CN203300627U - Heat dissipation device of integrated circuit - Google Patents
Heat dissipation device of integrated circuit Download PDFInfo
- Publication number
- CN203300627U CN203300627U CN2013202271028U CN201320227102U CN203300627U CN 203300627 U CN203300627 U CN 203300627U CN 2013202271028 U CN2013202271028 U CN 2013202271028U CN 201320227102 U CN201320227102 U CN 201320227102U CN 203300627 U CN203300627 U CN 203300627U
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- Prior art keywords
- water
- heat
- integrated circuit
- radiator
- heat dissipation
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Abstract
The utility model discloses a heat dissipation device and particularly to a heat dissipation device of an integrated circuit. The heat dissipation device comprises a heat-conducting plate which is provided with a heat dissipation set formed by a plurality of heat dissipation fins, and a water cooling apparatus which is disposed on the heat-conducting plate and used for cooling the heat dissipation set. 1. By adopting the heat dissipation fins and combining with the water cooling apparatus to dissipate heat, the heat dissipation device of the integrated circuit has a distinctly better heat dissipation effect than a device with single heat dissipation fins; 2. the water cooling apparatus is added based on a conventional heat dissipation device, structure is simple and cost is low; and by integrating the above two points, the heat dissipation device of the integrated circuit is good in a using effect, high in practicality and cost performance.
Description
Technical field
The utility model relates to the heat sink technology field, relates in particular to a kind of radiator of integrated circuit.
Background technology
Now, the computer that people use all a large amount of use integrated circuit, well-known, high temperature is the formidable enemy of integrated circuit, and high temperature can cause the integrated circuit operation irregularity, even can burn out circuit element, reduction of service life, and the generation of this high temperature generally comes from integrated circuit self.
Chinese utility model patent discloses a kind of heat spreader structures for large scale integrated circuit or high-power output, this structure is provided with a pedestal, this pedestal can be provided with the first clamping part on one side or one side, separately, this pedestal is provided with the fin that shape can coordinate with it, this fin be provided with can with the second clamping part of the first mutual buckle of clamping part.its operation principle is mainly to utilize the pedestal that arranges to carry out the guiding of heat, and heat is reached fin, such radiator can play a role to the less integrated circuit of some caloric values, but, present circuit board integrated level is more and more higher, but electronic product is more and more miniaturization but, cause its a large amount of integrated circuit all integrated in a very limited space, obviously, the thermal diffusivity of its requirement is also more and more higher, traditional this radiator can not be satisfied with the development and progress of integrated circuit, and the most complex structure of other radiators in the market, cost is higher.So, need badly and provide a kind of thermal diffusivity better, simple in structure, lower-cost radiator.
Summary of the invention
The purpose of this utility model is for the deficiencies in the prior art, provides a kind of heat dispersion better, simple in structure, lower-cost radiator.
For achieving the above object, the radiator of a kind of integrated circuit of the utility model, comprise heat-conducting plate, is laid with the heat radiation group that consists of some fin on heat-conducting plate, also comprises and be arranged at the water cooling plant that is used for the cooling heat dissipation group on heat-conducting plate.
Wherein, water cooling plant comprises water tank, and water tank is provided with delivery port and water inlet, be connected with the fortune water pump with described delivery port, the fortune water pump is connected with conduit, and the heat radiation group is provided with a plurality of water-cooled through holes that supply conduit to pass, and conduit passes described water-cooled through hole and with water inlet, is connected.
Preferably, water tank is provided with for the recess that water pump is installed.
Further, the water-cooled through hole offers six rows.
Further, described water tank inside is provided with demarcation strip, and described demarcation strip is divided into intake antrum and water chamber with water tank, and described demarcation strip is provided with limbers.
Preferably, the surface of fin is the waveform surface.
Further, described water tank side is provided with card article, and described heat-conducting plate is provided with grab, and described card article is fixedly connected with grab.Further, in the side of water tank, lug is set, offers connecting hole on described lug, described connecting hole and heat-conducting plate are spirally connected.
Preferably, conduit is copper pipe.
The beneficial effects of the utility model: a kind of radiator of integrated circuit, comprise heat-conducting plate, be laid with the heat radiation group that is formed by some fin on heat-conducting plate, also comprise and be arranged at the water cooling plant that is used for the cooling heat dissipation group on heat-conducting plate.One, adopted fin due to the utility model and in conjunction with the mode of water cooling plant, dispelled the heat, its thermal diffusivity is obviously than single fin better effects if; Two, install water cooling plant additional on traditional radiator basis, simple in structure, cost is lower; Comprehensive above 2 points, the utility model result of use is good, and is practical, has higher cost performance.
Description of drawings
Fig. 1 is perspective view of the present utility model.
Fig. 2 is water tank of the present utility model and fortune water pump combining structure schematic diagram.
Fig. 3 is cisten mechanism cutaway view of the present utility model.
Fig. 4 is main TV structure schematic diagram of the present utility model.
Fig. 5 is the A place structure for amplifying schematic diagram of Fig. 4.
Fig. 6 is plan structure schematic diagram of the present utility model.
Fig. 7 is that fin of the present utility model is analysed and observe schematic cross-section.
Reference numeral comprises:
The 1--heat-conducting plate, 11--grab, 2--heat radiation group, 21--fin, 22--water-cooled through hole, 3--water cooling plant, the 31--water tank, 311--delivery port, 312--water inlet, 313--recess, 314--intake antrum, the 315--water chamber, the 316--card article, the 317--lug, 32--transports water pump, 33--conduit.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in detail.
As shown in Figures 1 to 7, a kind of radiator of integrated circuit, comprise heat-conducting plate 1, is laid with the heat radiation group 2 that consists of some fin 21 on heat-conducting plate 1, also comprises and be arranged at the water cooling plant 3 that is used for cooling heat dissipation group 2 on heat-conducting plate 1.Wherein, water cooling plant 3 comprises water tank 31, water tank 31 is provided with delivery port 311 and water inlet 312, described delivery port 311 is connected with fortune water pump 32, fortune water pump 32 is connected with conduit 33, heat radiation group 2 is provided with a plurality of water-cooled through holes 22 that supply conduit 33 to pass, and conduit 33 passes described water-cooled through hole 22 and with water inlet 312, is connected.During work, in 31 li, water tank, fill a certain amount of cooling water, fortune water pump 32, by with surface-mounted integrated circuit, being connected, provides a less voltage, is generally 5 volts, drives fortune water pump 32 cooling water is extracted out from water tank 31, by fortune water pump 32, sends into conduit 33; Due to, heat-conducting plate 1 has been delivered to heat each fin 21 of heat radiation group 2, and at this moment, fin 21 need to distribute a large amount of heat, cooling water is when being arranged on the conduit 33 between fin 21, can take away most of heat,, until cooling water is got back to water tank 31 from water inlet 312, complete the circulation of a heat conduction, finally, the most of heat that produces can be delivered in water tank 31 away from integrated circuit immediately, and distributes, and has ensured the integrated circuit normal operation.
As preferably, because fortune water pump 32 must be connected with the delivery port 311 of water tank 31, as a kind of better improvement, delivery port 311 relevant positions at water tank 31 arrange a recess 313, thereby will transport water pump 32 and be fixed on recess 313, make the total of whole water cooling plant 3 arrange more succinct, reasonable, certainly, this is a better optimal way, obviously, also fortune water pump 32 can be placed separately, for example: also can itself and heat-conducting plate 1 is fixing separately, it does not affect effect of the present utility model.
Further, radiator is when work, its maximum heat concentrates on the heat radiation group 2 that consists of fin 21, for the better cooling effect of performance water cooling plant 3, the water-cooled through hole 22 of heat radiation group 2 is offered six rows, then conduit 33 is passed successively the cold through hole 22 of each draining, radiating effect is better; Certainly, also can offer the water-cooled through hole 22 of more rows according to the size of radiator, perhaps suitably strengthen the diameter of conduit 33, but equal improving radiating effect.
further, when the cooling water that will absorb heat when conduit 33 imports to water tank 31, at this moment, the cooling water of two kinds of different temperatures will mix, for the water with two kinds of different temperatures is separated, the water maintenance uniform temperature of to improve delivery port 311, extracting out, with the interior demarcation strip that arranges of water tank 31, be intake antrum 314 and water chamber 315 with the interior separation of water tank 31, wherein the demarcation strip between intake antrum 314 and water chamber 315 offers limbers, water pump extracts the cooling water of water cavity 315 by delivery port 311, and intake antrum 314 is used for receiving the cooling water that conduit 33 is derived.When water chamber 315 water shortage, the water of intake antrum 314 can import to cooling water water chamber 315 automatically.Thereby make the cooling water of water chamber 315 keep a relatively low temperature, further bring into play cooling effect.
Preferably, the surface of fin 21 is the waveform surface, and the ripple glaze surface can better increase heat-delivery surface, can promote preferably distributing of heat.
Further, because water tank 31 is equipped with a large amount of cooling waters, for better fixedly water tank 31, because water tank 31 bodies generally are not easy to arrange the position, hole, thus be provided with card article 316 in water tank 31 sides, and in the end of heat-conducting plate 1, grab 11 is set, card article 316 is fixing with the grab 11 that heat-conducting plate 1 arranges, saved the method for utilizing bolt fixing, only needed clamping to get final product, operated more easy.
As another kind of fixed form, a lug 317 is set in the side of water tank 31, offer connecting hole on described lug 317, described connecting hole and heat-conducting plate 1 are spirally connected, and its utilization is spirally connected equally firm effect.
Preferably, because the Main Function of conduit 33 is to transport water and heat conduction, this programme is selected heat conductivility copper pipe preferably, can certainly select other heat conductivilitys metal material preferably, such as: aluminum pipe etc.
Above content is only preferred embodiment of the present utility model, for those of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, this description should not be construed as restriction of the present utility model.
Claims (9)
1. the radiator of an integrated circuit, comprise heat-conducting plate (1), be laid with the heat radiation group (2) that is formed by some fin (21) on described heat-conducting plate (1), it is characterized in that: also comprise and be arranged at the upper water cooling plant (3) that is used for cooling heat dissipation group (2) of heat-conducting plate (1).
2. the radiator of a kind of integrated circuit according to claim 1, it is characterized in that: described water cooling plant (3) comprises water tank (31), described water tank (31) is provided with delivery port (311) and water inlet (312), described delivery port (311) is connected with fortune water pump (32), fortune water pump (32) is connected with conduit (33), described heat radiation group (2) is provided with a plurality of water-cooled through holes (22) that supply conduit (33) to pass, and conduit (33) passes described water-cooled through hole (22) and with water inlet (312), is connected.
3. the radiator of a kind of integrated circuit according to claim 2 is characterized in that: described water tank (31) is provided with for the recess (313) that water pump is installed.
4. the radiator of a kind of integrated circuit according to claim 3, it is characterized in that: described water-cooled through hole (22) offers six rows.
5. the radiator of a kind of integrated circuit according to claim 4, it is characterized in that: described water tank (31) inside is provided with demarcation strip, and described demarcation strip is divided into intake antrum (314) and water chamber 315 with water tank), described demarcation strip is provided with limbers.
6. the radiator of a kind of integrated circuit according to claim 2 is characterized in that: the surface of described fin (21) is the waveform surface.
7. the radiator of according to claim 5 or 6 described a kind of integrated circuits, it is characterized in that: described water tank (31) side is provided with card article (316), described heat-conducting plate (1) is provided with grab (11), and described card article (316) is fixedly connected with grab (11).
8. the radiator of according to claim 5 or 6 described a kind of integrated circuits, it is characterized in that: the side of described water tank (31) is provided with lug (317), and described lug (317) offers connecting hole, and described connecting hole and heat-conducting plate (1) are spirally connected.
9. the radiator of a kind of integrated circuit according to claim 6, it is characterized in that: described conduit (33) is copper pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202271028U CN203300627U (en) | 2013-04-28 | 2013-04-28 | Heat dissipation device of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202271028U CN203300627U (en) | 2013-04-28 | 2013-04-28 | Heat dissipation device of integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203300627U true CN203300627U (en) | 2013-11-20 |
Family
ID=49576621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202271028U Expired - Lifetime CN203300627U (en) | 2013-04-28 | 2013-04-28 | Heat dissipation device of integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203300627U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110518814A (en) * | 2019-09-19 | 2019-11-29 | 江西精骏电控技术有限公司 | A kind of two-sided cooling structure for vehicle-mounted inverter |
| CN112616295A (en) * | 2020-12-11 | 2021-04-06 | 中国北方发动机研究所(天津) | Hanging radiator for controller |
-
2013
- 2013-04-28 CN CN2013202271028U patent/CN203300627U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110518814A (en) * | 2019-09-19 | 2019-11-29 | 江西精骏电控技术有限公司 | A kind of two-sided cooling structure for vehicle-mounted inverter |
| CN112616295A (en) * | 2020-12-11 | 2021-04-06 | 中国北方发动机研究所(天津) | Hanging radiator for controller |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131120 |