TW201513778A - Heat dissipation module - Google Patents

Abstract

A heat dissipation module having a heat pipe, heat dissipation fins, a base plate having an opening for a protruding zone of the heat dissipation fins having a pipe-housing ditch formed therein is disclosed. The base plate has dissipation fin-riveting grooves formed and piers formed at the two opposite sides of the opening. The heat dissipation module is assembled by inserting the protruding fin zone through the opening of the plate, riveting heat dissipation fins into the fins grooves on the base plate top surface, disposing pipe into the pipe-housing ditch on the protruding fin zone, and flattening the pipe on both protruding fin zone bottom surface and base plate bottom surface. The L-shaped bottom surface of the protruding fin zone, bottom surface of the base plate and the flattened pipe surface are all at about a same plane level.

Description

Thermal module

The invention relates to a heat dissipation module, in particular to a heat dissipation module applied to a 1U server or a blade servo. The heat pipe with high heat conduction efficiency directly contacts the heat source of the wafer, and directly guides the heat generated by the wafer to the heat dissipation fins. In order to improve the performance of the 1U server cooling module.

Unlike a typical desktop computer or laptop, the user will shut down the computer (or at least be asleep) after use. In addition to the specific maintenance day, the server is almost open all year round. The server service includes large enterprise users or cloud users, and most of the time is at high speed. Therefore, for the cooling of the CPU, the reliability is particularly demanding.

Especially the 1U server, which puts each server flat on a rack. The height of each server is only about 1U units (4.445cm). Although it saves space, it also makes the heat dissipation problem more challenging. Another space-saving blade server is characterized in that the computer board is inserted one by one on the base and shares a power supply. It is conceivable that the latter has more requirements for the heat dissipation module than the former. In response to the challenges of severe cooling conditions, the highest-end cooling and cooling modules usually use a Vapor Chamber with a thermal conductivity close to 100,000 Watt/m-°C as the heat sink base plate, allowing the temperature equalization plate to directly contact the heat source of the wafer. get over. But the average temperature plate manufacturing High difficulty and high cost are a high-quality and high-price solution.

The thermal conductivity of the heat pipe is also close to 100,000Watt/m-°C. In the industry trend of pursuing high cost performance (CP value), the combination of cheap heat pipe and copper or aluminum base plate is used to develop a kind of low cost but still retain The heat-dissipating module with excellent performance is the trend of the server cooling module.

A conventional heat dissipation module 10 that is recognized as being effective in reducing costs, please refer to the exploded view shown in FIG. The heat sink fin group 20, a heat pipe group 30, a heat dissipation substrate 40, and a copper plate 50 are included from the bottom. The copper plate 50 is about 1 mm thick and is in contact with a heat source (wafer), for example, a CPU chip. The first surface 41 of the heat dissipation substrate 40 has a heat pipe 30 receiving groove 45 formed therein to accommodate the heat pipe group 30. The heat pipe group shown in the figure includes an S group and two horseshoe types. The second surface 42 of the heat dissipation substrate 40 has a recessed portion 46 (the reference numeral 46 points toward the edge of the recessed portion) to accommodate the copper plate 50. The second surface 32 of the heat pipe group 30 is partially in contact with the copper plate 50, and the first surface 31 is in contact with the heat dissipation fin group 20.

Thus, the heat source is directly transmitted to the heat pipe 30 by the copper plate 50 having a good thermal conductivity. Heat pipe 30 in turn conducts heat directly to a large area of fin assembly 20. Therefore, although the heat transfer efficiency is slightly lower than that of the temperature equalization plate, the cost can be considerably reduced. The components of the heat dissipation module: the heat dissipation fin group 20, the heat pipe group 30, the heat dissipation substrate 40, and the copper plate 50 are assembled by combining the components and then passing through the reflow furnace to combine the soldering of the components into a solder heat dissipation. Module 10. 2A shows a perspective view of the combination, and FIG. 2B shows a front view in which the first surface of the heat dissipation base 40 is flat.

In order to further reduce the cost, another conventional technique is to combine the heat pipe group 30, the heat dissipation fin group 20, and the heat dissipation substrate (aluminum) 40 by a solderless bonding technique. The components of the heat dissipation module 20, 30, 40 do not need to go through the reflow oven, please refer to the explosion diagram of Figure 3. Figure 4A shows a perspective view of the assembled product. First of the heat dissipation substrate 40 The face 41 is provided with a riveting slot 44 for the heat sink fin set 20. The other side of the bottom plate 42 has a heat pipe receiving groove 45. Please refer to the second surface 42 of the heat dissipation base plate 40 shown in FIG. 4B. 4C shows a front view, the first surface 41 of the heat dissipation substrate 40 having the heat dissipation fin group 20 riveted to the socket 44. The heat pipe group 30 with high heat transfer efficiency is in direct contact with the heat source. However, the heat pipe group 30 is not directly in contact with the heat dissipation fin group 20, and is partitioned by an aluminum heat dissipation substrate 40 having a poor heat conduction efficiency (a heat conductivity of aluminum is about 205 Watt/m-°C copper is about 400 Watt/m-°C), so that heat dissipation is performed. The fin set 20 is more difficult to exert its heat dissipation performance. The combination of the components 20, 30, and 40 of the heat dissipation module does not need to pass through the reflow furnace, and the aluminum base plate or the heat dissipation fins do not need to be plated with nickel, and the expensive copper base plate is also omitted, which can greatly reduce the cost, but the performance. But far less than the average temperature board.

In view of the above, it is an object of the present invention to develop a heat dissipation module that can substantially reduce the cost and meet the stringent heat dissipation performance requirements of a 1U server.

The technical problem solved by the present invention is to provide a heat dissipation module to meet the stringent heat dissipation performance requirements of the blade servo.

The invention discloses a heat dissipation module, comprising a heat pipe group, a heat dissipation bottom plate, wherein the heat dissipation bottom plate is provided with a plurality of transparent areas therein, and the first surface of the heat dissipation bottom plate is provided with a heat dissipation fin riveting groove, and is disposed on the second surface There are two pairs of sides of the heat pipe bridge in each of the transparent areas, the second surface is in contact with the wafer; a heat dissipating fin group is staggered by a plurality of convex areas and a plurality of non-bumping areas, and then a plurality of fasteners are buckled Each of the protruding regions includes a plurality of heat dissipating fins arranged in parallel, and each non-protruding region also includes a plurality of heat dissipating fins arranged in parallel, wherein the protruding regions are provided with a plurality of heat pipe trench patterns therein, The ends of the fins of the protruding regions are folded into an L shape to resist the wafer, so that the heat dissipating fin group and the heat dissipating fin are riveted to the first surface of the heat dissipating bottom plate, and the heat dissipating fin group After the heat pipe ditches in the protruding area are riveted together with the heat pipe group, After the heat pipe group is combined with the heat pipe pier of the heat dissipation bottom plate, the protruding portions of the heat dissipation fin groups protrude from the transparent area of the heat dissipation floor, and the horizontal plane of the L type heat dissipation fin and the transparent area The surface of the inner heat pipe set that has been riveted is substantially at the same level as the second surface.

The above heat pipe group is a plurality of bent copper pipes, and the copper pipes may be continuous or discontinuous, for example, a plurality of bent copper pipes to increase heat pipe coverage.

The above-mentioned convex regions and transparent regions are not limited to a plurality of, for example, one convex region corresponds to one transparent region.

According to still another embodiment of the present invention, the heat dissipation module is combined by soldering. At this time, the first surface of the heat dissipation substrate is flat without a trench, and the bottom edge of the heat dissipation fin group and the bottom plate or the CPU are L-shaped. Folding, and then placing the welding fixture according to the bottom process (a) applying the solder paste to the interface of the solder joint assembly, (b) the fin portion of the heat sink fin facing upward, and (c) the heat sink bottom plate The transparent area corresponds to the convex area, the first surface of the heat dissipation substrate contacts the heat dissipation fins of the peripheral non-protrusion area, and (d) the second surface of the heat pipe group faces upwardly disposed on the heat dissipation bottom plate and the convex area supported by the heat pipe pier In the accommodating pattern of the heat pipe of 22, wherein the second surface of the heat pipe group, the heat dissipating fins L of the protruding portion, and the second surface of the heat dissipating bottom plate are substantially in the same horizontal plane, (e) The assembled components are placed in a reflow oven for welding. It should be noted that the second surface of the heat pipe group used in this embodiment must be leveled in advance, and therefore, the heat pipe group is generally semicircular or flat.

The above-mentioned soldering heat dissipating module has better performance and the cost will be significantly lower than that of the uniform temperature board cooling module, but it will be higher than the cost of the non-welding heat dissipating module.

20‧‧‧Fixing fin group

30‧‧‧Heat management group

20C‧‧‧The core of the heat sink fin group

20P‧‧‧around the heat sink fin group unit

21‧‧‧ Non-protruding area of the fin assembly

22‧‧‧Bumping area of heat sink fin set

23‧‧‧L-shaped resisting part of heat sink fin

227‧‧‧ Heat pipe diagram of heat sink fins case

31‧‧‧The first side of the heat pipe group

32‧‧‧ second side of the heat pipe group

40‧‧‧ Thermal floor

41‧‧‧The first side of the heat sink

42‧‧‧ second side of the heat sink

44‧‧‧Fixed fin riveting slot

45‧‧‧Heat tube receiving slot

47‧‧‧Heat tube pier

1 is an exploded view of a conventional soldering heat dissipating module; FIG. 2A is a perspective view of a conventional soldering heat dissipating module; FIG. 2B is a front view of a conventional soldering heat dissipating module; FIG. 3 is a conventional Wuxi Explosion diagram of the welded heat dissipation module; FIG. 4A is a perspective view of a conventional heat dissipation module of Wuxi welding;

FIG. 4B shows a heat pipe accommodating groove on the second surface of the heat dissipation base plate of the conventional heat-dissipating module of the solderless solder.

4C is a front view of a conventional heat-dissipating module of Wuxi soldering;

FIG. 5 shows an exploded view of a heat dissipation module in accordance with an embodiment of the present invention.

FIG. 6A is a finished view of a combination of heat dissipation modules according to an embodiment of the present invention, with the wafer contact surface facing up.

6B is a top plan view of the heat dissipation fin of the heat dissipation module before the heat pipe is not installed according to an embodiment of the invention.

6C is a side view of a heat dissipation module in accordance with an embodiment of the present invention.

In order to make the above-mentioned objects, features and advantages of the present invention more comprehensible, the heat-dissipating module according to the present invention will be described in detail below with reference to the accompanying drawings.

The technology of the present invention can be applied to other PCs or general radiators in addition to the 1U server or the blade server to improve the cost performance. benefit.

FIG. 5 shows an exploded view of a heat dissipation module designed in accordance with an embodiment of the present invention. As shown in FIG. 5, the heat dissipation fin group 20, a heat dissipation substrate 40, and a heat pipe group 30 are respectively from top to bottom. The heat pipe group 30 is composed of an S-shaped and two horseshoe-shaped heat pipes, and the shape of the heat pipe combination is not limited thereto. The heat sink base 40 is an aluminum heat sink base plate 40. The heat dissipation base plate 40 is shown by the three rectangular through-opening regions 43. The first surface 41 is provided with a heat dissipating fin riveting groove 44, and the second surface 42 is provided with heat pipe bridges 47 on opposite sides of each of the transparent areas 43, the second surface 42 being in contact with a heat source such as a CPU. The core portion of the heat dissipation fin group 20 (all of the rectangular air permeability areas 43 including the rectangular air permeability area 43, please refer to FIGS. 6A and 6B at the same time) 20C is composed of a plurality of convex areas 22 (corresponding to the transparent area 23) and A plurality of non-protrusion regions 21 (corresponding to the interval between the transparent regions 23) are staggered, and the periphery 20P of the core (refer to FIG. 6B) is a non-bumping region, and both sides of each of the heat dissipation fins 20 are provided. The fastening portion comprises a fastening piece and a buckle for a buckle of the adjacent heat dissipation fin 20 . For details of the clasps, buckles and cassettes, reference is made to another novel patent filed by the inventor in Taiwan on September 8, 2003, the patent number M267819, which is incorporated herein by reference. Each of the protruding regions 22 includes a plurality of heat dissipating fins arranged in parallel, and each of the non-protruding regions also includes a plurality of heat dissipating fins arranged in parallel. The protruding portions 22 are provided with a plurality of heat pipe receiving patterns 227. The ends of the heat dissipation fins of the protruding regions 22 are folded into an L-shape 23 to resist the wafer. When the heat dissipation fin assembly 20 is riveted to the first surface 41 of the heat dissipation substrate 40, the heat dissipation is performed. After the heat pipe accommodating groove 227 in the fin group bulging area 22 is riveted with the heat pipe group 30, and the heat pipe group 30 is riveted to the second surface 42 by the heat pipe pier of the heat dissipation base plate 40, the bulging areas 22 The surface of the L-shaped heat-dissipating fins 23 and the surface of the L-shaped heat-dissipating fins and the second surface 42 are substantially in the same horizontal plane. Figure 6A shows the combined composition Product map. FIG. 6B shows a top view of the heat sink fin set 20 before the heat pipe 30 is mounted. FIG. 6B includes a projection 22, a non-protrusion portion 21, and a heat pipe accommodating pattern 227. Figure 6C is a side view.

The heat pipe group before the combination of the present invention may be circular, semi-circular, or flat, but after riveting, the heat pipe riveting plane 32 of the transparent area and the horizontal surface 23 of the L-shaped heat radiating fin will be in direct contact with the CPU heat source.

The heat pipe group 30 is three copper pipes which are bent in multiple stages, but it should not be limited thereto. For example, a single copper pipe with a plurality of bends may be used, but a plurality of bent copper pipes may increase the heat pipe coverage. .

The above-mentioned convex regions 22 and the transparent regions 43 are not limited to a plurality of, for example, one protruding region corresponding to one transparent region may also be used.

The concept of the heat pipe of the present invention directly contacting the chip and the heat dissipating fins 20 can of course be applied to the welding method, that is, the first surface of the heat dissipating bottom plate is flat without a ditch, and the heat dissipating fin group 20 is in contact with the bottom plate 40 or the CPU. The bottom edge has an L-shaped flange, and then the welding clamp is placed according to the bottom process (a) the interface of the joint to be welded is first coated with solder paste, and (b) the transparent area 43 of the heat dissipation substrate 40 corresponds to The protruding portion 22, the first surface 41 of the heat dissipation substrate 40 contacts the heat dissipation fins of the peripheral 20P non-protrusion region 21, and (c) the second surface 32 of the heat pipe group 30 faces upwardly disposed on the heat dissipation substrate 40 supported by the heat pipe bridge 47. And the accommodating pattern 227 of the heat pipe of the protruding portion 22, wherein the second surface 32 of the heat pipe group 30 (having a significant planar area, such as a semicircular tube or a flat tube), and the heat dissipating fins L of the protruding portion 22 The type 23 and the second surface bottom plate 42 of the heat dissipation base plate 40 are substantially in the same horizontal plane, and (e) the assembled assembly is placed in a reflow oven and then welded.

The above-mentioned soldering heat-dissipating module has better performance and the cost will be significantly lower than that of the uniform-temperature board heat-dissipating module, but it will cost less than the welding-free heat-dissipating module. high.

The invention has the following advantages:

1. The heat dissipation module of the present invention uses a splicing method to combine the components, and the aluminum bottom plate or the fin group does not need to be plated with nickel, and does not need a reflow furnace for high temperature soldering, and has low cost, environmental protection, and labor saving. benefit.

2. The second surface 32 of the heat pipe, the second surface 42 of the heat dissipation substrate, and the end 23 of the L-shaped protruding heat dissipation fin are all in the same plane, so that the heat source directly contacts the heat pipe group 32, the heat dissipation fin group 23, and the heat pipe 30 The heat sink fin protruding region 22 is also directly contacted, and the heat can be directly guided to the heat sink fin group 20 for heat dissipation. Therefore, the conventional solderless riveting technique is greatly improved, and the heat pipe group 30 and the heat dissipation fin group 20 are separated by the aluminum base plate 40, which solves the problem that the heat pipe does not directly contact the heat dissipation fins.

3. The heat pipe group 30 of the present invention directly contacts the heat source (wafer) with the heat sink fin group 20, which is more direct than the conventional heat sink through the copper base plate 50 and then contacts the heat source. Therefore, the heat dissipation performance can be about the same as that of the temperature equalization plate, but the cost can be greatly reduced.

The present invention has been described above by way of a preferred example, but it is not intended to limit the spirit of the invention and the inventive subject matter. Those who are familiar with the technology can easily understand and utilize other components or methods to produce the same effect. Modifications made within the spirit and scope of the invention are intended to be included within the scope of the invention.

20‧‧‧Fixing fin group

20C‧‧‧Financial fin group core area

22‧‧‧Bumping area of heat sink fin set

30‧‧‧Heat management group

40‧‧‧ Thermal floor

42‧‧‧ second surface of the heat sink

44‧‧‧ Riveted slot

Claims (9)

A heat dissipating module comprises: a heat pipe comprising a flat surface; a heat dissipating bottom plate, wherein at least one air permeable area is disposed therein, the first surface of the heat dissipating bottom plate is provided with a heat dissipating fin riveting groove, and is disposed on the second surface a heat pipe bridge piers the two opposite sides of each of the transparent areas, the second surface is in contact with the wafer; and a heat dissipating fin set is composed of at least one protruding area and a peripheral non-protruding area, the at least one protruding The area includes a plurality of heat dissipating fins arranged in parallel, and the number of the at least one transparent area is equal to and corresponding to the number of the protruding areas, and the peripheral non-protruding area also includes a plurality of heat dissipating fins arranged in parallel. The at least one protruding portion is provided with a accommodating region of the heat pipe, and the ends of the heat dissipating fins of the at least one protruding portion are folded into an L shape to resist the wafer, the heat pipe, the heat dissipating bottom plate, and the heat dissipating fin group The connecting relationship is that the heat dissipating fins of the heat dissipating fin group are connected to the riveting groove of the heat dissipating bottom plate, and the at least one protruding area is respectively connected to the at least one transparent area, and the heat pipe is located in the accommodating area of the heat pipe and the Heat pipe bridge pier, so that the L-shaped heat sink fin Horizontal plane, the permeable region of the heat pipe of the flat surface, the second surface of the heat radiating plate, three significant at the same level. The heat dissipation module of claim 1, wherein the heat pipe is in a straight line segment in the at least one transparent area. The heat dissipation module of claim 1, wherein the heat pipe is a plurality of bent semicircular or flat copper tubes to make the second surface flat. A heat dissipation module comprises at least: a heat pipe group, which is composed of a plurality of heat pipes; a heat dissipation bottom plate, wherein a plurality of air permeable regions are disposed therein, and the first surface of the heat dissipation substrate a heat dissipating fin riveting groove is provided, and a heat pipe bridge is disposed on the second surface on two opposite sides of each of the transparent areas, the second surface is in contact with the wafer; and a heat dissipating fin set includes a plurality of protruding portions in the core portion Corresponding to the stray distribution area and the plurality of non-protrusion areas staggered, the periphery of the core part is a non-protrusion area, and is further composed of a plurality of fasteners, each of which comprises a plurality of heat dissipation fins Parallelly arranged, each of the non-convex regions also includes a plurality of heat dissipating fins arranged in parallel, wherein the protruding regions are provided with a plurality of heat pipe trench patterns therein, and the fin portions of the protruding regions are folded into L-shaped to resist the wafer, the heat-dissipating bottom plate and the heat-dissipating fin group are connected by the heat-dissipating fins of the heat-dissipating fin group and the riveting groove of the heat-dissipating bottom plate, and the plurality of protruding regions and the plurality Corresponding connections are respectively connected to the permeable area of the heat pipe and the heat pipe pier, so that the horizontal plane of the L-shaped heat sink fin, the flat surface of the heat pipe in the permeable area, and the heat sink base Two surfaces, the three are located at the same level. The heat dissipation module of claim 4, wherein the heat pipe is in a straight line segment within the range of the permeable areas. The heat dissipation module of claim 4, wherein the heat pipe is a plurality of bent semicircular or flat copper tubes to make the second surface flat. A heat dissipating module includes at least: a heat pipe having a second surface; the heat dissipating bottom plate is provided with at least one permeable area, and the second surface of the heat dissipating bottom plate is provided with a heat pipe pier Two opposite sides of the empty area, the second surface is in contact with the wafer; and a heat dissipating fin group is formed by at least one protruding area corresponding to the at least one transparent area, and a periphery other than the protruding area is a non-protruding area. And then consisting of a plurality of fasteners, the at least one protruding area The plurality of heat dissipating fins are arranged in parallel, and the peripheral non-protrusion area further includes a plurality of heat dissipating fins arranged in parallel, wherein the at least one protruding area is provided with a heat receiving groove of the heat pipe, and the heat dissipating fin ends The L-shaped portion of the protruding portion is favorable for resisting the wafer, and the L-shaped portion of the non-protrusion region is favorable for soldering; and the connection relationship between the heat-dissipating bottom plate and the heat-dissipating fin group is (a) the heat-dissipating fin group The protruding area is upward, (b) the transparent area of the heat dissipation substrate corresponds to the protruding area, the first surface of the heat dissipation substrate contacts the heat dissipation fin of the peripheral non-protrusion area, and (c) the heat pipe The heat dissipating bottom plate supported by the heat pipe pier and the accommodating groove of the heat pipe of the protruding portion are disposed on the second surface of the heat pipe, wherein the heat dissipating fins of the second surface of the heat pipe And the second side of the heat dissipation base plate is substantially at the same horizontal plane. The heat dissipation module of claim 7, wherein when the at least one of the permeable areas and the at least one bulging area are plural, the number is equal, and the space between the permeable area and the permeable area is At a spacing, the convex region and the convex region are spaced apart by a non-convex region to accommodate the first interval. The heat dissipation module of claim 7, wherein the heat pipe is a plurality of bent semicircular or flat copper pipes to provide a flat surface of the heat pipe.