure, and the double-side copper foil baseplate structure is advantageous to increase
Area of dissipation, be advantageous to quickly transmit the heat from copper foil layer device, so as to be advantageous to improve the service life of device, carry
The high reliability of product, secondly, several horizontal through hole are advantageous to the gas in metal substrate towards the fan on PCB
The quick flowing of stream, so as to which more heats be taken out of.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of double-side copper foil baseplate structure, including gold
Belong to substrate, upper copper foil layer and lower copper foil layer, there is the first epoxy glue adhesion coating, the gold between the metal substrate and upper copper foil layer
There is the second epoxy glue adhesion coating between category substrate and lower copper foil layer, be provided with the middle part of the metal substrate and along its in-plane
Several horizontal through hole, several this horizontal through hole are parallel and arranged at equal intervals.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, the adjacent horizontal through hole at intervals of 10 ~ 30mm.
2. in such scheme, the thickness of the metal substrate is 300 ~ 3000 microns.
3. in such scheme, the thickness of the upper copper foil layer and lower copper foil layer is 5 ~ 70 microns.
4. in such scheme, the metal substrate is aluminium base, copper base or iron substrate.
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
The utility model double-side copper foil baseplate structure, if it is located in the middle part of the metal substrate and is provided with along its in-plane
A dry horizontal through hole, several this horizontal through hole are parallel and arranged at equal intervals, are advantageous to increase area of dissipation, be advantageous to by from
The heat of copper foil layer device quickly transmits, and so as to be advantageous to improve the service life of device, improves the reliability of product, its
Secondary, towards the fan on PCB, the air-flow be advantageous in metal substrate quickly flows several horizontal through hole, so that will more
More heats are taken out of.
Brief description of the drawings
Accompanying drawing 1 is the utility model double-side copper foil baseplate structure structural representation；
Accompanying drawing 2 is the A-A cross-sectional views of accompanying drawing 1.
In the figures above：1st, metal substrate；2nd, upper copper foil layer；3rd, the first epoxy glue adhesion coating；4th, horizontal through hole；5th, lower copper foil
Layer；6th, the second epoxy glue adhesion coating.
Embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of double-side copper foil baseplate structure, including metal substrate 1, upper copper foil layer 2 and lower copper foil layer 5, it is described
There is the first epoxy glue adhesion coating 3 between metal substrate 1 and upper copper foil layer 2, have between the metal substrate 1 and lower copper foil layer 5
Second epoxy glue adhesion coating 6, positioned at the middle part of metal substrate 1 and several horizontal through hole 4 are provided with along its in-plane, several
This horizontal through hole 4 is parallel and arranged at equal intervals.
The adjacent horizontal through hole 4 at intervals of 18mm, the thickness of said metal substrates 1 is 2000 microns.
The thickness of above-mentioned upper copper foil layer 2 and lower copper foil layer 5 is 20 microns.
Said metal substrates 1 are iron substrate.
Embodiment 2：A kind of double-side copper foil baseplate structure, including metal substrate 1, upper copper foil layer 2 and lower copper foil layer 5, it is described
There is the first epoxy glue adhesion coating 3 between metal substrate 1 and upper copper foil layer 2, have between the metal substrate 1 and lower copper foil layer 5
Second epoxy glue adhesion coating 6, positioned at the middle part of metal substrate 1 and several horizontal through hole 4 are provided with along its in-plane, several
This horizontal through hole 4 is parallel and arranged at equal intervals.
The adjacent horizontal through hole 4 at intervals of 25mm, the thickness of said metal substrates 1 is 1600 microns.
The thickness of above-mentioned upper copper foil layer 2 and lower copper foil layer 5 is 55 microns.
Said metal substrates 1 are copper base.
During using above-mentioned double-side copper foil baseplate structure, if it is located in the middle part of the metal substrate and is provided with along its in-plane
A dry horizontal through hole, several this horizontal through hole are parallel and arranged at equal intervals, are advantageous to increase area of dissipation, be advantageous to by from
The heat of copper foil layer device quickly transmits, and so as to be advantageous to improve the service life of device, improves the reliability of product, its
Secondary, towards the fan on PCB, the air-flow be advantageous in metal substrate quickly flows several horizontal through hole, so that will more
More heats are taken out of.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (5)
- A kind of 1. double-side copper foil baseplate structure, it is characterised in that：Including metal substrate（1）, upper copper foil layer（2）With lower copper foil layer （5）, the metal substrate（1）With upper copper foil layer（2）Between there is the first epoxy glue adhesion coating（3）, the metal substrate（1）With under Copper foil layer（5）Between there is the second epoxy glue adhesion coating（6）, positioned at the metal substrate（1）Middle part and it is provided with along its in-plane Several horizontal through hole（4）, several this horizontal through hole（4）Parallel and arranged at equal intervals.
- 2. double-side copper foil baseplate structure according to claim 1, it is characterised in that：The adjacent horizontal through hole（4）'s At intervals of 10 ~ 30mm.
- 3. double-side copper foil baseplate structure according to claim 1, it is characterised in that：The metal substrate（1）Thickness be 300 ~ 3000 microns.
- 4. double-side copper foil baseplate structure according to claim 1, it is characterised in that：The upper copper foil layer（2）With lower copper foil Layer（5）Thickness be 5 ~ 70 microns.
- 5. double-side copper foil baseplate structure according to claim 1, it is characterised in that：The metal substrate（1）For aluminium base, Copper base or iron substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720468029.1U CN206790768U (en) | 2017-04-29 | 2017-04-29 | Double-side copper foil baseplate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720468029.1U CN206790768U (en) | 2017-04-29 | 2017-04-29 | Double-side copper foil baseplate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206790768U true CN206790768U (en) | 2017-12-22 |
Family
ID=60709835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720468029.1U Active CN206790768U (en) | 2017-04-29 | 2017-04-29 | Double-side copper foil baseplate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206790768U (en) |
-
2017
- 2017-04-29 CN CN201720468029.1U patent/CN206790768U/en active Active
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