CN101605443B - Heat dissipation device and heat dissipater thereof - Google Patents
Heat dissipation device and heat dissipater thereof Download PDFInfo
- Publication number
- CN101605443B CN101605443B CN200810067740.1A CN200810067740A CN101605443B CN 101605443 B CN101605443 B CN 101605443B CN 200810067740 A CN200810067740 A CN 200810067740A CN 101605443 B CN101605443 B CN 101605443B
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- Prior art keywords
- heat sink
- radiator
- heat dissipation
- heat
- slot
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一种散热装置,包括一散热器及一设于散热器上的风扇,该散热器包括一底板及若干散热鳍片,所述散热鳍片间隔设置于所述底板上,所述散热鳍片上开设有朝向散热器中部延伸的至少一个切槽,该切槽贯穿散热鳍片的顶边并将散热鳍片分割成至少两个部分,该切槽的底部相较于该切槽的顶部更靠近散热器的中部,该风扇产生的气流通过所述切槽的导引流向散热器的中部。
A heat dissipation device, comprising a heat sink and a fan arranged on the heat sink, the heat sink includes a bottom plate and a plurality of heat dissipation fins, the heat dissipation fins are arranged on the bottom plate at intervals, and the heat dissipation fins are provided with There is at least one slot extending toward the middle of the heat sink, the slot runs through the top edge of the fin and divides the fin into at least two parts, the bottom of the slot is closer to the heat sink than the top of the slot The airflow generated by the fan flows to the middle of the radiator through the guide of the slot.
Description
技术领域technical field
本发明涉及一种散热装置,尤其是指一种用于对电子元件散热的散热装置及其散热器。The invention relates to a heat dissipation device, in particular to a heat dissipation device and a heat sink for cooling electronic components.
背景技术Background technique
随着电子信息产业的快速发展,中央处理器等发热电子元件高速、高频及集成化使其发热量剧增,为了在有限空间内高效地带走发热电子元件产生的热量,业者通常采用散热器与风扇组合使用的方式对发热电子元件进行散热。With the rapid development of the electronic information industry, the high-speed, high-frequency and integration of heat-generating electronic components such as the central processing unit have caused a sharp increase in heat generation. In order to efficiently remove the heat generated by the heat-generating electronic components in a limited space, the industry usually uses radiators Used in combination with fans to dissipate heat from electronic components.
现有的散热装置,包括一散热器及设于该散热器上的一风扇。该风扇用于提供吹向散热器的低温气流,该风扇中部设有一马达,当该风扇运转时,散热器位于马达正下方的位置即散热器的中部的风量最小,而其它位置风量较大,而发热电子元件则通常设于散热器的中部,使得散热器中部的热量多于其它位置的热量,这样就使得散热器中部的热量散发不充分,而导致散热器的散热不均匀,从而影响散热效果。The existing cooling device includes a radiator and a fan arranged on the radiator. The fan is used to provide low-temperature airflow to the radiator. There is a motor in the middle of the fan. When the fan is running, the position where the radiator is located directly below the motor, that is, the central part of the radiator, has the smallest air volume, while other positions have a larger air volume. The heating electronic components are usually located in the middle of the radiator, so that the heat in the middle of the radiator is more than that in other positions, so that the heat in the middle of the radiator is not fully dissipated, resulting in uneven heat dissipation of the radiator, which affects heat dissipation. Effect.
发明内容Contents of the invention
有鉴于此,有必要提供一种散热效果较佳的散热装置及其散热器。In view of this, it is necessary to provide a heat dissipation device and a heat sink with better heat dissipation effect.
一种散热器,包括一底板及若干散热鳍片,所述散热鳍片间隔设置于所述底板上,所述散热鳍片上开设有朝向散热器中部延伸的至少一个切槽,该切槽贯穿散热鳍片的顶边并将散热鳍片分割成至少两个部分,该切槽的底部相较于该切槽的顶部更靠近散热器的中部。A heat sink, comprising a bottom plate and a plurality of heat dissipation fins, the heat dissipation fins are arranged at intervals on the bottom plate, and at least one slot extending toward the middle of the heat sink is opened on the heat dissipation fin, the slot runs through the heat dissipation The top edge of the fin divides the cooling fin into at least two parts, and the bottom of the slot is closer to the middle of the heat sink than the top of the slot.
一种散热装置,包括一散热器及一设于散热器上的风扇,该散热器包括一底板及若干散热鳍片,所述散热鳍片间隔设置于所述底板上,所述散热鳍片上开设有朝向散热器中部延伸的至少一个切槽,该切槽贯穿散热鳍片的顶边并将散热鳍片分割成至少两个部分,该切槽的底部相较于该切槽的顶部更 靠近散热器的中部,该风扇产生的气流通过所述切槽的导引流向散热器的中部。A heat dissipation device, comprising a heat sink and a fan arranged on the heat sink, the heat sink includes a bottom plate and a plurality of heat dissipation fins, the heat dissipation fins are arranged on the bottom plate at intervals, and the heat dissipation fins are provided with There is at least one slot extending toward the middle of the heat sink, the slot runs through the top edge of the fin and divides the fin into at least two parts, the bottom of the slot is closer to the heat sink than the top of the slot The airflow generated by the fan flows to the middle of the radiator through the guide of the slot.
与现有技术相比,本发明散热装置中通过在散热鳍片上设置若干向散热器的中部倾斜的切槽,将散热器周围的气流导向散热器的中部,使散热器能均匀的散热,提升了散热器的散热性能。Compared with the prior art, the cooling device of the present invention guides the airflow around the radiator to the middle of the radiator by setting a number of slits inclined to the middle of the radiator on the radiator fins, so that the radiator can dissipate heat evenly and improve The cooling performance of the radiator.
附图说明Description of drawings
图1为本发明一较佳实施例中的散热装置的立体组装图。FIG. 1 is a three-dimensional assembly view of a heat sink in a preferred embodiment of the present invention.
图2为图1所示散热装置的立体分解图。FIG. 2 is an exploded perspective view of the heat sink shown in FIG. 1 .
图3为本发明另一较佳实施例中的散热器的立体图。Fig. 3 is a perspective view of a radiator in another preferred embodiment of the present invention.
具体实施方式Detailed ways
下面参照附图结合实施例对本发明作进一步的说明。The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.
请参照图1及图2,图中所示为本发明一较佳实施例中的散热装置,该散热装置包括一风扇10及一散热器20。该风扇10中央设有一马达11,该风扇10设于散热器20的顶部,用于提供吹向散热器20的低温气流。Please refer to FIG. 1 and FIG. 2 , which show a heat dissipation device in a preferred embodiment of the present invention, the heat dissipation device includes a
该散热器20包括一底板21及设于该底板21上的若干散热鳍片22。The
该底板21大致呈方形,其下表面与一发热电子元件(图未示)热接触。The
这些散热鳍片22自底板21的上表面向上一体延伸形成,每一散热鳍片22为一弯曲结构,具有一朝向散热器20中部的弧形的表面,这些散热鳍片22分作两组,这两组散热鳍片22自上而下分别由散热器20的左右两侧向着散热器20的中部倾斜,从而使散热器20的中部形成一大致呈“V”形的沟槽23,该沟槽23的宽度自上而下逐渐减小,每组散热鳍片22中的相邻两散热鳍片22之间形成一弧形的气流通道24,每一气流通道24自散热器20的顶部向散热器20的底板21延伸且向散热器20的中部倾斜。These
该散热器20的中间位置自顶部向下设有一大致呈矩形的开槽25,该开槽25垂直于沟槽23,该开槽25将散热鳍片22分为前后对称的两部分,该开槽25用于收容一扣具(图未示)。该散热鳍片22在开槽25的两侧对称设置有若干弧状的切槽26,这些切槽26贯穿散热鳍片22的顶边,将各散热鳍片22切割成上端相分离的多个部分,本实施例中,各散热鳍片22上设有六个切槽26,这些切槽26和开槽25一起将该散热鳍片22分割为上端相分离 的八个部分。这些切槽26均呈弧形,且与气流通道24垂直连通,这些切槽26自散热器20的顶部向散热器20的底板21延伸,且朝向开槽25即散热器20的中部倾斜设置,也可以说该切槽26的底部相较于该切槽26的顶部更靠近散热器20的中部,该切槽26与开槽25间的距离由散热器20的顶部向散热器20的底板21逐渐减小,同时,靠近开槽25的切槽26的深度小于远离开槽25的切槽26的深度,靠近开槽25的切槽26的倾斜度也小于远离开槽25的其它部分切槽26的倾斜度。The middle position of the
当该散热装置工作时,风扇10产生吹向散热器20的低温气流,此时马达11周围的气流分别由气流通道24及切槽26导向位于马达11的正下方的散热器20的中部,增大了散热器20的中部的气流量,使散热器20的中部能更好的与低温气流进行热交换,从而提高了散热装置的散热效率。另外,沟槽23的宽度自上而下逐渐减小,使流经沟槽23的气流的速度自上而下越来越大,从而进一步提高散热装置的散热效率。When the cooling device was working, the
当然,该散热器20还可以有其它设计,请参照图3,图中所示为本发明另一较佳实施例中的散热器20a,与前一实施例相比,不同之处在于,散热器20a的散热鳍片22a为一弯折结构,其纵截面呈一钝角,上述散热鳍片22a先自上而下呈直线状垂直延伸,然后向散热器20a的中部沟槽23所在的位置呈直线状倾斜延伸,散热鳍片22a上的切槽26a为直线形,自散热器20a的顶部向下并向开槽25倾斜延伸,这样可以使切槽26a的加工更容易。Certainly, this
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810067740.1A CN101605443B (en) | 2008-06-13 | 2008-06-13 | Heat dissipation device and heat dissipater thereof |
| US12/409,499 US8050035B2 (en) | 2008-06-13 | 2009-03-24 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810067740.1A CN101605443B (en) | 2008-06-13 | 2008-06-13 | Heat dissipation device and heat dissipater thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN101605443A CN101605443A (en) | 2009-12-16 |
| CN101605443B true CN101605443B (en) | 2011-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200810067740.1A Expired - Fee Related CN101605443B (en) | 2008-06-13 | 2008-06-13 | Heat dissipation device and heat dissipater thereof |
Country Status (2)
| Country | Link |
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| US (1) | US8050035B2 (en) |
| CN (1) | CN101605443B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201336791Y (en) * | 2008-12-17 | 2009-10-28 | 鸿富锦精密工业(深圳)有限公司 | Radiator |
| JP5381730B2 (en) * | 2010-01-12 | 2014-01-08 | 富士通株式会社 | Heat sink and heat sink fixing method |
| US10103089B2 (en) * | 2010-03-26 | 2018-10-16 | Hamilton Sundstrand Corporation | Heat transfer device with fins defining air flow channels |
| TWI458932B (en) * | 2011-09-02 | 2014-11-01 | 技嘉科技股份有限公司 | heat sink |
| CN103874394B (en) * | 2012-12-18 | 2017-01-04 | 国网山东省电力公司德州供电公司 | Electronic installation and radiator module thereof |
| CN103104894A (en) * | 2013-02-06 | 2013-05-15 | 喻新立 | Light-emitting diode (LED) pressure installing structure |
| TWM528417U (en) * | 2016-02-19 | 2016-09-11 | 恩佐科技股份有限公司 | Radiator with low heat pressure, low noise and high efficiency |
| CN111629569B (en) * | 2020-06-23 | 2022-06-21 | 镇江元普电子科技有限公司 | Electronic radiator with air cooling and water cooling combined |
| CN113594344A (en) * | 2021-07-30 | 2021-11-02 | 浙江珵美科技有限公司 | Refrigeration chip heat dissipation device and use method |
| EP4293234A1 (en) * | 2022-06-17 | 2023-12-20 | FRONIUS INTERNATIONAL GmbH | Fan, cooling device with such a fan and housing with such a cooling device |
| US12363869B2 (en) * | 2023-08-15 | 2025-07-15 | Nidec Chaun-Choungtechnology Corporation | Heat dissipation device |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20090310306A1 (en) | 2009-12-17 |
| CN101605443A (en) | 2009-12-16 |
| US8050035B2 (en) | 2011-11-01 |
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