CN220510060U - COB packaging substrate - Google Patents
COB packaging substrate Download PDFInfo
- Publication number
- CN220510060U CN220510060U CN202322156085.XU CN202322156085U CN220510060U CN 220510060 U CN220510060 U CN 220510060U CN 202322156085 U CN202322156085 U CN 202322156085U CN 220510060 U CN220510060 U CN 220510060U
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- Prior art keywords
- bonding pad
- substrate
- negative electrode
- pad
- positive electrode
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- 239000000758 substrate Substances 0.000 title claims abstract description 71
- 238000004806 packaging method and process Methods 0.000 title abstract description 13
- 239000011231 conductive filler Substances 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 10
- 238000003825 pressing Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model discloses a COB packaging substrate, which comprises a substrate, wherein the front side and the back side of the substrate are both provided with circuit layers; an LED chip is arranged in the middle of the front surface of the substrate, and a first negative electrode bonding pad, a first positive electrode bonding pad and a bonding wire bonding pad are arranged on a circuit layer of the front surface of the substrate; the circuit layer on the back side of the substrate is provided with a power negative electrode circuit and a power positive electrode circuit, a second negative electrode bonding pad cover is welded on the power negative electrode circuit, a second positive electrode bonding pad cover is welded on the power positive electrode circuit, a bonding pad that a through hole penetrates through the substrate and the front side and the back side of the substrate is arranged, and conductive filler is arranged in the through hole for filling. The utility model has reasonable structural design and has the following beneficial effects: the circuit layers are arranged on the front side and the back side of the substrate, and the conductive filler is arranged in the through hole, so that the front side and the back side can be electrically connected, the operation is convenient during application, and the positive and negative electrode leads are omitted; meanwhile, the welding pads are used for welding the radiating plates, bottom radiating glue is removed, and screws or pressing plates are used for fixing, so that the cost can be reduced.
Description
Technical Field
The utility model relates to the technical field of COB illumination, in particular to a COB packaging substrate.
Background
COB packages, collectively known as Chip On Board (COB), are one technique that aims to solve the problem of LED heat dissipation. The bare chip is adhered to the interconnection substrate by conductive or non-conductive adhesive, and then wire bonding is performed to realize the electrical connection. COB packages are susceptible to contamination or human damage if the bare chip is directly exposed to air, affecting or destroying the chip functionality, and thus encapsulating the chip and bond wires with glue. This form of packaging is also known as soft encapsulation.
The existing COB packaging substrate is printed with a circuit layer on the front side and no circuit is printed on the bottom; the bottom is coated with heat-dissipating glue during installation, then the heat radiator is fixed through a screw or a pressing plate, and the anode and the cathode are led out through a lead and connected with an upper power supply, so that the lamp is assembled, the assembly is complex, the steps are complicated, the cost is high, and the automatic operation is difficult to realize.
Disclosure of Invention
The utility model aims to provide a COB packaging substrate which is simple to assemble, low in cost and capable of realizing automatic production.
In order to achieve the above purpose, the technical scheme of the utility model provides a COB packaging substrate, which comprises a substrate, wherein the front and the back of the substrate are provided with circuit layers; an LED chip is arranged in the middle of the front surface of the substrate; a front bonding pad is arranged on the circuit layer on the front side of the substrate, and comprises a first negative bonding pad, a first positive bonding pad and a bonding wire bonding pad; the positive electrode and the negative electrode of the LED chip are electrically connected with the bonding wire bonding pad, through holes are formed in the first negative electrode bonding pad and the first positive electrode bonding pad, and through holes are also formed in the positions of the substrate, the circuit layer, the first negative electrode bonding pad and the first positive electrode bonding pad, which correspond to the through holes; a power negative electrode line and a power positive electrode line are arranged on the line layer on the back surface of the substrate, a second negative electrode bonding pad cover is welded on the power negative electrode line, and a second positive electrode bonding pad cover is welded on the power positive electrode line; the power negative electrode line is electrically connected with the second negative electrode bonding pad, and the power positive electrode line is electrically connected with the second positive electrode bonding pad; the second negative electrode pad and the second positive electrode pad are provided with through holes, and the positions of the through holes on the second negative electrode pad and the second positive electrode pad correspond to the positions of the through holes on the first negative electrode pad and the first positive electrode pad; conductive fillers are arranged in the through holes; the bottom bonding pad is welded at the center of the back surface of the substrate; a power circuit and a heat dissipation plate are welded on the bottom bonding pad; the second negative electrode pad and the second positive electrode pad are respectively and electrically connected with the first negative electrode pad and the first positive electrode pad through conductive fillers in the through holes.
Further, the first negative electrode bonding pad, the first positive electrode bonding pad, the second negative electrode bonding pad and the second positive electrode bonding pad are arranged at corners of the substrate, and the bonding wire bonding pad is arranged beside the chip.
Further, the circuit layer is a copper circuit layer.
Further, the bonding wire bonding pad is welded on the circuit layer on the front face of the substrate, and the anode and the cathode of the LED chip are electrically connected with the bonding wire bonding pad through a wire.
Further, the wire is gold wire or silver wire.
Further, the conductive filler arranged in the through hole is copper filler.
Further, the power supply circuit and the heat dissipation plate are welded on the bottom bonding pad through conductive welding paste.
Further, the welding paste is solder paste.
Further, the area of the circuit layer uncovered by the bonding pad is provided with an ink layer.
In summary, the device provided by the utility model has reasonable structural design, and has the following beneficial effects by applying the technical scheme of the utility model: the circuit layers are arranged on the front side and the back side of the substrate, and the conductive filler is arranged in the through hole, so that the front side and the back side can be electrically connected, the operation is convenient in application, and the positive and negative electrode leads are omitted; meanwhile, the welding pads are used for welding the radiating plates, bottom radiating glue is removed, screws or pressing plates are used for fixing, and cost is reduced.
Drawings
FIG. 1 is a side view of the present utility model;
FIG. 2 is a front view of a substrate of the present utility model;
FIG. 3 is a reverse side view of a substrate of the present utility model;
reference numerals illustrate: 1-a substrate; 2-a circuit layer; a 3-LED chip; 4-a first negative electrode pad; 5-a first positive electrode pad; 6-bonding wire bonding pads; 7-a second negative electrode pad; 8-a second positive electrode pad; 9-through holes; 10-bottom pads; 11-a power supply line and a heat dissipation plate; 12-ink layer.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model, but the scope of protection of the present utility model is not limited.
In the present utility model, for a clearer description, the following description is made: the observer views fig. 1 with the front left side of the observer set to the front, the rear right side of the observer set to the rear, the rear left side of the observer set to the left, the front right side of the observer set to the right, the upper side of the observer set to the upper side, and the lower side of the observer set to the lower side, and it should be noted that the terms "front end", "rear end", "left side", "right side", "middle", "upper", "lower", etc. in this text indicate orientations or positional relationships based on the orientations or positional relationships set in the drawings, and are merely for convenience of clearly describing the present utility model, but do not indicate or imply that the structures or components to be referred to must have specific orientations, be constructed in specific orientations, and therefore should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," "fourth" and the like are used for clarity or to simplify the description, and are not to be construed as indicating or implying a relative importance or quantity.
Referring to fig. 1-3, the utility model provides a COB package substrate, which comprises a substrate 1, wherein the front and back sides of the substrate 1 are respectively provided with a circuit layer 2; an LED chip 3 is arranged in the middle of the front surface of the substrate 1, and the LED chip 3 is solidified by adopting packaging adhesive; a front bonding pad is arranged on the circuit layer 2 on the front side of the substrate 1, and comprises a first negative bonding pad 4, a first positive bonding pad 5 and a bonding wire bonding pad 6; the anode and the cathode of the LED chip 3 are electrically connected with the bonding wire bonding pad 6, through holes 9 are formed in the first anode bonding pad 4 and the first cathode bonding pad 5, and through holes 9 are also formed in the positions of the substrate 1, the circuit layer 2, the first anode bonding pad 4 and the first cathode bonding pad 5, which correspond to the through holes 9; a power negative electrode line and a power positive electrode line are arranged on the line layer 2 on the back surface of the substrate 1, a second negative electrode bonding pad 7 is welded on the power negative electrode line to cover the power negative electrode line, and a second positive electrode bonding pad 8 is welded on the power positive electrode line to cover the power positive electrode line; the power negative electrode line is electrically connected with the second negative electrode bonding pad 7, and the power positive electrode line is electrically connected with the second positive electrode bonding pad 8; the second negative electrode bonding pad 7 and the second positive electrode bonding pad 8 are provided with through holes 9, and the positions of the through holes 9 on the second negative electrode bonding pad 7 and the second positive electrode bonding pad 8 correspond to the positions of the through holes 9 on the first negative electrode bonding pad 4 and the first positive electrode bonding pad 5; conductive fillers are arranged in the through holes 9; the center of the back surface of the substrate 1 is welded with a bottom bonding pad 10; a power supply circuit and a heat dissipation plate 11 are welded on the bottom bonding pad 10; the second negative electrode pad 7 and the second positive electrode pad 8 are electrically connected to the first negative electrode pad 4 and the first positive electrode pad 5, respectively, through conductive fillers in the through holes 9.
The base plate 1 is non-solderable, and is coated with a layer of heat dissipation glue for heat dissipation, and the scheme is characterized in that a welding pad is arranged and a welding paste is adopted for welding the heat dissipation plate, so that bottom heat dissipation glue and screws or pressing plates are removed for fixation, the cost is reduced, and heat is led out to the heat dissipation plate through the welding pad.
In a preferred embodiment, the first negative electrode pad 4, the first positive electrode pad 5, the second negative electrode pad 7 and the second positive electrode pad 8 are arranged at the corners of the substrate 1, and the bonding wire pad 6 is arranged beside the chip.
In a preferred embodiment, the circuit layer 2 is a copper circuit layer.
Specifically, the bonding wire pad 6 is soldered on the wiring layer 2 on the front surface of the substrate 1, and the anode and cathode of the LED chip 3 are electrically connected with the bonding wire pad 6 through wires.
In a preferred embodiment, the wire is a gold wire or a silver wire.
In a preferred embodiment, the conductive filler provided in the via hole 9 is a copper filler.
In a preferred embodiment, the encapsulation glue is a silicone glue mixed with phosphor.
Specifically, the power supply line and the heat dissipation plate 11 are soldered to the bottom pad 10 by conductive solder paste.
In a preferred embodiment, the solder paste is a solder paste.
In a preferred embodiment, the circuit layer 2 is not covered by the ink layer 12 in the pad coverage area, so that a more beautiful and insulating effect can be achieved.
The installation step comprises the following steps:
firstly, adopting a copper foil printed circuit layer 2 on the front and back sides of a substrate 1, then placing an LED chip 3 in the center of the front side of the substrate 1, welding a bonding wire bonding pad 6 on the circuit layer 2 on the front side of the substrate 1, connecting the anode and the cathode of the LED chip 3 with the bonding wire bonding pad 6 by using a lead, and then packaging the LED chip 3, namely curing and packaging the LED chip 3 by using silicone glue mixed with fluorescent powder; a first negative electrode bonding pad 4, a first positive electrode bonding pad 5 and a bonding wire bonding pad 6 are welded on the circuit layer 2 on the front surface of the substrate 1, through holes 9 are formed in the first negative electrode bonding pad 4 and the first positive electrode bonding pad 5, and through holes 9 are also formed in the substrate 1 and the circuit layer 2 at positions corresponding to the through holes 9 in the first negative electrode bonding pad 4 and the first positive electrode bonding pad 5; a power negative electrode line and a power positive electrode line are arranged on the line layer 2 on the back surface of the substrate 1, a second negative electrode bonding pad 7 is welded on the power negative electrode line to cover the power negative electrode line, and a second positive electrode bonding pad 8 is welded on the power positive electrode line to cover the power positive electrode line; the second negative electrode bonding pad 7 and the second positive electrode bonding pad 8 are provided with through holes 9, and the positions of the through holes 9 on the second negative electrode bonding pad 7 and the second positive electrode bonding pad 8 correspond to the positions of the through holes 9 on the first negative electrode bonding pad 4 and the first positive electrode bonding pad 5; conductive fillers are arranged in the through holes 9; a bottom bonding pad 10 is welded on the center of the back surface of the substrate 1, and a power supply circuit and a heat dissipation plate 11 are welded on the bottom bonding pad 10.
As can be seen from the above, when the power is on, the power negative electrode circuit and the power positive electrode circuit are connected with the circuits on the front and the back through the circuit layer 2 made of copper foil, the first negative electrode bonding pad 4, the first positive electrode bonding pad 5, the second negative electrode bonding pad 7, the second positive electrode bonding pad 8, the substrate 1 and the through holes 9 on the circuit layer 2, so that the electric conduction of the back through holes 9 to the circuit layer 2 on the front can be achieved, then the bonding wire bonding pad 6 can be conducted to the LED chip 3 through the circuit layer 2, and when the COB light source is installed, the positive and negative electrode leads are removed.
The device can also realize automatic installation.
When in use, firstly, LED packaging is carried out on the front surface of the substrate 1, namely, chips are distributed in the middle of the substrate 1 according to the requirement, the anode and the cathode of the chips are connected with the bonding wire bonding pad 6 by leads, and then the packaging glue is solidified; secondly, the packaged substrate 1 is mounted on a power circuit and a heat dissipation plate 11, during mounting, the electric conduction and heat conduction paste is placed in a steel mesh with a pattern, the steel mesh is printed on a bottom bonding pad 10 on the back surface of the substrate 1 corresponding to the power circuit and the heat dissipation plate 11, the substrate 1 is automatically placed at a corresponding position by a machine, and then the substrate 1 is connected with the power circuit and the heat dissipation plate 11 through reflow soldering or a heating table.
While the foregoing is directed to the preferred embodiments of the present utility model, it will be appreciated by those skilled in the art that changes and modifications may be made without departing from the principles of the utility model, such changes and modifications are also intended to be within the scope of the utility model.
Claims (9)
1. A COB package substrate, comprising a substrate, characterized in that: the front and back sides of the substrate are provided with circuit layers;
an LED chip is arranged in the middle of the front surface of the substrate;
a front bonding pad is arranged on the circuit layer on the front side of the substrate, and comprises a first negative bonding pad, a first positive bonding pad and a bonding wire bonding pad;
the anode and the cathode of the LED chip are electrically connected with the bonding wire bonding pad,
through holes are formed in the first negative electrode bonding pad and the first positive electrode bonding pad, and through holes are also formed in the positions of the substrate and the circuit layer, which correspond to the through holes in the first negative electrode bonding pad and the first positive electrode bonding pad;
a power negative electrode line and a power positive electrode line are arranged on the line layer on the back surface of the substrate, a second negative electrode bonding pad cover is welded on the power negative electrode line, and a second positive electrode bonding pad cover is welded on the power positive electrode line;
the power negative electrode line is electrically connected with the second negative electrode bonding pad, and the power positive electrode line is electrically connected with the second positive electrode bonding pad;
the second negative electrode pad and the second positive electrode pad are provided with through holes, and the positions of the through holes on the second negative electrode pad and the second positive electrode pad correspond to the positions of the through holes on the first negative electrode pad and the first positive electrode pad;
conductive fillers are arranged in the through holes;
the bottom bonding pad is welded at the center of the back surface of the substrate;
a power circuit and a heat dissipation plate are welded on the bottom bonding pad;
the second negative electrode pad and the second positive electrode pad are respectively and electrically connected with the first negative electrode pad and the first positive electrode pad through conductive fillers in the through holes.
2. The COB package substrate of claim 1, wherein: the first negative electrode bonding pad, the first positive electrode bonding pad, the second negative electrode bonding pad and the second positive electrode bonding pad are arranged at corners of the substrate, and the bonding wire bonding pad is arranged beside the chip.
3. The COB package substrate of claim 1 or 2, wherein: the circuit layer is a copper circuit layer.
4. The COB package substrate of claim 3, wherein: and the bonding wire bonding pad is welded on the circuit layer on the front surface of the substrate, and the anode and the cathode of the LED chip are electrically connected with the bonding wire bonding pad through a wire.
5. The COB package substrate of claim 4, wherein: the lead is gold wire or silver wire.
6. The COB package substrate of claim 1, wherein: the conductive filler arranged in the through hole is copper filler.
7. The COB package substrate of claim 1, wherein: the power supply circuit and the heat dissipation plate are welded on the bottom bonding pad through conductive welding paste.
8. The COB package substrate of claim 7, wherein: the welding paste is solder paste.
9. The COB package substrate of claim 1, wherein: the area of the circuit layer, which is not covered by the bonding pad, is provided with an ink layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322156085.XU CN220510060U (en) | 2023-08-10 | 2023-08-10 | COB packaging substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322156085.XU CN220510060U (en) | 2023-08-10 | 2023-08-10 | COB packaging substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220510060U true CN220510060U (en) | 2024-02-20 |
Family
ID=89875868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322156085.XU Active CN220510060U (en) | 2023-08-10 | 2023-08-10 | COB packaging substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220510060U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119816033A (en) * | 2025-03-12 | 2025-04-11 | 江苏宜美照明科技股份有限公司 | A fixing bracket for COB LED |
-
2023
- 2023-08-10 CN CN202322156085.XU patent/CN220510060U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119816033A (en) * | 2025-03-12 | 2025-04-11 | 江苏宜美照明科技股份有限公司 | A fixing bracket for COB LED |
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| GR01 | Patent grant |