CN2699362Y - CPU radiator - Google Patents
CPU radiator Download PDFInfo
- Publication number
- CN2699362Y CN2699362Y CN 200420045744 CN200420045744U CN2699362Y CN 2699362 Y CN2699362 Y CN 2699362Y CN 200420045744 CN200420045744 CN 200420045744 CN 200420045744 U CN200420045744 U CN 200420045744U CN 2699362 Y CN2699362 Y CN 2699362Y
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- heat
- radiation
- fan
- cpu
- radiator
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- Expired - Fee Related
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Abstract
The utility model relates to a high efficiency CPU radiator which comprises a heat conduction plate, a radiation fin connected with the heat conduction plate, and a heat pipe and a fan which are connected with the radiation fin. The utility model is characterized in that the upper side of a heat conduction copper plate is provided with the radiation fin and a fan bracket, the fan bracket and a wind guide cover are fixed together, the inner part of the wind guide cover is provided with a worm wheel fan, one end of the heat pipe is fixed between the contact surfaces of the heat conduction copper plate and the radiation fin, and the other end is fixed in the radiation fin. The utility model has the working principle that heat quantity generated by a CPU is fast transferred to the radiation fin through the heat pipe, and the heat quantity emitted by the radiation pin is sucked inside by the worm wheel fan and is exhausted from a heat radiation window through the wind guide cover. The high and lower rotation speed change of the worm wheel fan is realized through a speed control circuit. Because the worm wheel fan and the heat pipe technology are used, the original wind blowing radiation mode is changed into a ventilation heat extraction mode, and the utility model enhances the radiation efficiency and satisfies the radiation requirement of the CPU.
Description
Technical field
The utility model relates to the heating radiator of computing machine, specifically is meant a kind of efficient cpu heat for the CPU heat radiation.
Background technology
CPU (central processing unit) is the topmost parts in the computing machine, also is simultaneously maximum heater members (power reaches about 100 watts), so, must dispel the heat to CPU.Cpu heat in the past is crimped on CPU by the bottom surface of a copper heat-conducting block of triangle mostly, and two triangular facets and the heat radiator of the copper heat-conducting block of triangle are fixed together, and dispel the heat by fan.The thermolysis of fan mainly realizes by heat radiator is dried.Just there is a problem in this, and promptly the space in the computer case is very limited, and the heat radiation window on the housing is also very little, thus the hot blast that causes fan to blow out can not drain very soon, major part is stayed in the cabinet, does not reach radiating effect, radiating efficiency is very low.Along with the continuous increase of cpu power, this problem just more looms large.So, just need to improve the structure, the change draft type that have heating radiator now, improve radiating efficiency.
Summary of the invention
The purpose of this utility model is exactly to provide a kind of efficient cpu heat for the problem that overcomes existing cpu heat existence.
The realization the technical solution of the utility model is: this efficient cpu heat comprises heat-conducting plate and the heat radiator that is attached thereto, reaches the heat pipe and the fan that are connected with heat radiator.Its primary structure is provided with heat radiator and blower tray on conducting copper plate, blower tray and wind scooper are fixed together, and is Worm fan in the wind scooper; One end of heat pipe is fixed between the surface of contact of conducting copper plate and heat radiator, and its other end is fixed in the heat radiator.
The utlity model has following advantage:
1. the change radiating mode improves radiating efficiency.
2. obvious energy conservation.
Description of drawings
Fig. 1 is an overall schematic perspective view of the present utility model, wherein 1 cavernous body, 2 wind scoopers, 3 thermal sensing elements, 4 power leads, 5 Worm fans, 6 gib screws, 7 heat pipes, 8 conducting copper plate, 9 attachment screws, 10 springs, 11 blower trays, 12 heat radiator, 13 backboards, 14 heat-conducting glues, 15 vacuum covers.
Fig. 2 is the assembling decomposing schematic representation of Fig. 1.
Embodiment
This heating radiator is made up of cavernous body 1, wind scooper 2, thermal sensing element 3, power lead 4, Worm fan 5, gib screw 6, heat pipe 7, conducting copper plate 8, attachment screw 9, spring 10, blower tray 11, heat radiator 12, backboard 13, heat-conducting glue 14, vacuum cover 15.Its primary structure is provided with heat radiator 12 and blower tray 11 on conducting copper plate 8, blower tray and wind scooper 2 are fixed together, and is Worm fan 5 in the wind scooper; One end of heat pipe 7 is fixed between the surface of contact of conducting copper plate and heat radiator, and its other end is fixed in the heat radiator; Between conducting copper plate and CPU, be connected with heat-conducting glue; Conducting copper plate is provided with thermal sensing element.
Be described further below in conjunction with drawings and Examples:
As shown in the figure, this radiator will be to use Worm fan and hot pipe technique.Conducting copper plate 8 is installed on the backboard 13 of CPU by attachment screw 9 and spring 10, be fixed with aluminium heat sink 12 and blower tray 11 above the conducting copper plate, one end of heat pipe 7 is inserted in the circular hole between heat radiator and the conducting copper plate, and the other end of heat pipe is inserted in the heat radiator.Worm fan 5 is installed on the blower tray by gib screw 6, and wormwheel blade is facing to heat radiator, and hot blast is discharged by wind scooper 2.Heat radiator is provided with thermal sensing element 3 (as thermistor), and thermal sensing element passes to speed controllable circuit with thermal signal, the rotating speed of speed controllable circuit control fan.One deck heat-conducting glue 14 is arranged between conducting copper plate 8 and CPU, and heat-conducting glue is sealed on the conducting copper plate by vacuum cover 15, and heat-conducting glue promptly can combine conducting copper plate and CPU more closely, can also play the heat conduction function.
Principle of work is, the heat that CPU produces passes to heat radiator rapidly by heat pipe, and the heat that heat radiator distributes is sucked by Worm fan and discharges from the heat radiation window of computer by wind scooper.Control the rotating speed of Worm fan by speed controllable circuit, when cpu temperature was low, Worm fan slowly ran, when cpu temperature is higher, and the Worm fan high-speed rotation.Owing to used Worm fan and hot pipe technique, original oblongleaf kadsura stem or root hot mode is changed into exhausting heat extraction mode, improved radiating efficiency, satisfied the heat radiation requirement of CPU.
Claims (5)
1. an efficient cpu heat comprises heat-conducting plate and the heat radiator that is attached thereto, reaches the heat pipe and the fan that are connected with heat radiator; It is characterized in that being provided with on conducting copper plate heat radiator and blower tray, blower tray and wind scooper are fixed together, and are Worm fan in the wind scooper; One end of heat pipe is fixed between the surface of contact of conducting copper plate and heat radiator, and its other end is fixed in the heat radiator.
2. according to the said heating radiator of claim 1, it is characterized in that conducting copper plate is provided with thermal sensing element.
3. according to the said heating radiator of claim 1, it is characterized in that being connected with heat-conducting glue between conducting copper plate and the CPU.
4. according to the said heating radiator of claim 1, it is characterized in that conducting copper plate links together by the deck of attachment screw, spring and base plate and CPU.
5. according to the said heating radiator of claim 1, it is characterized in that the exhaust outlet of wind scooper is connected on the heat radiation window of computer casing by the sea body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200420045744 CN2699362Y (en) | 2004-05-11 | 2004-05-11 | CPU radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200420045744 CN2699362Y (en) | 2004-05-11 | 2004-05-11 | CPU radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2699362Y true CN2699362Y (en) | 2005-05-11 |
Family
ID=34775746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200420045744 Expired - Fee Related CN2699362Y (en) | 2004-05-11 | 2004-05-11 | CPU radiator |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2699362Y (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100414693C (en) * | 2005-08-19 | 2008-08-27 | 富准精密工业(深圳)有限公司 | Heat sink |
CN100456205C (en) * | 2005-12-23 | 2009-01-28 | 富准精密工业(深圳)有限公司 | Heat radiator |
CN102238843A (en) * | 2010-04-23 | 2011-11-09 | 建准电机工业股份有限公司 | Radiating module |
CN102791106A (en) * | 2011-05-20 | 2012-11-21 | 富瑞精密组件(昆山)有限公司 | Thermal module and method for controlling same |
CN108536255A (en) * | 2017-03-02 | 2018-09-14 | 李寅菡 | Cpu radiating and wind guiding systems |
CN111381651A (en) * | 2020-03-31 | 2020-07-07 | 耿宽 | Computer CPU heat abstractor |
-
2004
- 2004-05-11 CN CN 200420045744 patent/CN2699362Y/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100414693C (en) * | 2005-08-19 | 2008-08-27 | 富准精密工业(深圳)有限公司 | Heat sink |
CN100456205C (en) * | 2005-12-23 | 2009-01-28 | 富准精密工业(深圳)有限公司 | Heat radiator |
CN102238843A (en) * | 2010-04-23 | 2011-11-09 | 建准电机工业股份有限公司 | Radiating module |
CN102238843B (en) * | 2010-04-23 | 2013-10-30 | 建准电机工业股份有限公司 | Radiating module |
CN102791106A (en) * | 2011-05-20 | 2012-11-21 | 富瑞精密组件(昆山)有限公司 | Thermal module and method for controlling same |
CN102791106B (en) * | 2011-05-20 | 2016-10-05 | 富瑞精密组件(昆山)有限公司 | Heat radiation module and the method controlling this heat radiation module |
CN108536255A (en) * | 2017-03-02 | 2018-09-14 | 李寅菡 | Cpu radiating and wind guiding systems |
CN111381651A (en) * | 2020-03-31 | 2020-07-07 | 耿宽 | Computer CPU heat abstractor |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050511 Termination date: 20120511 |
|
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Dongguan Xingqihong Electronics Co., Ltd. Assignor: Qihong Electronics (Shenzhen) Co., Ltd. Contract record no.: 2010440000598 Denomination of utility model: High-efficiency CPU (central processing unit) radiator Granted publication date: 20050511 License type: Exclusive License Record date: 20100602 |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model |