CN202472544U - Multi-channel heat dissipation structure - Google Patents
Multi-channel heat dissipation structure Download PDFInfo
- Publication number
- CN202472544U CN202472544U CN2012201090726U CN201220109072U CN202472544U CN 202472544 U CN202472544 U CN 202472544U CN 2012201090726 U CN2012201090726 U CN 2012201090726U CN 201220109072 U CN201220109072 U CN 201220109072U CN 202472544 U CN202472544 U CN 202472544U
- Authority
- CN
- China
- Prior art keywords
- heating radiator
- deep bead
- pcb board
- radiator
- cooling structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a multi-channel heat radiation structure. The multi-channel heat radiation structure comprises a first PCB (Printed Circuit Board), a third wind shielding board, a first heat radiator and a second heat radiator, wherein the first heat radiator and the second heat radiator are arranged between the first PCB and the third wind shielding board, and the back surfaces of the first heat radiator and the second heat radiator are oppositely arranged. According to the multi-channel heat radiation structure provided by the utility model, by oppositely arranging the back surfaces of the first heat radiator and the second heat radiator and utilizing the first PCB, the third wind shielding board, a first wind shielding board and a second wind shielding board to form a first heat radiation channel, a second heat radiation channel and a third heat radiation channel, thus the air ventilation is facilitated, and the heat radiation effect is increased.
Description
Technical field
The utility model relates to radiator structure, relates in particular to welding machine, particularly, relates to the multi-channel cooling structure.
Background technology
Radiator structure be used to conduct, the device of release heat.The field of radiator structure application at present mainly contains heating radiator, computer radiator, wherein adopts heating radiator and can be divided into some kinds according to material and mode of operation again, and computer radiator can be divided into some kinds according to purposes and installation method.An at present general radiator structure heating radiator or two unilateral single channels that are relatively set into of heatsink fins of adopting dispel the heat more; Its weak point is; Under the certain condition in space; Only use single heating radiator or two unilateral modes that are oppositely arranged of heatsink fins all only to form a heat dissipation channel, cause the channel space layout of circulation of air narrow short, be unfavorable for heat radiation.
The utility model content
To defective of the prior art, the purpose of the utility model provides a kind of multi-channel cooling structure, adopts following technical scheme:
The multi-channel cooling structure, comprise first pcb board, the 3rd deep bead and be installed in first pcb board and the 3rd deep bead between first heating radiator and second heating radiator, the back side of the back side of said first heating radiator and second heating radiator is oppositely arranged;
Preferably; The heating radiator installed surface of the installed surface of the back side of the back side of said first heating radiator, second heating radiator, first pcb board and the 3rd deep bead constitutes first heat dissipation channel; The heating radiator installed surface of the fin face of said first heating radiator, the installed surface of first pcb board and the 3rd deep bead constitutes second heat dissipation channel, and the heating radiator installed surface of the fin face of said second heating radiator, the installed surface of first pcb board and the 3rd deep bead constitutes the 3rd heat dissipation channel;
Preferably, also comprise bracing frame, wherein, said first pcb board, first heating radiator and second heating radiator are installed on the support frame as described above through said the 3rd deep bead;
Preferably, support frame as described above is positioned at the below of said the 3rd deep bead;
Preferably, support frame as described above is several fonts;
Preferably, also comprise the 3rd heating radiator and second pcb board that are connected, wherein, said second pcb board and said first heating radiator are positioned at the both sides of support frame as described above;
Preferably; Also comprise first deep bead and second deep bead that connect on said first pcb board; Wherein, the one side of said first deep bead is pressed close to the end of said first heat radiator fin, and the one side of said second deep bead is pressed close to the end of said second heat radiator fin;
Preferably, also comprise fan, wherein, the near-end of said first deep bead and second deep bead all extends to or extends beyond the air outlet mouth edge of fan;
Preferably, also comprise shell, wherein, said first pcb board, the 3rd deep bead, first heating radiator and second heating radiator are positioned at said shell, said shell following any or appoint a plurality of sides to be provided with louvre: downside; Upper side; Left surface; Right flank;
Preferably; Said shell is the recessed end of pressing close to said first heat radiator fin towards the subregion of the unilateral side of said first heatsink fins, and said shell is the recessed end of pressing close to said second heat radiator fin towards the subregion of the unilateral side of said second heatsink fins.
The utility model is through being oppositely arranged the back side of first heating radiator and the back side of second heating radiator; And utilize first pcb board, the 3rd deep bead and first deep bead and second deep bead to constitute first heat dissipation channel, second heat dissipation channel and the 3rd heat dissipation channel; Thereby help circulation of air, improve radiating effect.
Description of drawings
Fig. 1 illustrates the perspective view of multi-channel cooling structure;
Fig. 2 illustrates the main TV structure synoptic diagram of multi-channel cooling structure;
Fig. 3 illustrates the plan structure synoptic diagram of multi-channel cooling structure;
Fig. 4 illustrates the left TV structure synoptic diagram of multi-channel cooling structure.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and be easy to understand with effect and understand, below in conjunction with illustrating and specific embodiment, further set forth the utility model.
Shown in Fig. 1 to 4; The multi-channel cooling structure that the utility model proposes comprise first pcb board 1, the 3rd deep bead 10 and be installed in first pcb board 1 and the 3rd deep bead 10 between first heating radiator 4 and second heating radiator 3, the back side 41 of said first heating radiator 4 and the back side 31 of second heating radiator 3 are oppositely arranged.The 3rd heating radiator 7 that the multi-channel cooling structure also comprises bracing frame 8, be connected and second pcb board 9, be connected first deep bead 5 and second deep bead 6, fan 2, shell 12 on said first pcb board 1.
Particularly; The installed surface 101 of the back side 41 of said first heating radiator 4, the back side 31 of second heating radiator 3, first pcb board 1 and the heating radiator installed surface of the 3rd deep bead 10 100 constitute first heat dissipation channel 143; The heating radiator installed surface 100 of the fin face of said first heating radiator, the installed surface 101 of first pcb board and the 3rd deep bead 10 constitutes second heat dissipation channel 141, and the heating radiator installed surface 100 of the fin face of said second heating radiator 3, the installed surface 101 of first pcb board 1 and the 3rd deep bead 10 constitutes the 3rd heat dissipation channel 142.
More particularly; Said first pcb board 1, first heating radiator 4 and second heating radiator 3 are installed on the support frame as described above 8 through said the 3rd deep bead 10; Support frame as described above 8 is several fonts, and is as shown in Figure 2, and support frame as described above 8 is positioned at the below of said the 3rd deep bead 10; In the present embodiment, said the 3rd deep bead 10 is preferably insulcrete.It will be appreciated by those skilled in the art that in the prior art the parts in the shell 12 are to hang in the enclosure through the frame support that is positioned at the top, its assembling is complicated and need the web member of use more; And in the utility model, adopt the bracing frame of several fonts to replace frame support; Thereby make parts to place the top that is installed in bracing frame with the mode of support; Like this; Improved on the one hand mounting stability, made assembling become simple on the other hand, and the use amount of having saved web member is to reduce cost.
Further, said second pcb board 9 and said first heating radiator 4 are positioned at the both sides of support frame as described above 8.The one side of said first deep bead 5 is pressed close to the end of said first heating radiator, 4 fins, and the one side of said second deep bead 6 is pressed close to the end of said second heating radiator, 3 fins.Can make the cold wind wind concentration that flows through second heat dissipation channel and the 3rd heat dissipation channel with the many as far as possible heats that must take away heating radiator like this.
Like Fig. 3 and shown in Figure 4, the near-end 50 of said first deep bead 5 and the near-end 60 of second deep bead 6 all extend to or extend beyond the air outlet mouth edge of fan, thereby make wind-force can concentrate on second heat dissipation channel and the 3rd heat dissipation channel.Said first pcb board, the 3rd deep bead, first heating radiator and second heating radiator are positioned at said shell, said shell following any or appoint a plurality of sides to be provided with louvre: downside; Upper side; Left surface; Right flank.
In a variant of present embodiment; Said shell 12 is the recessed end of pressing close to said first heat radiator fin towards the subregion of the unilateral side 121 of said first heatsink fins; Said shell is the recessed end of pressing close to said second heat radiator fin towards the subregion of the unilateral side 122 of said second heatsink fins; At this moment, said first deep bead 5 and second deep bead 6 can be omitted.
More than show and described the advantage of ultimate principle, principal character and the utility model of the utility model.The technician of the industry should understand; The utility model is not restricted to the described embodiments; The principle of describing in the foregoing description and the instructions that the utility model just is described; The utility model also has various changes and modifications under the prerequisite that does not break away from the utility model spirit and scope, and these variations and improvement all fall in the utility model scope that requires protection.The utility model requires protection domain to be defined by appending claims and equivalent thereof.
Claims (10)
1. multi-channel cooling structure; Comprise first pcb board, the 3rd deep bead and be installed in first pcb board and the 3rd deep bead between first heating radiator and second heating radiator; It is characterized in that the back side of the back side of said first heating radiator and second heating radiator is oppositely arranged.
2. multi-channel cooling structure according to claim 1; It is characterized in that; The heating radiator installed surface of the installed surface of the back side of the back side of said first heating radiator, second heating radiator, first pcb board and the 3rd deep bead constitutes first heat dissipation channel; The heating radiator installed surface of the fin face of said first heating radiator, the installed surface of first pcb board and the 3rd deep bead constitutes second heat dissipation channel, and the heating radiator installed surface of the fin face of said second heating radiator, the installed surface of first pcb board and the 3rd deep bead constitutes the 3rd heat dissipation channel.
3. multi-channel cooling structure according to claim 1 is characterized in that, also comprises bracing frame, and wherein, said first pcb board, first heating radiator and second heating radiator are installed on the support frame as described above through said the 3rd deep bead.
4. multi-channel cooling structure according to claim 3 is characterized in that support frame as described above is positioned at the below of said the 3rd deep bead.
5. multi-channel cooling structure according to claim 3 is characterized in that, support frame as described above is several fonts.
6. multi-channel cooling structure according to claim 5 is characterized in that, also comprises the 3rd heating radiator and second pcb board that are connected, and wherein, said second pcb board and said first heating radiator are positioned at the both sides of support frame as described above.
7. multi-channel cooling structure according to claim 1; It is characterized in that; Also comprise first deep bead and second deep bead that connect on said first pcb board; Wherein, the one side of said first deep bead is pressed close to the end of said first heat radiator fin, and the one side of said second deep bead is pressed close to the end of said second heat radiator fin.
8. multi-channel cooling structure according to claim 7 is characterized in that, also comprises fan, and wherein, the near-end of said first deep bead and second deep bead all extends to or extend beyond the air outlet mouth edge of fan.
9. multi-channel cooling structure according to claim 1; It is characterized in that, also comprise shell, wherein; Said first pcb board, the 3rd deep bead, first heating radiator and second heating radiator are positioned at said shell, said shell following any or appoint a plurality of sides to be provided with louvre:
-downside;
-upper side;
-left surface;
-right flank.
10. multi-channel cooling structure according to claim 9; It is characterized in that; Said shell is the recessed end of pressing close to said first heat radiator fin towards the subregion of the unilateral side of said first heatsink fins, and said shell is the recessed end of pressing close to said second heat radiator fin towards the subregion of the unilateral side of said second heatsink fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201090726U CN202472544U (en) | 2012-03-21 | 2012-03-21 | Multi-channel heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201090726U CN202472544U (en) | 2012-03-21 | 2012-03-21 | Multi-channel heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202472544U true CN202472544U (en) | 2012-10-03 |
Family
ID=46920688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201090726U Expired - Fee Related CN202472544U (en) | 2012-03-21 | 2012-03-21 | Multi-channel heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202472544U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104460908A (en) * | 2014-12-16 | 2015-03-25 | 浪潮电子信息产业股份有限公司 | Multichannel heat radiation design method of 1U server |
| CN110502077A (en) * | 2019-07-23 | 2019-11-26 | 武汉光迅科技股份有限公司 | It is a kind of with dust-proof and heat sinking function cabinet apparatus |
| CN111065247A (en) * | 2020-01-07 | 2020-04-24 | 深圳市江霖电子科技有限公司 | High thermal-insulated three-dimensional PCB module |
| CN111093349A (en) * | 2020-01-07 | 2020-05-01 | 深圳市江霖电子科技有限公司 | Modular three-dimensional PCB module |
-
2012
- 2012-03-21 CN CN2012201090726U patent/CN202472544U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104460908A (en) * | 2014-12-16 | 2015-03-25 | 浪潮电子信息产业股份有限公司 | Multichannel heat radiation design method of 1U server |
| CN104460908B (en) * | 2014-12-16 | 2018-07-13 | 浪潮电子信息产业股份有限公司 | A kind of multi-channel cooling design method of 1U servers |
| CN110502077A (en) * | 2019-07-23 | 2019-11-26 | 武汉光迅科技股份有限公司 | It is a kind of with dust-proof and heat sinking function cabinet apparatus |
| CN110502077B (en) * | 2019-07-23 | 2020-11-17 | 武汉光迅科技股份有限公司 | Case device with dustproof and heat dissipation functions |
| CN111065247A (en) * | 2020-01-07 | 2020-04-24 | 深圳市江霖电子科技有限公司 | High thermal-insulated three-dimensional PCB module |
| CN111093349A (en) * | 2020-01-07 | 2020-05-01 | 深圳市江霖电子科技有限公司 | Modular three-dimensional PCB module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202472544U (en) | Multi-channel heat dissipation structure | |
| CN203953351U (en) | The radiator structure of electric-heating cooking utensil | |
| CN204496379U (en) | A kind of heat radiating type computer cabinet with anti-negative pressure function | |
| CN103717041A (en) | Heat-radiating device, heat-radiating device manufacturing method and electronic device | |
| CN207652767U (en) | A kind of circuit board with high-efficient radiating function | |
| CN205159306U (en) | CPU chip heat abstractor | |
| CN203574995U (en) | Heat-radiation type circuit board | |
| CN101916135B (en) | Electronic device | |
| CN203814123U (en) | Air-cooling heat dissipation device | |
| CN207022361U (en) | Remote control property cellular phone signal shielding device | |
| CN206115350U (en) | Heat dissipation type IPC industrial computer | |
| CN204990166U (en) | Novel radiating module | |
| CN209016921U (en) | A kind of electrical equipment with heat dissipation ventilation structure | |
| CN203482574U (en) | Heat dissipation device | |
| CN203679492U (en) | Squirrelcage high-power IGBT (Insulated Gate Bipolar Translator) single-tube inverter welding machine | |
| CN103702546A (en) | Converter and radiating method | |
| CN207623908U (en) | A kind of radiator structure of computer cabinet | |
| CN102573388B (en) | Heat-dissipation type PCB (Printed Circuit Board) tray | |
| CN109605929B (en) | Gilding press upper platform heat abstractor | |
| CN202634974U (en) | Heat dissipation structure and power unit possessing heat dissipation structure | |
| CN202472542U (en) | Display card radiator | |
| CN208338194U (en) | A kind of specific shape fin collocation type LED radiator | |
| CN105304274A (en) | Transformer having air passage partition board | |
| CN204595747U (en) | A kind of notebook radiator | |
| CN205040133U (en) | Aging testing cabinet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: SHANGHAI GUANGWEI ELECTRIC + TOOLS CO., LTD. SHANGHAI GUANGWEI ELECTRIC CO., LTD. Effective date: 20140701 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHANGHAI GUANGWEI WELDING EQUIPMENT CO., LTD. Free format text: FORMER NAME: SHANGHAI GUANGWEITUOPU ELECTRIC POWER CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 200241 Shanghai, Hongmei Road, Minhang District, Lane 4916, No. 18, building No. 4 Patentee after: SHANGHAI GREATWAY WELDING EQUIPMENT Co.,Ltd. Patentee after: ShangHai Guangwei Electric & Tools Co.,Ltd. Patentee after: SHANGHAI POWER STATION Co.,Ltd. Address before: 200241 No. 4916, Lane 18, Hongmei South Road, Shanghai, Minhang District Patentee before: SHANGHAI GREATWAY TOP POWER Co.,Ltd. Patentee before: ShangHai Guangwei Electric & Tools Co.,Ltd. Patentee before: SHANGHAI POWER STATION Co.,Ltd. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140701 Address after: 200241 Shanghai, Hongmei Road, Minhang District, Lane 4916, No. 18, building No. 4 Patentee after: SHANGHAI GREATWAY WELDING EQUIPMENT Co.,Ltd. Address before: 200241 Shanghai, Hongmei Road, Minhang District, Lane 4916, No. 18, building No. 4 Patentee before: SHANGHAI GREATWAY WELDING EQUIPMENT Co.,Ltd. Patentee before: ShangHai Guangwei Electric & Tools Co.,Ltd. Patentee before: SHANGHAI POWER STATION Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121003 Termination date: 20160321 |