CN105081495A - Novel radiator welding process method - Google Patents
Novel radiator welding process method Download PDFInfo
- Publication number
- CN105081495A CN105081495A CN201410219211.4A CN201410219211A CN105081495A CN 105081495 A CN105081495 A CN 105081495A CN 201410219211 A CN201410219211 A CN 201410219211A CN 105081495 A CN105081495 A CN 105081495A
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- CN
- China
- Prior art keywords
- radiator
- heating units
- heater
- aluminum base
- base pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The embodiment of the invention discloses a novel radiator welding process method. Heating units, an aluminum base PCB and a radiator are sequentially arranged from top to bottom. The heating units and the aluminum base PCB are welded into a whole through a solder medium, namely, tin, and then the whole is fixed with the radiator in a welding mode; in the welding process, an insulating layer and an electronic circuit on an aluminum substrate and the heating units cannot be damaged; a method that the combination of the heating units and the aluminum substrate is combined with the radiator is changed, and the transverse heat conductivity is enhanced in a welding mode; if in combination with the heat conduction technology of a vapor chamber, the vertical heat conductivity is greatly increased, and therefore the temperature rise of the heating units can be greatly reduced. According to the practical test result, the temperature rise of the same heating units can be decreased by 20 DEG C.
Description
Technical field
The present invention relates to field of radiating, particularly relate to new radiator welding technique.
Background technology
Common radiator structure is divided into several part:
A. heater: the Sensitive Apparatus of heat is as LED, and semiconductor power pipe etc., the heat produced is mediated not in time if self works, and high temperature can cause the life-span exhaustion of body.
B. aluminum base PCB plate: containing insulating barrier and electronic circuit, aluminum base PCB plate also possesses heat conduction function simultaneously;
C. heat-conducting cream: the lotion with higher thermal conductivity factor, for filling up the air gap between heater and radiator;
D. radiator: the aluminium body possessing larger area of dissipation, has fin usually;
E. fixture: as screw or fixing glue;
Usually, heater and aluminum base PCB plate are welded into an entirety by this solder medium of tin, then this overall by fixture such as screw or glue fixing on a heat sink, or heater directly to be fixed on a heat sink.Both heat-conducting cream solutions gap and mutual flatness is added in the middle of both; To temperature than more sensitive LED lamp bead or semiconductor devices, the heat using existing technique for fixing to derive is fewer, and the temperature of LED lamp bead or these heaters of semiconductor devices is higher, and service life is relatively short; Or want to reach lower temperature rise, the heatsink weight of use can increase greatly, the carbon of overall industrial chain can consume larger.
Existing fixing means is that centre certainly exists the thermoresistance layer of air or heat-conducting cream, and cause thermal resistance in the vertical direction large, heat is derived few by screw or glue combination (or heater) pressing of heater and aluminium base on a heat sink; Cannot be connected with radiator at horizontal aluminium base simultaneously, there is not horizontal heat conduction; Therefore the overall heat conduction amount of this mode is little, causes heater temperature rise higher.
Summary of the invention
Embodiment of the present invention technical problem to be solved is, provides that a kind of structure is simple, the new radiator welding technique of better heat-radiation effect.
Described new radiator welding technique, be disposed with heater, aluminum base PCB plate and radiator from top to bottom, described heater is welded into an entirety by solder medium tin and described aluminum base PCB plate, and the entirety that described heater and aluminum base PCB plate form and described radiator are fixed by welding manner.
The aluminum base PCB plate welded with described radiator in this technique is the aluminium base with LED light source and semiconductor devices.
Implement the embodiment of the present invention, there is following beneficial effect:
Embodiment of the present invention heater and aluminum base PCB plate are welded into an entirety by this solder medium of tin, then this entirety is fixed by welding manner and radiator; Insulating barrier on aluminium base and electronic circuit and heater can not be damaged in welding process; The method that the combination that the present embodiment changes heater aluminium base is combined with radiator, horizontal thermal conductivity is strengthened by welding manner, if again in conjunction with the heat conduction technology of temperature-uniforming plate, considerably increase vertical heat transfer rate simultaneously, therefore the temperature rise of heater can significantly reduce.According to the result of reality test, the temperature rise of identical heater can decline 20 degree.
Accompanying drawing explanation
Fig. 1 is embodiment of the present invention structural representation;
Fig. 2 is A-A sectional view in embodiment of the present invention Fig. 1.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, the present invention is described in further detail.
Embodiment of the present invention new radiator welding technique, as shown in Figure 1-2, be disposed with heater 1, aluminum base PCB plate 2 and radiator 3 from top to bottom, heater 1 is welded into an entirety by solder medium tin and aluminum base PCB plate 2, and the entirety that heater 1 and aluminum base PCB plate 2 form and radiator 3 are welded and fixed; Radiator 3 comprises base plate of radiator 4, and base plate of radiator 4 upper surface is provided with radiating fin 5.
Embodiment of the present invention heater and aluminum base PCB plate are welded into an entirety by this solder medium of tin, then this entirety is fixed by welding manner and radiator; Insulating barrier on aluminium base and electronic circuit and heater can not be damaged in welding process; The method that the combination that the present embodiment changes heater aluminium base is combined with radiator, horizontal thermal conductivity is strengthened by welding manner, if again in conjunction with the heat conduction technology of temperature-uniforming plate, considerably increase vertical heat transfer rate simultaneously, therefore the temperature rise of heater can significantly reduce.According to the result of reality test, the temperature rise of identical heater can decline 20 degree.
Above disclosedly be only a kind of preferred embodiment of the present invention, certainly can not limit the interest field of the present invention with this, therefore according to the equivalent variations that the claims in the present invention are done, still belong to the scope that the present invention is contained.
Claims (2)
1. a new radiator welding technique, it is characterized in that: be disposed with heater, aluminum base PCB plate and radiator from top to bottom, described heater is welded into an entirety by solder medium tin and described aluminum base PCB plate, and the entirety that described heater and aluminum base PCB plate form and described radiator are fixed by welding manner.
2. new radiator welding technique according to claim 1, base is characterised in that, the aluminum base PCB plate welded with described radiator in this technique is the aluminium base with LED light source and semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410219211.4A CN105081495A (en) | 2014-05-22 | 2014-05-22 | Novel radiator welding process method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410219211.4A CN105081495A (en) | 2014-05-22 | 2014-05-22 | Novel radiator welding process method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105081495A true CN105081495A (en) | 2015-11-25 |
Family
ID=54563313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410219211.4A Pending CN105081495A (en) | 2014-05-22 | 2014-05-22 | Novel radiator welding process method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105081495A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105583486A (en) * | 2016-02-25 | 2016-05-18 | 西北工业大学 | Optical fiber and light source butt welding device |
| CN106270871A (en) * | 2016-11-01 | 2017-01-04 | 株洲中车时代电气股份有限公司 | The welding method of a kind of semiconductor device and welding system |
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| CN101325165A (en) * | 2008-07-24 | 2008-12-17 | 哈尔滨海格科技发展有限责任公司 | Method for joining radiator and power component with low heat |
| KR20090111999A (en) * | 2008-04-23 | 2009-10-28 | 주식회사 만도 | Heat sink |
| CN201639904U (en) * | 2010-01-15 | 2010-11-17 | 张逸民 | Heat radiating structure of heat generating element |
| JP2012094594A (en) * | 2010-10-25 | 2012-05-17 | Toshiyuki Arai | Heat dissipation structure |
| KR20120053427A (en) * | 2010-11-17 | 2012-05-25 | 현대자동차주식회사 | Adhesive bonding of heatsinks to circuit boards |
| DE102011106762A1 (en) * | 2011-07-05 | 2013-01-10 | Sensor-Technik Wiedemann Gmbh | Method for wave soldering of e.g. printed circuit boards in wave soldering station to connect cooling bodies, involves preheating products for even heat distribution via solder masks, which consist of infrared transparent material portions |
| CN103100770A (en) * | 2013-03-06 | 2013-05-15 | 林秀林 | Welding process of electronic component assembly |
| CN203457421U (en) * | 2013-06-09 | 2014-02-26 | 美的集团武汉制冷设备有限公司 | PCB assembly and air conditioner outdoor unit provided with same |
| CN203457404U (en) * | 2013-06-09 | 2014-02-26 | 美的集团武汉制冷设备有限公司 | PCB assembly and air conditioner outdoor unit provided with same |
| US20140063747A1 (en) * | 2012-08-30 | 2014-03-06 | Mitsubishi Electric Corporation | Cooling structure for a shunt resistor and inverter apparatus using the same |
| CN203605189U (en) * | 2013-12-05 | 2014-05-21 | 中国科学院广州能源研究所 | Integrated heat dissipation structure applicable to LED lamp and backlight module |
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2014
- 2014-05-22 CN CN201410219211.4A patent/CN105081495A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090111999A (en) * | 2008-04-23 | 2009-10-28 | 주식회사 만도 | Heat sink |
| CN101325165A (en) * | 2008-07-24 | 2008-12-17 | 哈尔滨海格科技发展有限责任公司 | Method for joining radiator and power component with low heat |
| CN201639904U (en) * | 2010-01-15 | 2010-11-17 | 张逸民 | Heat radiating structure of heat generating element |
| JP2012094594A (en) * | 2010-10-25 | 2012-05-17 | Toshiyuki Arai | Heat dissipation structure |
| KR20120053427A (en) * | 2010-11-17 | 2012-05-25 | 현대자동차주식회사 | Adhesive bonding of heatsinks to circuit boards |
| DE102011106762A1 (en) * | 2011-07-05 | 2013-01-10 | Sensor-Technik Wiedemann Gmbh | Method for wave soldering of e.g. printed circuit boards in wave soldering station to connect cooling bodies, involves preheating products for even heat distribution via solder masks, which consist of infrared transparent material portions |
| US20140063747A1 (en) * | 2012-08-30 | 2014-03-06 | Mitsubishi Electric Corporation | Cooling structure for a shunt resistor and inverter apparatus using the same |
| CN103100770A (en) * | 2013-03-06 | 2013-05-15 | 林秀林 | Welding process of electronic component assembly |
| CN203457421U (en) * | 2013-06-09 | 2014-02-26 | 美的集团武汉制冷设备有限公司 | PCB assembly and air conditioner outdoor unit provided with same |
| CN203457404U (en) * | 2013-06-09 | 2014-02-26 | 美的集团武汉制冷设备有限公司 | PCB assembly and air conditioner outdoor unit provided with same |
| CN203605189U (en) * | 2013-12-05 | 2014-05-21 | 中国科学院广州能源研究所 | Integrated heat dissipation structure applicable to LED lamp and backlight module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105583486A (en) * | 2016-02-25 | 2016-05-18 | 西北工业大学 | Optical fiber and light source butt welding device |
| CN105583486B (en) * | 2016-02-25 | 2018-02-23 | 西北工业大学 | A kind of optical fiber and light source opposite soldering device |
| CN106270871A (en) * | 2016-11-01 | 2017-01-04 | 株洲中车时代电气股份有限公司 | The welding method of a kind of semiconductor device and welding system |
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| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151125 |