CN206790772U - Metal matrix copper-clad laminate - Google Patents
Metal matrix copper-clad laminate Download PDFInfo
- Publication number
- CN206790772U CN206790772U CN201720470599.4U CN201720470599U CN206790772U CN 206790772 U CN206790772 U CN 206790772U CN 201720470599 U CN201720470599 U CN 201720470599U CN 206790772 U CN206790772 U CN 206790772U
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- China
- Prior art keywords
- copper foil
- foil layer
- shrinkage pool
- clad laminate
- copper
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses a kind of metal matrix copper-clad laminate, including metal substrate, upper copper foil layer and lower copper foil layer, has the first epoxy glue adhesion coating between the metal substrate and upper copper foil layer, has the second epoxy glue adhesion coating between the metal substrate and lower copper foil layer；The metal substrate upper and lower surface has been equally spaced arc shrinkage pool and lower arc shrinkage pool respectively, and the interval of the adjacent upper arc shrinkage pool and lower arc shrinkage pool is 2 ~ 4cm.The utility model metal matrix copper-clad laminate had both improved the adhesive strength of copper foil layer and epoxy glue adhesion coating, the copper foil in PCB following process and etching is avoided to come off, it is also beneficial to increase area of dissipation, be advantageous to quickly transmit the heat from copper foil layer device, so as to be advantageous to improve the service life of device.
Description
Technical field
A kind of copper clad laminate, more particularly to metal matrix copper-clad laminate are the utility model is related to, belongs to printed substrate field.
Background technology
Printed substrate is the supplier of electronic component electrical connection, and the major advantage using wiring board is that integration is various
The set of electronic component and functional module, greatly reduce hand layouts and assembling mistake, improve electronic product assembling from
Dynamicization level and production efficiency.Wiring board is cut into certain size using insulation board as base material, thereon with multiple conductive patterns, and
Via hole is furnished with, realizes the interconnection between electronic component.
In the prior art because miniaturization of electronic products, the arranging density of device are stepped up, the radiating of heat is increasingly
Seriously, so as to influence the service life of electronic product, therefore, how on the premise of board area is not increased as far as possible, effectively
Heat dispersion is improved, turns into the direction of those of ordinary skill in the art's effort.
The content of the invention
The utility model purpose is to provide a kind of metal matrix copper-clad laminate, and the metal matrix copper-clad laminate both improves copper foil layer
With the adhesive strength of epoxy glue adhesion coating, avoid the copper foil in PCB following process and etching and come off, be also beneficial to increase radiating
Area, be advantageous to quickly transmit the heat from copper foil layer device, so as to be advantageous to improve the service life of device.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of metal matrix copper-clad laminate, including metal
Substrate, upper copper foil layer and lower copper foil layer, there is the first epoxy glue adhesion coating, the metal between the metal substrate and upper copper foil layer
There is the second epoxy glue adhesion coating between substrate and lower copper foil layer；
The metal substrate upper and lower surface has been equally spaced arc shrinkage pool respectively and lower arc is recessed
Hole.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, the interval of the adjacent upper arc shrinkage pool and lower arc shrinkage pool is 2 ~ 4cm.
2. in such scheme, the thickness of the metal substrate is 300 ~ 3000 microns.
3. in such scheme, the thickness of the upper copper foil layer and lower copper foil layer is 5 ~ 70 microns.
4. in such scheme, the thickness of the first epoxy glue adhesion coating and the second epoxy glue adhesion coating is 80 ~ 200 microns.
5. in such scheme, the metal substrate is aluminium base, copper base or iron substrate.
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
The utility model metal matrix copper-clad laminate, its metal substrate upper and lower surface have been equally spaced respectively
Arc shrinkage pool and lower arc shrinkage pool, had both improved the adhesive strength of copper foil layer and epoxy glue adhesion coating, had avoided follow-up in PCB
Copper foil comes off in processing and etching, is also beneficial to increase area of dissipation, is advantageous to the heat from copper foil layer device is quick
Transmit, so as to be advantageous to improve the service life of device.
Brief description of the drawings
Accompanying drawing 1 is the utility model metal matrix copper-clad laminate structural representation.
In the figures above：1st, metal substrate；2nd, upper copper foil layer；3rd, the first epoxy glue adhesion coating；5th, lower copper foil layer；6th, the second ring
Oxygen adhesive layer；7th, upper arc shrinkage pool；8th, lower arc shrinkage pool.
Embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of metal matrix copper-clad laminate, including metal substrate 1, upper copper foil layer 2 and lower copper foil layer 5, the gold
There is the first epoxy glue adhesion coating 3 between category substrate 1 and upper copper foil layer 2, with the between the metal substrate 1 and lower copper foil layer 5
Diepoxy adhesive layer 6；
The upper and lower surface of metal substrate 1 has been equally spaced arc shrinkage pool 7 and lower arc respectively
Shrinkage pool 8.
The adjacent upper arc shrinkage pool 7 and the interval of lower arc shrinkage pool 8 are 2.4cm.
The thickness of said metal substrates 1 is 800 microns.
The thickness of above-mentioned upper copper foil layer 2 and lower copper foil layer 5 is 60 microns.
Above-mentioned the first epoxy glue adhesion coating 3 and the thickness of the second epoxy glue adhesion coating 6 stated is 110 microns.
Said metal substrates 1 are iron substrate.
Embodiment 2：A kind of metal matrix copper-clad laminate, including metal substrate 1, upper copper foil layer 2 and lower copper foil layer 5, the gold
There is the first epoxy glue adhesion coating 3 between category substrate 1 and upper copper foil layer 2, with the between the metal substrate 1 and lower copper foil layer 5
Diepoxy adhesive layer 6；
The upper and lower surface of metal substrate 1 has been equally spaced arc shrinkage pool 7 and lower arc respectively
Shrinkage pool 8.
The adjacent upper arc shrinkage pool 7 and the interval of lower arc shrinkage pool 8 are 3.6cm.
The thickness of said metal substrates 1 is 2500 microns.
The thickness of above-mentioned upper copper foil layer 2 and lower copper foil layer 5 is 40 microns.
Above-mentioned the first epoxy glue adhesion coating 3 and the thickness of the second epoxy glue adhesion coating 6 stated is 150 microns.
Said metal substrates 1 are aluminium base.
During using above-mentioned metal matrix copper-clad laminate, its metal substrate upper and lower surface has been equally spaced respectively
Arc shrinkage pool and lower arc shrinkage pool, had both improved the adhesive strength of copper foil layer and epoxy glue adhesion coating, had avoided follow-up in PCB
Copper foil comes off in processing and etching, is also beneficial to increase area of dissipation, is advantageous to the heat from copper foil layer device is quick
Transmit, so as to be advantageous to improve the service life of device.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (6)
- A kind of 1. metal matrix copper-clad laminate, it is characterised in that：Including metal substrate（1）, upper copper foil layer（2）With lower copper foil layer（5）, The metal substrate（1）With upper copper foil layer（2）Between there is the first epoxy glue adhesion coating（3）, the metal substrate（1）With lower copper foil Layer（5）Between there is the second epoxy glue adhesion coating（6）；The metal substrate（1）Upper and lower surface has been equally spaced arc shrinkage pool respectively（7）With lower arc Shrinkage pool（8）.
- 2. metal matrix copper-clad laminate according to claim 1, it is characterised in that：The adjacent upper arc shrinkage pool（7） With lower arc shrinkage pool（8）Interval be 2 ~ 4cm.
- 3. metal matrix copper-clad laminate according to claim 1, it is characterised in that：The metal substrate（1）Thickness be 300 ~ 3000 microns.
- 4. metal matrix copper-clad laminate according to claim 1, it is characterised in that：The upper copper foil layer（2）With lower copper foil layer （5）Thickness be 5 ~ 70 microns.
- 5. metal matrix copper-clad laminate according to claim 1, it is characterised in that：The first epoxy glue adhesion coating（3）With Diepoxy adhesive layer（6）Thickness be 80 ~ 200 microns.
- 6. metal matrix copper-clad laminate according to claim 1, it is characterised in that：The metal substrate（1）For aluminium base, copper Substrate or iron substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720470599.4U CN206790772U (en) | 2017-04-29 | 2017-04-29 | Metal matrix copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720470599.4U CN206790772U (en) | 2017-04-29 | 2017-04-29 | Metal matrix copper-clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206790772U true CN206790772U (en) | 2017-12-22 |
Family
ID=60710375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720470599.4U Active CN206790772U (en) | 2017-04-29 | 2017-04-29 | Metal matrix copper-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206790772U (en) |
-
2017
- 2017-04-29 CN CN201720470599.4U patent/CN206790772U/en active Active
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