CN104640415A - Heat radiation device - Google Patents
Heat radiation device Download PDFInfo
- Publication number
- CN104640415A CN104640415A CN201310552235.7A CN201310552235A CN104640415A CN 104640415 A CN104640415 A CN 104640415A CN 201310552235 A CN201310552235 A CN 201310552235A CN 104640415 A CN104640415 A CN 104640415A
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- China
- Prior art keywords
- radiator
- fixed
- fan
- mainboard
- deep bead
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a heat radiation device. The heat radiation device is disposed on a main board. The heat radiation device comprises a first heat radiator, which is fixed on the main board and disposed on an air flow direction of a fan; a second heat radiator, which is fixed on the main board and disposed at the air flow direction of the fan, and which is far from the fan in relative to the fist heat radiator; and a wind shielding board, which is vertical to the main board, fixed between the first heat radiator and the second heat radiator, and provided with a notch having a size the same with the size of an end surface of the second heat radiator. With the heat radiation device, air flow management is optimized with minimum cost.
Description
[technical field]
The present invention is a kind of heat abstractor, especially a kind of heat abstractor being applicable to multi node server.
[background technology]
The management in system flow field occupies very large importance in electronic product radiating field, and good management can make systematic part temperature optimization, obtains good temperature treatment with minimum cost.Along with the power output of the electronic components such as central processing unit and improving constantly of operating frequency, the heat also showed increased of its corresponding generation, if get rid of the heat that it produces not in time, heat accumulation will be caused to cause temperature to raise, and have a strong impact on the normal operation of electronic component.For this reason, industry is usually installed a radiator on these heater element surfaces and is carried out auxiliary heat dissipation, installs a fan additional, to strengthen radiating effect in one end of radiator simultaneously.Traditional radiator is in order to take into account the needs that some are not very high electronic component to radiating requirements, the described electronic component not high to radiating requirements can be arranged on the side of described radiator so as the wind energy of described fan some can blow to the described electronic component not high to radiating requirements, but so arrange often because the wind blowing to the described electronic component not high to radiating requirements to result in the waste of air quantity beyond the demand of the heat radiation of itself, thus reduce the radiating effect of heat abstractor, and, the radiating requirements of memory modules has downward trend gradually, this means that the wind flow that memory modules needs is more and more lower, relatively, CPU can obtain more wind flow.
In view of this, the invention provides a kind of heat abstractor, it can reach with minimum cost optimizes wind flow management.
[summary of the invention]
Main purpose of the present invention is to provide a kind of heat abstractor, and it can reach with minimum cost optimizes wind flow management.
For reaching above-mentioned purpose, the invention provides a kind of heat abstractor, it is arranged on mainboard, it is characterized in that, comprising: the first radiator, and it is fixed on described mainboard, and described first radiator is arranged on the wind direction of described fan; Second radiator, it to be fixed on described mainboard and to be positioned on the wind direction of described fan, and relatively described first radiator of described second radiator is away from described fan; And deep bead, it is vertical with mainboard, and described deep bead is fixed between described first radiator and described second radiator, and described deep bead offers a breach, and the size of described breach is identical with described second radiator end face.
Preferably, described first radiator is fixed on fixed head by fixture, and described second radiator is fixed on described mainboard by fixture.
Preferably, described deep bead establishes the fixture of corresponding described first radiator and described second radiator to be provided with the sleeve of coupling, and described deep bead to be placed on the fixture of described first radiator and described second radiator by sleeve thus to be fixed between described first radiator and described second radiator.
Preferably, spaced apartly on described sleeve several through holes are provided with.
Compared with prior art, heat abstractor of the present invention is distinguished and admirable by stopping the first radiator described in pilot flow direction and the described second radiator end face relative with fan by what arrange that a part to flow to that described first radiator and described second radiator both sides are used for that the element not high to some cooling requirements dispel the heat by deep bead, add the wind flow of described first radiator and described second radiator, realize reaching with minimum cost optimizing wind flow management, additionally by sleeve deep bead being arranged corresponding radiator upper fixing element, thus without the need to additionally increasing fixture, save cost of parts.
[accompanying drawing explanation]
Fig. 1 is the assembling schematic diagram of heat abstractor of the present invention.
Fig. 2 is the decomposing schematic representation of heat abstractor of the present invention.
[embodiment]
Refer to shown in Fig. 1, a kind of heat abstractor of the present invention, in the present embodiment, it is applied to the electronic element radiating for its inside in a multi node server, described heat abstractor is arranged on for needing heat dissipation element to dispel the heat to the electronics etc. such as CPU, memory body that mainboard 1 is arranged on mainboard 1, and one end of described mainboard 1 arranges a fan (not shown) takes away the generation of each electronic component on mainboard 1 heat by the mode accelerating air flowing.
In the present invention, described heat abstractor comprises the first radiator 2,1 second radiator 3, and a deep bead 4.
Described first radiator 2 to be fixed on mainboard 1 by fixture 21 and to be positioned on the wind direction of described fan, for the electronic element radiating of a high radiating requirements, and such as CPU.
Described second radiator 3 to be fixed on mainboard by fixture 31 and to be positioned on the wind direction of described fan, relatively described first radiator 2 of described second radiator 3 away from described fan, for the electronic element radiating for the high radiating requirements of another on mainboard 1.
Described deep bead 4 is vertical with mainboard 1, it is fixed between described first radiator 2 and described second radiator 3 for described first radiator 2 of distinguished and admirable guiding of the both sides that will flow to described first radiator 2 and described second radiator 3 and described second radiator 3, in the present embodiment, described deep bead 4 is fixed on the fixture 21 of described first radiator 2 and described second radiator 3, on 31, the fixture 21 of corresponding described first radiator 2 of described deep bead 4 and described second radiator 3, 31 sleeves 41 being provided with coupling, described deep bead 4 is further in offering a breach 42, the size of described breach 42 is identical with described second radiator 2 end face, thus avoid stopping that the distinguished and admirable of fan blows to described second radiator 3.Spaced apartly on described each sleeve 41 be provided with several through holes 43, increase ventilative property.
In use, the distinguished and admirable meeting that fan produces some flow to described first radiator 2 and described the distinguished and admirable of second radiator 3 both sides is dispelled the heat for the element not high to some cooling requirements, in the present embodiment with memory body (not shown) for row, but owing to being subject to the stop of described deep bead 4, this a part of distinguished and admirable meeting is directed flows to described first radiator 2 and described second radiator 3 end face relative with fan, add the wind flow of described first radiator 2 and described second radiator 3, reach correct guidance whereby distinguished and admirable, best radiating effect is provided, achieve and reach with minimum cost the object optimizing wind flow management.
In sum, the various embodiments described above and diagram are only the preferred embodiment of the present invention, when can not with the scope of restriction the invention process, the equalization change namely generally done according to the present patent application the scope of the claims with modify, all should be covered by the present invention within the scope of the patent.
Claims (4)
1. a heat abstractor, it is arranged on mainboard, it is characterized in that, comprising:
First radiator, it is fixed on described mainboard, and described first radiator is arranged on the wind direction of described fan;
Second radiator, it to be fixed on described mainboard and to be positioned on the wind direction of described fan, and relatively described first radiator of described second radiator is away from described fan; And
Deep bead, it is vertical with mainboard, and described deep bead is fixed between described first radiator and described second radiator, and described deep bead offers a breach, and the size of described breach is identical with described second radiator end face.
2. heat abstractor according to claim 1, is characterized in that, described first radiator is fixed on fixed head by fixture, and described second radiator is fixed on described mainboard by fixture.
3. heat abstractor according to claim 2, it is characterized in that, described deep bead establishes the fixture of corresponding described first radiator and described second radiator to be provided with the sleeve of coupling, and described deep bead to be placed on the fixture of described first radiator and described second radiator by sleeve thus to be fixed between described first radiator and described second radiator.
4. heat abstractor according to claim 3, is characterized in that, spaced apartly on described sleeve is provided with several through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310552235.7A CN104640415A (en) | 2013-11-08 | 2013-11-08 | Heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310552235.7A CN104640415A (en) | 2013-11-08 | 2013-11-08 | Heat radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104640415A true CN104640415A (en) | 2015-05-20 |
Family
ID=53218574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310552235.7A Pending CN104640415A (en) | 2013-11-08 | 2013-11-08 | Heat radiation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104640415A (en) |
-
2013
- 2013-11-08 CN CN201310552235.7A patent/CN104640415A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150520 |
|
| WD01 | Invention patent application deemed withdrawn after publication |