CN204157202U - A kind of liquid-cooling heat radiation coldplate - Google Patents

Abstract

The utility model provides a liquid-cooled heat dissipation cooling plate, which has: a bottom plate, including a cooling plate surface and a bottom surface opposite to the cooling plate surface; area, the third flow channel area, water inlet, and water outlet, the first flow channel area, the second flow channel area, and the third flow channel area are all composed of multiple channels, and all channels in the first flow channel area are connected to The water inlet is connected, all the channels in the third flow channel area are connected to the water outlet, and the channels in the second flow channel area are interlaced and communicated with the channels in the first flow channel area and the channels in the third flow channel area; And the cover plate arranged above the cooling part has a certain thickness, and the length and width dimensions of the cover plate are consistent with the length and width dimensions of the bottom plate. The water-cooling and heat-dissipating cold plate involved in the utility model has three flow channel areas interlaced, which fully increases the disturbance of the cooling water in the cold plate, and the design of multiple channel flow channels in each flow channel area increases the heat exchange surface.

Description

A liquid-cooled cooling plate

technical field

The utility model relates to a liquid-cooled heat dissipation cooling plate, which belongs to the field of electronic equipment.

Background technique

With the rapid development of electronic equipment assembly technology, the size of equipment and components is getting smaller and smaller, and the assembly density is getting higher and higher. The development trend of electronic equipment to miniature high heat flux brings inevitable challenges to the heat dissipation of high heat flux. When the electronic equipment cannot dissipate heat well, excessive temperature will have a huge impact on the performance of the electronic equipment. For example, in the use of semiconductors, excessive temperature will endanger the junction of semiconductors, damage the connection interface of the circuit, increase the resistance of the conductor and cause mechanical stress damage; in terms of LED curing, if the surface junction temperature is higher than 120 ° C , will make the light decay of the LED increase rapidly, shorten its service life, and thus affect the curing effect. Therefore, ensuring that the high heat generated by electronic equipment can be dissipated in time is one of the most important factors in heat dissipation system design. In addition, it also takes into account the convenience and space occupied by its installation and operation.

At present, cold plates are mostly used to cool high-density electronic equipment. Commonly used cold plates include one-piece extruded cold plates and plate-and-tube cold plates. The one-piece extruded cold plate has a simple structure, but it is impossible to make the most important part of the heat sink thinner, and the height of the heat sink is also limited. The distance between each heat sink is relatively large (at least 3mm), and the heat dissipation efficiency is not good. High, it is difficult to meet the heat dissipation requirements, and under the same heat dissipation area, the amount of metal used is relatively large, and the cost is high. The plate-and-tube cold plate has compact structure, strong adaptability, and convenient processing and manufacturing, but it also has high demand in terms of metal consumption per unit heat transfer area.

Utility model content

The purpose of this utility model is to provide a liquid-cooled cooling plate to solve the above problems.

In order to achieve the above object, the technical solution adopted in the utility model is:

A liquid-cooled heat dissipation cooling plate, which cools electronic equipment through cooling water, is characterized in that it includes:

a bottom plate including a cooling plate surface and a bottom surface opposite the cooling plate surface;

The cooling part arranged on the cooling plate includes a first flow channel area, a second flow channel area, a third flow channel area, a water inlet, and a water outlet. The first flow channel area communicates with the water inlet, and the second flow channel area communicates with the water inlet. The first flow channel area and the third flow channel area are all connected, and the third flow channel area is also connected to the water outlet. The first flow channel area, the second flow channel area, and the third flow channel area are all composed of multiple channels. All the channels in the first channel area are connected to the water inlet, all the channels in the third channel area are connected to the water outlet, and the channels in the second channel area are respectively connected to the channels in the first channel area and the third channel. The slots in the zone are staggered and communicated; (to and)

The cover plate arranged above the cooling part has a certain thickness, and the length and width dimensions of the cover plate are consistent with the length and width dimensions of the bottom plate.

The cooling water flows in from the water inlet, respectively passes through the grooves in the first flow channel area, the grooves in the second flow channel area, and the grooves in the third flow channel area, and flows out from the water outlet.

The further feature of the technical solution of the utility model is that: the certain thickness is 1-7mm.

The further feature of the technical solution of the utility model is that: the number of channels in the first channel area is less than that in the second channel area, and the number of channels in the second channel area is less than that in the third channel area number of tracks.

The further feature of the technical solution of the utility model is that the channel is a rectangular channel.

Function and effect of utility model

Compared with the background technology, the liquid-cooled heat dissipation cooling plate involved in the utility model is provided with a total of three flow channel areas: the first flow channel area, the second flow channel area, and the third flow channel area, and the three flow channel areas are arranged alternately , fully increase the disturbance of the cooling water in the cold plate in the limited space, and the design of multiple channel channels in each flow channel area increases the heat exchange surface, so that the cooling water can fully flow through the three flow channel areas Take away the heat emitted by the electronic equipment placed above the cover, control the operating temperature of the electronic equipment within a reasonable range, and meet the heat dissipation needs of high-power power semiconductor components.

In addition, the cover plate has a certain thickness, which can meet the requirement of providing threaded holes matching the electronic equipment on the cover plate, so as to meet the requirement of installing the electronic equipment on the cold plate.

Description of drawings

Fig. 1 is the schematic structural view of the liquid-cooled heat dissipation cooling plate involved in the utility model in an embodiment;

Fig. 2 is the enlarged structure diagram of the channel of the liquid-cooled cooling plate involved in the utility model in the embodiment; and

FIG. 3 is an installation diagram of an LED module in an embodiment of the liquid-cooled heat dissipation cooling plate of the present invention.

Detailed ways

The specific implementation forms of the liquid-cooled heat dissipation cooling plate involved in the present invention will be further described below in conjunction with the accompanying drawings.

<Example>

FIG. 1 is a schematic structural view of a liquid-cooled heat dissipation cooling plate in an embodiment of the present invention.

As shown in Figure 1, the liquid-cooled cooling plate 10 provided in this embodiment is used to cool down electronic equipment, and is made of aluminum material, including a bottom plate 11, a cooling part 12 and a cover not shown in the figure above the cooling part 12 plate.

The bottom plate 11 has a length a of 160 mm, a width b of 60 mm, and a thickness of 16 mm, including a cooling plate surface 111 and a bottom surface opposite to the cooling plate surface 111 .

The cooling part 12 is located on the cooling plate surface 111 and includes a first channel area 121 , a second channel area 122 , a third channel area 123 , a water inlet 124 , and a water outlet 125 . The first channel area 121 communicates with the water inlet 124 , the second channel area 122 communicates with both the first channel area 121 and the third channel area 123 , and the third channel area 123 also communicates with the water outlet 125 .

Fig. 2 is an enlarged structure diagram of the channel of the liquid-cooled heat dissipation cooling plate in the embodiment of the present invention.

As shown in Figures 1 and 2, the first flow channel area 121 has twenty-three channels 126 to form a groove width of 1.5mm, and the thickness of the fins is 0.5mm, and the second flow channel area 122 has twenty-nine channels 127 to form a groove width 1mm, the fin thickness is 0.5mm, the third runner area 123 has forty-six channels 128 to form a groove width of 0.5mm, and the fin thickness is 0.5mm. The grooves 126-128 are rectangular ribs with a height of 8mm. All the grooves 126 in the first flow channel area 121 communicate with the water inlet 124, and all the grooves 128 in the third flow channel area 123 communicate with the water outlet 125. All the channels 127 of the flow channel area 122 communicate with the channels 126 of the first flow channel area 121 and the channels 128 of the third flow channel area 123 . The rib widths and rib heights of the channels 126 - 128 in the first flow channel area 121 , the second flow channel area 122 , and the third flow channel area 123 are the same.

The cover plate is arranged above the cooling part 12, and its length and width dimensions are consistent with those of the cold plate main body 11, and has a certain thickness, which is 3.5mm, and is used for placing electronic equipment.

The cooling water flows in from the water inlet 124 , passes through the channel 126 of the first channel area 121 , the channel 127 of the second channel area 122 , and the channel 128 of the third channel area 123 , and flows out from the water outlet 125 .

FIG. 3 is an installation diagram of an LED module in an embodiment of the liquid-cooled heat dissipation cooling plate of the present invention.

As shown in Figure 3, the electronic equipment required for cooling in this embodiment is ten LED modules, which are respectively the first module 131, the second module 132, the third module 133, the fourth module 134, the fifth module 135, and the sixth module. Module 136 , seventh module 137 , eighth module 138 , ninth module 139 , and tenth module 140 . 100 LED lamps are arranged inside each LED module.

When using the liquid-cooled cooling plate 10 provided in this embodiment to cool ten LED modules, according to the size of the LED module and the size of the nut, set a matching LED module on the cover plate of the liquid-cooled cooling plate 10. The threaded holes divide the ten LED modules into two rows, 5 in each row, and are arranged staggered at equal intervals above the first flow channel area 121 , the second flow channel area 122 , and the third flow channel area 123 on the cover plate. .

Cooling water flows in through the water inlet 124, flows through the channels 128 of the first channel area 121, the second channel area 122, and the third channel area 123 in sequence, and flows out from the water outlet 125, and the cooling water flows out through the channels 128 At the same time, the heat generated by the ten LED modules is taken out, thereby achieving a cooling effect on the LED modules. Function and effect of embodiment

Compared with the background technology, the liquid-cooled heat dissipation cooling plate involved in this embodiment is provided with a total of three flow channel areas: the first flow channel area, the second flow channel area, and the third flow channel area, and the three flow channel areas are arranged alternately , fully increase the disturbance of the cooling water in the cold plate in the limited space, and the design of multiple channel channels in each flow channel area increases the heat exchange surface, so that the cooling water can fully flow through the three flow channel areas Take away the heat emitted by the electronic equipment placed above the cover, control the operating temperature of the electronic equipment within a reasonable range, and meet the heat dissipation needs of high-power power semiconductor components.

In addition, the number of channels in the first channel area is the same as the number of channels in the third channel area, and is more than the number of channels in the second channel area, so that the front and rear channels can form a staggered arrangement to increase the flow of coolant When the disturbance, thereby enhancing the heat dissipation performance of the cold plate.

In addition, the cover plate has a certain thickness, which is 3.5mm, which can meet the requirement of providing threaded holes matching the electronic equipment on the cover plate, thereby satisfying the requirement of installing the electronic equipment on the cold plate.

In addition, the rectangular channel has a large heat exchange surface, so that the water flowing through the channel can fully take away the heat emitted by the electronic devices above, and control it within a reasonable working temperature range, so as to meet the needs of high-power applications. Heat dissipation of power semiconductor components.

Of course, the liquid-cooled heat dissipation cooling plate involved in the present invention is not limited to the structures in the above-mentioned embodiments. The above content is only a basic explanation under the conception of the utility model, and any equivalent transformation made according to the technical solution of the utility model belongs to the protection scope of the utility model.

In addition, in the above embodiment, the first runner area is composed of twenty-three channels, the second runner area is composed of twenty-nine channels, and the third runner area is composed of forty-six channels. The array is only a basic description, the number of channels in the three flow channel areas involved in the technical solution of the utility model can be selected from any value, preferably the number of channels in the first channel area and the number of channels in the third channel area The number of channels is the same and is more than the number of channels in the second flow channel area.

In addition, in the above-mentioned embodiment, the certain thickness is 3.5 mm, and the certain thickness involved in the technical solution of the utility model can be selected from any value between 1 and 7 mm, which can meet the requirements of setting on the cover plate to match the electronic equipment. Threaded holes required.

Claims (4)

1. A liquid-cooled heat dissipation cooling plate, which makes electronic equipment cool down by cooling water, is characterized in that, comprising: a base plate comprising a cooling plate surface and a bottom surface opposite to the cooling plate surface; The cooling part provided on the cooling plate includes a first flow channel area, a second flow channel area, a third flow channel area, a water inlet, and a water outlet, the first flow channel area communicates with the water inlet, The second flow channel area communicates with the first flow channel area and the third flow channel area, the third flow channel area also communicates with the water outlet, the first flow channel area, the second flow channel area Both the second channel area and the third channel area are composed of a plurality of channels, all the channels in the first channel area communicate with the water inlet, and all the channels in the third channel area are all communicated with the water outlet, and the channels of the second flow channel area are respectively arranged alternately with the channels of the first flow channel area and the channels of the third flow channel area; and The cover plate arranged above the cooling part has a certain thickness, and the length and width dimensions of the cover plate are consistent with the length and width dimensions of the bottom plate, The cooling water flows in from the water inlet, passes through the channels of the first flow channel area, the channel of the second flow channel area, and the channel of the third flow channel area respectively, and flows from the outlet Water flows out. the 2 . The liquid-cooled cooling plate according to claim 1 , wherein the certain thickness is 1-7 mm. 3 . the 3. A liquid-cooled heat dissipation cooling plate according to claim 1, characterized in that: the number of channels in the first flow channel area is less than the number of channels in the second flow channel area, and the number of channels in the second flow channel area The number of channels is less than the number of channels in the third flow channel area. the 4. A kind of liquid cooling cooling plate according to claim 1, is characterized in that: described channel is a rectangular channel. the