CN204157202U - A kind of liquid-cooling heat radiation coldplate - Google Patents
A kind of liquid-cooling heat radiation coldplate Download PDFInfo
- Publication number
- CN204157202U CN204157202U CN201420546608.XU CN201420546608U CN204157202U CN 204157202 U CN204157202 U CN 204157202U CN 201420546608 U CN201420546608 U CN 201420546608U CN 204157202 U CN204157202 U CN 204157202U
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- flow path
- path area
- conduit
- flow
- coldplate
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of liquid-cooling heat radiation coldplate, has: base plate, comprises coldplate face and the bottom surface relative with coldplate face; Be arranged on the cooling end on coldplate face, comprise first flow district, the second flow path area, the 3rd flow path area, water inlet and delivery port, first flow district, the second flow path area and the 3rd flow path area form by multiple conduit, all conduits in first flow district all communicate with water inlet, all conduits of the 3rd flow path area all communicate with delivery port, and the conduit of the second flow path area is crisscross arranged with the conduit in first flow district and the conduit of the 3rd flow path area and communicates respectively; And the cover plate be arranged on above cooling end, there is certain thickness, the length and width size of this cover plate and the length and width consistent size of base plate.Water-cooling cold drawing involved by the utility model three flow path areas are crisscross arranged, and substantially increase the disturbance of cooling water in cold drawing, and the design of the multiple conduit runner of each flow path area increases heat-transfer surface.
Description
Technical field
The utility model relates to a kind of liquid-cooling heat radiation coldplate, belongs to electronic device field.
Background technology
Along with electronic equipment packaging technology is maked rapid progress, the size of equipment and establishment is more and more less, and the density of assembling is increasing, and electronic equipment brings inevitable challenge to the heat radiation of development trend to high heat flux of miniature high heat flux.When electronic equipment can not dispel the heat preferably, too high temperature can have an immense impact on to the performance of electronic equipment.Such as, in semiconductor use, the node of too high temperature entail dangers to semiconductor, the linkage interface of damage circuit, increases the resistance of conductor and can form mechanical stress damage; In LED solidification, if when surperficial junction temperature is higher than 120 DEG C, the light decay of LED can be made to increase sharply, shorten its useful life, thus affect solidification effect.Therefore, it is the most important factor that cooling system designs that the high heat produced when ensureing electronic equipment operation can leave in time.In addition, also because considering its convenience installed and operate and taking up space.
At present, cold drawing is mostly adopted to lower the temperature to high density electronic equipment.Conventional cold drawing comprises one squash type cold drawing and band-tube type cold drawing.One squash type cold drawing structure is simple, but cannot wherein most important fin section be done thin, the height of fin is also subject to a definite limitation, spacing between each fin comparatively large (at least needing 3mm), radiating efficiency is not high, be difficult to reach cooling requirements, and to the large usage quantity of metal under same area of dissipation, cost is higher.Band-tube type cold drawing compact conformation, strong adaptability, processing and manufacturing are more convenient, but the same demand is higher in the metal consumption etc. of unit heat transfer area.
Utility model content
The purpose of this utility model is to provide a kind of liquid-cooling heat radiation coldplate, to solve the problem.
To achieve these goals, the technical scheme that the utility model adopts is:
A kind of liquid-cooling heat radiation coldplate, makes electronic equipment lower the temperature by cooling water, it is characterized in that, comprising:
Base plate, comprises coldplate face and the bottom surface relative with coldplate face;
Be arranged on the cooling end on coldplate face, comprise first flow district, second flow path area, 3rd flow path area, water inlet, and delivery port, first flow district communicates with water inlet, second flow path area all communicates with first flow district and the 3rd flow path area, 3rd flow path area also communicates with delivery port, first flow district, second flow path area, form by multiple conduit with the 3rd flow path area, all conduits in first flow district all communicate with water inlet, all conduits of the 3rd flow path area all communicate with delivery port, the conduit of the second flow path area is crisscross arranged with the conduit in first flow district and the conduit of the 3rd flow path area and communicates respectively, (go and)
Be arranged on the cover plate above cooling end, there is certain thickness, the length and width size of this cover plate and the length and width consistent size of base plate,
Cooling water flows into from water inlet, respectively via the conduit of the conduit in first flow district, the conduit of the second flow path area and the 3rd flow path area, flows out from delivery port.
The technical solution of the utility model is further characterized in that: certain thickness is 1 ~ 7mm.
The technical solution of the utility model is further characterized in that: the number of channels in first flow district is less than the conduit number of the second flow path area, and the number of the second flow path area conduit is less than the number of channels of the 3rd flow path area.
The technical solution of the utility model is further characterized in that: conduit is rectangular duct.
The effect of utility model and effect
Compared with background technology, liquid-cooling heat radiation coldplate involved by the utility model is provided with first flow district, second flow path area, and the 3rd flow path area totally three flow path areas, three flow path areas are crisscross arranged, fully the disturbance of cooling water water in cold drawing is increased in the space limited, the multiple conduit runner design of each flow path area increases heat-transfer surface, make cooling water flow after three flow path areas, fully can take away the heat that the electronic equipment placed above cover plate distributes, the working temperature of electronic equipment is controlled in the reasonable scope, meet the heat radiation needs of powerful electric power semiconductor element.
In addition, cover plate has certain thickness, can meet the screwed hole on the cover board arranging and match with electronic equipment, thus satisfied needs electronic equipment is arranged on cold drawing.
Accompanying drawing explanation
The liquid-cooling heat radiation coldplate structural representation in an embodiment of Fig. 1 involved by the utility model;
The liquid-cooling heat radiation coldplate of Fig. 2 involved by the utility model conduit amplification assumption diagram in an embodiment; And
The liquid-cooling heat radiation coldplate of Fig. 3 involved by the utility model LED module installation diagram in an embodiment.
Embodiment
Below in conjunction with accompanying drawing, the concrete example of the liquid-cooling heat radiation coldplate involved by the utility model is described further.
< embodiment >
The liquid-cooling heat radiation coldplate structural representation in an embodiment of Fig. 1 involved by the utility model.
As shown in Figure 1, the liquid-cooling heat radiation coldplate 10 that the present embodiment provides, for electronic equipment cooling, is aluminum material preparation, comprises base plate 11, cooling end 12 and be arranged in the cover plate that above cooling end 12, figure does not show.
The length a of base plate 11 is 160mm, and width b is 60mm, and thickness is 16mm, comprises coldplate face 111 and the bottom surface relative with coldplate face 111.
Cooling end 12 is positioned on coldplate face 111, comprises first flow district 121, second flow path area 122, the 3rd flow path area 123, water inlet 124 and delivery port 125.First flow district 121 communicates with water inlet 124, and the second flow path area 122 all communicates with first flow district 121 and the 3rd flow path area 123, and the 3rd flow path area 123 also communicates with delivery port 125.
The liquid-cooling heat radiation coldplate of Fig. 2 involved by the utility model conduit amplification assumption diagram in an embodiment.
As illustrated in fig. 1 and 2, first flow district 121 forms groove width 1.5mm by 23 conduits 126, fin thickness 0.5mm, second flow path area 122 forms groove width 1mm by two nineteen conduits 127, fin thickness 0.5mm, 3rd flow path area 123 forms groove width 0.5mm by 46 conduits 128, fin thickness 0.5mm.Conduit 126 ~ 128 is 8mm for rectangular fin height, all conduits 126 in first flow district 121 all communicate with water inlet 124, all conduits 128 of the 3rd flow path area 123 all communicate with delivery port 125, and all conduits 127 of the second flow path area 122 communicate with the conduit 128 of the conduit 126 in first flow district 121 and the 3rd flow path area 123.Rib width and the rib height of first flow district 121, second flow path area 122 and the conduit 126 ~ 128 of the 3rd flow path area 123 are all identical.
Cover plate is arranged on above cooling end 12, and the length and width consistent size of length and width size and cold drawing main body 11, has certain thickness, and certain thickness is 3.5mm, for placing electronic equipment.
Cooling water flows into from water inlet 124, respectively via the conduit 127 of conduit 126, second flow path area 122 and the conduit 128 of the 3rd flow path area 123 in first flow district 121, flows out from delivery port 125.
The liquid-cooling heat radiation coldplate of Fig. 3 involved by the utility model LED module installation diagram in an embodiment.
As shown in Figure 3, the electronic equipment of the required cooling of the present embodiment is ten LED modules, is respectively the first module 131, second module 132, the 3rd module 133, four module 134, the 5th module 135, the 6th module 136, the 7th module 137, the 8th module 138, the 9th module 139 and the tenth module 140.100 LED are furnished with inside each LED module.
When the liquid-cooling heat radiation coldplate 10 using the present embodiment to provide is lowered the temperature to ten LED modules, according to LED module size and nut size, the cover plate of liquid-cooling heat radiation coldplate 10 arranges the screwed hole matched with LED module, two rows are divided respectively by ten LED modules, often arrange 5, equidistantly staggered on the cover board first flow district 121, second flow path area 122 and the 3rd flow path area 123 top position place.
Cooling water flows into via water inlet 124, flow through the conduit 128 of first flow district 121, second flow path area 122 and the 3rd flow path area 123 successively, flow out from delivery port 125, while cooling water flows out via conduit 128, the heat that ten LED modules produce is taken out of, thus plays the cooling-down effect to LED module.The effect of embodiment and effect
Compared with background technology, liquid-cooling heat radiation coldplate involved by the present embodiment is provided with first flow district, second flow path area, and the 3rd flow path area totally three flow path areas, three flow path areas are crisscross arranged, fully the disturbance of cooling water water in cold drawing is increased in the space limited, the multiple conduit runner design of each flow path area increases heat-transfer surface, make cooling water flow after three flow path areas, fully can take away the heat that the electronic equipment placed above cover plate distributes, the working temperature of electronic equipment is controlled in the reasonable scope, meet the heat radiation needs of powerful electric power semiconductor element.
In addition, the number of channels in first flow district is identical with the number of channels of the 3rd flow path area, and more than the number of the second flow path area conduit, front and back runner can be formed staggered, increases disturbance during coolant flow, thus strengthens the heat dispersion of cold drawing.
In addition, cover plate has certain thickness, and certain thickness is 3.5mm, can meet the screwed hole on the cover board arranging and match with electronic equipment, thus can meet the needs be arranged on by electronic equipment on cold drawing.
In addition, the conduit of rectangle has larger heat-transfer surface, the heat that the electronic device making current fully can take away top after conduit distributes, and is controlled in rational operating temperature range, thus can meet the heat radiation of powerful electric power semiconductor element.
Certainly, the liquid-cooling heat radiation coldplate involved by the utility model is not merely defined in the structure in above-described embodiment.Above content is only the basic explanation under the utility model design, and according to any equivalent transformation that the technical solution of the utility model is done, all belongs to protection range of the present utility model.
In addition, in above-described embodiment, first flow district is made up of 23 conduits, second flow path area is made up of two nineteen conduits, 3rd flow path area is made up of 46 conduits, the array of these conduits is only basic explanation, three flow path areas involved by the technical solution of the utility model the number of conduit, can any number be selected from, the number of channels in preferred first flow district is identical with the number of channels of the 3rd flow path area, and the scheme of number more than the second flow path area conduit.
In addition, in above-described embodiment, certain thickness is 3.5mm, and the certain thickness involved by the technical solution of the utility model can be selected from any number between 1 ~ 7mm, all can meet the needs on the cover board arranging the screwed hole matched with electronic equipment.
Claims (4)
1. a liquid-cooling heat radiation coldplate, makes electronic equipment lower the temperature by cooling water, it is characterized in that, comprising:
Base plate, comprises coldplate face and the bottom surface relative with described coldplate face;
Be arranged on the cooling end on described coldplate face, comprise first flow district, second flow path area, 3rd flow path area, water inlet, and delivery port, described first flow district communicates with described water inlet, described second flow path area all communicates with described first flow district and described 3rd flow path area, described 3rd flow path area also communicates with described delivery port, described first flow district, described second flow path area, form by multiple conduit with described 3rd flow path area, all conduits in described first flow district all communicate with described water inlet, all conduits of described 3rd flow path area all communicate with described delivery port, the conduit of described second flow path area is crisscross arranged with the conduit in described first flow district and the conduit of described 3rd flow path area and communicates respectively, and
Be arranged on the cover plate above described cooling end, there is certain thickness, the length and width size of this cover plate and the length and width consistent size of described base plate,
Described cooling water flows into from described water inlet, respectively via the conduit of the conduit in described first flow district, the conduit of described second flow path area and described 3rd flow path area, flows out from described delivery port.
2. a kind of liquid-cooling heat radiation coldplate according to claim 1, is characterized in that: described certain thickness is 1 ~ 7mm.
3. a kind of liquid-cooling heat radiation coldplate according to claim 1, is characterized in that: the number of channels in described first flow district is less than the conduit number of the second flow path area, and the number of the second flow path area conduit is less than the number of channels of the 3rd flow path area.
4. a kind of liquid-cooling heat radiation coldplate according to claim 1, is characterized in that: described conduit is rectangular duct.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420546608.XU CN204157202U (en) | 2014-09-23 | 2014-09-23 | A kind of liquid-cooling heat radiation coldplate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420546608.XU CN204157202U (en) | 2014-09-23 | 2014-09-23 | A kind of liquid-cooling heat radiation coldplate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204157202U true CN204157202U (en) | 2015-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420546608.XU Expired - Fee Related CN204157202U (en) | 2014-09-23 | 2014-09-23 | A kind of liquid-cooling heat radiation coldplate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704984A (en) * | 2016-03-04 | 2016-06-22 | 中国电子科技集团公司第三十八研究所 | Integrated cooling device |
| CN108481747A (en) * | 2018-04-23 | 2018-09-04 | 广州迈普再生医学科技股份有限公司 | A kind of ultralow temperature print platform of biology 3D printer |
| CN110165355A (en) * | 2019-07-02 | 2019-08-23 | 电子科技大学 | A kind of 3D printing integral heat radiator and its application in phased array antenna |
-
2014
- 2014-09-23 CN CN201420546608.XU patent/CN204157202U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704984A (en) * | 2016-03-04 | 2016-06-22 | 中国电子科技集团公司第三十八研究所 | Integrated cooling device |
| CN105704984B (en) * | 2016-03-04 | 2018-04-06 | 中国电子科技集团公司第三十八研究所 | A kind of integral type cooling device |
| CN108481747A (en) * | 2018-04-23 | 2018-09-04 | 广州迈普再生医学科技股份有限公司 | A kind of ultralow temperature print platform of biology 3D printer |
| CN108481747B (en) * | 2018-04-23 | 2020-12-25 | 广州迈普再生医学科技股份有限公司 | Ultralow temperature printing platform of biological 3D printer |
| CN110165355A (en) * | 2019-07-02 | 2019-08-23 | 电子科技大学 | A kind of 3D printing integral heat radiator and its application in phased array antenna |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150211 Termination date: 20150923 |
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| EXPY | Termination of patent right or utility model |