CN208781838U - Phalanx porous semiconductor devices dedicated wind cooling radiator - Google Patents
Phalanx porous semiconductor devices dedicated wind cooling radiator Download PDFInfo
- Publication number
- CN208781838U CN208781838U CN201821530320.8U CN201821530320U CN208781838U CN 208781838 U CN208781838 U CN 208781838U CN 201821530320 U CN201821530320 U CN 201821530320U CN 208781838 U CN208781838 U CN 208781838U
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- CN
- China
- Prior art keywords
- hole
- row
- longitudinal
- radiator casing
- radiator
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model belongs to electronic component, in particular to a kind of Phalanx porous semiconductor devices dedicated wind cooling radiator.On before radiating shell (1), under be respectively provided with an installation positioning through hole (1-1), it is intermediate before radiator casing to be equipped with a centre part positioning through hole (1-2), two rows are equipped in the top of multiple left side threaded connection holes (1-9) of radiator casing, every multiple cross through hole of row (1-7), blind hole (1-4) on multiple longitudinal directions is laid on the upper surface of radiator casing (1), it is left on the lower end surface of radiator casing, right two sides are respectively equipped with three row arranged side by side, blind hole (1-6) under every multiple longitudinal directions of row, longitudinal hole (1-5) and longitudinal lower blind hole are connected between cross through hole respectively, right side threaded connection hole there are two being set on the right side of radiator casing (1).Air-cooled radiator structure is simple, light-weight, and installation is particularly convenient, time saving and labor saving.
Description
Technical field
The utility model belongs to electronic component, in particular to a kind of Phalanx porous semiconductor devices dedicated wind cooling heat dissipation
Device.
Background technique
Previous semiconductor devices is directly installed on bottom plate, due to there is no radiator, heating element at work
The heat of generation can not distribute, and cause component element long period to run use under high temperature environment, considerably reduce these yuan
The service life of device not can guarantee the normal operation of integral device.
Summary of the invention
The purpose of the utility model is to overcome above-mentioned technical deficiency, provide that a kind of structure is simple, and good heat dissipation effect can
Reduce the Phalanx porous semiconductor devices dedicated wind cooling radiator of production cost.
The utility model solve technical problem the technical solution adopted is that: Phalanx porous semiconductor devices dedicated wind cooling
Radiator includes radiator casing, its main feature is that being respectively provided with an installation positioning through hole above and below before radiating shell, is being dissipated
It is intermediate before hot device shell to be equipped with a centre part positioning through hole, a semicircle is equipped on the left side of radiator casing
Installation positioning through slot and multiple left side threaded connection holes, be equipped in the top of multiple left side threaded connection holes of radiator casing
Two rows of, every multiple cross through hole of row, are laid with blind hole on multiple longitudinal directions on the upper surface of radiator casing, vertical in every two
Be laid with longitudinal two rows of, every multiple longitudinal holes of row between upward blind hole, longitudinal hole and it is longitudinal go up blind hole respectively with transverse direction
Through-hole connection, arranged on left and right sides is respectively equipped with blind hole under three row arranged side by side, the multiple longitudinal directions of every row on the lower end surface of radiator casing,
Uniformly distributed three groups of the inside of blind hole two rows of, every multiple longitudinal holes of row side by side under three row arranged side by side, the multiple longitudinal directions of every row, three groups arranged side by side two
Blind hole under two rows of, every multiple longitudinal directions of row, longitudinal hole and longitudinal lower blind hole point are respectively equipped between row, the multiple longitudinal holes of every row
It is not connected to, sets on the right side of radiator casing there are two right side threaded connection hole between cross through hole.
The beneficial effects of the utility model are: Phalanx porous semiconductor devices dedicated wind cooling heat spreader structures are simple,
It is light-weight, consumable quantity is reduced, manufacturing cost has been saved, heat is discharged by Phalanx porous structure, good heat dissipation effect, half
Conductor device can be directly installed on air-cooled radiator, and installation is particularly convenient, time saving and labor saving.
Detailed description of the invention
It is illustrated below in conjunction with attached drawing with embodiment.
Fig. 1 is Phalanx porous semiconductor devices dedicated wind cooling radiator shape main view.
Fig. 2 is the top view of Fig. 1.
Fig. 3 is the bottom view of Fig. 1.
Fig. 4 is the right side view of Fig. 1.
Fig. 5 is attempted on the left of Fig. 1.
Fig. 6 is the A-A cross-sectional view of Fig. 5.
In figure, 1- radiator casing；1-1- installs positioning through hole；1-2- centre part positioning through hole；1-3- installation positioning
Through slot；Blind hole on the longitudinal direction 1-4-；1-5- longitudinal hole；The lower blind hole in the longitudinal direction 1-6-；1-7- cross through hole；It is threadedly coupled on the right side of 1-8-
Hole；Threaded connection hole on the left of 1-9-.
Specific embodiment
Embodiment, referring to attached drawing 1-6, the radiator casing 1 of Phalanx porous semiconductor devices dedicated wind cooling radiator
Before be respectively provided with an installation positioning through hole 1-1 above and below, 1 front of radiator casing is intermediate to be equipped with a centre part positioning
Through-hole 1-2.The left side of radiator casing 1 is equipped with a semicircular installation positioning through slot 1-3 and four left side screw threads connect
Hole 1-9 is met, the top of four left side threaded connection hole 1-9 of radiator casing 1 is equipped with two rows of, every four cross through hole 1-7 of row.
Blind hole 1-4 on four longitudinal directions is laid on the upper surface of radiator casing 1, it is uniformly distributed between every two longitudinally upper blind hole 1-4
Equipped with longitudinal two rows of, every four longitudinal hole 1-5 of row, longitudinal hole 1-5 and it is longitudinal go up blind hole 1-4 respectively with cross through hole 1-7
Connection.Arranged on left and right sides is respectively equipped with blind hole 1-6 under four three row arranged side by side, every row longitudinal directions on the lower end surface of radiator casing 1, and
Uniformly distributed three groups of the inside of blind hole 1-6 two rows of, every four longitudinal hole 1-5 of row arranged side by side under four three row of column, every row longitudinal directions, three groups simultaneously
Blind hole 1-6, longitudinal hole 1-5 under two rows of, every four longitudinal directions of row are respectively equipped between column two rows, every four longitudinal hole 1-5 of row
And longitudinal lower blind hole 1-6 is connected between cross through hole 1-7 respectively, sets that there are two right side spiral shells on the right side of radiator casing 1
Line connecting hole 1-8.
The working principle of Phalanx porous semiconductor devices dedicated wind cooling radiator is: in use, semiconductor devices point
Not Tong Guo left side threaded connection hole 1-9 and right side threaded connection hole 1-8 on the radiator casing 1, by cross through hole 1-7 with
It is connected between blind hole 1-6 under blind hole 1-4, longitudinal hole 1-5, longitudinal direction on longitudinal direction, forms Phalanx porous structure, Phalanx
The structure of porous increases the contact area between radiator casing 1 and air, the heat generated when semiconductor devices being made to work
Amount emits rapidly, improves the service life of semiconductor devices.
Claims (1)
1. a kind of Phalanx porous semiconductor devices dedicated wind cooling radiator, including radiator casing (1), which is characterized in that
It is respectively provided with an installation positioning through hole (1-1) above and below before radiator casing (1), it is intermediate before radiator casing (1)
Equipped with a centre part positioning through hole (1-2), it is fixed that a semicircular installation is equipped on the left side of radiator casing (1)
Position through slot (1-3) and multiple left side threaded connection holes (1-9), in multiple left side threaded connection holes (1-9) of radiator casing (1)
Top be equipped with two rows of, every multiple cross through hole of row (1-7), be laid on the upper surface of radiator casing (1) multiple vertical
Upward blind hole (1-4) is laid with longitudinal two rows of, every multiple longitudinal hole (1- of row between every two longitudinally upper blind hole (1-4)
5), longitudinal hole (1-5) and longitudinal upper blind hole (1-4) are connected to cross through hole (1-7) respectively, under radiator casing (1)
Arranged on left and right sides is respectively equipped with blind hole (1-6) under three row arranged side by side, the multiple longitudinal directions of every row on end face, three row arranged side by side, the multiple longitudinal directions of every row
Uniformly distributed three groups of the inside of lower blind hole (1-6) two rows of, every multiple longitudinal holes of row (1-5) arranged side by side, three groups two rows, every row are multiple side by side
It is respectively equipped with blind hole (1-6) under two rows of, every multiple longitudinal directions of row between longitudinal hole (1-5), it is blind under longitudinal hole (1-5) and longitudinal direction
Hole (1-6) is connected between cross through hole (1-7) respectively, is set on the right side of radiator casing (1) there are two right side screw thread
Connecting hole (1-8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821530320.8U CN208781838U (en) | 2018-09-19 | 2018-09-19 | Phalanx porous semiconductor devices dedicated wind cooling radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821530320.8U CN208781838U (en) | 2018-09-19 | 2018-09-19 | Phalanx porous semiconductor devices dedicated wind cooling radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208781838U true CN208781838U (en) | 2019-04-23 |
Family
ID=66161849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821530320.8U Expired - Fee Related CN208781838U (en) | 2018-09-19 | 2018-09-19 | Phalanx porous semiconductor devices dedicated wind cooling radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208781838U (en) |
-
2018
- 2018-09-19 CN CN201821530320.8U patent/CN208781838U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190423 Termination date: 20200919 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |