CN104869785B - Electronic equipment - Google Patents
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- CN104869785B CN104869785B CN201410058595.6A CN201410058595A CN104869785B CN 104869785 B CN104869785 B CN 104869785B CN 201410058595 A CN201410058595 A CN 201410058595A CN 104869785 B CN104869785 B CN 104869785B
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Abstract
The invention discloses electronic equipment, which comprises an electronic device, a heat pipe and a driving piece, wherein liquid metal is arranged in the heat pipe, the heat pipe is a return pipe, the heat pipe comprises an evaporation section, a condensation section, a first conduction section and a second conduction section which are sequentially connected, and the evaporation section is arranged on the electronic device and used for absorbing heat emitted by the electronic device; the driving piece is used for driving the liquid metal to circulate in the heat pipe, so that the liquid metal absorbing the heat can flow to the condensation section through the first conduction section to dissipate the heat, and then circulates to the evaporation section through the second conduction section to absorb the heat.
Description
Technical Field
The present invention relates to the field of electronic technologies, and in particular, to an electronic device.
Background
With the development of science and technology and the progress of society, electronic devices such as computers, mobile phones and televisions have become an indispensable part of life and work of people.
In order to ensure that the electronic devices in the electronic equipment can work normally, the electronic equipment is usually provided with a heat dissipation device. Specifically, the electronic device includes: the heat pipe is internally provided with water or hydrogen chloride, one end of the heat pipe is an evaporation end, the other end of the heat pipe is a condensation end, the evaporation end is arranged on the electronic device, liquid in the evaporation end is used for absorbing the heat emitted by the electronic device to evaporate and flow to the condensation end to dissipate and condense the heat, and the condensed liquid flows to the evaporation end to absorb the heat, so that the circulation is realized.
However, in the process of implementing the technical solution of the present application, the inventors of the present application find at least the following technical problems in the prior art:
because the liquid flows back from the condensation end to the evaporation end under the action of gravity, the position of the evaporation end must be lower than that of the condensation end during use to ensure that the liquid in the condensation end flows to the evaporation end, which is inconvenient for users to use.
Disclosure of Invention
The application provides an electronic equipment has solved among the prior art because of the liquid follow the condensation end flows back lean on the effect of gravity during the evaporation end, must guarantee during the use the position of evaporation end is less than the position of condensation end leads to the technical problem that the not convenient to use user used.
The application provides an electronic device, which comprises an electronic device, a heat pipe and a driving piece, wherein liquid metal is arranged in the heat pipe, the heat pipe is a loop pipe, the heat pipe comprises an evaporation section, a condensation section, a first conduction section and a second conduction section which are sequentially connected, and the evaporation section is arranged on the electronic device and used for absorbing heat emitted by the electronic device; the driving piece is used for driving the liquid metal to circulate in the heat pipe, so that the liquid metal absorbing the heat can flow to the condensation section through the first conduction section to dissipate the heat, and then circulates to the evaporation section through the second conduction section to absorb the heat.
Preferably, the drive member is embodied as a solenoid pump.
Preferably, a plurality of heat dissipation fins for increasing the heat dissipation area are arranged on the condensation section.
Preferably, the electronic device further comprises an airflow accelerator disposed on the condensation section.
Preferably, the electronic device further comprises a container containing heat absorption liquid, and the condensation section is arranged in the container and is in contact with the heat absorption liquid.
Preferably, the thickness of the tube wall of the heat pipe is less than 1 mm.
Preferably, the device between the evaporation section and the electronic device is provided with a heat conducting pad.
Preferably, the electronic apparatus further includes a fixing member for fixing the heat pipe.
The beneficial effect of this application is as follows:
according to the electronic equipment, the liquid metal is arranged in the heat pipe, the driving piece is arranged to drive the liquid metal, so that the liquid metal absorbs the heat dissipated by the electronic device at the evaporation section of the heat pipe, then the liquid metal flows to the condensation section through the first conduction section to dissipate the heat, and then the liquid metal circulates to the evaporation section through the second conduction section to absorb the heat dissipated by the electronic device, so that the heat generated by the electronic device is dissipated, and the technical problem that in the prior art, due to the fact that the liquid metal flows back to the evaporation end from the condensation end through the action of gravity, the position of the evaporation end is lower than the position of the condensation end when the electronic equipment is used, and the use of a user is inconvenient is solved.
The heat conducting pad is arranged between the evaporation section and the electronic device, so that the heat conduction efficiency of the evaporation section and the electronic device is increased, the heat generated by the electronic device can be conducted in time, and the heat dissipation effect of the electronic device is further improved.
The thickness of the pipe wall of the heat pipe is set to be smaller than 1mm, so that the space occupied by the heat pipe in the electronic equipment due to the fact that the pipe wall is too thick is reduced, and the development trend of lightness and thinness of the electronic equipment is facilitated.
The plurality of radiating fins are arranged on the condensing section, so that the radiating area is increased, the radiating effect is improved, and the radiating efficiency of the condensing section is improved.
The airflow accelerator is arranged on the condensation section, so that the flowing speed of the space around the condensation section is accelerated, and the heat dissipation efficiency of the condensation section is improved.
Through arranging the container filled with heat absorption liquid and arranging the condensation end in the container to be in contact with the heat absorption liquid, the condensation end and the heat absorption liquid are subjected to heat exchange, and therefore the heat dissipation efficiency of the condensation end is improved.
Through setting up the mounting that is used for the heat pipe to prevent the heat pipe is in the displacement takes place in the electronic equipment, guarantees radiating efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention.
FIG. 1 is a top view of an electronic device according to a preferred embodiment of the present application;
fig. 2 is a bottom view of the electronic device of fig. 1.
Detailed Description
The embodiment of the application provides an electronic equipment, has solved among the prior art because of the liquid follow the condensation end flows back lean on the effect of gravity during the evaporation end, must guarantee during the use the position of evaporation end is less than the position of condensation end leads to the technical problem that the user of not being convenient for used.
In order to solve the technical problems, the general idea of the embodiment of the application is as follows:
an electronic device comprises an electronic device, a heat pipe and a driving piece, wherein liquid metal is arranged in the heat pipe, the heat pipe is a loop pipe, the heat pipe comprises an evaporation section, a condensation section, a first conduction section and a second conduction section which are sequentially connected, and the evaporation section is arranged on the electronic device and used for absorbing heat emitted by the electronic device; the driving piece is used for driving the liquid metal to circulate in the heat pipe, so that the liquid metal absorbing the heat can flow to the condensation section through the first conduction section to dissipate the heat, and then circulates to the evaporation section through the second conduction section to absorb the heat.
According to the electronic equipment, the liquid metal is arranged in the heat pipe, the driving piece is arranged to drive the liquid metal, so that the liquid metal absorbs the heat dissipated by the electronic device at the evaporation section of the heat pipe, then the liquid metal flows to the condensation section through the first conduction section to dissipate the heat, and then the liquid metal circulates to the evaporation section through the second conduction section to absorb the heat dissipated by the electronic device, so that the heat generated by the electronic device is dissipated, and the technical problem that in the prior art, due to the fact that the liquid metal flows back to the evaporation end from the condensation end through the action of gravity, the position of the evaporation end is lower than the position of the condensation end when the electronic equipment is used, and the use of a user is inconvenient is solved.
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
Fig. 1 is a top view of an electronic device 100 according to a first preferred embodiment of the present application. The electronic device 100 may be a mobile phone, a computer, a PAD, a television, etc. The electronic apparatus 100 includes an electronic device 10, a heat pipe 20, and a driver 30.
Referring also to fig. 2, the electronic device 10 is capable of generating heat during operation, and the electronic device 10 may be a cpu, a chip, or the like.
Liquid metal is provided within the heat pipe 20. The heat pipe 20 is a loop pipe. The heat pipe 20 includes an evaporation section 21, a condensation section 22, a first conduction section 23, and a second conduction section 24, and the evaporation section 21, the condensation section 22, the first conduction section 23, and the second conduction section 24 are connected in sequence, so that the liquid metal can circulate in a loop formed by the evaporation section 21, the condensation section 22, the first conduction section 23, the second conduction section 24, and the evaporation section 21. Under the action of force, the liquid metal can circulate from the evaporation section 21 to the first conduction section 23, from the first conduction section 23 to the condensation section 22, from the condensation section 22 to the second conduction section 24, and from the second conduction section 24 to the evaporation section 21. The evaporation section 21 is arranged on the electronic device 10 and used for absorbing heat emitted by the electronic device 10, under the action of force, liquid metal absorbing the heat enters the condensation section 22 through the first conduction section 23 to be condensed, and after condensation, the liquid metal enters the evaporation section 21 through the second conduction section 24 to continuously absorb the heat emitted by the electronic device 10.
The driving member 30 is configured to drive the liquid metal to circulate in the heat pipe 20, so that the liquid metal absorbing the heat emitted from the electronic device 10 can flow to the condensation section 22 through the first conduction section 23 to dissipate the heat, and then circulate to the evaporation section 21 through the second conduction section 24 to absorb the heat emitted from the electronic device 10.
In particular, the drive member 30 may be embodied as a solenoid pump. The electromagnetic pump is a pump in which an electrified fluid in a magnetic field flows in a certain direction under the action of electromagnetic force, and the interaction of the current in the magnetic field and the current in the conductive fluid is utilized to enable the fluid to generate pressure gradient under the action of the electromagnetic force, so that the fluid is pushed to move.
In the electronic apparatus 100, the liquid metal is disposed in the heat pipe 20, and the driving member 30 is disposed to drive the liquid metal, so that the liquid metal flows to the condensation section 22 through the first conduction section 23 to dissipate heat after the evaporation section 21 of the heat pipe 20 absorbs the heat dissipated by the electronic device 10, and then circulates to the evaporation section 21 through the second conduction section 24 to absorb the heat dissipated by the electronic device 10, thereby dissipating the heat generated by the electronic device 10.
Specifically, in order to increase the heat conduction efficiency between the evaporation section 21 and the electronic device 10, a thermal pad 40 is disposed between the evaporation section 21 and the electronic device 10. The heat conducting pad is a high-performance gap-filled heat conducting material, is mainly used for a transfer interface between electronic equipment and a radiating fin or a product shell, has good viscosity, flexibility, good compression performance and excellent heat conductivity, and can completely discharge air between an electronic element and the radiating fin in use so as to achieve full contact and increase the radiating effect. By arranging the thermal pad 40 between the evaporation section 21 and the electronic device 10, the thermal conduction efficiency of the evaporation section 21 and the electronic device 10 is increased, so that heat generated by the electronic device 10 can be conducted in time, and the heat dissipation effect of the electronic device 10 is further improved.
Specifically, the dimensions of the heat pipe 20, including length, diameter, wall thickness, etc., may be set according to the size of the space within the electronic device 100, and in a small device, the wall thickness of the heat pipe 20 may be set to be less than 1mm in order to reduce the space occupied by the heat pipe 20. The thickness of the tube wall of the heat tube 20 is set to be less than 1mm, so that the space occupied by the heat tube 20 in the electronic device 100 due to the excessively thick tube wall is reduced, and the development trend of lightness and thinness of the electronic device 100 is facilitated.
In order to increase the heat dissipation effect of the condensation section 22, a heat dissipation device for dissipating heat from the condensation end 22 may be added to the condensation section 22, and specifically, the heat dissipation device may be one or a combination of the following.
First, the heat dissipation device is a heat dissipation fin 51, that is, the electronic device 100 includes a plurality of heat dissipation fins 51 disposed on an outer surface of the condensation section 22, and the heat dissipation fins 51 are used to increase a heat dissipation area and improve heat dissipation efficiency. The plurality of heat dissipation fins 51 are arranged on the condensation section 22, so that the heat dissipation area is increased, the heat dissipation effect is improved, and the heat dissipation efficiency of the condensation section 22 is improved.
Secondly, the heat dissipation device is an airflow accelerating unit 52, that is, the electronic device 100 further includes an airflow accelerator 52, and the airflow accelerator 52 is disposed on the condensation section 22. The airflow accelerator 52 is used to accelerate the flow speed of the airflow and to accelerate the flow speed of the space around the condensation section 22, thereby improving the heat dissipation efficiency of the condensation section 22. The air flow accelerator 52 may be an air pump or a fan. The airflow accelerator 22 is disposed at the condensation section 22 to accelerate the flow speed of the space around the condensation section 22, thereby improving the heat dissipation efficiency of the condensation section 22.
Thirdly, the heat dissipation device may also be a container containing a heat absorption liquid, that is, in other embodiments, the electronic device 100 further includes a container containing a heat absorption liquid, and the condensation section 22 is disposed in the container and is in contact with the heat absorption liquid. By arranging the container filled with the heat absorption liquid and arranging the condensation end 22 in the container to be in contact with the heat absorption liquid, the condensation end 22 and the heat absorption liquid exchange heat, and therefore the heat dissipation efficiency of the condensation end 22 is improved.
In addition, specifically, the electronic apparatus 100 further includes a fixing member 60 for fixing the heat pipe 20. By providing the fixing member 60 for the heat pipe 20, the heat pipe 20 is prevented from being displaced in the electronic device 100, and the heat dissipation efficiency is ensured.
In the electronic apparatus 100, the liquid metal is disposed in the heat pipe 20, and the driving member 30 is disposed to drive the liquid metal, so that the liquid metal flows to the condensation section 22 through the first conduction section 23 to dissipate heat after the evaporation section 21 of the heat pipe 20 absorbs the heat dissipated by the electronic device 10, and then circulates to the evaporation section 21 through the second conduction section 24 to absorb the heat dissipated by the electronic device 10, thereby dissipating the heat generated by the electronic device 10.
By arranging the thermal pad 40 between the evaporation section 21 and the electronic device 10, the thermal conduction efficiency of the evaporation section 21 and the electronic device 10 is increased, so that heat generated by the electronic device 10 can be conducted in time, and the heat dissipation effect of the electronic device 10 is further improved.
The thickness of the tube wall of the heat tube 20 is set to be less than 1mm, so that the space occupied by the heat tube 20 in the electronic device 100 due to the excessively thick tube wall is reduced, and the development trend of lightness and thinness of the electronic device 100 is facilitated.
The plurality of heat dissipation fins 51 are arranged on the condensation section 22, so that the heat dissipation area is increased, the heat dissipation effect is improved, and the heat dissipation efficiency of the condensation section 22 is improved.
The airflow accelerator 22 is disposed at the condensation section 22 to accelerate the flow speed of the space around the condensation section 22, thereby improving the heat dissipation efficiency of the condensation section 22.
By arranging the container filled with the heat absorption liquid and arranging the condensation end 22 in the container to be in contact with the heat absorption liquid, the condensation end 22 and the heat absorption liquid exchange heat, and therefore the heat dissipation efficiency of the condensation end 22 is improved.
By arranging the fixing member 60 for the heat pipe 60, the heat pipe 20 is prevented from being displaced in the electronic device 100, and the heat dissipation efficiency is ensured.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. An electronic device, the electronic device comprising:
an electronic device;
the heat pipe is provided with liquid metal and is a loop pipe, the heat pipe comprises an evaporation end, a first conduction end, a condensation end and a second conduction end which are sequentially connected, so that the liquid metal can circulate in the loop formed by the evaporation end, the first conduction end, the condensation end, the second conduction end and the evaporation end, and the evaporation end is arranged on the electronic device and used for absorbing heat emitted by the electronic device;
the driving piece is used for driving the liquid metal to circulate in the heat pipe, so that the liquid metal absorbing the heat can flow to the condensation end through the first conduction section to dissipate the heat, and then circulates to the evaporation end through the second conduction section to absorb the heat; the driving piece is arranged between the first conducting section and the evaporation end;
the driving part is specifically an electromagnetic pump, the electromagnetic pump is a pump which enables electrified liquid metal in a magnetic field to flow under the action of electromagnetic force, and the interaction of the magnetic field and current in the conductive liquid metal is utilized to enable the liquid metal to generate pressure gradient under the action of electromagnetic force, so that the liquid metal is pushed to move;
the electronic equipment further comprises a fixing piece for fixing the heat pipe so as to ensure the heat dissipation efficiency.
2. The electronic device of claim 1, wherein the condensation end is provided with a plurality of heat dissipation fins for increasing a heat dissipation area.
3. The electronic device of any of claims 1-2, further comprising an airflow accelerator disposed on the condensation end.
4. The electronic device according to any of claims 1-2, wherein the electronic device further comprises a container containing a heat absorbing liquid, and wherein the condensation end is disposed in the container and in contact with the heat absorbing liquid.
5. The electronic device of any of claims 1-2, wherein a wall thickness of the heat pipe is less than 1 mm.
6. The electronic device of any of claims 1-2, wherein a thermal pad is disposed between the evaporation end and the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410058595.6A CN104869785B (en) | 2014-02-20 | 2014-02-20 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410058595.6A CN104869785B (en) | 2014-02-20 | 2014-02-20 | Electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104869785A CN104869785A (en) | 2015-08-26 |
| CN104869785B true CN104869785B (en) | 2021-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410058595.6A Active CN104869785B (en) | 2014-02-20 | 2014-02-20 | Electronic equipment |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105240284A (en) * | 2015-11-03 | 2016-01-13 | 安徽腾龙泵阀制造有限公司 | Practical cooling magnetic pump |
| CN106604615A (en) * | 2017-01-03 | 2017-04-26 | 联想(北京)有限公司 | Electronic device |
| CN107529327B (en) * | 2017-10-24 | 2024-01-30 | 山东大学 | Micro-driving active heat dissipation device and electronic equipment with same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2874396Y (en) * | 2005-10-21 | 2007-02-28 | 中国科学院理化技术研究所 | Pulse heat pipe radiator using low melting point metal and common fluid as flow work medium |
| US7705342B2 (en) * | 2005-09-16 | 2010-04-27 | University Of Cincinnati | Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes |
| CN201674744U (en) * | 2009-07-23 | 2010-12-15 | 青岛海信日立空调系统有限公司 | Novel radiating device of air-conditioning variable frequency module |
| CN102056459A (en) * | 2009-10-30 | 2011-05-11 | 鸿富锦精密工业（深圳）有限公司 | Liquid-cooling heat radiating device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201344754Y (en) * | 2009-01-22 | 2009-11-11 | 浙江大学 | Vapor-liquid bi-phase separation type radiator for gravity assisted heat pipe |
| JP2012132661A (en) * | 2010-12-01 | 2012-07-12 | Fujitsu Ltd | Cooling device and electronic device |
| CN102637542B (en) * | 2012-01-06 | 2013-09-11 | 西安交通大学 | Radiator based on circular radiating of liquid metal or alloy thereof for high-capacity direct-current circuit breaker |
-
2014
- 2014-02-20 CN CN201410058595.6A patent/CN104869785B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7705342B2 (en) * | 2005-09-16 | 2010-04-27 | University Of Cincinnati | Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes |
| CN2874396Y (en) * | 2005-10-21 | 2007-02-28 | 中国科学院理化技术研究所 | Pulse heat pipe radiator using low melting point metal and common fluid as flow work medium |
| CN201674744U (en) * | 2009-07-23 | 2010-12-15 | 青岛海信日立空调系统有限公司 | Novel radiating device of air-conditioning variable frequency module |
| CN102056459A (en) * | 2009-10-30 | 2011-05-11 | 鸿富锦精密工业（深圳）有限公司 | Liquid-cooling heat radiating device |
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| CN104869785A (en) | 2015-08-26 |
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