WO2020042519A1 - Dual-heat-conducting-strip splint type led display unit module - Google Patents

Dual-heat-conducting-strip splint type led display unit module Download PDF

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Publication number
WO2020042519A1
WO2020042519A1 PCT/CN2019/070245 CN2019070245W WO2020042519A1 WO 2020042519 A1 WO2020042519 A1 WO 2020042519A1 CN 2019070245 W CN2019070245 W CN 2019070245W WO 2020042519 A1 WO2020042519 A1 WO 2020042519A1
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WO
WIPO (PCT)
Prior art keywords
thermally conductive
back plate
led display
heat
panel
Prior art date
Application number
PCT/CN2019/070245
Other languages
French (fr)
Chinese (zh)
Inventor
刘振亮
Original Assignee
刘振亮
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 刘振亮 filed Critical 刘振亮
Publication of WO2020042519A1 publication Critical patent/WO2020042519A1/en

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Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

Definitions

  • the invention relates to the technical field of LED display screens, in particular to a dual thermally conductive sheet plywood LED display unit module.
  • the general process structure of the traditional LED display unit module is: after the LED display lamp board is installed in the plastic shell, a liquid sealant is poured into the plastic shell to encapsulate the LED display lamp board in the plastic shell, and the liquid is sealed. After the glue is cured, the mask is placed on the light-emitting side of the LED display lamp board and locked with the plastic shell to form a finished LED display unit module.
  • the sealing gel and the plastic gel constituting the mask are poor thermal conductors, the heat generated by the sun will
  • the sealing gel on the front surface of the display lamp board is gathered in the body; at the same time, the circuit board located on the back side of the LED light-emitting tube is made of fiber material, which is also a poor thermal conductor, and is lit by the LED light (ie, the LED light-emitting tube in the working state).
  • the heat generated will also be collected in the sealant at the same time; based on this, the heat generated by sunlight exposure and the heat generated by LED lights will be superimposed on each other, and due to the lack of structural transmission and heat dissipation of the entire module, the continuous sunlight Under the exposure and continuous operation of the unit module, the internal temperature of the sealing gel will rise sharply, and the temperature will change sharply and continuously with the change of the ambient temperature and the brightness of the display lamp board. The high temperature will cause the unit module and even the outdoor LED display. Screens commonly exist such as excessive temperature of the lamp body and uncontrollable temperature rise, which in turn leads to an increase in the rate of dead lights, serious light decay, and display. Group deformation, fault frequent many other issues, this is the outdoor LED display industry for many years the presence of chronic illness.
  • an object of the present invention is to provide a dual thermally conductive sheet plywood LED display unit module.
  • a dual-heat-conducting sheet-clamp type LED display unit module includes an LED display light board.
  • the LED display light board includes a circuit board, an IC chip mounted on a rear surface of the circuit board, and a plurality of chips mounted on the circuit board. LED light-emitting tubes on the front surface of the front surface and in an array;
  • the circuit board is stacked and clamped between the thermally conductive panel and the thermally conductive back plate.
  • the thermally conductive panel is in phase with each LED light-emitting tube. Corresponding positions are provided with lamp body vias for LED light emitting tubes to pass through.
  • the front end of the thermally conductive post sequentially penetrates the thermally conductive back plate and the circuit board and is locked to the thermally conductive panel.
  • the sealing gel covers the thermally conductive panel. And at least cover the heat conducting panel and the LED display lamp board as a whole.
  • a first raised rib position is provided on the heat conductive panel and at a position corresponding to each heat conductive column, and the raised surface of the first raised rib position is located on the front surface side of the circuit board. The front end of the heat conducting column is locked on the first raised rib.
  • the thermally conductive post includes a nut portion abutting on a rear surface side of the thermally conductive back plate, and a guide post which is axially extended from a central area of the nut portion and is formed to penetrate the thermally conductive back plate and the circuit board at the same time.
  • the front end of the guide post portion is extended axially after the front end of the guide post portion is formed and fixed to the first protruding rib position.
  • the length of the guide post portion is not less than the thickness of the circuit board and the thickness of the heat conductive back plate.
  • the front end surface of the guide post portion is in abutment with the convex surface of the first raised rib position, and the diameter of the wire portion is smaller than the diameter of the guide post portion.
  • a convex point of a lamp point is provided on the heat conducting panel and located at the side of each of the through holes of the lamp body.
  • the front surface of the sealing colloid is a hemp surface and / or the front surface of the sealing colloid is formed with an anti-reflective pattern for covering the lamp point ribs distributed in rows or rows as a whole.
  • the circuit board is further provided with a plurality of thermally conductive copper posts distributed through the circuit board, and the rear end surface of the thermally conductive copper posts is in contact with the thermally conductive back plate.
  • a second raised rib position for accommodating an IC chip is provided on the thermally conductive back plate, and a raised surface of the second raised rib position is located on a rear surface side of the thermally conductive back plate, and the second A plurality of external fixing nuts arranged in an array are arranged on the convex surface of the convex rib position.
  • the rear surface of the thermally conductive back plate is provided with a first colloidal sealing line covering a peripheral surface of the external fixing nut and distributed along a circular path formed by a plurality of external fixing nuts connected end to end.
  • a plurality of internal fixing nuts distributed in an array with each other are further disposed on the rear surface of the thermally conductive back plate.
  • a second colloidal seal line covering the peripheral surface of the pair of internally fixed nuts and distributed along a circular path formed by end-to-end connection of a plurality of paired internally fixed nuts;
  • the terminal box also includes a terminal box that is locked to the thermally conductive back plate by a pair of internal fixing nuts.
  • the terminal box at least includes a thermally conductive bottom plate stacked on the thermally conductive back plate and a box body assembled integrally with the thermally conductive bottom plate. Heat dissipation fins are arranged on the front surface of the outside of the box.
  • the sealing glue includes a main body area covering the heat-conducting panel and formed on the main body area.
  • the periphery of the part covers at least the peripheral wall part of the side of the heat conducting panel and the side of the circuit board at the same time, and a colloid tenon part filled in the injection tongue is formed on the peripheral wall part.
  • the glue-injection tongues are also distributed through the sides of the thermally conductive back plate at the same time, and the peripheral wall portion simultaneously covers the sides of the thermally conductive panel, the sides of the circuit board, and the sides of the thermally conductive back plate.
  • the sealing colloid further includes a back-side edging portion formed on a rear side of the peripheral wall portion and covering a rear surface edge of the thermally conductive back plate;
  • it further comprises a glue injection via which is distributed through the heat conductive panel, the circuit board and the heat conductive back plate at the same time and distributed around each heat conductive column, and a back which is connected to the sealing gel body and covers the heat conductive column through the glue injection via. The end of the thermally conductive post is covered.
  • the thermally conductive panel and / or the thermally conductive back plate is a plate-like structure formed by punching an aluminum plate and subjecting the surface to an anodizing process + blackening process; and the thermally conductive pillar is a copper structure.
  • the invention uses a thermally conductive panel and a thermally conductive back plate to form a double-layered thermally conductive sheet that holds the LED display lamp board.
  • a thermally conductive post With the cooperation of a thermally conductive post, the heat generated by direct sunlight and the heat generated by the LED display lamp board can be quickly conducted and dissipated.
  • the use of sealing gel can not only enhance the structural seal of the entire module, but also improve the thermal conductivity of the panel and LED display.
  • the lamp plate and the thermally conductive back plate are subject to secondary locking equivalent to the form of rubber strip riveting to ensure the stability of the module structure.
  • FIG. 1 is a schematic plan structural view of a front view of an embodiment of the present invention
  • FIG. 2 is a schematic diagram of a rear-view plane structure according to an embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional structure view taken along A-A in FIG. 2;
  • FIG. 4 is a schematic cross-sectional structure view taken along the line B-B in FIG. 2;
  • FIG. 5 is an enlarged schematic view of a partial structure in an exploded state according to an embodiment of the present invention.
  • FIG. 6 is an enlarged schematic view of a partial structure of the sealing colloid in FIG. 5;
  • FIG. 7 is a schematic exploded view of an embodiment of the present invention.
  • FIG. 8 is an enlarged schematic view of a partial structure of an area A in FIG. 7; FIG.
  • FIG. 9 is a schematic exploded view of the embodiment of the present invention after the sealing colloid is simplified.
  • Second colloidal sealing line Network 50, thermally conductive post, 51, nut part, 52, guide post part, 53, wire tooth part, 60, terminal block box, 61, heat conductive bottom plate, 62, box body, 63, heat dissipation fin, 64, storage Can battery + super capacitor.
  • a dual thermally conductive sheet plywood type LED display unit module includes an LED display light board 10 and a sealing gel 20 (which can be colored and transparent liquid silica gel according to specific conditions) And is formed by a plastic injection molding machine), a thermally conductive panel 30, a thermally conductive back plate 40, and a plurality of thermally conductive columns 50; wherein the LED display lamp board 10 includes a circuit board 11, and an IC mounted on the rear surface of the circuit board 11 The chip 12 and a plurality of LED light-emitting tubes 13 mounted on the front surface of the circuit board 11 and arranged in an array with each other; the circuit board 11 is stacked and clamped between the thermally conductive panel 30 and the thermally conductive back plate 40.
  • a lamp body via a is provided on the upper part and at a position corresponding to each LED light emitting tube 13 for the LED light emitting tube 13 to penetrate therethrough.
  • the front end portion of the thermally conductive post 50 penetrates the thermally conductive back plate 40 and the circuit board 11 in order and is locked.
  • the sealing gel 20 covers the heat-conducting panel 30 and covers at least the heat-conducting panel 30 and the LED display light board 10 as a whole; the heat-conducting panel 30 and the heat-conducting back plate 40 of this embodiment may be based on actual conditions Made of a material plate with good thermal conductivity Molding, such as aluminum sheet metal.
  • the LED display unit module of this embodiment uses the thermally conductive panel 30 and the thermally conductive back plate 40 to sandwich the LED display light board 10 in a stacked manner, and displays the LEDs through the connection relationship between the thermally conductive pillar 50 and the thermally conductive panel 30.
  • the lamp plate 10, the heat conducting panel 30 and the heat conducting back plate 40 are locked and fixed, so that the entire module constitutes a combination of the LED display lamp plate 10 centered, and the heat conducting panel 30 and the heat conducting back plate 40 located on the front and rear sides of the LED display lamp plate 10.
  • the sealing gel 20 is used to align the front surface area of the thermally conductive panel 30, the peripheral surface area of the LED display light board 10, the peripheral surface area of the thermally conductive panel 30, and even the peripheral surface area and back of the thermally conductive back plate 40.
  • the local area of the surface is covered and covered; thus, the entire module has the following beneficial effects, specifically:
  • the structural cooperation between the thermally conductive panel 30, the thermally conductive back plate 40, and the thermally conductive pillars 50 constitutes the heat generated by direct sunlight and the LED display light panel 10
  • the heat generated during work is a carrier for heat conduction and heat dissipation; among them, the heat conduction panel 30 is covered in the sealing gel 20, and the heat absorbed and accumulated by the heat conduction panel 30 is conducted in a balanced manner on the heat conduction panel 30, and then the heat conduction
  • the post 50 is conducted to the thermally conductive back plate 40 and finally uses the structural characteristics of the large area surface area of the thermally conductive back plate 40 that are exposed to the sealing gel 20 to be radiated to the outside of the module; and because the thermally conductive back plate 40 is close to the circuit board 11
  • the backside and the IC chip 12 enable the heat generated by the LED display light board 10 to be directly radiated to the outside of the module synchronously from the thermally conductive back plate 40; thus the module itself has good internal heat con
  • the sealing colloid 20 can be formed by colored and transparent liquid silicone gel after injecting, cooling and solidifying. By using the structural features of the sealing colloid 20 to cover or cover relevant components and areas, it can not only effectively enhance the module's waterproofness and dust resistance, etc. Sealing performance, and the cured sealant 20 can perform secondary locking on the LED display lamp board 10, the heat conducting panel 30, and the heat conducting back plate 40, so as to cooperate with the heat conducting column 50 to complete the structural stability of the entire module.
  • a first raised rib 31 is provided on the thermally conductive panel 30 and at a position corresponding to each thermally conductive post 50 (
  • the first raised rib position 31 can be formed by pressing in the direction of the circuit board 11 using a stamping process.
  • the raised surface of the first raised rib position 31 is located on the circuit.
  • the front surface side of the plate 11, and the front end portion of the thermally conductive post 50 is locked on the central region of the first raised rib position 31. Therefore, the first raised rib 31 is used to provide a structural space for the heat-conducting column 50 to be fixed on the heat-conducting panel 30.
  • the thermal conductivity of this embodiment can be set by referring to the structure of a hardware connector such as a screw, a screw, or a screw. That is, the post 50 includes a nut portion 51 for rotating the entire heat conducting post 50 and abutting the rear surface side of the heat conducting back plate 40. The central area of the nut portion 51 is axially extended and formed, and penetrates through the heat conductive back plate 40 and the guide post portion 52 distributed on the circuit board 11 at the same time.
  • a guide post via hole b1 for the guide post portion 52 to pass through may be opened in the circuit board 11 and the thermally conductive back plate 40 in advance.
  • b2 (as a preferred solution, the inner diameter of the guide post via hole b1 and the guide post via hole b2 are the same), a guide post via hole b3 is provided at the center of the first raised rib 31 for the wire teeth 53 to be locked.
  • the front end surface of the guide pillar portion 52 (that is, the transition surface between the guide pillar portion 52 and the wire teeth portion 53) will be in contact with the first The raised surface of the raised rib position 31 abuts, and the nut portion 51 abuts against the back surface of the thermally conductive back plate 40.
  • the front-to-back tensile force generated by the thermally conductive pillar 50 will act on the guide through the first raised rib position 31.
  • the rear-to-front pulling force on the pillar portion 52 will be directly applied to the thermally conductive back plate 40 by the nut portion 51, so that the point force generated by the thermally conductive pillar 50 is converted into the thermally conductive panel 50 and the thermally conductive back plate 40 by Applying force to the area of the circuit board 11 (ie, the area holding force), thereby avoiding the problem that the circuit board 11 is easily damaged due to the local thermal force applied to the circuit board 11 directly by the thermal conductive pillar 50.
  • a lamp point convex rib 32 is provided on the front surface of the thermally conductive panel 30 and on the side of each of the lamp body vias a.
  • the light point convex rib positions 32 can be directly formed; thus, using the light point convex rib positions 32 can not only form sunshade projections on the sides of each LED light emitting tube 13 to pass through. Blocking the sunlight to improve the contrast of the entire module, and after the injection molding and forming the sealant 20, the lamp point protrusions 32 can play a role of reinforcing ribs inside the sealant 20, thereby effectively slowing the frontal impact on the LED Damage caused by the arc tube 13.
  • the front surface of the sealing gel 20 of this embodiment may adopt a curved hemp surface structure composed of raised particles (for example, an arc surface is formed in the corresponding area of each LED light emitting tube 13).
  • the protrusions 26 and / or stripe lines 28 are provided on the front surface thereof and / or anti-reflective lines 27 are provided on the front surface of the sealant 20 (the arrangement form may be light bulb convex ribs distributed in rows or rows)
  • the bits 32 are continuously covered to form a multi-striped path. In this way, the curved protrusions 26, the striped pattern 28 and / or the anti-reflective pattern 27 can diffusely reflect the light incident from the outside to prevent the module surface from reflecting, The display effect of the module is further enhanced.
  • a number of thermally conductive copper posts (not shown in the figure, The setting position and number can be arranged according to the number and arrangement relationship of the LED light-emitting tubes 13, such as being arranged in the center area of an array area composed of a plurality of LED light-emitting tubes 13.
  • the rear end surface of the thermally conductive copper pillar and the thermally conductive back plate 40, and the front end surface of the LED light emitting tube 13 can be offset with the bottom surface of one of the LED light emitting tubes 13 in a certain array area.
  • the heat collected by the circuit board 11 and even the heat generated by the LED light emitting tube 13 can be quickly conducted to the heat conductive back plate 40 by using the heat conductive copper pillars, so that the heat conductive back plate 40 can be used for rapid heat dissipation.
  • the IC chip 12 is one of the main heat sources in the LED display lamp board 10.
  • a second protrusion for accommodating the IC chip 12 is provided on the thermally conductive back plate 40.
  • Reinforcement position 41 which can be formed by pressing the heat conductive back plate 40 such as a metal plate after punching), so that the convex surface of the second raised rib position 41 is located on the rear surface side of the heat conductive back plate 40, thereby using the second protrusion
  • the rib position 41 provides structural space for the placement of the IC chip 12 and enables the IC chip 12 to closely adhere to the front surface of the second raised rib position 41.
  • the direct contact between the IC chip 12 and the thermal back plate 40 is used to achieve rapid heat conduction and heat dissipation.
  • a plurality of external fixing nuts 42 distributed in an array are arranged on the convex surface of the second protruding rib position 41, so that the entire module and the display box body can be connected by using the external locking nuts 42.
  • the second raised ribs 41 of this embodiment do not need to correspond to the IC chip 12 one-to-one, and can be set according to a certain circular path, such as set similar to " Back "shape, IC chip 1 at this time 2 can be distributed on the circuit board 11 in a rectangular regular array and fit into the second raised ribs 41, so as to provide conditions for setting the external fixing nut 42 and assembling the entire module into the display case.
  • a peripheral surface covering the external fixing nut 42 is provided on the rear surface of the thermally conductive back plate 40.
  • the first colloidal seal line 43 is distributed along a ring-shaped path formed by a plurality of external fixing nuts 42 connected end to end (also can be understood as being distributed along the outline shape of the first raised rib position 41).
  • the colloidal sealing wire 43 can be formed synchronously by selecting the relevant mold or setting the structure of the module when the sealing colloid 10 is injection-molded (such as the corresponding setting on the thermal conductive panel 30, the circuit board 11 and the thermal conductive back plate 40). Structure of injection vias, etc.).
  • first colloid sealing wire 43 can not only wrap the external fixing nut 42 to prevent it from being attacked by external factors, but also lock the external locking nut 42 and the display case to lock the first colloid.
  • the seal line 43 is pressed, so that the first colloidal seal line 43 has a sealing effect such as waterproofness and dustproofness.
  • the module is also located on the rear surface of the thermally conductive back plate 40 and within the enclosed area of the first gel seal line 43.
  • a plurality of inner fixing nuts 44 (which can be arranged in a rectangular array) are arranged in an array, and a rear surface of the heat conductive back plate 40 is provided with a peripheral surface covering the inner fixing nuts 44 and
  • the second colloidal seal line 45 is distributed along a circular path formed by end-to-end connection of several pairs of internal fixing nuts 44; at the same time, the module of this embodiment further includes locking to the heat-conducting back by the internal fixing nuts 44
  • the terminal box 60 on the board 40, and the terminal box 60 includes at least a heat conductive bottom plate 61 stacked on the heat conductive back plate 40 and a box body 62 integrated with the heat conductive bottom plate 61, and is on the outer front surface of the box body 62 There are heat-dissipating fins 63 (of course, the energy storage battery
  • the use of the second colloid sealing wire 45 to wrap the inner fixing nut 44 can effectively prevent the inner fixing nut 44 from being attacked by external factors, and at the same time, the second gel is sealed by the terminal box 60 (especially the box body 62).
  • the squeezing effect of the wire network 45 can achieve a sealing effect on the structural gap between the terminal block 60 and the thermally conductive back plate 40, thereby preventing water, dust, and the like from entering the terminal block 60.
  • thermally conductive bottom plate 61 and the thermally conductive back plate The contact relationship between the plate 40 and the connection relationship between the internal fixing nut 44 and the heat conductive back plate 40 can quickly conduct the heat accumulated on the heat conductive back plate 40 to the box body 62, and then use the heat dissipation fins 63 for effective air convection. To achieve rapid heat dissipation of the module.
  • the display module of this embodiment further includes a plurality of glue-injection tongues c (which can be distributed through the sides of the heat-conducting panel 30 and the side of the circuit board 11 at the same time.
  • the case is such as an inverted "V" shape or a dovetail shape)
  • the sealing gel 20 includes a main body area portion 21 covering the heat conductive panel 30 and a periphery of the main body area portion 21 and at least covering the heat conductive panel 30 at the same time.
  • the peripheral enclosing wall portion 22 of the side and the side of the circuit board 11 is formed on the peripheral enclosing wall portion 22 with a colloidal tenon portion 23 that is filled in the injection hole c.
  • the liquid raw material is simultaneously filled in the injection molding tongue c to form a colloid during the process of filling and covering the heat conductive panel 30 and the LED light emitting tube 13.
  • the tenon-convex portion 23 and the peripheral wall portion 22 are formed, so that the front and peripheral sides of the module are covered with the sealant 20, which can not only achieve a sealing effect but also effectively cover the heat-conducting panel 30 and the LED display lamp board. 10 and the thermally conductive back plate 40 are reinforced.
  • the thermally conductive back plate 40 of this embodiment may adopt different structural forms, such as a plate-like structure without a peripheral wall or a shell-like structure with a peripheral wall; as a preferred solution, the thermally-conductive back plate of this embodiment 40 adopts a plate-like structure without a peripheral wall.
  • a glue injection tenon c is required to be distributed through the sides of the thermally conductive back plate 40 at the same time, while the peripheral wall portion 22 simultaneously covers the sides of the thermally conductive panel 30 and the circuit board 11 side and the side of the heat conductive back plate 40, and in the process of injection molding to form the sealant 20, the injection molding tenon c can be used to simultaneously form a back side edge portion 24 on the rear surface edge of the heat conductive back plate 40 ( That is, it is equivalent to that the sealant 20 includes a back-side beading portion 24), and the back-side beading portion 24 and the rear side of the peripheral wall portion 22 are integrally connected.
  • the sealing gel 20 can be used to form a covering structure on the edges of the front surface, the peripheral wall surface and the rear surface of the module. While ensuring the structural stability and sealing of the entire module, the heat conductive back plate 40 The rear surface has sufficient and exposed surface area, which provides conditions for good heat dissipation of the module.
  • the display module of this embodiment further includes glue injection vias distributed through the thermal conductive panel 30, the circuit board 11 and the thermal conductive back plate 40 and distributed around each thermal conductive pillar 50 (in the figure) (Not shown), in the process of injection molding the sealant 20, the liquid rubber material will flow to the back surface side of the hot backing plate 40 through the injection vias and finally form the filling vias and cover the thermal conductive posts.
  • the thermally conductive pillar 50 is sealed, thereby preventing the thermally conductive pillar 50 from being attacked by external air.
  • the heat conducting column 50 when it is actually arranged, it can be set along the contour side of the module, the contour path of the second colloidal seal line 45, and the contour path of the first colloidal seal line 43, so that it can be set in In the process of injection molding the sealing colloid 20, the thermally conductive backing plate 40 is directly formed on the thermally conductive backing plate 40 through the injection molding via hole on the thermally conductive column end surface covering portion 25, the second colloidal sealing line 45 and the first The colloidal seal line 43 or the second colloidal seal line 45 or the first colloidal seal line 43 is directly used as the thermally conductive post end surface covering portion 25.
  • the heat-conducting panel 30 and / or the heat-conducting back plate 40 of this embodiment may be a plate-like structure formed by pressing an aluminum plate and forming the surface by an anodizing process + a blackening process.
  • the thermal conductive pillar 50 is preferably a copper structure.
  • the thermally conductive panel 30 and the thermally conductive back plate 40 have thermally conductive and non-conductive properties, and the copper thermally conductive pillar 50 facilitates heat conduction between the thermally conductive panel 30 and the thermally conductive back plate 40.
  • the LED display unit module of this embodiment effectively solves the dysentery that has existed in the LED outdoor display industry for many years through the improvement of the process structure, specifically:
  • the thermally conductive panel 30 and the thermally conductive back plate 40 made of metal materials such as aluminum are equivalent to the bimetallic thermally conductive sheet holding the LED display lamp board 10. Due to the structural arrangement of the three superimposed on each other, the LED display lamp can be made.
  • the plate 10 and even the entire module have good flatness and enhanced rigidity; at the same time, the bimetal thermally conductive sheet is locked by a certain number of regularly distributed thermally conductive posts 50 to ensure that the entire module has good internal thermal conductivity, and It also has sufficient heat dissipation surface area to the outside, which provides a structural channel for the heat dissipation of the module, and effectively avoids a series of problems of the display unit module under the traditional process structure due to poor heat dissipation or inability to dissipate heat.
  • the use of the lamp point convex ribs 32 provided on the thermally conductive panel 30 not only can block the sun and improve the display contrast of the module, but also because it is encapsulated inside the sealing gel 20, it also acts as an internal reinforcing rib.
  • the function can effectively slow down the mechanical damage caused by the frontal impact on the LED light points, and eliminate the defects that the existing plastic display module plastic mask is easily warped and deformed.
  • the sealing gel body 20 formed by the liquid glue such as colored transparent silica gel Through injection molding and curing mold, it can effectively improve the light output and display effect of the module; Encapsulation or injection molding of the thermally conductive column end covering portion 25, the second colloidal seal line 45, and the first colloidal seal line 43 are equivalent to secondary adhesives.
  • the bimetal sheet and the LED display lamp board 10 are composed of multiple pieces. The rubber posts are riveted, so that the module as a whole has higher strength and better sealing performance.
  • the second colloidal seal line 45 and the first colloidal seal line 43 are equivalent to the heat conductive back plate 40 formed in the The soft colloid sealing line that can play a role of closing and sealing when the module is assembled, further improves the sealing and waterproof effect of the mold assembly accessories.
  • the space enclosed by the second colloidal sealing wire 45 and the inner fixing nut 44 on the back side of the thermally conductive back plate 40 provides a sealed space for external data lines, power lines, and the like of the LED display unit module.
  • the present invention uses a thermally conductive panel and a thermally conductive back plate to form a double-layered thermally conductive sheet that holds the LED display lamp plate.
  • the thermally conductive pillars With the cooperation of the thermally conductive pillars, the heat generated by direct sunlight and the LED display lamp plate can be generated.
  • the rapid heat conduction and heat dissipation of heat effectively avoids a series of problems caused by poor or incapable heat dissipation of the display unit module under the traditional process structure.
  • the use of sealing gel can enhance the structural tightness of the entire module, and can also Secondary locking of the thermally conductive panel, LED display light board and thermally conductive back plate, which is equivalent to the strip riveting, ensures the stability of the module structure.

Abstract

Disclosed is a dual-heat-conducting-strip splint type LED display unit module, relating to the technical field of LED display screen. The dual-heat-conducting-strip splint type LED display unit module comprises a sealant body (20), a heat conducting panel (30), a heat conducting back plate (40), a heat conducting column (50), and an LED display lamp board (10) composed of circuit boards (11), IC chips (12) and LED light emitting tubes (13). The circuit boards (11) are stacked and clamped between the heat conducting panel (30) and the heat conducting back plate (40); lamp body via holes (a) are formed at positions corresponding to the LED light emitting tubes (13) on the heat conducting panel (30); the heat conducting column (50) runs through the heat conducting back plate (40) and the circuit board (11) to be locked and fixed on the heat conducting panel (30); the sealant body (20) covers the heat conducting panel (30) and integrates at least the heat conducting panel (30) and the LED display lamp board (10) into a whole. The heat conducting panel (30) and the heat conducting back plate (40) are used to constitute double-layer heat conducting strips clamping the LED display lamp board (10), so as to rapidly conduct and dissipate heat generated by direct solar radiation and the LED display lamp board (10) in cooperation with the heat conducting column (50). Besides, the sealant body (20) can not only enhance the structural airtightness of the entire module, but also lock and fix the heat conducting panel (30), the LED display lamp board (10) and the heat conducting back plate (40), thereby guaranteeing the stability of the module structure.

Description

一种双导热片夹板式LED显示单元模组Double thermally conductive sheet plywood type LED display unit module 技术领域Technical field
本发明涉及LED显示屏技术领域,尤其是一种双导热片夹板式LED显示单元模组。The invention relates to the technical field of LED display screens, in particular to a dual thermally conductive sheet plywood LED display unit module.
背景技术Background technique
众所周知,传统LED显示单元模组通用工艺结构为:将LED显示灯板装设于胶壳内后,向胶壳内灌入液体密封胶以将LED显示灯板封装于胶壳内,待液体密封胶固化后,再将面罩置于LED显示灯板的发光侧并与胶壳锁固为一体,以此即构成了成品LED显示单元模组。As we all know, the general process structure of the traditional LED display unit module is: after the LED display lamp board is installed in the plastic shell, a liquid sealant is poured into the plastic shell to encapsulate the LED display lamp board in the plastic shell, and the liquid is sealed. After the glue is cured, the mask is placed on the light-emitting side of the LED display lamp board and locked with the plastic shell to form a finished LED display unit module.
技术问题technical problem
传统LED显示单元模组在置于户外环境中(尤其是阳光照射下的环境中)使用时,由于密封胶体以及构成面罩的塑料胶体均为不良导热体,因太阳曝晒所产生的热量会在LED显示灯板前表面的密封胶体内集聚;同时,位于LED发光管背侧的电路板为纤维材质,也属于不良导热体,被点亮的LED灯(即:处于工作状态下的LED发光管)所产生的热量也会同时集聚在密封胶体内;基于此,阳光暴晒所产生的热量会与LED灯所产生的热量相互叠加,且由于整个模组缺少热量传递及散发的结构通道,在持续的阳光曝晒下及单元模组的持续工作下会使得密封胶体的内部温度急剧升高且随环境温度、显示灯板亮度变化而导致温度急剧变化、持续升高,由高温导致单元模组乃至户外LED显示屏普遍存在诸如灯体温度过高、温升不可控,继而带来死灯率增加、光衰现象严重、显示模组变形、故障频繁等诸多问题,这是LED户外显示屏行业多年存在的痼疾。When the traditional LED display unit module is used in an outdoor environment (especially in an environment exposed to sunlight), since the sealing gel and the plastic gel constituting the mask are poor thermal conductors, the heat generated by the sun will The sealing gel on the front surface of the display lamp board is gathered in the body; at the same time, the circuit board located on the back side of the LED light-emitting tube is made of fiber material, which is also a poor thermal conductor, and is lit by the LED light (ie, the LED light-emitting tube in the working state). The heat generated will also be collected in the sealant at the same time; based on this, the heat generated by sunlight exposure and the heat generated by LED lights will be superimposed on each other, and due to the lack of structural transmission and heat dissipation of the entire module, the continuous sunlight Under the exposure and continuous operation of the unit module, the internal temperature of the sealing gel will rise sharply, and the temperature will change sharply and continuously with the change of the ambient temperature and the brightness of the display lamp board. The high temperature will cause the unit module and even the outdoor LED display. Screens commonly exist such as excessive temperature of the lamp body and uncontrollable temperature rise, which in turn leads to an increase in the rate of dead lights, serious light decay, and display. Group deformation, fault frequent many other issues, this is the outdoor LED display industry for many years the presence of chronic illness.
技术解决方案Technical solutions
针对上述现有技术存在的不足,本发明的目的在于提供一种双导热片夹板式LED显示单元模组。In view of the shortcomings of the prior art described above, an object of the present invention is to provide a dual thermally conductive sheet plywood LED display unit module.
为了实现上述目的,本发明采用如下技术方案:In order to achieve the above objective, the present invention adopts the following technical solutions:
一种双导热片夹板式LED显示单元模组,它包括LED显示灯板,所述LED显示灯板包括电路板、贴装于电路板的后表面上的IC芯片及若干颗贴装于电路板的前表面且相互间呈阵列分布的LED发光管;A dual-heat-conducting sheet-clamp type LED display unit module includes an LED display light board. The LED display light board includes a circuit board, an IC chip mounted on a rear surface of the circuit board, and a plurality of chips mounted on the circuit board. LED light-emitting tubes on the front surface of the front surface and in an array;
它还包括密封胶体、导热面板、导热背板和若干颗导热柱,所述电路板叠置并夹持于导热面板与导热背板之间,所述导热面板上且与每颗LED发光管相对应的位置均开设有一供LED发光管贯穿分布的灯体过孔,所述导热柱的前端部顺序地贯穿导热背板和电路板后锁固于导热面板上,所述密封胶体覆盖于导热面板上并至少将导热面板和LED显示灯板包覆为一体。It also includes a sealing gel, a thermally conductive panel, a thermally conductive back plate, and a plurality of thermally conductive columns. The circuit board is stacked and clamped between the thermally conductive panel and the thermally conductive back plate. The thermally conductive panel is in phase with each LED light-emitting tube. Corresponding positions are provided with lamp body vias for LED light emitting tubes to pass through. The front end of the thermally conductive post sequentially penetrates the thermally conductive back plate and the circuit board and is locked to the thermally conductive panel. The sealing gel covers the thermally conductive panel. And at least cover the heat conducting panel and the LED display lamp board as a whole.
优选地,所述导热面板上且与每颗导热柱相对应的位置均设置有一第一凸起筋位,所述第一凸起筋位的凸起面位于电路板的前表面侧,所述导热柱的前端部锁固于第一凸起筋位上。Preferably, a first raised rib position is provided on the heat conductive panel and at a position corresponding to each heat conductive column, and the raised surface of the first raised rib position is located on the front surface side of the circuit board. The front end of the heat conducting column is locked on the first raised rib.
优选地,所述导热柱包括抵接于导热背板的后表面侧的螺帽部、由螺帽部的中心区域作轴向延伸后成型并同时贯穿于导热背板和电路板分布的导柱部以及由导柱部的前端作轴向延伸后成型并锁固于第一凸起筋位上的丝牙部;所述导柱部的长度不小于电路板的厚度与导热背板的厚度之和,且所述导柱部的前端面与第一凸起筋位的凸起面相抵,所述丝牙部的直径小于导柱部的直径。Preferably, the thermally conductive post includes a nut portion abutting on a rear surface side of the thermally conductive back plate, and a guide post which is axially extended from a central area of the nut portion and is formed to penetrate the thermally conductive back plate and the circuit board at the same time. The front end of the guide post portion is extended axially after the front end of the guide post portion is formed and fixed to the first protruding rib position. The length of the guide post portion is not less than the thickness of the circuit board and the thickness of the heat conductive back plate. And, the front end surface of the guide post portion is in abutment with the convex surface of the first raised rib position, and the diameter of the wire portion is smaller than the diameter of the guide post portion.
优选地,所述导热面板上且位于每个灯体过孔的边侧均设置有一灯点凸筋位。Preferably, a convex point of a lamp point is provided on the heat conducting panel and located at the side of each of the through holes of the lamp body.
优选地,所述密封胶体的前表面为麻面和/或所述密封胶体的前表面形成有用于将成行或成排分布的灯点凸筋位遮盖为一体的防反光纹路。Preferably, the front surface of the sealing colloid is a hemp surface and / or the front surface of the sealing colloid is formed with an anti-reflective pattern for covering the lamp point ribs distributed in rows or rows as a whole.
优选地,所述电路板上还设置有若干个贯穿于电路板分布的导热铜柱,所述导热铜柱的后端面与导热背板相抵。Preferably, the circuit board is further provided with a plurality of thermally conductive copper posts distributed through the circuit board, and the rear end surface of the thermally conductive copper posts is in contact with the thermally conductive back plate.
优选地,所述导热背板上设置有用于容置IC芯片的第二凸起筋位,所述第二凸起筋位的凸起面位于导热背板的后表面侧,且所述第二凸起筋位的凸起面上设置有若干颗相互间呈阵列分布的对外固定螺母。Preferably, a second raised rib position for accommodating an IC chip is provided on the thermally conductive back plate, and a raised surface of the second raised rib position is located on a rear surface side of the thermally conductive back plate, and the second A plurality of external fixing nuts arranged in an array are arranged on the convex surface of the convex rib position.
优选地,所述导热背板的后表面上设置有包覆对外固定螺母的周面并沿由若干颗对外固定螺母作首尾相连后所形成的环状路径分布的第一胶体密封线络。Preferably, the rear surface of the thermally conductive back plate is provided with a first colloidal sealing line covering a peripheral surface of the external fixing nut and distributed along a circular path formed by a plurality of external fixing nuts connected end to end.
优选地,所述导热背板的后表面上且位于第一胶体密封线络的围合面域内还设置有若干颗相互间呈阵列分布的对内固定螺母,所述导热背板的后表面上设置有包覆对内固定螺母的周面并沿由若干颗对内固定螺母作首尾相连后所形成的环状路径分布的第二胶体密封线络;Preferably, on the rear surface of the thermally conductive back plate and within the enclosed area of the first colloidal sealing network, a plurality of internal fixing nuts distributed in an array with each other are further disposed on the rear surface of the thermally conductive back plate. Provided with a second colloidal seal line covering the peripheral surface of the pair of internally fixed nuts and distributed along a circular path formed by end-to-end connection of a plurality of paired internally fixed nuts;
它还包括通过对内固定螺母锁固于导热背板上的接线端子盒,所述接线端子盒至少包括叠置于导热背板上的导热底板以及与导热底板装配为一体的盒体,所述盒体外前表面上设置有散热翅片。It also includes a terminal box that is locked to the thermally conductive back plate by a pair of internal fixing nuts. The terminal box at least includes a thermally conductive bottom plate stacked on the thermally conductive back plate and a box body assembled integrally with the thermally conductive bottom plate. Heat dissipation fins are arranged on the front surface of the outside of the box.
优选地,它还包括若干个同时贯穿于导热面板的边侧和电路板的边侧分布的注胶榫口,所述密封胶体包括覆盖于导热面板上的主体面域部以及形成于主体面域部的周边并至少同时包覆导热面板的边侧和电路板的边侧的周边围壁部,所述周边围壁部上形成有填充于注胶榫口内的胶体榫凸部。Preferably, it further comprises a plurality of glue-injection tongues distributed through the sides of the heat-conducting panel and the sides of the circuit board at the same time, and the sealing glue includes a main body area covering the heat-conducting panel and formed on the main body area. The periphery of the part covers at least the peripheral wall part of the side of the heat conducting panel and the side of the circuit board at the same time, and a colloid tenon part filled in the injection tongue is formed on the peripheral wall part.
优选地,所述注胶榫口还同时贯穿导热背板的边侧分布,所述周边围壁部同时包覆导热面板的边侧、电路板的边侧和导热背板的边侧,且所述密封胶体还包括形成于周边围壁部的后侧并包覆导热背板的后表面边缘的背侧包边部;Preferably, the glue-injection tongues are also distributed through the sides of the thermally conductive back plate at the same time, and the peripheral wall portion simultaneously covers the sides of the thermally conductive panel, the sides of the circuit board, and the sides of the thermally conductive back plate. The sealing colloid further includes a back-side edging portion formed on a rear side of the peripheral wall portion and covering a rear surface edge of the thermally conductive back plate;
优选地,它还包括同时贯穿于导热面板、电路板和导热背板分布并围绕每颗导热柱分布的注胶过孔以及经由注胶过孔与密封胶体连为一体并包覆导热柱的背端的导热柱端面包覆部。Preferably, it further comprises a glue injection via which is distributed through the heat conductive panel, the circuit board and the heat conductive back plate at the same time and distributed around each heat conductive column, and a back which is connected to the sealing gel body and covers the heat conductive column through the glue injection via. The end of the thermally conductive post is covered.
优选地,所述导热面板和/或导热背板为铝板作冲压后成型且表面经阳极氧化工艺+发黑工艺处理的板状结构体;所述导热柱为铜质结构体。Preferably, the thermally conductive panel and / or the thermally conductive back plate is a plate-like structure formed by punching an aluminum plate and subjecting the surface to an anodizing process + blackening process; and the thermally conductive pillar is a copper structure.
有益效果Beneficial effect
本发明利用导热面板和导热背板构成夹持LED显示灯板的双层导热片,在导热柱的配合下可对太阳直射所产生的热量及LED显示灯板所产生的热量进行快速导热及散热,有效地避免了传统工艺结构下的显示单元模组因散热不良或无法散热而出现的系列问题;同时,利用密封胶体既可以增强整个模组的结构密封性,也可以对导热面板、LED显示灯板及导热背板进行相当于胶条铆接形式的二次锁固,保证模组结构的稳定性。The invention uses a thermally conductive panel and a thermally conductive back plate to form a double-layered thermally conductive sheet that holds the LED display lamp board. With the cooperation of a thermally conductive post, the heat generated by direct sunlight and the heat generated by the LED display lamp board can be quickly conducted and dissipated. , Effectively avoiding the series of problems of the display unit module under the traditional process structure due to poor heat dissipation or inability to dissipate heat; at the same time, the use of sealing gel can not only enhance the structural seal of the entire module, but also improve the thermal conductivity of the panel and LED display. The lamp plate and the thermally conductive back plate are subject to secondary locking equivalent to the form of rubber strip riveting to ensure the stability of the module structure.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1是本发明实施例的正视平面结构示意图;FIG. 1 is a schematic plan structural view of a front view of an embodiment of the present invention; FIG.
图2是本发明实施例的后视平面结构示意图;2 is a schematic diagram of a rear-view plane structure according to an embodiment of the present invention;
图3是图2中A-A向的截面结构示意图;FIG. 3 is a schematic cross-sectional structure view taken along A-A in FIG. 2; FIG.
图4是图2中B-B向的截面结构示意图;4 is a schematic cross-sectional structure view taken along the line B-B in FIG. 2;
图5是本发明实施例在分解状态下的局部结构放大示意图;5 is an enlarged schematic view of a partial structure in an exploded state according to an embodiment of the present invention;
图6是图5中密封胶体的局部结构放大示意图;6 is an enlarged schematic view of a partial structure of the sealing colloid in FIG. 5;
图7是本发明实施例的结构分解示意图;FIG. 7 is a schematic exploded view of an embodiment of the present invention; FIG.
图8是图7中A区域的局部结构放大示意图;FIG. 8 is an enlarged schematic view of a partial structure of an area A in FIG. 7; FIG.
图9是本发明实施例在对密封胶体作简化处理后的结构分解示意图;FIG. 9 is a schematic exploded view of the embodiment of the present invention after the sealing colloid is simplified;
图中:In the picture:
a、灯体过孔;b1、导柱过孔;b2、导柱过孔;c、注胶榫口;a. Lamp body vias; b1, guide post vias; b2, guide post vias; c, glue injection tongue;
10、LED显示灯板;11、电路板;12、IC芯片;13、LED发光管;20、密封胶体;21、主体面域部;22、周边围壁部;23、胶体榫凸部;24、背侧包边部;25、导热柱端面包覆部;26、弧面凸起;27、防反光纹路;28、条纹纹路;30、导热面板;31、第一凸起筋位;32、灯点凸筋位;40、导热背板;41、第二凸起筋位;42、对外固定螺母;43、第一胶体密封线络;44、对内固定螺母;45、第二胶体密封线络;50、导热柱;51、螺帽部;52、导柱部;53、丝牙部;60、接线端子盒;61、导热底板;62、盒体;63、散热翅片;64、储能电池+超级电容。10, LED display lamp board; 11, circuit board; 12, IC chip; 13, LED light-emitting tube; 20, sealing gel; 21, the main body area; 22, the surrounding wall; 23, colloid tenon; 24 、 Back side edging part; 25. End surface covering part of thermal conductive column; 26. Arc convex; 27. Anti-reflective texture; 28; Striped texture; 30; Thermal conductive panel; 31; First raised rib position; Light point convex rib position; 40. Thermally conductive back plate; 41. Second convex rib position; 42. External fixing nut; 43. First colloidal sealing line; 44. Internal fixing nut; 45. Second colloidal sealing line Network, 50, thermally conductive post, 51, nut part, 52, guide post part, 53, wire tooth part, 60, terminal block box, 61, heat conductive bottom plate, 62, box body, 63, heat dissipation fin, 64, storage Can battery + super capacitor.
本发明的最佳实施方式Best Mode of the Invention
以下结合附图对本发明的实施例进行详细说明,但是本发明可以由权利要求限定和覆盖的多种不同方式实施。The embodiments of the present invention are described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.
如图1至图9所示,本实施例提供的一种双导热片夹板式LED显示单元模组,它包括LED显示灯板10、密封胶体20(其可根据具体情况选用有色透明的液体硅胶并经由注胶机注胶模具成型)、导热面板30、导热背板40和若干颗导热柱50;其中,LED显示灯板10包括电路板11、贴装于电路板11的后表面上的IC芯片12及若干颗贴装于电路板11的前表面且相互间呈阵列分布的LED发光管13;电路板11叠置并夹持于导热面板30与导热背板40之间,在导热面板30上且与每颗LED发光管13相对应的位置均开设有一供LED发光管13贯穿分布的灯体过孔a,导热柱50的前端部顺序地贯穿导热背板40和电路板11后锁固于导热面板30上,同时,密封胶体20覆盖于导热面板30上并至少将导热面板30和LED显示灯板10包覆为一体;本实施例的导热面板30和导热背板40可根据实际情况由具有良好导热性能的材料板加工成型,如铝等金属板材。As shown in FIG. 1 to FIG. 9, a dual thermally conductive sheet plywood type LED display unit module provided in this embodiment includes an LED display light board 10 and a sealing gel 20 (which can be colored and transparent liquid silica gel according to specific conditions) And is formed by a plastic injection molding machine), a thermally conductive panel 30, a thermally conductive back plate 40, and a plurality of thermally conductive columns 50; wherein the LED display lamp board 10 includes a circuit board 11, and an IC mounted on the rear surface of the circuit board 11 The chip 12 and a plurality of LED light-emitting tubes 13 mounted on the front surface of the circuit board 11 and arranged in an array with each other; the circuit board 11 is stacked and clamped between the thermally conductive panel 30 and the thermally conductive back plate 40. A lamp body via a is provided on the upper part and at a position corresponding to each LED light emitting tube 13 for the LED light emitting tube 13 to penetrate therethrough. The front end portion of the thermally conductive post 50 penetrates the thermally conductive back plate 40 and the circuit board 11 in order and is locked. On the heat-conducting panel 30, at the same time, the sealing gel 20 covers the heat-conducting panel 30 and covers at least the heat-conducting panel 30 and the LED display light board 10 as a whole; the heat-conducting panel 30 and the heat-conducting back plate 40 of this embodiment may be based on actual conditions Made of a material plate with good thermal conductivity Molding, such as aluminum sheet metal.
本实施例的LED显示单元模组利用导热面板30与导热背板40对LED显示灯板10以层叠叠置的方式进行夹持并通过导热柱50与导热面板30之间的连接关系对LED显示灯板10、导热面板30和导热背板40进行锁合固定,使整个模组构成了LED显示灯板10居中、导热面板30和导热背板40位于LED显示灯板10的前后两侧的组合夹层结构;同时,利用密封胶体20对导热面板30的前表面面域、LED显示灯板10的周面面域、导热面板30的周面面域乃至导热背板40的周面面域及背表面局部面域进行覆盖包覆;由此,使得整个模组具有以下有益效果,具体为:The LED display unit module of this embodiment uses the thermally conductive panel 30 and the thermally conductive back plate 40 to sandwich the LED display light board 10 in a stacked manner, and displays the LEDs through the connection relationship between the thermally conductive pillar 50 and the thermally conductive panel 30. The lamp plate 10, the heat conducting panel 30 and the heat conducting back plate 40 are locked and fixed, so that the entire module constitutes a combination of the LED display lamp plate 10 centered, and the heat conducting panel 30 and the heat conducting back plate 40 located on the front and rear sides of the LED display lamp plate 10. Sandwich structure; at the same time, the sealing gel 20 is used to align the front surface area of the thermally conductive panel 30, the peripheral surface area of the LED display light board 10, the peripheral surface area of the thermally conductive panel 30, and even the peripheral surface area and back of the thermally conductive back plate 40. The local area of the surface is covered and covered; thus, the entire module has the following beneficial effects, specifically:
1、在实际应用时(尤其是应用在户外环境中时),通过导热面板30、导热背板40和导热柱50之间的结构配合构成了对太阳直射所产生的热量以及LED显示灯板10工作时所产生的热量进行导热及散热的载体;其中,导热面板30因被包覆于密封胶体20内,导热面板30所吸收并聚集的热量会在导热面板30上进行平衡传导,再经由导热柱50传导至导热背板40上并最终利用导热背板40所具有的大区域表面积均裸露于密封胶体20的结构特点向模组外部散发;而由于导热背板40是紧贴电路板11的背侧和IC芯片12的,使得LED显示灯板10本身所产生的热量也可直接由导热背板40同步向模组外部散发;从而使得模组本身具备了良好的内部导热能力和对外散热能力,为降低模组的死灯率、光衰和故障频率以及增强模组温升的可控性创造了条件。1. In practical applications (especially when applied in outdoor environments), the structural cooperation between the thermally conductive panel 30, the thermally conductive back plate 40, and the thermally conductive pillars 50 constitutes the heat generated by direct sunlight and the LED display light panel 10 The heat generated during work is a carrier for heat conduction and heat dissipation; among them, the heat conduction panel 30 is covered in the sealing gel 20, and the heat absorbed and accumulated by the heat conduction panel 30 is conducted in a balanced manner on the heat conduction panel 30, and then the heat conduction The post 50 is conducted to the thermally conductive back plate 40 and finally uses the structural characteristics of the large area surface area of the thermally conductive back plate 40 that are exposed to the sealing gel 20 to be radiated to the outside of the module; and because the thermally conductive back plate 40 is close to the circuit board 11 The backside and the IC chip 12 enable the heat generated by the LED display light board 10 to be directly radiated to the outside of the module synchronously from the thermally conductive back plate 40; thus the module itself has good internal heat conduction and external heat dissipation capabilities. This has created conditions for reducing the dead lamp rate, light attenuation and failure frequency of the module, and enhancing the controllability of the module's temperature rise.
2、在导热面板30和导热背板40之间锁入LED显示灯板10后,由于三者之间具有相互叠加的结构特点且导热面板30和导热背板40本身所具有的结构平整度和刚性,可极大地增强模组整体的平整度和刚性。2. After the LED display lamp board 10 is locked between the thermally conductive panel 30 and the thermally conductive back plate 40, the three have superimposed structural features and the structural flatness and Rigidity can greatly enhance the flatness and rigidity of the module as a whole.
3、密封胶体20可由有色透明的液体硅胶经注胶、冷却固化后成型,利用密封胶体20对相关部件及区域的覆盖或包覆的结构特点,不但可以有效增强模组的防水、防尘等密封性能,而且固化后的密封胶体20可对LED显示灯板10、导热面板30和导热背板40进行二次锁固,从而配合导热柱50完成对整个模组的结构稳定性的加固。3. The sealing colloid 20 can be formed by colored and transparent liquid silicone gel after injecting, cooling and solidifying. By using the structural features of the sealing colloid 20 to cover or cover relevant components and areas, it can not only effectively enhance the module's waterproofness and dust resistance, etc. Sealing performance, and the cured sealant 20 can perform secondary locking on the LED display lamp board 10, the heat conducting panel 30, and the heat conducting back plate 40, so as to cooperate with the heat conducting column 50 to complete the structural stability of the entire module.
本发明的实施方式Embodiments of the invention
如图1至图9所示:As shown in Figures 1 to 9:
为保证导热柱50与导热面板30在连接后的结构稳定性,在导热面板30上且与每颗导热柱50相对应的位置均设置有一第一凸起筋位31(在导热面板30由诸如金属板材等具有一定刚性的材料板制作成型时,第一凸起筋位31可利用冲压工艺朝电路板11所在的方向进行冲压后成型),第一凸起筋位31的凸起面位于电路板11的前表面侧,而导热柱50的前端部则锁固于第一凸起筋位31的中心区域上。由此,利用第一凸起筋位31为导热柱50锁固于导热面板30上提供了结构位置空间。To ensure the structural stability of the thermally conductive posts 50 and the thermally conductive panel 30 after being connected, a first raised rib 31 is provided on the thermally conductive panel 30 and at a position corresponding to each thermally conductive post 50 ( When a metal plate, such as a metal plate, has a certain rigidity, the first raised rib position 31 can be formed by pressing in the direction of the circuit board 11 using a stamping process. The raised surface of the first raised rib position 31 is located on the circuit. The front surface side of the plate 11, and the front end portion of the thermally conductive post 50 is locked on the central region of the first raised rib position 31. Therefore, the first raised rib 31 is used to provide a structural space for the heat-conducting column 50 to be fixed on the heat-conducting panel 30.
鉴于电路板11一般为纤维材质的材料特性以及电路板11在整个模组中的特殊性,为防止因导热柱50锁固后所产生的挤压力对电路板11破坏,本实施例的导热柱50可参考诸如螺丝、螺钉或螺杆等五金连接件的结构进行设置,即:包括用于对整个导热柱50进行旋转操控并抵接于导热背板40的后表面侧的螺帽部51、由螺帽部51的中心区域作轴向延伸后成型并同时贯穿于导热背板40和电路板11分布的导柱部52以及由导柱部52的前端作轴向延伸后成型并锁固于第一凸起筋位31上的丝牙部53;其中,导柱部52的长度不小于电路板11的厚度与导热背板40的厚度之和(当然,作为优选方案,导柱部52的长度最好等于电路板11与导热背板40的厚度之和),丝牙部53的直径则小于导柱部52的直径,从而使得整个导热柱50形成了类似于前端具有丝牙结构、主体部分呈现周面平滑且整体正台阶式的圆柱状结构形式。当将LED显示灯板10、导热面板30和导热背板40进行锁固装配时,可预先在电路板11和导热背板40上开设用于供导柱部52穿设的导柱过孔b1和b2(作为优选方案,导柱过孔b1和导柱过孔b2内径相同),在第一凸起筋位31的中心开设供丝牙部53进行锁固的导柱过孔b3。由此,当丝牙部53锁固于第一凸起筋位31上后,导柱部52的前端面(即:导柱部52与丝牙部53之间的过渡面)会与第一凸起筋位31的凸起面相抵、螺帽部51则与导热背板40的背表面相抵,导热柱50所产生的由前至后的拉力会通过第一凸起筋位31作用于导柱部52上、由后至前的拉力则会由螺帽部51直接作用于导热背板40上,从而利用导热面板30和导热背板40将导热柱50所产生的点位施力转换为对电路板11的面域施力(即:面域夹持力),从而避免了因导热柱50直接对电路板11进行局部施力而容易导致电路板11破损的问题。In view of the material characteristics of the circuit board 11 generally made of fiber material and the particularity of the circuit board 11 in the entire module, in order to prevent the circuit board 11 from being damaged due to the squeezing force generated after the thermal conductive pillar 50 is locked, the thermal conductivity of this embodiment The post 50 can be set by referring to the structure of a hardware connector such as a screw, a screw, or a screw. That is, the post 50 includes a nut portion 51 for rotating the entire heat conducting post 50 and abutting the rear surface side of the heat conducting back plate 40. The central area of the nut portion 51 is axially extended and formed, and penetrates through the heat conductive back plate 40 and the guide post portion 52 distributed on the circuit board 11 at the same time. The wire teeth portion 53 on the first raised rib position 31; wherein the length of the guide post portion 52 is not less than the sum of the thickness of the circuit board 11 and the thickness of the heat conductive back plate 40 (Of course, as a preferred solution, the length of the guide post portion 52 The length is preferably equal to the sum of the thickness of the circuit board 11 and the thermally conductive back plate 40), and the diameter of the wire teeth 53 is smaller than the diameter of the guide post portion 52, so that the entire heat conduction column 50 forms a body similar to the front side with a wire structure and a main body. Partially smooth perimeter and overall platform Type cylindrical structure. When the LED display lamp board 10, the thermally conductive panel 30, and the thermally conductive back plate 40 are locked and assembled, a guide post via hole b1 for the guide post portion 52 to pass through may be opened in the circuit board 11 and the thermally conductive back plate 40 in advance. And b2 (as a preferred solution, the inner diameter of the guide post via hole b1 and the guide post via hole b2 are the same), a guide post via hole b3 is provided at the center of the first raised rib 31 for the wire teeth 53 to be locked. Therefore, after the wire teeth portion 53 is locked on the first raised rib position 31, the front end surface of the guide pillar portion 52 (that is, the transition surface between the guide pillar portion 52 and the wire teeth portion 53) will be in contact with the first The raised surface of the raised rib position 31 abuts, and the nut portion 51 abuts against the back surface of the thermally conductive back plate 40. The front-to-back tensile force generated by the thermally conductive pillar 50 will act on the guide through the first raised rib position 31. The rear-to-front pulling force on the pillar portion 52 will be directly applied to the thermally conductive back plate 40 by the nut portion 51, so that the point force generated by the thermally conductive pillar 50 is converted into the thermally conductive panel 50 and the thermally conductive back plate 40 by Applying force to the area of the circuit board 11 (ie, the area holding force), thereby avoiding the problem that the circuit board 11 is easily damaged due to the local thermal force applied to the circuit board 11 directly by the thermal conductive pillar 50.
为增强模组的显示效果,在导热面板30的前表面上且位于每个灯体过孔a的边侧均设置有一灯点凸筋位32,在对导热面板30进行灯体过孔a的开设的过程中(如冲压成型的过程中)可直接形成灯点凸筋位32;以此,利用灯点凸筋位32不但可以在每颗LED发光管13的边侧形成遮阳凸起以通过遮挡阳光照射来提升整个模组的对比度,而且进行注胶包覆并形成密封胶体20后,灯点凸起32可在密封胶体20的内部起到加强筋的作用,进而有效减缓正面冲击对LED发光管13所造成的损伤破坏。In order to enhance the display effect of the module, a lamp point convex rib 32 is provided on the front surface of the thermally conductive panel 30 and on the side of each of the lamp body vias a. During the opening process (such as in the process of stamping and forming), the light point convex rib positions 32 can be directly formed; thus, using the light point convex rib positions 32 can not only form sunshade projections on the sides of each LED light emitting tube 13 to pass through. Blocking the sunlight to improve the contrast of the entire module, and after the injection molding and forming the sealant 20, the lamp point protrusions 32 can play a role of reinforcing ribs inside the sealant 20, thereby effectively slowing the frontal impact on the LED Damage caused by the arc tube 13.
为进一步增强模组的显示效果,本实施例的密封胶体20的前表面可采用由凸起的微粒所组成的弧形麻面结构(如在每颗LED发光管13的对应区域均形成弧面凸起26和/或在其前表面上设置条纹纹路28)和/或在密封胶体20的前表面设置有防反光纹路27(其布置形式可采用将成行分布或成排分布的灯点凸筋位32进行连续遮盖,以形成多条纹路。以此,利用弧面凸起26、条纹纹路28和/或防反光纹路27可对由外界射入的光线进行漫反射以防止模组表面反光,进而增强模组的显示效果。In order to further enhance the display effect of the module, the front surface of the sealing gel 20 of this embodiment may adopt a curved hemp surface structure composed of raised particles (for example, an arc surface is formed in the corresponding area of each LED light emitting tube 13). The protrusions 26 and / or stripe lines 28 are provided on the front surface thereof and / or anti-reflective lines 27 are provided on the front surface of the sealant 20 (the arrangement form may be light bulb convex ribs distributed in rows or rows) The bits 32 are continuously covered to form a multi-striped path. In this way, the curved protrusions 26, the striped pattern 28 and / or the anti-reflective pattern 27 can diffusely reflect the light incident from the outside to prevent the module surface from reflecting, The display effect of the module is further enhanced.
为保证LED发光管13所产生的热量能够迅速地经由导热背板40向外散发,在电路板11上还设置有若干个贯穿于电路板11分布的导热铜柱(图中未示出,其设置位置及数量可以依据LED发光管13的数量及排列关系进行布局,如设置于由若干颗LED发光管13所组成的阵列面域的中心区域),导热铜柱的后端面则与导热背板40相抵,而其前端面则最好能够与一定阵列面域内的其中一颗LED发光管13的底面相抵。由此,利用导热铜柱可将电路板11所聚集的热量、乃至LED发光管13所产生的热量快速地传导至导热背板40上,从而利用导热背板40进行快速散热。In order to ensure that the heat generated by the LED light emitting tube 13 can be quickly dissipated outward through the thermally conductive back plate 40, a number of thermally conductive copper posts (not shown in the figure, The setting position and number can be arranged according to the number and arrangement relationship of the LED light-emitting tubes 13, such as being arranged in the center area of an array area composed of a plurality of LED light-emitting tubes 13. The rear end surface of the thermally conductive copper pillar and the thermally conductive back plate 40, and the front end surface of the LED light emitting tube 13 can be offset with the bottom surface of one of the LED light emitting tubes 13 in a certain array area. Therefore, the heat collected by the circuit board 11 and even the heat generated by the LED light emitting tube 13 can be quickly conducted to the heat conductive back plate 40 by using the heat conductive copper pillars, so that the heat conductive back plate 40 can be used for rapid heat dissipation.
IC芯片12作为LED显示灯板10中的其中一主要热量来源,为进一步增强对LED显示灯板10的导热及散热效果,在导热背板40上设置有用于容置IC芯片12的第二凸起筋位41,其可由诸如金属板材的导热背板40经冲压后成型),使第二凸起筋位41的凸起面位于导热背板40的后表面侧,以此利用第二凸起筋位41为IC芯片12的放置提供结构空间并使IC芯片12能够紧贴第二凸起筋位41的前表面,进而利用IC芯片12与导热背板40的直接接触来达到快速导热及散热的目的;同时,在第二凸起筋位41的凸起面上设置有若干颗相互间呈阵列分布的对外固定螺母42,以便利用对外锁固螺母42能够将整个模组与显示屏箱体进行锁固;当然,需要指出的是:本实施例的第二凸起筋位41并不需要与IC芯片12一一对应,其可按照一定的环状路径进行设置,如设置为类似于“回”字形的形状,此时IC芯片12可按照矩形规则阵列分布于电路板11上并嵌合于第二凸起筋位41内,从而为对外固定螺母42的设置以及将整个模组装配于显示屏箱体内提供条件。The IC chip 12 is one of the main heat sources in the LED display lamp board 10. In order to further enhance the heat conduction and heat dissipation effect on the LED display lamp board 10, a second protrusion for accommodating the IC chip 12 is provided on the thermally conductive back plate 40. Reinforcement position 41, which can be formed by pressing the heat conductive back plate 40 such as a metal plate after punching), so that the convex surface of the second raised rib position 41 is located on the rear surface side of the heat conductive back plate 40, thereby using the second protrusion The rib position 41 provides structural space for the placement of the IC chip 12 and enables the IC chip 12 to closely adhere to the front surface of the second raised rib position 41. The direct contact between the IC chip 12 and the thermal back plate 40 is used to achieve rapid heat conduction and heat dissipation. At the same time, a plurality of external fixing nuts 42 distributed in an array are arranged on the convex surface of the second protruding rib position 41, so that the entire module and the display box body can be connected by using the external locking nuts 42. Of course, it should be pointed out that the second raised ribs 41 of this embodiment do not need to correspond to the IC chip 12 one-to-one, and can be set according to a certain circular path, such as set similar to " Back "shape, IC chip 1 at this time 2 can be distributed on the circuit board 11 in a rectangular regular array and fit into the second raised ribs 41, so as to provide conditions for setting the external fixing nut 42 and assembling the entire module into the display case.
为增强整个模组与显示屏箱体装配后的结构紧凑性并起到对两者之间连接缝隙的密封效果,在导热背板40的后表面上设置有包覆对外固定螺母42的周面并沿由若干颗对外固定螺母42作首尾相连后所形成的环状路径分布(也可以理解为是沿第一凸起筋位41的轮廓形状分布)的第一胶体密封线络43,第一胶体密封线络43可在密封胶体10经注胶成型时通过对相关模具的选择设置或者对模组本身结构的设置同步成型(如在导热面板30、电路板11和导热背板40上设置相应的注胶过孔结构等)。以此,利用第一胶体密封线络43不但可以对对外固定螺母42进行包裹以防止其受到外部因素的侵蚀,而且将对外锁固螺母42与显示屏箱体进行锁固后可对第一胶体密封线络43形成挤压,从而使第一胶体密封线络43起到防水、防尘等密封效果。In order to enhance the compactness of the assembly of the entire module and the display box body and to seal the connection gap between the two, a peripheral surface covering the external fixing nut 42 is provided on the rear surface of the thermally conductive back plate 40. The first colloidal seal line 43 is distributed along a ring-shaped path formed by a plurality of external fixing nuts 42 connected end to end (also can be understood as being distributed along the outline shape of the first raised rib position 41). The colloidal sealing wire 43 can be formed synchronously by selecting the relevant mold or setting the structure of the module when the sealing colloid 10 is injection-molded (such as the corresponding setting on the thermal conductive panel 30, the circuit board 11 and the thermal conductive back plate 40). Structure of injection vias, etc.). In this way, using the first colloid sealing wire 43 can not only wrap the external fixing nut 42 to prevent it from being attacked by external factors, but also lock the external locking nut 42 and the display case to lock the first colloid. The seal line 43 is pressed, so that the first colloidal seal line 43 has a sealing effect such as waterproofness and dustproofness.
为进一步为模组的相关组成部件(如起到端子连接或者控制等功能的部件)提供装配空间,在导热背板40的后表面上且位于第一胶体密封线络43的围合面域内还设置有若干颗相互间呈阵列分布的对内固定螺母44(其可采用矩形阵列的方式进行设置),同时在导热背板40的后表面上设置有包覆对内固定螺母44的周面并沿由若干颗对内固定螺母44作首尾相连后所形成的环状路径分布的第二胶体密封线络45;同时,本实施例的模组还包括通过对内固定螺母44锁固于导热背板40上的接线端子盒60,而接线端子盒60则至少包括叠置于导热背板40上的导热底板61以及与导热底板61装配为一体的盒体62,并且在盒体62外前表面上设置有散热翅片63(当然,在接线端子盒60内可根据实际情况设置储能电池+超级电容64、连接端子等部件);其中,第二胶体密封线络45的成型方式可参考第一胶体密封线络43。以此,利用第二胶体密封线络45对内固定螺母44的包裹可有效防止对内固定螺母44受到外部因素的侵蚀,同时通过接线端子盒60(尤其是盒体62)对第二胶体密封线络45的挤压效应可达到对接线端子盒60与导热背板40之间的结构缝隙的密封效果,从而防止水、灰尘等侵入接线端子盒60内;另外,通过导热底板61与导热背板40的接触关系以及对内固定螺母44与导热背板40的连接关系,可将导热背板40上所聚集的热量迅速传导至盒体62上,进而利用散热翅片63进行有效地空气对流,实现模组的快速散热。To further provide assembly space for the relevant component parts of the module (such as those for terminal connection or control functions), it is also located on the rear surface of the thermally conductive back plate 40 and within the enclosed area of the first gel seal line 43. A plurality of inner fixing nuts 44 (which can be arranged in a rectangular array) are arranged in an array, and a rear surface of the heat conductive back plate 40 is provided with a peripheral surface covering the inner fixing nuts 44 and The second colloidal seal line 45 is distributed along a circular path formed by end-to-end connection of several pairs of internal fixing nuts 44; at the same time, the module of this embodiment further includes locking to the heat-conducting back by the internal fixing nuts 44 The terminal box 60 on the board 40, and the terminal box 60 includes at least a heat conductive bottom plate 61 stacked on the heat conductive back plate 40 and a box body 62 integrated with the heat conductive bottom plate 61, and is on the outer front surface of the box body 62 There are heat-dissipating fins 63 (of course, the energy storage battery + super capacitor 64, connection terminals and other components can be set in the terminal box 60 according to the actual situation); among them, the molding method of the second gel seal wire 45 can be A first sealing line test colloidal network 43. In this way, the use of the second colloid sealing wire 45 to wrap the inner fixing nut 44 can effectively prevent the inner fixing nut 44 from being attacked by external factors, and at the same time, the second gel is sealed by the terminal box 60 (especially the box body 62). The squeezing effect of the wire network 45 can achieve a sealing effect on the structural gap between the terminal block 60 and the thermally conductive back plate 40, thereby preventing water, dust, and the like from entering the terminal block 60. In addition, the thermally conductive bottom plate 61 and the thermally conductive back plate The contact relationship between the plate 40 and the connection relationship between the internal fixing nut 44 and the heat conductive back plate 40 can quickly conduct the heat accumulated on the heat conductive back plate 40 to the box body 62, and then use the heat dissipation fins 63 for effective air convection. To achieve rapid heat dissipation of the module.
为最大限度地优化整个模组的结构,本实施例的显示模组还包括若干个同时贯穿于导热面板30的边侧和电路板11的边侧分布的注胶榫口c(其可根据实际情况采用诸如倒“V”字形或者燕尾形),而密封胶体20则包括覆盖于导热面板30上的主体面域部21以及形成于主体面域部21的周边并至少同时包覆导热面板30的边侧和电路板11的边侧的周边围壁部22,在周边围壁部22上形成有填充于注胶榫口c内的胶体榫凸部23。由此,再利用诸如液体硅胶等原料经注胶形成密封胶体20的过程中,液体原料在填充并覆盖导热面板30及LED发光管13过程中会同步填充于注胶榫口c内以形成胶体榫凸部23并且形成周边围壁部22,从而利用密封胶体20对模组的正面及周边侧面进行覆盖包覆,不但可以起到密封的效果而且能够有效地对导热面板30、LED显示灯板10和导热背板40进行加固。In order to maximize the structure of the entire module, the display module of this embodiment further includes a plurality of glue-injection tongues c (which can be distributed through the sides of the heat-conducting panel 30 and the side of the circuit board 11 at the same time. The case is such as an inverted "V" shape or a dovetail shape), and the sealing gel 20 includes a main body area portion 21 covering the heat conductive panel 30 and a periphery of the main body area portion 21 and at least covering the heat conductive panel 30 at the same time. The peripheral enclosing wall portion 22 of the side and the side of the circuit board 11 is formed on the peripheral enclosing wall portion 22 with a colloidal tenon portion 23 that is filled in the injection hole c. Therefore, in the process of using a raw material such as liquid silica gel to form a sealant gel 20 through injection molding, the liquid raw material is simultaneously filled in the injection molding tongue c to form a colloid during the process of filling and covering the heat conductive panel 30 and the LED light emitting tube 13. The tenon-convex portion 23 and the peripheral wall portion 22 are formed, so that the front and peripheral sides of the module are covered with the sealant 20, which can not only achieve a sealing effect but also effectively cover the heat-conducting panel 30 and the LED display lamp board. 10 and the thermally conductive back plate 40 are reinforced.
本实施例的导热背板40可根据实际情况采用不同的结构形式,如无周边围壁的板状结构体或者有周边围壁的壳状结构体;作为优选方案,本实施例的导热背板40采用无周边围壁的板状结构体,此时需要注胶榫口c同时贯穿导热背板40的边侧分布,而周边围壁部22则同时包覆导热面板30的边侧、电路板11的边侧和导热背板40的边侧,而在注胶形成密封胶体20的过程中,利用注胶榫口c可同时在导热背板40的后表面边缘形成背侧包边部24(即:相当于密封胶体20包括背侧包边部24),且背侧包边部24与周边围壁部22的后侧衔接为一体。由此,利用密封胶体20可对模组的前表面、周壁面及后表面的边沿形成覆盖包覆结构,在保证整个模组的结构稳定性以及密封性的同时,也使得导热背板40的后表面具有足够的且外露的表面积,为模组的良好散热提供了条件。The thermally conductive back plate 40 of this embodiment may adopt different structural forms, such as a plate-like structure without a peripheral wall or a shell-like structure with a peripheral wall; as a preferred solution, the thermally-conductive back plate of this embodiment 40 adopts a plate-like structure without a peripheral wall. At this time, a glue injection tenon c is required to be distributed through the sides of the thermally conductive back plate 40 at the same time, while the peripheral wall portion 22 simultaneously covers the sides of the thermally conductive panel 30 and the circuit board 11 side and the side of the heat conductive back plate 40, and in the process of injection molding to form the sealant 20, the injection molding tenon c can be used to simultaneously form a back side edge portion 24 on the rear surface edge of the heat conductive back plate 40 ( That is, it is equivalent to that the sealant 20 includes a back-side beading portion 24), and the back-side beading portion 24 and the rear side of the peripheral wall portion 22 are integrally connected. Thus, the sealing gel 20 can be used to form a covering structure on the edges of the front surface, the peripheral wall surface and the rear surface of the module. While ensuring the structural stability and sealing of the entire module, the heat conductive back plate 40 The rear surface has sufficient and exposed surface area, which provides conditions for good heat dissipation of the module.
为进一步增强整个模组的性能,本实施例的显示模组还包括同时贯穿于导热面板30、电路板11和导热背板40分布并围绕每颗导热柱50分布的注胶过孔(图中未示出),在对密封胶体20进行注胶成型的过程中,液体胶料会经由注胶过孔流向导热背板40的背表面侧并最终形成填充于注胶过孔内并覆盖导热柱50的背端的导热柱端面包覆部25。由此,通过对导热柱端面包覆部25的厚度、宽度由模具成型并覆盖导热柱50,实现对导热柱50的封装,从而避免导热柱50受到外部空气的侵蚀。当然,在对导热柱50进行实际布置时,可将其沿模组的轮廓边侧、第二胶体密封线络45的轮廓路径及第一胶体密封线络43的轮廓路径进行设置,从而可在对密封胶体20注胶成型的过程中,直接通过注胶过孔在导热背板40上形成于密封胶体20连为一体的导热柱端面包覆部25、第二胶体密封线络45及第一胶体密封线络43或者直接利用第二胶体密封线络45或第一胶体密封线络43作为导热柱端面包覆部25。In order to further enhance the performance of the entire module, the display module of this embodiment further includes glue injection vias distributed through the thermal conductive panel 30, the circuit board 11 and the thermal conductive back plate 40 and distributed around each thermal conductive pillar 50 (in the figure) (Not shown), in the process of injection molding the sealant 20, the liquid rubber material will flow to the back surface side of the hot backing plate 40 through the injection vias and finally form the filling vias and cover the thermal conductive posts. The back end heat-conducting pillar end-face covering portion 25 of 50. Therefore, by forming the thickness and width of the thermally conductive pillar end surface covering portion 25 by a mold and covering the thermally conductive pillar 50, the thermally conductive pillar 50 is sealed, thereby preventing the thermally conductive pillar 50 from being attacked by external air. Of course, when the heat conducting column 50 is actually arranged, it can be set along the contour side of the module, the contour path of the second colloidal seal line 45, and the contour path of the first colloidal seal line 43, so that it can be set in In the process of injection molding the sealing colloid 20, the thermally conductive backing plate 40 is directly formed on the thermally conductive backing plate 40 through the injection molding via hole on the thermally conductive column end surface covering portion 25, the second colloidal sealing line 45 and the first The colloidal seal line 43 or the second colloidal seal line 45 or the first colloidal seal line 43 is directly used as the thermally conductive post end surface covering portion 25.
另外,为最大限度地增强整个模组的性能,本实施例的导热面板30和/或导热背板40可采用铝板作冲压后成型且表面经阳极氧化工艺+发黑工艺处理的板状结构体;而导热柱50则优选为铜质结构体。由此,使得导热面板30和导热背板40具有导热、不导电的性能,而铜质的导热柱50则利于在导热面板30与导热背板40进行热量传导。In addition, in order to maximize the performance of the entire module, the heat-conducting panel 30 and / or the heat-conducting back plate 40 of this embodiment may be a plate-like structure formed by pressing an aluminum plate and forming the surface by an anodizing process + a blackening process. ; And the thermal conductive pillar 50 is preferably a copper structure. As a result, the thermally conductive panel 30 and the thermally conductive back plate 40 have thermally conductive and non-conductive properties, and the copper thermally conductive pillar 50 facilitates heat conduction between the thermally conductive panel 30 and the thermally conductive back plate 40.
综上所述,本实施例的LED显示单元模组通过工艺结构的改进,有效地解决了LED户外显示屏行业多年存在的痼疾,具体为:In summary, the LED display unit module of this embodiment effectively solves the dysentery that has existed in the LED outdoor display industry for many years through the improvement of the process structure, specifically:
1、利用诸如铝等金属材料制作而成导热面板30和导热背板40相当于构成了夹持LED显示灯板10的双金属导热片,由于三者相互叠加的结构布置方式可使得LED显示灯板10乃至整个模组具有良好的平整度及增强的刚性;同时,通过一定数量且呈规则分布的导热柱50将双金属导热片进行锁定,保证了整个模组具有良好的内部导热能力,并且对外部也具有足够的散热表面积,为模组的散热提供了结构通道,有效地避免了传统工艺结构下的显示单元模组因散热不良或无法散热而出现的系列问题。1. The thermally conductive panel 30 and the thermally conductive back plate 40 made of metal materials such as aluminum are equivalent to the bimetallic thermally conductive sheet holding the LED display lamp board 10. Due to the structural arrangement of the three superimposed on each other, the LED display lamp can be made. The plate 10 and even the entire module have good flatness and enhanced rigidity; at the same time, the bimetal thermally conductive sheet is locked by a certain number of regularly distributed thermally conductive posts 50 to ensure that the entire module has good internal thermal conductivity, and It also has sufficient heat dissipation surface area to the outside, which provides a structural channel for the heat dissipation of the module, and effectively avoids a series of problems of the display unit module under the traditional process structure due to poor heat dissipation or inability to dissipate heat.
2、利用设置于导热面板30上的灯点凸筋位32,不但可以起到遮挡阳光以提升模组显示对比度的作用,而且由于其是封装于密封胶体20内部的,也起到了内部加强筋的作用,可有效减缓正面冲击对LED灯点所造成的机械损伤破坏,根除了现有塑胶显示模组塑胶面罩易翘起变形、易损坏的缺陷。2. The use of the lamp point convex ribs 32 provided on the thermally conductive panel 30 not only can block the sun and improve the display contrast of the module, but also because it is encapsulated inside the sealing gel 20, it also acts as an internal reinforcing rib. The function can effectively slow down the mechanical damage caused by the frontal impact on the LED light points, and eliminate the defects that the existing plastic display module plastic mask is easily warped and deformed.
3、利用诸如有色透明硅胶等液体胶料经注胶、固化模具成型的密封胶体20所呈现的麻面、纹路以及筋位等等结构特点,可有效改善模组出光及显示的效果;而通过灌胶或注胶成型的导热柱端面包覆部25、第二胶体密封线络45和第一胶体密封线络43等相当于二次用胶将双金属片、LED显示灯板10由多条胶柱进行铆接,使模组整体具有了更高的强度和更好的密封性能,尤其是第二胶体密封线络45和第一胶体密封线络43相当于在导热背板40上形成了在对模组进行装配时可起到闭合密封作用的软胶体密封线,进一步提升了模组装配件的密封防水效果。3. Utilizing the structural characteristics such as the matte surface, texture, and tendons of the sealing gel body 20 formed by the liquid glue such as colored transparent silica gel through injection molding and curing mold, it can effectively improve the light output and display effect of the module; Encapsulation or injection molding of the thermally conductive column end covering portion 25, the second colloidal seal line 45, and the first colloidal seal line 43 are equivalent to secondary adhesives. The bimetal sheet and the LED display lamp board 10 are composed of multiple pieces. The rubber posts are riveted, so that the module as a whole has higher strength and better sealing performance. In particular, the second colloidal seal line 45 and the first colloidal seal line 43 are equivalent to the heat conductive back plate 40 formed in the The soft colloid sealing line that can play a role of closing and sealing when the module is assembled, further improves the sealing and waterproof effect of the mold assembly accessories.
4、利用第二胶体密封线络45和对内固定螺母44在导热背板40的背侧所围合的空间为LED显示单元模组的外连数据线、电源线等等提供了密封空间。4. The space enclosed by the second colloidal sealing wire 45 and the inner fixing nut 44 on the back side of the thermally conductive back plate 40 provides a sealed space for external data lines, power lines, and the like of the LED display unit module.
工业实用性Industrial applicability
由于采用了上述方案,本发明利用导热面板和导热背板构成夹持LED显示灯板的双层导热片,在导热柱的配合下可对太阳直射所产生的热量及LED显示灯板所产生的热量进行快速导热及散热,有效地避免了传统工艺结构下的显示单元模组因散热不良或无法散热而出现的系列问题;同时,利用密封胶体既可以增强整个模组的结构密封性,也可以对导热面板、LED显示灯板及导热背板进行相当于胶条铆接形式的二次锁固,保证模组结构的稳定性。Due to the adoption of the above solution, the present invention uses a thermally conductive panel and a thermally conductive back plate to form a double-layered thermally conductive sheet that holds the LED display lamp plate. With the cooperation of the thermally conductive pillars, the heat generated by direct sunlight and the LED display lamp plate can be generated. The rapid heat conduction and heat dissipation of heat effectively avoids a series of problems caused by poor or incapable heat dissipation of the display unit module under the traditional process structure. At the same time, the use of sealing gel can enhance the structural tightness of the entire module, and can also Secondary locking of the thermally conductive panel, LED display light board and thermally conductive back plate, which is equivalent to the strip riveting, ensures the stability of the module structure.
以上所述仅为本发明的优选实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本发明的专利保护范围内。The above is only a preferred embodiment of the present invention, and thus does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the description and drawings of the present invention, or directly or indirectly used in other related The technical field is included in the patent protection scope of the present invention.

Claims (13)

  1. 一种双导热片夹板式LED显示单元模组,它包括LED显示灯板,所述LED显示灯板包括电路板、贴装于电路板的后表面上的IC芯片及若干颗贴装于电路板的前表面且相互间呈阵列分布的LED发光管;其特征在于:A dual-heat-conducting sheet-clamp type LED display unit module includes an LED display light board. The LED display light board includes a circuit board, an IC chip mounted on a rear surface of the circuit board, and a plurality of chips mounted on the circuit board. LED light-emitting tubes on the front surface of the light-emitting diode and arranged in an array with each other;
    它还包括密封胶体、导热面板、导热背板和若干颗导热柱,所述电路板叠置并夹持于导热面板与导热背板之间,所述导热面板上且与每颗LED发光管相对应的位置均开设有一供LED发光管贯穿分布的灯体过孔,所述导热柱的前端部顺序地贯穿导热背板和电路板后锁固于导热面板上,所述密封胶体覆盖于导热面板上并至少将导热面板和LED显示灯板包覆为一体。It also includes a sealing gel, a thermally conductive panel, a thermally conductive back plate, and a plurality of thermally conductive columns. The circuit board is stacked and clamped between the thermally conductive panel and the thermally conductive back plate. The thermally conductive panel is in phase with each LED light-emitting tube. Corresponding positions are provided with lamp body vias for LED light emitting tubes to pass through. The front end of the thermally conductive post sequentially penetrates the thermally conductive back plate and the circuit board and is locked to the thermally conductive panel. The sealing gel covers the thermally conductive panel. And at least cover the heat conducting panel and the LED display lamp board as a whole.
  2. 如权利要求1所述的一种双导热片夹板式LED显示单元模组,其特征在于:所述导热面板上且与每颗导热柱相对应的位置均设置有第一凸起筋位,所述第一凸起筋位的凸起面位于电路板的前表面侧,所述导热柱的前端部锁固于第一凸起筋位上。The dual thermally conductive sheet plywood LED display unit module according to claim 1, wherein a first raised rib position is provided on the thermally conductive panel and at a position corresponding to each thermally conductive post, so The raised surface of the first raised rib position is located on the front surface side of the circuit board, and the front end portion of the thermally conductive post is locked to the first raised rib position.
  3. 如权利要求2所述的一种双导热片夹板式LED显示单元模组,其特征在于:所述导热柱包括抵接于导热背板的后表面侧的螺帽部、由螺帽部的中心区域作轴向延伸后成型并同时贯穿于导热背板和电路板分布的导柱部以及由导柱部的前端作轴向延伸后成型并锁固于第一凸起筋位上的丝牙部;所述导柱部的长度不小于电路板的厚度与导热背板的厚度之和,且所述导柱部的前端面与第一凸起筋位的凸起面相抵,所述丝牙部的直径小于导柱部的直径。The dual thermally conductive sheet plywood LED display unit module according to claim 2, wherein the thermally conductive post includes a nut portion abutting on a rear surface side of the thermally conductive back plate, and a center of the nut portion The area is formed after being axially extended and penetrates at the same time through the guide post portion distributed by the heat conductive backplane and the circuit board, and the front end of the guide post portion is axially extended and formed and locked on the wire portion of the first raised rib position. ; The length of the guide post portion is not less than the sum of the thickness of the circuit board and the thickness of the heat conductive back plate, and the front end surface of the guide post portion is in abutment with the convex surface of the first raised rib position, the wire teeth portion Is smaller than the diameter of the guide post portion.
  4. 如权利要求1所述的一种双导热片夹板式LED显示单元模组,其特征在于:所述导热面板上且位于每个灯体过孔的边侧均设置有一灯点凸筋位。The dual heat-conducting sheet plywood LED display unit module according to claim 1, wherein a lamp point convex rib position is provided on the heat-conducting panel and located on the side of each light body via hole.
  5. 如权利要求4所述的一种双导热片夹板式LED显示单元模组,其特征在于:所述密封胶体的前表面为麻面和/或所述密封胶体的前表面形成有用于将成行或成排分布的灯点凸筋位遮盖为一体的防反光纹路。The dual heat-conducting sheet plywood LED display unit module according to claim 4, wherein the front surface of the sealing gel is a hemp surface and / or the front surface of the sealing gel is formed to form a line or The rows of light spot convex ribs cover an integrated anti-reflective pattern.
  6. 如权利要求1所述的一种双导热片夹板式LED显示单元模组,其特征在于:所述电路板上还设置有若干个贯穿于电路板分布的导热铜柱,所述导热铜柱的后端面与导热背板相抵。The dual thermally conductive sheet plywood LED display unit module according to claim 1, wherein the circuit board is further provided with a plurality of thermally conductive copper posts distributed through the circuit board, The rear end face is in contact with the thermally conductive back plate.
  7. 如权利要求1所述的一种双导热片夹板式LED显示单元模组,其特征在于:所述导热背板上设置有用于容置IC芯片的第二凸起筋位,所述第二凸起筋位的凸起面位于导热背板的后表面侧,且所述第二凸起筋位的凸起面上设置有若干颗相互间呈阵列分布的对外固定螺母。The dual thermally conductive sheet plywood type LED display unit module according to claim 1, wherein a second convex rib position for accommodating an IC chip is provided on the thermally conductive back plate, and the second convex The raised surface of the rib position is located on the rear surface side of the heat conductive back plate, and the raised surface of the second raised rib position is provided with a plurality of external fixing nuts distributed in an array with each other.
  8. 如权利要求7所述的一种双导热片夹板式LED显示单元模组,其特征在于:所述导热背板的后表面上设置有包覆对外固定螺母的周面并沿由若干颗对外固定螺母作首尾相连后所形成的环状路径分布的第一胶体密封线络。The dual thermally conductive sheet plywood type LED display unit module according to claim 7, characterized in that: the rear surface of the thermally conductive back plate is provided with a peripheral surface covering an external fixing nut and fixed by a plurality of external components along the peripheral surface. The nut serves as the first colloidal sealing network of the annular path formed by the end-to-end connection.
  9. 如权利要求8所述的一种双导热片夹板式LED显示单元模组,其特征在于:所述导热背板的后表面上且位于第一胶体密封线络的围合面域内还设置有若干颗相互间呈阵列分布的对内固定螺母,所述导热背板的后表面上设置有包覆对内固定螺母的周面并沿由若干颗对内固定螺母作首尾相连后所形成的环状路径分布的第二胶体密封线络;The dual thermally conductive sheet plywood-type LED display unit module according to claim 8, characterized in that: on the rear surface of the thermally conductive back plate and in a surrounding area of the first gel seal line, a plurality of Two inner fixing nuts distributed in an array with each other, the rear surface of the thermally conductive back plate is provided with a ring formed by covering the peripheral surface of the inner fixing nuts and being connected end-to-end by a plurality of inner fixing nuts. Path distribution of the second colloidal seal line;
    它还包括通过对内固定螺母锁固于导热背板上的接线端子盒,所述接线端子盒至少包括叠置于导热背板上的导热底板以及与导热底板装配为一体的盒体,所述盒体外前表面上设置有散热翅片。It also includes a terminal box that is locked to the thermally conductive back plate by a pair of internal fixing nuts. The terminal box at least includes a thermally conductive bottom plate stacked on the thermally conductive back plate and a box body assembled integrally with the thermally conductive bottom plate. Heat dissipation fins are arranged on the front surface of the outside of the box.
  10. 如权利要求1所述的一种双导热片夹板式LED显示单元模组,其特征在于:它还包括若干个同时贯穿于导热面板的边侧和电路板的边侧分布的注胶榫口,所述密封胶体包括覆盖于导热面板上的主体面域部以及形成于主体面域部的周边并至少同时包覆导热面板的边侧和电路板的边侧的周边围壁部,所述周边围壁部上形成有填充于注胶榫口内的胶体榫凸部。The dual thermally conductive sheet plywood LED display unit module according to claim 1, further comprising: a plurality of glue-injection tongues distributed through both the sides of the heat-conducting panel and the sides of the circuit board, The sealing gel includes a main body area portion covered on the heat conduction panel and a peripheral wall portion formed on the periphery of the main body area portion and covering at least the sides of the heat conduction panel and the side of the circuit board at the same time. A colloidal tenon is formed in the wall portion and filled in the gel injection tenon.
  11. 如权利要求10所述的一种双导热片夹板式LED显示单元模组,其特征在于:所述注胶榫口还同时贯穿导热背板的边侧分布,所述周边围壁部同时包覆导热面板的边侧、电路板的边侧和导热背板的边侧,且所述密封胶体还包括形成于周边围壁部的后侧并包覆导热背板的后表面边缘的背侧包边部。The dual thermally conductive sheet plywood LED display unit module according to claim 10, characterized in that the glue injection tenon is also distributed through the sides of the thermally conductive back plate, and the peripheral wall portions are simultaneously covered The side of the thermally conductive panel, the side of the circuit board, and the side of the thermally conductive back plate, and the sealant further includes a back side edge formed on the rear side of the peripheral wall portion and covering the rear surface edge of the thermally conductive back plate. unit.
  12. 如权利要求1所述的一种双导热片夹板式LED显示单元模组,其特征在于:它还包括同时贯穿于导热面板、电路板和导热背板分布并围绕每颗导热柱分布的注胶过孔以及经由注胶过孔与密封胶体连为一体并包覆导热柱的背端的导热柱端面包覆部。The dual thermally conductive sheet plywood LED display unit module according to claim 1, further comprising: a glue injection penetrating through the thermally conductive panel, the circuit board, and the thermally conductive back plate and distributed around each thermally conductive post. The via hole and the heat-conducting pillar end surface covering part which is integrated with the sealing gel body through the glue injection via hole and covers the back end of the heat-conducting pillar.
  13. 如权利要求1-12中任一项所述的一种双导热片夹板式LED显示单元模组,其特征在于:所述导热面板和/或导热背板为铝板作冲压后成型且表面经阳极氧化工艺+发黑工艺处理的板状结构体;所述导热柱为铜质结构体。The dual thermally conductive sheet plywood type LED display unit module according to any one of claims 1-12, wherein the thermally conductive panel and / or the thermally conductive back plate is formed by punching an aluminum plate and the surface is subjected to anode A plate-like structure processed by an oxidation process + a blackening process; the thermally conductive pillar is a copper structure.
PCT/CN2019/070245 2018-08-29 2019-01-03 Dual-heat-conducting-strip splint type led display unit module WO2020042519A1 (en)

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