TWI547232B - Heat dissipation module - Google Patents

Description

Thermal module

The invention relates to a heat dissipation module, in particular to a heat dissipation module applied to a 1U server or a blade servo. The heat pipe with high heat conduction efficiency directly contacts the heat source of the wafer, and directly guides the heat generated by the wafer to the heat dissipation fins. In order to improve the performance of the 1U server cooling module.

Unlike a typical desktop computer or laptop, the user will shut down the computer (or at least be asleep) after use. In addition to the specific maintenance day, the server is almost open all year round. The server service includes large enterprise users or cloud users, and most of the time is at high speed. Therefore, for the cooling of the CPU, the reliability is particularly demanding.

Especially the 1U server, which puts each server flat on a rack. The height of each server is only about 1U units (4.445cm). Although it saves space, it also makes the heat dissipation problem more challenging. Another space-saving blade server is characterized in that the computer board is inserted one by one on the base and shares a power supply. It is conceivable that the latter has more requirements for the heat dissipation module than the former. In response to the challenges of severe cooling conditions, the highest-end cooling and cooling modules usually use a Vapor Chamber with a thermal conductivity close to 100,000 Watt/m-°C as the heat sink base plate, allowing the temperature equalization plate to directly contact the heat source of the wafer. get over. But the average temperature plate manufacturing High difficulty and high cost are a high-quality and high-price solution.

The thermal conductivity of the heat pipe is also close to 100,000Watt/m-°C. In the industry trend of pursuing high cost performance (CP value), the combination of cheap heat pipe and copper or aluminum base plate is used to develop a kind of low cost but still retain The heat-dissipating module with excellent performance is the trend of the server cooling module.

A conventional heat dissipation module 10 that is recognized as being effective in reducing costs, please refer to the exploded view shown in FIG. The heat sink fin group 20, a heat pipe group 30, a heat dissipation substrate 40, and a copper plate 50 are included from the bottom. The copper plate 50 is about 1 mm thick and is in contact with a heat source (wafer), for example, a CPU chip. The first surface 41 of the heat dissipation substrate 40 has a heat pipe group 30 accommodating groove 45 formed therein to accommodate the heat pipe group 30. The heat pipe group shown in the figure includes an S group and two horseshoe types. The second surface 42 of the heat dissipation substrate 40 has a recessed portion 46 (the reference numeral 46 points toward the edge of the recessed portion) to accommodate the copper plate 50. The second surface 32 of the heat pipe group 30 is partially in contact with the copper plate 50, and the first surface 31 is in contact with the heat dissipation fin group 20.

Thus, the heat source is directly transmitted to the heat pipe group 30 by the copper plate 50 having a good thermal conductivity. The heat pipe set 30 in turn conducts heat directly to the large area of the heat sink fin set 20. Therefore, although the heat transfer efficiency is slightly lower than that of the temperature equalization plate, the cost can be considerably reduced. The components of the heat dissipation module: the heat dissipation fin group 20, the heat pipe group 30, the heat dissipation substrate 40, and the copper plate 50 are assembled by combining the components and then passing through the reflow furnace to combine the soldering of the components into a solder heat dissipation. Module 10. 2A shows a perspective view of the combination, and FIG. 2B shows a front view in which the first surface of the heat dissipation base 40 is flat.

In order to further reduce the cost, another conventional technique is to combine the heat pipe group 30, the heat dissipation fin group 20 and the heat dissipation base plate (aluminum) 40 by a solderless riveting technique. The components of the heat dissipation module 20, 30, 40 do not need to go through the reflow oven, please refer to the explosion diagram of Figure 3. Figure 4A shows a perspective view of the assembled product. First of the heat dissipation substrate 40 The face 41 is provided with a riveting slot 44 for the heat sink fin set 20. The other side of the bottom plate 42 has a heat pipe receiving groove 45. Please refer to the second surface 42 of the heat dissipation base plate 40 shown in FIG. 4B. 4C shows a front view, the first surface 41 of the heat dissipation substrate 40 having the heat dissipation fin group 20 riveted to the socket 44. The heat pipe group 30 with high heat transfer efficiency is in direct contact with the heat source. However, the heat pipe group 30 is not directly in contact with the heat dissipation fin group 20, and is partitioned by an aluminum heat dissipation substrate 40 having a poor heat conduction efficiency (a heat conductivity of aluminum is about 205 Watt/m-°C copper is about 400 Watt/m-°C), so that heat dissipation is performed. The fin set 20 is more difficult to exert its heat dissipation performance. The combination of the components 20, 30, and 40 of the heat dissipation module does not need to pass through the reflow furnace, and the aluminum base plate or the heat dissipation fins do not need to be plated with nickel, and the expensive copper base plate is also omitted, which can greatly reduce the cost, but the performance. But far less than the average temperature board.

In view of the above, it is an object of the present invention to develop a heat dissipation module that can substantially reduce the cost and meet the stringent heat dissipation performance requirements of a 1U server.

The technical problem solved by the present invention is to provide a heat dissipation module to meet the stringent heat dissipation performance requirements of the blade servo.

The invention discloses a heat dissipation module, comprising a heat pipe group, a heat dissipation bottom plate, wherein the heat dissipation bottom plate is provided with a plurality of transparent areas therein, and the first surface of the heat dissipation bottom plate is provided with a heat dissipation fin riveting groove, and is disposed on the second surface There are two pairs of sides of the heat pipe bridge in each of the transparent areas, the second surface is in contact with the wafer; a heat dissipating fin group is staggered by a plurality of convex areas and a plurality of non-bumping areas, and then a plurality of fasteners are buckled Each of the protruding regions includes a plurality of heat dissipating fins arranged in parallel, and each non-protruding region also includes a plurality of heat dissipating fins arranged in parallel, wherein the protruding regions are provided with a plurality of heat pipe receiving grooves therein, The ends of the fins of the protruding regions are folded into an L-shaped abutting portion to resist the wafer, so that the heat dissipating fin group and the riveting groove of the first surface of the heat dissipating bottom plate are riveted. The heat pipe accommodating groove in the protruding portion of the heat dissipation fin group is combined with the heat pipe group After the combination of the heat pipe group and the heat pipe pier of the heat dissipation bottom plate, the protruding portions of the heat dissipation fin groups protrude from the transparent area of the heat dissipation substrate, and the L-shaped resisting portion of the heat dissipation fin end, The surface of the heat pipe group after being riveted in the permeable area is substantially at the same level as the second surface.

The above heat pipe group is a plurality of bent copper pipes, and the copper pipes may be continuous or discontinuous, for example, a plurality of bent copper pipes to increase heat pipe coverage.

The above-mentioned convex regions and transparent regions are not limited to a plurality of, for example, one convex region corresponds to one transparent region.

According to still another embodiment of the present invention, the heat dissipation module is combined by soldering. At this time, the first surface of the heat dissipation substrate is flat without a riveting trench, and the bottom edge of the heat dissipation fin group and the bottom plate or the CPU are L-shaped. On the side, the welding fixture is placed according to the bottom process (a) the solder joint assembly is first coated with solder paste, (b) the heat sink fin group has its convex area facing upward, and (c) the heat sink bottom plate is transparent. The empty area corresponds to the convex area, the first surface of the heat dissipation substrate contacts the heat dissipation fins of the peripheral non-protrusion area, and (d) the second surface of the heat pipe group faces the heat dissipation bottom plate and the convex area 22 supported by the heat pipe pier. In the accommodating groove of the heat pipe, wherein the second surface of the heat pipe group, the L-shaped abutting portion of the heat dissipating fins and the second surface of the heat dissipating bottom plate are substantially in the same horizontal plane, (e) The assembled components are placed in a reflow oven and then welded. It should be noted that the second surface of the heat pipe group used in this embodiment must be leveled in advance, and therefore, the heat pipe group is generally semicircular or flat.

The above-mentioned soldering heat dissipation module has better performance and the cost is also significantly lower than that of the uniform temperature board heat dissipation module, but it is higher than the cost of riveting the solderless heat dissipation module.

20‧‧‧Fixing fin group

30‧‧‧Heat management group

20C‧‧‧The core of the heat sink fin group

20P‧‧‧The periphery of the core of the heat sink fin group

21‧‧‧ Non-protruding area of the fin assembly

22‧‧‧Bumping area of heat sink fin set

23‧‧‧L-shaped abutment at the end of the fin

227‧‧‧Heat tube receiving slots for heat sink fins

31‧‧‧The first side of the heat pipe group

32‧‧‧ second side of the heat pipe group

40‧‧‧ Thermal floor

41‧‧‧The first side of the heat sink

42‧‧‧ second side of the heat sink

44‧‧‧ Riveting groove for fins

45‧‧‧Heat tube receiving slot

47‧‧‧Heat tube pier

43‧‧‧Through area

1 is an exploded view of a conventional soldering heat dissipating module; FIG. 2A is a perspective view of a conventional soldering heat dissipating module; FIG. 2B is a front view of a conventional soldering heat dissipating module; FIG. 3 is a conventional Wuxi FIG. 4A is a perspective view of a heat dissipating module of a conventional Wuxi soldering; FIG. 4B is a heat pipe accommodating groove on a second surface of a heat dissipating bottom plate of a conventional Wuxi soldering heat dissipating module.

4C is a front view of a conventional heat-dissipating module of Wuxi soldering; FIG. 5 is an exploded view of the heat-dissipating module according to an embodiment of the present invention.

FIG. 6A is a finished view of a combination of heat dissipation modules according to an embodiment of the present invention, with the wafer contact surface facing up.

6B is a top plan view of the heat dissipation fin of the heat dissipation module before the heat pipe is not installed according to an embodiment of the invention.

6C is a side view of a heat dissipation module in accordance with an embodiment of the present invention.

In order to make the above-mentioned objects, features and advantages of the present invention more comprehensible, the heat-dissipating module according to the present invention will be described in detail below with reference to the accompanying drawings.

The technology of the present invention can be applied to other PCs or general radiators in addition to the 1U server or the blade server to improve the cost performance. benefit.

FIG. 5 shows an exploded view of a heat dissipation module designed in accordance with an embodiment of the present invention. As shown in FIG. 5, the heat dissipation fin group 20, a heat dissipation substrate 40, and a heat pipe group 30 are respectively from top to bottom. The heat pipe group 30 is composed of an S-shaped and two horseshoe-shaped heat pipes, and the shape of the heat pipe combination is not limited thereto. The heat sink base 40 is an aluminum heat sink base plate 40. The heat dissipation base plate 40 is shown with three permeable areas 43 as shown, and the illustrated permeable area 43 is rectangular. The first surface 41 of the heat dissipation substrate is provided with a heat dissipation fin riveting groove 44, and the second surface 42 of the heat dissipation substrate is provided with heat pipe bridges 47 on opposite sides of each of the transparent areas 43, and the second surface 42 of the heat dissipation substrate Contact with a heat source such as a CPU. The core portion of the heat dissipation fin group 20 (all of the transparent area 43 including the space of the transparent area 43, please refer to FIGS. 6A and 6B at the same time) 20C is composed of a plurality of convex areas 22 (corresponding to the transparent area 43) and a plurality of non-convex portions. The exit areas 21 (corresponding to the intervals between the transparent areas 43) are staggered, and the periphery 20P of the heat dissipation fin group core (refer to FIG. 6B) is a non-bumping area, and both sides of each of the heat dissipation fins 20 are provided. The fastening portion comprises a fastening piece and a buckle for a buckle of the adjacent heat dissipation fin 20 . For details of the clasps, buckles and cassettes, reference is made to another novel patent filed by the inventor in Taiwan on September 8, 2003, the patent number M267819, which is incorporated herein by reference. Each of the protruding regions 22 includes a plurality of heat dissipating fins arranged in parallel, and each of the non-protruding regions also includes a plurality of heat dissipating fins arranged in parallel. The heat dissipating fins of the protruding regions 22 are provided with a plurality of heat pipe receiving slots. 227, wherein the heat dissipation fin ends of the protruding regions 22 are folded into an L-shaped resisting portion 23 to resist the wafer, and the heat dissipation fin group 20 and the first surface 41 of the heat dissipation substrate 40 are riveted. The heat pipe receiving groove 227 in the protruding portion 22 of the heat radiating fin group is riveted with the heat pipe group 30, and the heat pipe group 47 of the heat pipe group 30 is riveted to the second surface 42 by the heat pipe pier 47. The protruding regions 22 respectively protrude from the transparent regions 43 , and the L-shaped resisting portions 23 at the ends of the heat radiating fins and the heat pipes in the transparent regions 43 The surface after riveting is substantially at the same level as the second surface 42. Fig. 6A shows the finished product diagram after combination. FIG. 6B shows a top view of the heat sink fin set 20 before the heat pipe group 30 is mounted. FIG. 6B includes a projection 22, a non-protrusion portion 21, and a heat pipe accommodating groove 227. Figure 6C is a side view.

The heat pipe group before the combination of the present invention may be circular, semi-circular, or flat, but after riveting, the heat pipe riveting plane 32 of the transparent area and the L-shaped abutting portion 23 at the end of the heat radiating fin will be combined with the CPU heat source. direct contact.

The heat pipe group 30 is three copper pipes which are bent in multiple stages, but it should not be limited thereto. For example, a single copper pipe with a plurality of bends may be used, but a plurality of bent copper pipes may increase the heat pipe coverage. .

The above-mentioned convex regions 22 and the transparent regions 43 are not limited to a plurality of, for example, one protruding region corresponding to one transparent region may also be used.

The concept of the heat pipe of the present invention directly contacting the wafer and the heat dissipating fins 20 can of course be applied to the welding method, that is, the first surface of the heat dissipating bottom plate is flat without riveting trenches, and the heat dissipating fin group 20 is in contact with the bottom plate 40 or the CPU. The bottom edge has an L-shaped folded edge, and then the welding clamp is placed according to the bottom process (a) the interface of the welded joint assembly is first coated with solder paste, and (b) the transparent portion 43 of the heat dissipation bottom plate 40 corresponds to the convex portion. In the exit area 22, the first surface 41 of the heat dissipation substrate 40 contacts the heat dissipation fins of the peripheral 20P non-protrusion area 21 of the heat dissipation fin group core, and (c) the second surface 32 of the heat pipe group 30 is placed upwards on the heat pipe bridge 47. The heat dissipating bottom plate 40 and the accommodating groove 227 of the heat pipe of the protruding portion 22, wherein the second surface 32 of the heat pipe group 30 (having a significant planar area, such as a semicircular tube or a flat tube), the convex portion 22 The heat dissipating fins L-shaped abutting portion 23 and the second surface 42 of the heat dissipating bottom plate 40 are substantially in the same horizontal plane, and (e) the assembled components are placed in a reflow oven and then welded.

The above-mentioned soldering heat dissipation module has better performance and the cost is also significantly lower than that of the uniform temperature board heat dissipation module, but it is higher than the cost of riveting the solderless heat dissipation module.

The invention has the following advantages:

1. The heat dissipating module of the invention is riveted to rive the components, the aluminum bottom plate or the fin set does not need to be nickel plated, and does not need a reflow oven for high temperature soldering, which has low cost, environmental protection, and labor saving benefits. .

2. The second surface 32 of the heat pipe, the second surface 42 of the heat dissipation substrate, and the L-shaped abutting portion 23 of the protruding heat dissipation fins are all in the same plane, so that the heat source directly contacts the second surface 32 of the heat pipe group and dissipates heat. The end of the fin set has an L-shaped abutting portion 23, and the heat pipe group 30 also directly contacts the heat dissipating fin protruding portion 22, and can directly conduct heat to the heat dissipating fin group 20. Therefore, the conventional solderless riveting technique is greatly improved, and the heat pipe group 30 and the heat dissipation fin group 20 are separated by the aluminum base plate 40, which solves the problem that the heat pipe does not directly contact the heat dissipation fins.

3. The heat pipe group 30 of the present invention directly contacts the heat source (wafer) with the heat sink fin group 20, which is more direct than the conventional heat source through the copper base plate 50. Therefore, the heat dissipation performance can be about the same as that of the temperature equalization plate, but the cost can be greatly reduced.

The present invention has been described above by way of a preferred example, but it is not intended to limit the spirit of the invention and the inventive subject matter. Those who are familiar with the technology can easily understand and utilize other components or methods to produce the same effect. Modifications made within the spirit and scope of the invention are intended to be included within the scope of the invention.

20‧‧‧Fixing fin group

20C‧‧‧Financial fin group core area

22‧‧‧Bumping area of heat sink fin set

30‧‧‧Heat management group

40‧‧‧ Thermal floor

42‧‧‧ second surface of the heat sink

44‧‧‧ riveting ditch

Claims (3)

A heat dissipation module includes at least: a plurality of heat pipes, each of the heat pipes includes at least two straight segments connected by a circular arc segment, and the heat pipe has a flat surface; and a heat dissipation bottom plate is provided with a plurality of transparent regions The space between the transparent area and the transparent area has a spacing, the first surface of the heat dissipation substrate is provided with a heat dissipating fin riveting groove, and the second surface is provided with a heat pipe pier in each of the transparent areas. The heat pipe grooves of the two opposite sides of the front and rear sides and the second surface is further provided with a circular arc segment are connected by a through-hole heat pipe bridge pier to the heat pipe pier adjacent to the other through-opening region; the second surface is in contact with the wafer; A heat dissipation fin group is composed of a plurality of mutually parallel heat dissipation fins, and has a fastening portion on both sides to provide a card to buckle adjacent heat dissipation fins, and the heat dissipation fin group has a corresponding air permeability area The same number and the corresponding position of the protruding area and the surrounding non-protruding area, the protruding areas are provided with the heat pipe receiving groove therein, and the L-shaped resisting is formed at the ends of the protruding areas To resist the wafer; when mounting, the fins of the first surface of the heat dissipation substrate are riveted The divule is riveted with the heat sink fin set for tightly engaging the heat sink fin set, and the second surface for contacting the wafer faces upward to mount the heat pipes, and at least two straight segments of each heat pipe are respectively located at the heat dissipation a receiving groove of the heat pipe of the two protruding regions of the fin group and a heat pipe pier before and after the transparent area of the heat dissipation floor, and connecting the two straight segment arc segments on the non-protruding area of the heat dissipation fin group The heat pipe is disposed in the range of the heat dissipation substrate, and the flat surface of the heat pipe, the L-shaped abutting portion of the heat dissipation fin end of the heat dissipation fin group, and the second surface of the heat dissipation substrate include The space between the left and right sides of the air-permeable area and the second surface of the arc-shaped heat pipe accommodating groove are substantially in the same horizontal plane. The heat dissipation module according to claim 1, wherein the heat pipes include three straight segments and one arc segment, and three straight segments and two arc segments, the latter and the three straight segments respectively Located in three permeable areas, the two arc segments respectively connect the three straight segments to each other. For example, the heat dissipation module described in claim 2, wherein the heat pipes have "two straight segments and one arc segment" are respectively in the "left through zone and the middle through zone", and "right through" The zone and the middle transparent zone", and the three straight sections and the two arc segments are S-shaped interlaced in the above two "two straight segments and one arc segment".