CN212675508U

CN212675508U - Intelligent temperature control device for connecting CPU and display card

Info

Publication number: CN212675508U
Application number: CN202021940887.XU
Authority: CN
Inventors: 刘文元; 李洁
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-09-07
Filing date: 2020-09-07
Publication date: 2021-03-09
Anticipated expiration: 2030-09-07

Abstract

The utility model provides an intelligent temperature control device for connecting CPU and display card, include: the CPU heat dissipation copper pipe group is used for clamping the CPU heat dissipation fin clamp on the CPU heat dissipation fin, and the display card back plate heat conduction paste is used for being pasted on the display card back plate. When the CPU is overheated and the display card is low in temperature, the CPU and the display card have temperature difference, the heat dissipation fan of the CPU is in a full load state at the moment, the display card fan still has residual power, when the heat dissipation copper pipe group guides the temperature of the CPU to the display card, the heat dissipation copper pipe dissipates a part of the temperature, the temperature of the display card rises, the power of the display card fan can be further improved to accelerate the heat dissipation of the display card, and the CPU heat dissipation is assisted by the further display card fan. When the temperature of the CPU is lower than that of the display card, the CPU fan assists the display card in heat dissipation in the same way as the above, so that the temperature of the CPU and the display card can be intelligently controlled in a two-way mode without adopting software and a chip, and when one temperature is high, the other fan can assist in heat dissipation.

Description

Intelligent temperature control device for connecting CPU and display card

Technical Field

The utility model belongs to the technical field of computer cooling device technique and specifically relates to an intelligent temperature control device for connecting CPU and display card.

Background

DIY is a way for assembling a computer and making a computer for modifying the heart instrument by a player. The temperature of the CPU generally floats about 25-75 ℃ when the CPU works, and the temperature of the display card generally floats about 30-85 ℃ when the display card works. When large-scale software is run, the CPU temperature and the graphics card temperature are not equal, as in a normal case, such as when 3Dmax rendering is used, the CPU temperature of a normally configured computer can be as high as 90 ℃ or more, even up to 100 ℃, and the graphics card temperature can be generally kept at 75 ℃ or more. However, when running a large 3D game, it may be the case that the CPU temperature may be maintained at 70 ℃ and the graphics card may reach around 90 ℃. And when the display card is in idle standby, the temperatures of the display card and the CPU are relatively close. Especially, in the over-frequency state, the temperature of the CPU can reach more than 100 ℃ instantly, and the temperature of the display card can reach about 50-60 ℃, so that the heat dissipation and cooling functions of the CPU can not be met on the basis of the existing fan, the heat dissipation plate and the air duct.

In the desktop computer, the CPU and the display card are provided with independent cooling fans. In the notebook, because of the space problem, the fan of the display card is generally cancelled, and the temperature of the display card is brought out by utilizing the fan of the CPU and combining an air duct.

Therefore, how to combine the CPU and the fan of the display card together is to use a new heat dissipation device to intelligently combine the heat dissipation of the CPU and the display card by means of DIY without changing the structure of the existing computer device, thereby achieving the purpose of heat dissipation.

Therefore, the computer assembly player can obtain the temperature data of the heart instrument when testing the CPU and the display card through single baking or double baking, and obtain better scores in relevant software such as running and the like.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an intelligent temperature control device for connecting CPU and display card, it is high to solve current CPU and display card temperature, mutual not inseparable technical problem of heat dissipation relation.

In order to achieve the above object, the utility model provides a following technical scheme:

a intelligent temperature control device for connecting CPU and display card includes:

the CPU heat dissipation copper pipe group is used for clamping the CPU heat dissipation fin clamp on the CPU heat dissipation fin and a display card back plate heat conduction paste which is used for being pasted on the display card back plate;

one end of the heat dissipation copper tube set is connected with the central piece of the CPU heat dissipation fin clamp, and the other end of the heat dissipation copper tube set is connected with the heat conduction patch of the display card backboard heat conduction patch;

the heat dissipation copper pipe group comprises a first copper pipe, a second copper pipe, a turning pipe, a connecting piece and a plurality of extension copper pipes; the cartridge end of first copper pipe is equipped with the inserted sheet, the installation end of second copper pipe is equipped with the paster, the both ends of connecting piece can be respectively with the link of first copper pipe, the link of second copper pipe, the both ends of extension copper pipe and the both ends equipment of turn pipe.

The cross sections of the first copper pipe, the second copper pipe, the rotary bent pipe, the connecting piece and the plurality of extension copper pipes are rounded rectangles.

The CPU heat dissipation fin clamp comprises an upper clamping piece, a lower clamping piece and a central piece; the head ends of the upper clamping piece and the lower clamping piece are respectively provided with a sliding block, the central piece is provided with a sliding groove, and the sliding blocks are arranged in the sliding grooves in a matching manner; a spring is arranged in the sliding groove, and two ends of the spring are respectively connected with the sliding block of the upper clamping piece and the sliding block of the lower sliding piece;

the central piece is provided with a slot, and the slot is matched with the inserting piece.

And the binding surfaces of the upper clamping piece, the lower clamping piece and the CPU heat dissipation fins are coated with heat dissipation silicone grease layers.

The display card backboard heat conduction paste comprises a heat conduction paste, and the paste is installed on the heat conduction paste through a bolt.

The first copper pipe and the second copper pipe are heat pipes.

Wherein, also include, the radiator fan; the casing of radiator fan sets up the engaging lug, radiator fan pass through the engaging lug install in on the heat dissipation copper nest of tubes, radiator fan is equipped with the USB power supply head.

The utility model discloses an intelligent temperature control device for connecting CPU and display card, CPU heat radiation fin presss from both sides and presss from both sides on CPU heat radiation fin, and display card backplate heat conduction subsides are adorned on the display card backplate, and CPU heat radiation fin presss from both sides and closes display card backplate heat conduction subsides and carry out the conduction of heat through the heat dissipation copper pipe group. When the CPU is overheated and the display card is low in temperature, the CPU and the display card have temperature difference, the heat dissipation fan of the CPU is in a full load state at the moment, the display card fan still has residual power, when the heat dissipation copper pipe group guides the temperature of the CPU to the display card, the heat dissipation copper pipe dissipates a part of the temperature, the temperature of the display card rises, the power of the display card fan can be further improved to accelerate the heat dissipation of the display card, and the CPU heat dissipation is assisted by the further display card fan. When the temperature of the CPU is lower than that of the display card, the CPU fan assists the display card in heat dissipation in the same way as the above, so that the temperature of the CPU and the display card can be intelligently controlled in a two-way mode without adopting software and a chip, and when one temperature is high, the other fan can assist in heat dissipation.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic view of the assembled structure of the present invention;

fig. 2 is a schematic structural diagram of the present invention;

FIG. 3 is a schematic structural view of a CPU heat dissipation fin clip of the present invention;

FIG. 4 is a schematic cross-sectional structure of the center piece of the present invention;

fig. 5 is a schematic structural view of the upper clip sheet of the present invention;

fig. 6 is a schematic view of the cross-sectional shape of the first copper pipe, the second copper pipe, the elbow pipe, the connecting member, and the plurality of extension copper pipes of the present invention;

FIG. 7 is a schematic view of a first copper tube structure of the present invention;

FIG. 8 is a schematic view of a second copper tube structure of the present invention;

fig. 9 is a schematic structural view of the heat dissipation fan of the present invention;

fig. 10 is an assembled schematic view of another embodiment of the present invention.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings of the present invention, and obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The heat sink is commonly called a heat sink and is a passive heat sink. The material is usually aluminum or copper which is easy to conduct heat. The CPU heat dissipation fins absorb the heat of the CPU through direct contact with the CPU, and the heat is dissipated by a CPU fan in a convection mode.

The heat-dissipating silicone grease is also called heat-conducting silicone grease, so-called heat-dissipating paste, and is a paste which is made up by using special silicone oil as base oil, using novel metal oxide as filler and adding several functional additives and adopting a specific technological process. The material has good heat conduction, temperature resistance and insulation performance, is an ideal medium material for heat-resistant devices, has stable performance, does not generate corrosive gas in use, and does not influence contacted metals. High purity fillers and silicones ensure smooth, uniform and high temperature insulation of the product. The coating is coated on the assembly surfaces of the power device and the radiator, helps to eliminate air gaps of contact surfaces, increases heat circulation, reduces thermal resistance, reduces the working temperature of the power device, improves reliability and prolongs service life.

A heat pipe is a heat transfer element for realizing heat exchange. The inner cavity of a typical heat pipe is provided with working liquid, and heat transfer is achieved through gas-liquid conversion of the working liquid. And the heat pipe has reversibility, and both ends can be used as an evaporation end and a condensation end.

The heat dissipation fan, the heat dissipation fins, the display card structure and the fan structure of the CPU are all the prior art, and are not described herein. The utility model discloses a through using the essence the utility model discloses an intelligent temperature control device for connecting CPU and display card carries out the DIY repacking to current desktop or notebook computer to obtain good temperature performance in single roast or two roast, and use and run and divide software and obtain good number of copies, perhaps in using large-scale software, CPU and display card can assist the heat dissipation mutually, thereby holistic promotion heat dispersion.

The single baking and the double baking are common languages in the field, and refer to that test software is used to enable a CPU or a display card to run to the strongest performance, and temperature data is checked to judge the heat dissipation performance. The single baking is used for testing the CPU or the display card independently, and the double baking is used for testing the CPU and the display card simultaneously.

As shown in fig. 1-10, the intelligent temperature control device for connecting a CPU and a display card of the present invention comprises:

the CPU heat dissipation fin comprises a CPU heat dissipation fin clamp 2 used for clamping a CPU heat dissipation fin 1, a heat dissipation copper tube group 3 and a display card back plate heat conduction paste 5 used for being pasted on a display card back plate 4; one end of the heat dissipation copper pipe group 3 is connected with the central piece 201 of the CPU heat dissipation fin clip 2, and the other end is connected with the heat conduction patch 501 of the display card back plate heat conduction patch 5. The CPU heat dissipation fin clamp 2 transfers heat on the CPU heat dissipation fin 1 to the heat dissipation copper pipe group 3, and the display card back plate heat conduction paste 5 transfers heat on the display card back plate 4 to the heat dissipation copper pipe group 3.

In order to fix the CPU radiator fin clip 2 on the CPU radiator fin 1 and to absorb the heat of the CPU radiator fin 1 better, as shown in fig. 2 to 5, the CPU radiator fin clip 2 includes an upper clip 202, a lower clip 203, and a central piece 201. The upper clip 202 may have the same shape as the lower clip 203. The head ends of the upper clamping piece 202 and the lower clamping piece 203 are both provided with a sliding block 211, the central piece 201 is provided with a sliding groove 204, and the sliding block 211 is fittingly arranged in the sliding groove 204; when the sliding block 211 is installed in the sliding groove 204, both the upper clamping piece 202 and the lower clamping piece 203 can only move up and down along the length direction of the sliding groove 204, a spring 205 is further arranged in the sliding groove 204, and two ends of the spring 205 are respectively connected with the sliding block of the upper clamping piece 202 and the sliding block of the lower clamping piece 203; the spring 205 tensions the upper clip 202 and the lower clip 203 under the action of the spring 205, so that the upper clip 202, the lower clip 203 and the central piece 201 form a clip structure, and the CPU heat sink fin clip 2 can be clipped on the CPU heat sink fin 1 through the clip structure. The CPU radiating fin clamp 2 is simple and reasonable in structure, can be quickly installed on the CPU radiating fins 1 on the basis of not changing the structure of an original computer, reduces DIY difficulty, and enhances practicability although the structure is simple. The upper clip 202 and the lower clip 203 are in contact with the CPU heat sink fins to conduct heat to the center piece 201.

The upper clip 202, the lower clip 203 and the central piece 201 are preferably made of copper, and have better heat dissipation performance and heat conduction performance. The sizes and specific shapes of the upper clip 202, the lower clip 203 and the central piece 201 are not limited herein, and may be adapted according to the structure of the chassis. The upper clamping piece and the lower clamping piece are uniformly provided with the hollowed-out hole grooves, so that the ventilation effect of CPU heat dissipation fins is avoided from being blocked excessively, and the heat dissipation capacity of the CPU heat dissipation fins is reduced. The joint surfaces of the upper clip 202, the lower clip 203 and the CPU heat dissipation fin 201 are coated with a heat dissipation silicone grease layer, which is a layer of heat dissipation silicone grease evenly coated on the joint surfaces of the upper clip 202, the lower clip 203 and the CPU heat dissipation fin 201, so that the heat conduction capability is improved.

The central piece 201 is provided with a slot 206, and the slot 206 is matched with the insertion piece 311, so that the insertion piece 311 can be inserted into the slot 206, thereby realizing the connection between the central piece 201 and the first copper pipe 301.

As shown in fig. 7-8, the heat dissipating copper pipe set 3 includes a first copper pipe 301, a second copper pipe 302, a turning pipe 303, a connecting member 304, and a plurality of extension copper pipes 305. The inserting piece 311 is arranged at the inserting end of the first copper pipe 301, and the inserting piece 311 is inserted into the inserting slot 206 on the central piece 201, so that the assembly of the first copper pipe 301 and the CPU heat dissipation fin clip 2 can be completed. A connector 304 may be used to connect the connecting end of the first copper tube 301 with the connecting end of the second copper tube 302. When the positions of the CPU and the display card are too far or greatly deviated, the direction can be changed by arranging the elbow pipe 303, and the copper pipe 304 is used for prolonging the distance. Specifically, both ends of the connecting member 304 may be arbitrarily assembled with the connecting end of the first copper pipe 301, the connecting end of the second copper pipe 302, both ends of the extension copper pipe 305, and both ends of the turning pipe 303, respectively. The mode of equipment can be selected for current connected mode, preferably the grafting of comparatively simple, convenient dismantlement repacking, mode such as threaded connection. The mounting end of the second copper pipe 302 is provided with a patch 312, and the patch 312 is used for being attached to the heat conducting patch 501. Thereby transferring heat from the thermal pad 501 into the second copper tube 302.

The display card backboard heat conduction paste 5 comprises a heat conduction patch 501, and can also comprise a grid part 502 for assisting heat conduction, wherein the grid part 502 is positioned at the periphery of the heat conduction patch 501 and is fixedly connected with the heat conduction patch 501 in the existing connection mode, and the patch 312 is installed on the heat conduction patch 501 through a bolt. The heat conductive patch 501 may be circular, rectangular, or the like, and may be selected according to the structure of the display card. The heat conducting patch 501 cannot be attached to the heat dissipation hole of the display card backplane, so that heat dissipation of the display card backplane is hindered. The preferred heat conducting patch 501 is attached at a heat dissipating hole away from the back panel 4 of the graphics card. When the heat conducting patch 501 is attached to the display card back plate, low-temperature soldering paste can be selected to be used for connection and fixation, or the heat conducting patch can be selected to be directly placed on the surface of the display card back plate, and the attached gap is selected to be filled with heat dissipation silicone grease.

In an alternative embodiment, the cross-section of the first copper pipe 301, the second copper pipe 302, the turning pipe 303, the connecting member 304 and the plurality of extension copper pipes 305 is a rounded rectangle as shown in fig. 6. Facilitating a reduction in thickness for retrofitting in smaller cabinets or installation in the limited space in notebooks.

In an alternative embodiment, the first copper pipe 301 and the second copper pipe 302 are heat pipes to further increase the heat conduction speed. The heat pipe structure can be the existing heat pipe structure.

In an alternative embodiment, as shown in fig. 9-10, if for further heat dissipation, such as in desktop retrofit, the desktop chassis space is larger and a heat sink fan 6 may be provided; radiator fan 6's casing sets up engaging lug 61, through silk thread, iron wire, ribbon etc. passes engaging lug 61 and installs radiator fan 6 in on the radiator copper nest of tubes 3, radiator fan 6 is equipped with USB power supply head 62, and USB power supply head inserts the USB socket department of desktop and can be for the radiator fan power supply, and radiator fan 6 blows to radiator copper nest of tubes 3 to accelerate radiator copper nest of tubes 3's radiating efficiency. And the heat dissipation capability of the whole case is also accelerated.

The intelligent point of the invention is that a control chip such as a singlechip is not needed, and only by combining the capabilities of a CPU fan and a display card fan, when the CPU is overheated and the temperature of the display card is low, the CPU and the display card have temperature difference, at the moment, a heat dissipation fan of the CPU is in a full load state, but the display card fan still has residual force, when the heat dissipation copper pipe group guides the temperature of the CPU onto the display card, a part of the temperature of the heat dissipation copper pipe can be dissipated, the temperature of the display card is increased, the power of the display card fan can be further improved, the heat dissipation of the display card is accelerated, and the display card fan assists the CPU in heat dissipation. When the temperature of the CPU is lower than that of the display card, the CPU fan assists the display card in heat dissipation in the same way as the above, so that the temperature of the CPU and the display card can be intelligently controlled in a two-way mode without adopting software and a chip, and when one temperature is high, the other fan can assist in heat dissipation.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention.

Claims

1. A intelligent temperature control device for connecting CPU and display card, its characterized in that includes:

2. The intelligent temperature control device for connecting the CPU and the display card according to claim 1, wherein: the cross sections of the first copper pipe, the second copper pipe, the rotary bent pipe, the connecting piece and the plurality of extension copper pipes are rounded rectangles.

3. The intelligent temperature control device for connecting the CPU and the display card according to claim 2, wherein: the CPU heat dissipation fin clamp comprises an upper clamping piece, a lower clamping piece and a central piece; the head ends of the upper clamping piece and the lower clamping piece are respectively provided with a sliding block, the central piece is provided with a sliding groove, and the sliding blocks are arranged in the sliding grooves in a matching manner; a spring is arranged in the sliding groove, and two ends of the spring are respectively connected with the sliding block of the upper clamping piece and the sliding block of the lower sliding piece;

4. The intelligent temperature control device for connecting the CPU and the display card according to claim 3, wherein: and the binding surfaces of the upper clamping piece, the lower clamping piece and the CPU heat dissipation fins are coated with heat dissipation silicone grease layers.

5. The intelligent temperature control device for connecting the CPU and the display card according to claim 4, wherein: the display card backboard heat conduction patch comprises a heat conduction patch, and the patch is installed on the heat conduction patch through a bolt.

6. The intelligent temperature control device for connecting the CPU and the display card according to claim 5, wherein: the first copper pipe and the second copper pipe are heat pipes.

7. The intelligent temperature control device for connecting the CPU and the display card according to claim 5, wherein: also includes a heat radiation fan; the casing of radiator fan sets up the engaging lug, radiator fan pass through the engaging lug install in on the heat dissipation copper nest of tubes, radiator fan is equipped with the USB power supply head.