CN109743837A - Glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof - Google Patents
Glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof Download PDFInfo
- Publication number
- CN109743837A CN109743837A CN201910197289.3A CN201910197289A CN109743837A CN 109743837 A CN109743837 A CN 109743837A CN 201910197289 A CN201910197289 A CN 201910197289A CN 109743837 A CN109743837 A CN 109743837A
- Authority
- CN
- China
- Prior art keywords
- glass
- glass substrate
- printing
- powder
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 98
- 239000000758 substrate Substances 0.000 title claims abstract description 54
- 238000004587 chromatography analysis Methods 0.000 title claims abstract description 15
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000000843 powder Substances 0.000 claims abstract description 33
- 238000005245 sintering Methods 0.000 claims abstract description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910000906 Bronze Inorganic materials 0.000 claims abstract description 14
- 239000010974 bronze Substances 0.000 claims abstract description 14
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000007646 gravure printing Methods 0.000 claims abstract description 8
- 238000007650 screen-printing Methods 0.000 claims abstract description 4
- 238000007639 printing Methods 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- OGFYIDCVDSATDC-UHFFFAOYSA-N silver silver Chemical compound [Ag].[Ag] OGFYIDCVDSATDC-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000004020 luminiscence type Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
A kind of glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof, the glass substrate light source circuit board and preparation method thereof, glass powder bronze mixed ink and glass powder silver powder mixed ink are used on the glass substrate, it is printed by gravure printing and silk-screen printing chromatography twice, and glass circuit substrate plate is formd by high temperature sintering twice, the yield rate of product can be increased substantially, production cost can be reduced simultaneously, the glass circuit substrate plate has good solderability and good conveyance capacity, alternative existing LED light source circuit plate and other circuit boards.
Description
Technical field:
The present invention relates to a kind of glass circuit substrate plate, especially a kind of glass substrate bimetallic chromatography LED light source circuit plate and
Preparation method, the light source circuit board and preparation method thereof are solved by the printing process of bimetallic chromatography on the glass substrate
The solderability of pad on glass circuit substrate plate, and the printing precision of pad is improved by bimetallic chromatography.
Background technique:
It is electrically conductive ink, electroluminescent in recent years, the type of ink is also quickling increase with the fast development of printed electronics
Color shifting ink etc. has been commonly utilized in different printed electronic fields, in printed electronics technical field, it is already possible to film crystalline substance
The thin-film electronic elements such as body pipe, resistance, inductance and capacitor are printed on the grounds such as stationery, dry goods, PVC plastic, leather,
But the fusing point of the resin glue added in common conductive ink is lower, and when using electric iron welding LED luminescence chip, electricity is ironed
The melting point resins glue that the temperature of iron is higher than resin glue will melt, and cause common electrically conductive ink not have solderability, in order to solve
Solderability problem, addition glass powder is for bonding glass substrate in the existing ink on LED glass circuit substrate plate
And electrically conductive ink, the fusing point of glass powder are 650 DEG C, temperature when LED luminescence chip are welded much higher than electric iron, so glass powder
It will not melt, therefore the ink can be used on LED glass circuit substrate plate, which has solderability.
Existing LED glass circuit substrate plate is all to use silk screen monochromatic print mode, on LED glass circuit substrate plate
Circuit and pad are all to use silver as printing material, there are problems that following two:
But when using silk-screen printing, the jagged out-of-flatness of the pad edge being printed on glass circuit substrate plate can not accurately really
Determine pad spacing dimension, and the pad spacing of existing LED luminescence chip is smaller, generally between 70um to 150um, is easy to cause
LED luminescence chip short circuit, and use silver as single printing material, since silver is inadequate with substrate of glass bond strength, weldering
Pad is easy to be absorbed by scolding tin when connecing, and leads to Pad off.
Summary of the invention:
In order to solve the problems, such as existing LED glass circuit board pad solderability and pad printing precision, the present invention is directed to
The shortcomings of the prior art improves the prior art, proposes a kind of glass substrate bimetallic chromatography LED light source electricity
Road plate and preparation method thereof, the glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof, makes on the glass substrate
With glass powder bronze mixed ink and glass powder silver powder mixed ink, printed by gravure printing and silk-screen printing chromatography twice,
And by glass circuit substrate plate made of high temperature sintering twice, selection transparent glass first is as glass substrate, using glass
Flour gold powder mixed ink is printed pad on the glass substrate by the higher gravure printing mode of printing precision, because gold is molten
Point is higher to be can be very good to solve the problems, such as pad solderability, simultaneously as the printing precision of gravure printing mode is higher, is solved
Then the jagged problem of the pad edge out-of-flatness of other mode of printings passes through wire-mesh cover using glass powder silver powder mixed ink
The printing of the conducting wire between pad will be electrically connected on the glass substrate by printing mode of printing, can be with by Silkscreen print mode of printing
Conducting wire printing precision problem between very good solution pad and pad, simultaneously as the printing of Silkscreen print mode of printing
Conducting wire is thicker, and the electric current that route passes through is also larger, and the overcurrent requirement of very good solution LED line road high current passes through two
Secondary printing and high-temperature sintering process twice form glass circuit substrate plate, and the glass circuit substrate plate and preparation method thereof can
The yield rate of product is increased substantially, while production cost can be reduced.
The technical solution adopted by the present invention to solve the technical problems is: selection transparent glass first as glass substrate,
Glass powder bronze mixed ink is mixed and made into using glass powder and bronze, passes through gravure printing using glass powder bronze mixed ink
Mode prints pad on the glass substrate, and the glass substrate for being printed on pad is carried out first time high temperature sintering, high for the first time
In warm sintering process, glass powder is simultaneously bonded bronze on the glass substrate, is then mixed and made into glass using glass powder silver powder
Glass powder silver powder mixed ink will be electrically connected between pad using glass powder silver powder mixed ink by Silkscreen print mode of printing
Conducting wire is printed on the glass substrate after first time high temperature sintering, the glass base after being then again completed for printing Silkscreen print
Plate carries out second of high temperature sintering, and in second of high-temperature sintering process, silver powder is simultaneously bonded in glass substrate by glass powder
On, by above-mentioned printing twice and high-temperature sintering process twice, forms with good solderability and there is high printing essence
The LED glass circuit substrate plate of degree.
Detailed description of the invention
The following further describes the present invention with reference to the drawings.
Fig. 1 is overall structure figure of the invention.
Fig. 2 is A-A cross-sectional view of the invention.
In Fig. 1 and Fig. 2, selection transparent glass first is mixed and made into glass using glass powder bronze as glass substrate 1-1
Pad 2-1 to 2-24 is printed on glass by gravure printing mode using glass powder bronze mixed ink by flour gold powder mixed ink
On glass substrate 1-1, the glass substrate 1-1 for being printed on pad is subjected to first time high temperature sintering, in first time high-temperature sintering process,
High temperature makes the glass powder in pad 2-1 to 2-24 and the bronze good bond in pad 2-1 to 2-24 in glass base
On plate 1-1, glass powder silver powder mixed ink is then mixed and made into using glass powder silver powder, it is logical using glass powder silver powder mixed ink
Cross Silkscreen print mode of printing by be electrically connected pad between conducting wire 3-1 to 3-17 be printed on first time high temperature sintering after
On glass substrate 1-1, glass substrate 1-1 after being then again completed for printing Silkscreen print carries out second of high temperature sintering, the
In secondary high-temperature sintering process, high temperature makes the glass powder in conducting wire 3-1 to 3-17 and conducting wire 3-1 to 3-
Silver powder good bond in 17, by above-mentioned printing twice and high-temperature sintering process twice, ultimately forms on glass substrate 1-1
With good solderability and with the LED glass circuit substrate plate of high printing precision.
Claims (4)
1. a kind of glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof, it is characterized in that: making on the glass substrate
With glass powder bronze mixed ink and glass powder silver powder mixed ink, printed by gravure printing and silk-screen printing chromatography twice,
And glass circuit substrate plate is made by high temperature sintering twice.
2. the glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof according to claim 1, feature
Be: glass substrate selection transparent glass is process.
3. the glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof according to claim 1, feature
It is: glass powder bronze mixed ink is mixed and made into using glass powder and bronze, and it is recessed to use glass powder bronze mixed ink to pass through
The glass substrate of pad will be printed on the glass substrate and carry out first time high temperature sintering by printing mode of printing and printing pad, the
In high-temperature sintering process, glass powder is simultaneously bonded bronze on the glass substrate, can be more very because the fusing point of gold is higher
Good solves the problems, such as pad solderability, by using the higher gravure printing mode of printing precision, solves pad edge not
Smooth jagged problem.
4. the glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof according to claim 1, feature
It is: glass powder silver powder mixed ink is mixed and made into using glass powder and silver powder, and passes through silk using glass powder silver powder mixed ink
Net cover prints on the glass substrate after the conducting wire being electrically connected between pad is printed on first time high temperature sintering by mode of printing, so
Glass substrate after being afterwards again completed for printing Silkscreen print carries out second of high temperature sintering, in second of high-temperature sintering process,
Glass powder simultaneously bonds silver silver on the glass substrate, can be very good to solve pad and weldering by using Silkscreen print printing
Conducting wire printing precision problem between disk, simultaneously as the conducting wire of Silkscreen print mode of printing printing is thicker, route
By electric current it is also larger, the overcurrent requirement of very good solution route high current.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910197289.3A CN109743837A (en) | 2019-03-15 | 2019-03-15 | Glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910197289.3A CN109743837A (en) | 2019-03-15 | 2019-03-15 | Glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109743837A true CN109743837A (en) | 2019-05-10 |
Family
ID=66370586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910197289.3A Pending CN109743837A (en) | 2019-03-15 | 2019-03-15 | Glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109743837A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114466528A (en) * | 2022-02-16 | 2022-05-10 | 江苏大学 | Rapid preparation method of flexible conductive circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103219448A (en) * | 2013-04-12 | 2013-07-24 | 杭州普朗克光电科技有限公司 | Method for welding light emitting diode (LED) on glass |
| CN104272883A (en) * | 2012-03-02 | 2015-01-07 | 诺瓦利亚公司 | Circuit board assembly |
| CN104407735A (en) * | 2014-11-11 | 2015-03-11 | 长沙市宇顺显示技术有限公司 | Touch screen leading wire conductive circuit, manufacturing method thereof, and touch screen mobile phone |
| CN105682346A (en) * | 2016-02-03 | 2016-06-15 | 武汉华尚绿能科技股份有限公司 | Manufacturing method for high-conduction transparent glass-based circuit board |
-
2019
- 2019-03-15 CN CN201910197289.3A patent/CN109743837A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104272883A (en) * | 2012-03-02 | 2015-01-07 | 诺瓦利亚公司 | Circuit board assembly |
| CN103219448A (en) * | 2013-04-12 | 2013-07-24 | 杭州普朗克光电科技有限公司 | Method for welding light emitting diode (LED) on glass |
| CN104407735A (en) * | 2014-11-11 | 2015-03-11 | 长沙市宇顺显示技术有限公司 | Touch screen leading wire conductive circuit, manufacturing method thereof, and touch screen mobile phone |
| CN105682346A (en) * | 2016-02-03 | 2016-06-15 | 武汉华尚绿能科技股份有限公司 | Manufacturing method for high-conduction transparent glass-based circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114466528A (en) * | 2022-02-16 | 2022-05-10 | 江苏大学 | Rapid preparation method of flexible conductive circuit board |
| CN114466528B (en) * | 2022-02-16 | 2023-12-15 | 江苏大学 | Rapid preparation method of flexible conductive circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101243552B (en) | Radio frequency identification device and method for manufacturing radio frequency identification device | |
| CN101692360B (en) | Chip type thermal resistor and manufacturing method thereof | |
| CN106098277B (en) | Flexible LED lamp bar dedicated resistor and its manufacturing method | |
| CN104797083B (en) | The method and its printed circuit board of embedding resistance in printed circuit board | |
| CN107394366A (en) | A kind of extensive mimo antenna structure and manufacturing process | |
| CN107825881A (en) | A kind of conductive heat transfer colour ribbon for RFID printings and preparation method and application | |
| CN102646606A (en) | Packaging method of integrated circuit (IC) card module | |
| CN103329263A (en) | Stitch bump stacking design for overall package size reduction for multiple stack | |
| CN103140055A (en) | Surface mount technology process for advanced quad flat no-lead package process and stencil used therewith | |
| CN109743837A (en) | Glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof | |
| CN109360882A (en) | A kind of double-colored upside-down mounting COB that monochromatic front is luminous | |
| CN108493121B (en) | A kind of support plate production and packaging method solving double-sided circuit wafer short-circuited with solder | |
| CN206758464U (en) | A kind of LED packaged light sources based on ceramic substrate | |
| CN107615893B (en) | Circuit board, electronic device and electronic module | |
| CN102339759A (en) | Ball-mounting method of flip substrate | |
| CN202075772U (en) | Contact-type integrated card (IC) module | |
| CN203312286U (en) | All card payment smart card carrying belt | |
| CN108417522A (en) | Three ply board structural circuit packaging method | |
| CN104600047B (en) | Power module and packaging method thereof | |
| CN109982516A (en) | Vacuum-sintering precipitation and separation glass circuit substrate plate and preparation method thereof | |
| CN205987536U (en) | Fixed subassembly of metal shrapnel and mobile terminal | |
| CN104051284B (en) | Electronic packaging structure and manufacture method thereof | |
| CN207283941U (en) | A kind of electronic circuit board graft structure | |
| CN107071944A (en) | A kind of electrical heating face equipment and preparation method thereof | |
| CN102892256A (en) | Method for sticking electronic element on surface of printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190510 |
|
| WD01 | Invention patent application deemed withdrawn after publication |