CN201336791Y - Radiator - Google Patents

Radiator Download PDF

Info

Publication number
CN201336791Y
CN201336791Y CNU2008203034762U CN200820303476U CN201336791Y CN 201336791 Y CN201336791 Y CN 201336791Y CN U2008203034762 U CNU2008203034762 U CN U2008203034762U CN 200820303476 U CN200820303476 U CN 200820303476U CN 201336791 Y CN201336791 Y CN 201336791Y
Authority
CN
China
Prior art keywords
radiator
fin
base
heat abstractor
air inlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008203034762U
Other languages
Chinese (zh)
Inventor
曹亮亮
杜中勇
李阳
郭磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CNU2008203034762U priority Critical patent/CN201336791Y/en
Priority to US12/485,326 priority patent/US20100147495A1/en
Application granted granted Critical
Publication of CN201336791Y publication Critical patent/CN201336791Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

The utility model relates to a radiator, which comprises a base contacted with an element to be radiated, and a plurality of radiating plates fixed with the base together. The radiating plates radiate slantingly and unwards from the base of the radiator, and are gradually retracted from top to bottom. The radiator is provided with retract type radiating plates, thereby improving the radiating efficiency and reducing the weight of the radiator.

Description

Heat abstractor
Technical field
The utility model is about a kind of heat abstractor, refers to a kind of in light weight and heat abstractor that radiating efficiency is high especially.
Background technology
Along with the power output of electronic components such as central processing unit and improving constantly of operating frequency, the heat of its corresponding generation is showed increased also, if the heat of untimely its generation of eliminating will cause accumulation of heat to cause that temperature raises, and have a strong impact on the normal operation of electronic component.For this reason, industry is carried out auxiliary heat dissipation at these heat-generating electronic elements mounted on surface one radiators usually, installs a fan simultaneously on radiator additional, to strengthen radiating effect.Traditional radiator comprises some radiating fins that described foot of radiator is provided with that are parallel to, and therefore has bigger weight and radiating efficiency is not high.
Summary of the invention
In view of above content, be necessary to provide a kind of in light weight and heat abstractor that radiating efficiency is high.
A kind of radiator, comprise one with treat the base of heat dissipation element thermo-contact, and the fin that is fixed together of some and described base, described fin gives off obliquely from foot of radiator, and is the form of gathering gradually from top to bottom.
A kind of heat abstractor, comprise radiator and give the radiator fan of described radiator air-supply, described radiator comprise one with treat the base of heat dissipation element thermo-contact, reach the fin that some and described base is fixed together, described fin gives off obliquely from foot of radiator, and is the form of drawing in gradually from top to bottom.
Relative prior art, the radiator that the utility model heat abstractor adopts gathering formula fin to be provided with has improved radiating efficiency and has alleviated the weight of radiator.
Description of drawings
Fig. 1 is the three-dimensional exploded view of the utility model heat abstractor preferred embodiment.
Fig. 2 is the three-dimensional assembly diagram of Fig. 1.
Embodiment
See also Fig. 1, the utility model heat abstractor comprises a radiator 10, reaches a fan 20 that is fixed on the described radiator 10.
Radiator 10 comprises a base 11, is provided with some fin 12 at the upper surface of base 11.The lower surface of base 11 can contact with the heat dissipation element (as central processing unit) for the treatment of on the computer main board, treats that the heat that heat dissipation element produces is sent on the fin 12 via base 11.These fin 12 give off obliquely from the base 11 of radiator 10, and are the form of drawing in gradually from top to bottom.The centre of these fin 12 surrounds a space that is truncated cone-shaped, and its top is the air inlet of radiator 10.Be provided with two guide vanes 13 after being positioned at outer field each fin 12,13 of two adjacent guide vanes that adjacent skin two fin are 12 form an air guide hole 14, from the distinguished and admirable fin of flowing through of described air inlet after flow out by described air guide hole 14.
See also Fig. 2, fan 20 is rounded, is positioned at the air inlet place of described radiator 10.In the utility model better embodiment, fan 20 is fixed on the radiator 10 in mode bonding or that screw fixes.Fin 12 and guide vane 13 are on the base 11 that is integrally formed in radiator 10.
Described fin 12 is and draws in gradually from top to bottom and form the truncated cone-shaped space that is beneficial to distinguished and admirable motion, when fan 20 high speed rotating at the air inlet place that is positioned at radiator 10, distinguished and admirable gathering effect through fin 12, and make distinguished and admirable in the process of fin 12 of flowing through flow velocity increase gradually, speed reaches maximum when arriving base 11 upper surfaces of radiator 10, therefore can produce bigger impact air-flow to the base 11 of heat-dense on the radiator 10, can reduce the temperature for the treatment of heat dissipation element efficiently, improve radiating efficiency greatly.Because radiator 10 designs for the gathering formula and fin 12 and guide vane 13 are integrally formed on the base 11, helps alleviating the weight of radiator 10.
The radiator that the utility model heat abstractor adopts gathering formula fin to be provided with, improve radiating efficiency and alleviated the weight of radiator, described fin 12 and guide vane 13 can be non-integrally formed with the base 11 of described radiator 10, be fixed in the base 11 of radiator 10 as single element, constituted the body of radiator 10.

Claims (9)

1. radiator, comprise one with the base for the treatment of the heat dissipation element thermo-contact, and the fin that is fixed together of some and described base, it is characterized in that: described fin gives off obliquely from foot of radiator, and is the form of gathering gradually from top to bottom.
2. radiator as claimed in claim 1 is characterized in that: the centre of described fin surrounds a space that is truncated cone-shaped, and its top is the air inlet of radiator.
3. radiator as claimed in claim 2, it is characterized in that: be provided with two guide vanes after being positioned at outer field each fin, form an air guide hole between adjacent two guide vanes between adjacent skin two fin, from the distinguished and admirable fin of flowing through of described air inlet after flow out by described air guide hole.
4. radiator as claimed in claim 3 is characterized in that: described fin and guide vane are on the base that is integrally formed in radiator.
5. heat abstractor, comprise radiator and give the radiator fan of described radiator air-supply, described radiator comprise one with treat the base of heat dissipation element thermo-contact, reach the fin that some and described base is fixed together, it is characterized in that: described fin gives off obliquely from foot of radiator, and be gradually the form of drawing in from top to bottom, and the centre of described fin surrounds a space that is truncated cone-shaped, and its top is the air inlet of radiator.
6. heat abstractor as claimed in claim 5, it is characterized in that: be provided with two guide vanes after being positioned at outer field each fin, form an air guide hole between adjacent two guide vanes between adjacent skin two fin, from the distinguished and admirable fin of flowing through of described air inlet after flow out by described air guide hole.
7. heat abstractor as claimed in claim 6 is characterized in that: described radiator fan is rounded and be positioned at the air inlet position.
8. heat abstractor as claimed in claim 6 is characterized in that: described fan is fixed on the described radiator in mode bonding or that screw fixes.
9. heat abstractor as claimed in claim 6 is characterized in that: described fin and guide vane are on the base that is integrally formed in radiator.
CNU2008203034762U 2008-12-17 2008-12-17 Radiator Expired - Fee Related CN201336791Y (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNU2008203034762U CN201336791Y (en) 2008-12-17 2008-12-17 Radiator
US12/485,326 US20100147495A1 (en) 2008-12-17 2009-06-16 Heat dissipation apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008203034762U CN201336791Y (en) 2008-12-17 2008-12-17 Radiator

Publications (1)

Publication Number Publication Date
CN201336791Y true CN201336791Y (en) 2009-10-28

Family

ID=41288454

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008203034762U Expired - Fee Related CN201336791Y (en) 2008-12-17 2008-12-17 Radiator

Country Status (2)

Country Link
US (1) US20100147495A1 (en)
CN (1) CN201336791Y (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201438459U (en) * 2009-03-13 2010-04-14 鸿富锦精密工业（深圳）有限公司 Heat dissipating device assembly
CN101876427A (en) * 2009-04-29 2010-11-03 鸿富锦精密工业（深圳）有限公司 Heat dissipation device of LED lamp

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3394387A (en) * 1966-03-08 1968-07-23 Theodore M. Williams Spark plug heat dissipator
US4823869A (en) * 1986-06-19 1989-04-25 International Business Machines Corporation Heat sink
US5299090A (en) * 1993-06-29 1994-03-29 At&T Bell Laboratories Pin-fin heat sink
US5519575A (en) * 1995-02-14 1996-05-21 Chiou; Ming D. CPU cooling fan mounting structure
US6698499B1 (en) * 1996-02-01 2004-03-02 Agilent Technologies, Inc. Cooling device and method
EP0889524A3 (en) * 1997-06-30 1999-03-03 Sun Microsystems, Inc. Scalable and modular heat sink-heat pipe cooling system
US5860472A (en) * 1997-09-03 1999-01-19 Batchelder; John Samual Fluid transmissive apparatus for heat transfer
US6807059B1 (en) * 1998-12-28 2004-10-19 James L. Dale Stud welded pin fin heat sink
US6170563B1 (en) * 1999-07-26 2001-01-09 Hsieh Hsin-Mao Heat radiating device for notebook computer
US6445583B1 (en) * 2001-01-26 2002-09-03 Laird Technologies, Inc. Snap in heat sink shielding lid
US20020121365A1 (en) * 2001-03-05 2002-09-05 Kozyra Kazimierz L. Radial folded fin heat sink
AT413163B (en) * 2001-12-18 2005-11-15 Fotec Forschungs Und Technolog COOLING DEVICE FOR A CHIP AND METHOD OF MANUFACTURE
US6640883B2 (en) * 2002-02-14 2003-11-04 Glacialtech Inc. Computer heat sink
US20030188725A1 (en) * 2002-04-04 2003-10-09 John Van Winkle Fluid cooling apparatus for a combustion system
KR100719702B1 (en) * 2005-05-25 2007-05-17 삼성에스디아이 주식회사 Plasma Display Device
CN101605443B (en) * 2008-06-13 2011-06-08 富准精密工业(深圳)有限公司 Heat dissipation device and heat dissipater thereof
CN201422226Y (en) * 2009-05-06 2010-03-10 鸿富锦精密工业（深圳）有限公司 Radiator combination
CN101907101A (en) * 2009-06-05 2010-12-08 鸿富锦精密工业（深圳）有限公司 Radiator
US7911791B2 (en) * 2009-06-24 2011-03-22 Ati Technologies Ulc Heat sink for a circuit device
KR101414642B1 (en) * 2009-11-20 2014-07-03 엘지전자 주식회사 Heat-dissipating apparatus
USD634281S1 (en) * 2009-12-08 2011-03-15 Agency For Science, Technology And Research Heat sink
US20110232886A1 (en) * 2010-03-24 2011-09-29 Skynet Electronic Co., Ltd. Heat dissipation housing for led lamp

Also Published As

Publication number Publication date
US20100147495A1 (en) 2010-06-17

Similar Documents

Publication Publication Date Title
CN100529426C (en) Centrifugal fan, heat-radiation module using same and electronic device using the heat radiation module
CN101832280A (en) Heat-dissipating device, centrifugal fan thereof and electronic device using same
CN101193542A (en) Heat radiation device and wind guide sheet
CN201336791Y (en) Radiator
CN101106887B (en) Radiator
CN101166406B (en) Fin group and heat radiation device with fin group
CN201438459U (en) Heat dissipating device assembly
CN102478025B (en) Sink and centrifugal cutter thereof
CN101907101A (en) Radiator
CN205154745U (en) Structure is promoted to axial fan's complex flabellum amount of wind
CN201248224Y (en) Radiating device
CN2699362Y (en) CPU radiator
CN201600640U (en) 2U server wind scooper
CN101312635B (en) Air-guiding cover having hot pipe and heat radiating fins, electronic apparatus provided with the air-guiding cover
CN104105379B (en) Radiating subassembly and display card module
CN102588346A (en) Air-guiding device and radiating module provided with air-guiding device
CN202094113U (en) Novel radiator
CN100559573C (en) The CPU module that dispels the heat
CN101749261A (en) Radiating device
CN202189298U (en) Terminal device
CN206584304U (en) Radiating subassembly for notebook computer
CN101436574B (en) CPU radiator
CN2674518Y (en) Portable computer with inserted radiator
TWM295282U (en) Heat-sinking fan module
CN203167507U (en) Novel radiator

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091028

Termination date: 20101217