CN203708729U - Heat radiation device - Google Patents

Heat radiation device Download PDF

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Publication number
CN203708729U
CN203708729U CN201320704063.6U CN201320704063U CN203708729U CN 203708729 U CN203708729 U CN 203708729U CN 201320704063 U CN201320704063 U CN 201320704063U CN 203708729 U CN203708729 U CN 203708729U
Authority
CN
China
Prior art keywords
radiator
fixed
fan
mainboard
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320704063.6U
Other languages
Chinese (zh)
Inventor
陈少宇
曾文键
詹国强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunda Computer Technology Kunshan Co Ltd
Mitac International Corp
Original Assignee
Kunda Computer Technology Kunshan Co Ltd
Mitac International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunda Computer Technology Kunshan Co Ltd, Mitac International Corp filed Critical Kunda Computer Technology Kunshan Co Ltd
Priority to CN201320704063.6U priority Critical patent/CN203708729U/en
Application granted granted Critical
Publication of CN203708729U publication Critical patent/CN203708729U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a heat radiation device. The heat radiation device is disposed on a main board. The heat radiation device comprises a first heat radiator, which is fixed on the main board and disposed on an air flow direction of a fan; a second heat radiator, which is fixed on the main board and disposed at the air flow direction of the fan, and which is far from the fan in relative to the fist heat radiator; and a wind shielding board, which is vertical to the main board, fixed between the first heat radiator and the second heat radiator, and provided with a notch having a size the same with the size of an end surface of the second heat radiator. With the heat radiation device, air flow management is optimized with minimum cost.

Description

Heat abstractor
[technical field]
The utility model is a kind of heat abstractor, especially a kind of heat abstractor that is applicable to multi node server.
[background technology]
The management in system flow field occupies very large importance in electronic product radiating field, and good management can make systematic part temperature optimization, obtains good temperature treatment with minimum cost.Along with the power output of the electronic components such as central processing unit and improving constantly of operating frequency, also showed increased of the heat of its corresponding generation, if get rid of not in time the heat of its generation, will cause heat accumulative total to cause that temperature raises, and have a strong impact on the normal operation of electronic component.For this reason, industry is conventionally installed a radiator on these heater element surfaces and is carried out auxiliary heat dissipation, installs a fan additional, to strengthen radiating effect in one end of radiator simultaneously.Traditional radiator is not the needs of very high electronic component to radiating requirements in order to take into account some, can by described to the not high electronic component of radiating requirements be arranged on described radiator a side in case the wind energy of described fan some can blow to the described electronic component not high to radiating requirements, but often so arrange due to the waste that blows to demand that the described wind to the not high electronic component of radiating requirements exceeded the heat radiation of itself and caused air quantity, thereby reduce the radiating effect of heat abstractor, and, the radiating requirements of memory modules has downward trend gradually, the wind flow that this means memory modules needs is more and more lower, relatively, CPU can obtain more wind flow.
In view of this, the utility model provides a kind of heat abstractor, and it can reach and optimize wind flow management with minimum cost.
[utility model content]
Main purpose of the present utility model is to provide a kind of heat abstractor, and it can reach and optimize wind flow management with minimum cost.
For reaching above-mentioned purpose, the utility model provides a kind of heat abstractor, and it is arranged on mainboard, it is characterized in that, comprising: the first radiator, and it is fixed on described mainboard, and described the first radiator is arranged on the wind direction of described fan; The second radiator, it is fixed on described mainboard and is positioned on the wind direction of described fan, and relatively described the first radiator of described the second radiator is away from described fan; And deep bead, it is vertical with mainboard, and described deep bead is fixed between described the first radiator and described the second radiator, and described deep bead is offered a breach, and the size of described breach is identical with described the second radiator end face.
Preferably, described the first radiator is fixed on fixed head by fixture, and described the second radiator is fixed on described mainboard by fixture.
Preferably, the fixture that described deep bead is established corresponding described the first radiator and described the second radiator is provided with the sleeve of coupling, thereby described deep bead is placed on by sleeve on the fixture of described the first radiator and described the second radiator and is fixed between described the first radiator and described the second radiator.
Preferably, spaced apart several through holes that is provided with on described sleeve.
Compared with prior art, heat abstractor of the present utility model flows to the wind circulation of described the first radiator and described the second radiator both sides dispelling the heat for less demanding element that some are dispelled the heat by a part and crosses and stop the first radiator and described the second radiator end face relative with fan described in pilot flow direction by deep bead is set, increase the wind flow of described the first radiator and described the second radiator, realize with minimum cost and reach and optimize wind flow management, in addition by the sleeve of corresponding radiator upper fixing element is set on deep bead, thereby without the extra fixture that increases, save cost of parts.
[brief description of the drawings]
Fig. 1 is the assembling schematic diagram of the utility model heat abstractor.
Fig. 2 is the decomposing schematic representation of the utility model heat abstractor.
[embodiment]
Refer to shown in Fig. 1, a kind of heat abstractor of the utility model, in the present embodiment, it is applied in a multi node server is its inner electronic element radiating, described heat abstractor is arranged on mainboard 1 for needing heat dissipation element to dispel the heat to the electronics such as CPU, memory body arranging on mainboard 1 etc., and one end of described mainboard 1 arranges a fan (not shown) takes away the heat of the generation of each electronic component on mainboard 1 by accelerating the mode of Air Flow.
In the utility model, described heat abstractor comprises the first radiator 2, one second radiator 3, and a deep bead 4.
Described the first radiator 2 is fixed on mainboard 1 by fixture 21 and is positioned on the wind direction of described fan, for example, for the electronic element radiating of a high radiating requirements, CPU.
Described the second radiator 3 is fixed on mainboard by fixture 31 and is positioned on the wind direction of described fan, and relatively described the first radiator 2 of described the second radiator 3, away from described fan, is used to the electronic element radiating of another the high radiating requirements on mainboard 1.
Described deep bead 4 is vertical with mainboard 1, it is fixed between described the first radiator 2 and described the second radiator 3 for flowing to described the first radiator 2 of distinguished and admirable guiding and described second radiator 3 of both sides of described the first radiator 2 and described the second radiator 3, in the present embodiment, described deep bead 4 is fixed on the fixture 21 of described the first radiator 2 and described the second radiator 3, on 31, the fixture 21 of described deep bead 4 corresponding described the first radiators 2 and described the second radiator 3, 31 are provided with the sleeve 41 of coupling, described deep bead 4 is further in offering a breach 42, the size of described breach 42 is identical with described the second radiator 2 end faces, thereby that avoids stopping fan distinguished and admirablely blows to described the second radiator 3.On described each sleeve 41, spaced apart several through holes 43 that is provided with, increase ventilative property.
In use, some flows to described the first radiator 2 and the distinguished and admirable of described the second radiator 3 both sides dispelled the heat for less demanding element that some are dispelled the heat the distinguished and admirable meeting that fan produces, in the present embodiment taking memory body (not shown) as row, but owing to being subject to stopping of described deep bead 4, directed described the first radiator 2 and described the second radiator 3 end face relative with fan of flowing to of this part of distinguished and admirable meeting, increase the wind flow of described the first radiator 2 and described the second radiator 3, reach whereby correct guidance distinguished and admirable, best radiating effect is provided, realize with minimum cost and reached the object of optimizing wind flow management.
In sum, the various embodiments described above and diagram are only the preferred embodiment of the utility model, when can not with the scope of restriction the utility model enforcement, the equalization of generally being done according to the utility model claim changes and modifies, and all should belong in the scope that the utility model patent contains.

Claims (1)

1. a heat abstractor, it is arranged on mainboard, and one end of described mainboard arranges a fan, it is characterized in that, comprising:
The first radiator, it is fixed on described mainboard, and described the first radiator is arranged on the wind direction of described fan;
The second radiator, it is fixed on described mainboard and is positioned on the wind direction of described fan, and relatively described the first radiator of described the second radiator is away from described fan; And
Deep bead, it is vertical with described mainboard, and described deep bead is fixed between described the first radiator and described the second radiator, and described deep bead is offered a breach, and the size of described breach is identical with described the second radiator end face.
2. heat abstractor according to claim 1, is characterized in that, described the first radiator is fixed on fixed head by fixture, and described the second radiator is fixed on described mainboard by fixture.
3. heat abstractor according to claim 2, it is characterized in that, the fixture that described deep bead is established corresponding described the first radiator and described the second radiator is provided with the sleeve of coupling, thereby described deep bead is placed on by sleeve on the fixture of described the first radiator and described the second radiator and is fixed between described the first radiator and described the second radiator.
4. heat abstractor according to claim 3, is characterized in that, spaced apart several through holes that is provided with on described sleeve.
CN201320704063.6U 2013-11-08 2013-11-08 Heat radiation device Expired - Fee Related CN203708729U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320704063.6U CN203708729U (en) 2013-11-08 2013-11-08 Heat radiation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320704063.6U CN203708729U (en) 2013-11-08 2013-11-08 Heat radiation device

Publications (1)

Publication Number Publication Date
CN203708729U true CN203708729U (en) 2014-07-09

Family

ID=51059102

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320704063.6U Expired - Fee Related CN203708729U (en) 2013-11-08 2013-11-08 Heat radiation device

Country Status (1)

Country Link
CN (1) CN203708729U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105992506A (en) * 2015-03-31 2016-10-05 杭州迪普科技有限公司 Business board structure and distributed network device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105992506A (en) * 2015-03-31 2016-10-05 杭州迪普科技有限公司 Business board structure and distributed network device

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140709

Termination date: 20181108