CN215181753U

CN215181753U - Heat dissipation flow guide structure and case module

Info

Publication number: CN215181753U
Application number: CN202121009889.1U
Authority: CN
Inventors: 李想; 邵鹏; 史忠山; 赵婷婷; 史海波; 王硕
Original assignee: Dawning Information Industry Co Ltd
Current assignee: Dawning Information Industry Co Ltd
Priority date: 2021-05-12
Filing date: 2021-05-12
Publication date: 2021-12-14
Anticipated expiration: 2031-05-12

Abstract

The utility model relates to a heat dissipation water conservancy diversion structure and quick-witted case module relates to server technical field. The heat dissipation flow guide structure comprises a flow guide cover which is used for being installed on the chassis; a separation space is formed between the air guide sleeve and the box wall of the case, the separation space is communicated with the air outlet of the case, and the separation space is used for installing power consumption elements; the air guide sleeve is provided with an air inlet communicated with the blocking space, and the air inlet, the blocking space and the air outlet form a heat dissipation channel together. The utility model provides a heat dissipation water conservancy diversion structure separates consumption component and other hardware structures through the separation space that forms between kuppe and the quick-witted case, reduces the heat that consumption component produced and to the heat influence of other hardware structures to improve the radiating efficiency.

Description

Heat dissipation flow guide structure and case module

Technical Field

The utility model relates to a server technical field especially relates to heat dissipation water conservancy diversion structure and quick-witted case module.

Background

The workstation is the most common model in the computer column, bears the Internet and establishes a stable bridge between the user and the network. However, as the amount of network data increases and media application tools continue to be improved, the demands on computer information processing and computing power from clients become higher and higher. Meanwhile, along with the increase of the number of the required workstations, the requirements of people on the physical space and the cost performance of the machine are gradually increased, so that the market competition is intensified increasingly, and the workstations are developing towards miniaturization and low cost.

However, an increase in the performance of the workstation means an increase in the power consumption, resulting in a significant increase in the heat flux density inside the system. The existing heat dissipation structure has the following defects in actual use: when the radiator brings the air volume to all parts of the chassis, the heat is also brought to all parts of the chassis when the CPU runs under high load. With the improvement of configuration performance and the improvement of configuration quantity, the power consumption of the CPU and each hardware is gradually increased. At this time, the air blown out from the radiator can not radiate heat for other devices, but can generate a heating effect. Meanwhile, heat is difficult to discharge, heat backflow exists in the case, hot air emitted from the lower side of the radiator can be used as inlet air of the upper fan, the inlet air temperature of the fan is greatly increased, and the heat dissipation efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a heat dissipation and flow guiding structure for solving the technical problems in the prior art that a heat sink for a server not only has a heating effect, but also causes difficulty in heat dissipation in a chassis, and is likely to generate heat backflow, thereby causing low heat dissipation efficiency.

A heat dissipation flow guide structure comprises a flow guide cover used for being installed on a chassis;

a separation space is formed between the air guide sleeve and the box wall of the case, the separation space is communicated with the air outlet of the case, and the separation space is used for installing power consumption elements; the air guide sleeve is provided with an air inlet communicated with the blocking space, and the air inlet, the blocking space and the air outlet form a heat dissipation channel together.

In one embodiment, the air guide sleeve is provided with a raised part on one side facing the air outlet, and the raised part is provided with a raised space communicated with the blocking space. The setting of increase portion provides one and increases the space to with separation space cooperation increase heat dissipation channel, especially increase towards the heat radiating area of air outlet department, thereby be convenient for take away more heats, improve the radiating efficiency.

In one embodiment, the height-increasing space is in a gradually expanding structure from the air inlet to the air outlet. The arrangement of the gradually-expanding structure is more beneficial to the air flow flowing towards the air outlet, and the heat dissipation efficiency is improved.

In one embodiment, the pod bend is configured as the elevated portion. The flow guide cover is bent to form the heightening part, so that the processing is convenient, the integral structure is improved, other accessories are not required to be installed, and the manufacturing cost is reduced.

In one embodiment, an extending side plate is arranged on one side, away from the air inlet, of the air guide sleeve, the extending side plate is connected with the box wall, and a floating space is arranged between the extending side plate and the box wall. The setting of extending the curb plate is used for supporting the kuppe to the floating space between utilization extension curb plate and the tank wall not only plays the absorbing effect, reduces the wearing and tearing between the two moreover.

In one embodiment, the heat dissipation and flow guiding structure further comprises a buffer pad accommodated in the floating space, and the buffer pad is connected between the extension side plate and the box wall. The effect of shock attenuation and abrasionproof damage is further improved through the setting of blotter.

In one embodiment, the number of the extension side plates is two, two of the extension side plates are arranged adjacently, and an open cavity is defined by the two extension side plates and the air guide sleeve. The arrangement of the two extending side plates improves the support performance of the air guide sleeve, and the size of the blocking space is limited by the formation of the open cavity between the two extending side plates and the air guide sleeve, so that the occupied space of the heat dissipation heat flow structure relative to the case is reduced.

In one embodiment, the heat dissipation and flow guiding structure further includes a heat dissipation fan, the heat dissipation fan is accommodated in the blocking space, an air inlet end of the heat dissipation fan is communicated with the air inlet, and an air outlet end of the heat dissipation fan is communicated with the air outlet. The setting of radiator fan is used for dispelling the heat to the consumption component, cooperates the separation space that kuppe and quick-witted case enclose to establish simultaneously, improves the radiating efficiency to the consumption component.

In one embodiment, a wind shield is arranged at the edge of the air inlet and used for separating the air inlet end and the air outlet end. The air inlet end of the heat radiation fan is separated from the air outlet end of the heat radiation fan through the wind shield, so that hot air in the separation space is ensured not to flow back from the air inlet of the air guide sleeve, and the heat radiation efficiency is further improved. Meanwhile, due to the arrangement of the wind shield, the installation area of the air guide sleeve and the heat dissipation fan is increased, and the assembly reliability of the air guide sleeve relative to the heat dissipation fan is improved.

In one embodiment, the edge of the air inlet facing the blocking space is provided with an annular guide mounting frame, and the fan frame of the heat dissipation fan is provided with a guide mounting groove into which the guide mounting frame can be inserted. Through the looks adaptation of direction installing frame and direction mounting groove, improve the installation convenience and the precision of the relative radiator fan of kuppe to play the constraint effect to the skew of the relative quick-witted case of kuppe.

In one embodiment, a positioning column is arranged on one side of the edge of the air inlet facing the blocking space, and a fan frame of the cooling fan is provided with a positioning hole into which the positioning column can be inserted. Through the looks adaptation of reference column and locating hole, play the installation positioning action to the installation of kuppe, ensure that the relative radiator fan of kuppe can not appear the skew, further improve the installation precision.

In one embodiment, the number of the positioning columns is multiple, and the positioning columns are arranged at intervals along the circumferential direction of the air inlet. The setting of a plurality of reference posts further improves location installation effect.

The utility model also provides a quick-witted case module can solve above-mentioned at least one technical problem.

A chassis module comprises the heat dissipation flow guide structure and a chassis, wherein the heat dissipation flow guide structure is arranged in the chassis.

The utility model has the advantages that:

the utility model provides a pair of heat dissipation water conservancy diversion structure, including being used for installing in the kuppe of quick-witted case. When the air guide sleeve is installed relative to the case, a separation space is formed between the air guide sleeve and the case wall of the case, the separation space is communicated with the air outlet of the case, and the power consumption element of the server is installed in the separation space. The air guide sleeve is provided with an air inlet communicated with the blocking space, and the air inlet, the blocking space and the air outlet form a heat dissipation channel together. That is to say, the heat dissipation diversion structure forms a separation space between the diversion cover and the chassis to separate the power consumption element from other hardware structures in the server, and the heat generated by the power consumption element is contained in the separation space and is not in direct contact with other hardware structures. When the heat radiator is used for heat dissipation, the air flow entering the blocking space through the air inlet on the air guide sleeve contacts with the heat generated by the power consumption element and then flows out of the air outlet on the case, so that the heat in the blocking space is taken away, and the wind energy blown out by the heat radiator for heat dissipation can flow along the heat dissipation channel and cannot reach other hardware structures, so that the heat dissipation of the power consumption element is realized, and the heat influence on other hardware structures is reduced. Meanwhile, due to the fact that the heat of the power consumption element is blocked by the blocking space, the part of heat cannot be refluxed to heat other hardware structures, and the heat dissipation efficiency is further improved.

The utility model provides a pair of machine case module, including foretell heat dissipation water conservancy diversion structure, still include quick-witted case, heat dissipation water conservancy diversion structure installs in quick-witted incasement to be installed in the consumption component of quick-witted case and other hardware structure separate, improve the radiating efficiency, can realize above-mentioned at least one technological effect.

Drawings

Fig. 1 is a first partial schematic view of a heat dissipation and flow guiding structure installed in a chassis according to the present invention;

fig. 2 is a first schematic view of the heat dissipation and flow guiding structure shown in fig. 1;

fig. 3 is a second schematic view of the heat dissipation structure shown in fig. 1;

fig. 4 is a schematic view of the heat dissipation and flow guiding structure provided by the present invention installed in a chassis;

fig. 5 is a second partial schematic view illustrating the heat dissipation and flow guiding structure of the present invention installed in the chassis;

fig. 6 is a schematic view of the chassis module according to the present invention.

Reference numerals: 10-a flow guide sleeve; 30-extension side plate; 40-a heat dissipation fan; 41-fan frame; 100-a heat dissipation flow guide structure; 101-an air inlet; 102-a recessed region; 103-open cavity; 104-a guiding installation frame; 105-a positioning post; 106-wind deflector; 107-elevated portion; 1077-elevated space; 111-sloped sidewalls; 112-high flaps; 113-low flaps; 200-a chassis; 201-air outlet; 202-a tank wall; 300-power consuming elements; 1000-blocking the space.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

As shown in fig. 1 to 3, an embodiment of the present invention provides a heat dissipation and flow guiding structure 100, which includes a flow guiding cover 10 for being mounted on a chassis 200. A blocking space 1000 is formed between the pod 10 and the wall 202 of the chassis 200, and the blocking space 1000 is communicated with the air outlet 201 of the chassis 200, and the blocking space 1000 is used for installing the power consumption element 300. The air guide sleeve 10 has an air inlet 101 communicated with the blocking space 1000, and the air inlet 101, the blocking space 1000 and the air outlet 201 together form a heat dissipation channel.

Specifically, the air inlet 101 on the air guide sleeve 10, the blocking space 1000 and the air outlet 201 on the chassis 200 together form a heat dissipation channel, so as to ensure that the airflow generated by the heat sink can flow along the heat dissipation channel as much as possible. In actual use, the power consumption element 300 is installed in the chassis 200, and a blocking space 1000 is formed between the pod 10 and the chassis 200 after being installed relative to the chassis 200 to accommodate the power consumption element 300, so as to isolate the power consumption element 300 from other hardware structures in the chassis 200. At this time, heat generated by the operation of the power consumption element 300 is also contained in the blocking space 1000, so that heat emitted to other hardware structures is reduced, and the influence of the heat of the power consumption element 300 on other hardware structures is reduced. When the power consumption element 300 is dissipating heat, cold airflow can enter the blocking space 1000 from the air inlet 101 on the air guide sleeve 10, and contacts with heat in the blocking space 1000 to absorb the heat to become hot airflow, and the heated airflow flows out from the air outlet 201 on the chassis 200, so as to take away the heat in the blocking space 1000. Moreover, the heat of the power consumption element 300 is blocked by the blocking space 1000, so that the airflow flowing along the heat dissipation channel does not spread to other hardware structures outside the blocking space 1000, and when the heat of the power consumption element 300 is dissipated, the heat in the blocking space 1000 does not flow back along the heat dissipation channel to heat other hardware structures, thereby reducing the thermal influence on other hardware structures. Because the heat generated by the power consumption element 300 does not flow back due to the arrangement of the blocking space 1000, a large rotating speed is not needed when the heat is dissipated through the radiator, so that the noise generated by the work of the radiator is reduced, and the noise reduction effect is achieved.

When the power consumption element 300 radiates heat, the power consumption element 300 may be provided with a heat sink itself, or an externally disposed heat sink may be used as long as an air flow for radiating heat from the power consumption element 300 can be provided. Wherein the power consuming element 300 may be a CPU. Of course, the power dissipation elements accommodated in the blocking space 1000 may also be a CPU and a memory stick, and when the power of the heat sink is increased, the generated air flow can flow to the memory stick, thereby achieving heat dissipation of the CPU and the memory stick. Moreover, just because the setting of separation space 1000 influences the flow direction of heat dissipation channel, when the memory stick sets up near the air outlet, the heat dissipation air current has the radiating effect to the memory stick all the time.

As shown in fig. 2, 3 and 6, in some embodiments, the air guide sleeve 10 has a raised portion 107 on a side facing the air outlet 201, and the raised portion 107 is configured with a raised space 1077 communicating with the blocking space 1000. Specifically, the raised space 1077 formed by the raised portion 107 increases the volume of the heat dissipation channel, so that the airflow flowing in through the air inlet 101 can be in sufficient contact with the heat in the blocking space 1000 to absorb heat, thereby taking more heat away. And just because the setting of heightening space 1077 is in the side towards air outlet 201 for the heat can flow towards the side of air outlet 201 as much as possible, thereby improving the heat dissipation efficiency. In addition, due to the arrangement of the raised portion 107, the air guide sleeve 10 at the air inlet 101 is provided with a recessed area 102, so that the air flow outside the air guide sleeve 10 can more easily flow to the air inlet 101 under the action of the heat sink, and meanwhile, the change of the working power of the heat sink can be matched, for example, the increased power generates strong air flow, so that the heat of other areas is absorbed in the process of conducting the air flow guiding outside the air guide sleeve 10, and the effect of assisting heat dissipation is achieved.

As shown in fig. 2, 3, and 6, in some embodiments, the elevated space 1077 is tapered from the inlet 101 to the outlet 201. The arrangement of the divergent structure gradually increases the airflow flowing cross section from the air inlet 101 to the air outlet 201, so as to gradually increase the heat dissipation area to the air outlet 201, so that the airflow can flow to the air outlet 201 as much as possible, thereby improving the heat dissipation efficiency. Specifically, taking the placement orientation in fig. 1 as an example, the top is located above and the bottom is located below the thickness direction of the chassis 200, and the raised portion 107 is raised from bottom to top relative to the air inlet 101, so as to form a recessed area 102 at the air inlet 101. Meanwhile, as shown in fig. 6, when the chassis 200 is in the normal installation position, the chassis 200 has two air outlets 201 respectively disposed at the top and the side of the chassis 200, so as to cooperate with the increasing space 1077 of the gradually expanding structure, so that heat generated by the heat sink flows to the air outlets 201 more easily, thereby improving the heat dissipation efficiency. The air outlet 201 disposed on the side of the chassis 200 is a main air outlet.

In one particular embodiment, as shown in fig. 2 and 3, the pod 10 is bent to form the raised portion 107. Bending the air guide sleeve 10 to form the heightening part 107, so that the heat dissipation air guide structure 100 is simple in structure and convenient to process, the heightening part 107 and the air guide sleeve 10 are installed relatively without other accessories, and the manufacturing cost of the server is reduced. Specifically, the pod 10 includes an upper flap 112, an angled sidewall 111, and a lower flap 113, the angled sidewall 111 being connected between the upper flap 112 and the lower flap 113, and the upper flap 112 and the lower flap 113 being parallel to each other. Wherein, the high-part folded plate 112 is arranged in an L shape, and the inclined side wall 111 correspondingly connected encloses the L shape. That is, the high flap 112 and the inclined sidewall 111 are located at two adjacent sides of the low flap 113 and are located toward the air outlet 201 on the chassis 200, so as to configure the raised portion 107 at a position toward the air outlet 201. The lower flap 113 and the sloping side wall 111 enclose a recessed area 102. The intake vent 101 is disposed in the lower flap 113 so that the cool air flows through the depressed area 102, which is gradually reduced in size, into the intake vent 101. The corners of the connecting portion are weakened and stress concentration is reduced by rounding off at the bent portions of the high-portion flap 112 and the inclined side wall 111, at the bent portions of the inclined side wall 111 and the low-portion flap 113 and at the connecting portion of the two inclined side walls 111.

As shown in fig. 2 to 4, in some embodiments, an extension side plate 30 is disposed on a side of the pod 10 facing away from the air inlet 101, the extension side plate 30 is connected to the box wall 202, and a floating space is provided between the extension side plate 30 and the box wall 202. Specifically, the extension side plate 30 extends downward from the pod 10 in the thickness direction of the chassis 200 so as to be connected to the wall 202 of the chassis 200, so that the pod 10, the extension side plate 30, and the wall 202 together form the blocking space 1000. Wherein, a small floating space is provided between the extended side plate 30 and the wall 202 of the chassis 200 to perform the shock absorption function. When the cabinet 200 vibrates due to the vibration in the server operation, it is due to the arrangement of the floating space, so that the vibration transmitted from the cabinet 200 to the extension side panel 30 and the pod 10 is reduced. In a particular embodiment, the width of the floating space is between 0.5mm and 1 mm. Such an arrangement not only facilitates a close connection between the extension side panel 30 and the chassis 200, but also reduces wear therebetween.

In one specific embodiment, as shown in fig. 1 and 4, the heat dissipation and flow guidance structure 100 further includes a cushion pad accommodated in the floating space, and the cushion pad is connected between the extension side plate 30 and the box wall 202. The shock absorption effect is further realized through the arrangement of the buffer cushion. Generally, the cushion pad is made of elastic rubber material. Specifically, the upper portion of the cushion is connected to the bottom of the extension side panel 30, and the lower portion of the cushion is connected to the tank wall 202. Further, the number of the cushion pads may be plural, and the plural cushion pads are arranged at intervals along the extended length of the floating space. The shock-absorbing effect is further improved if a plurality of cushion pads are fitted to the floating space. In another embodiment, a main board is installed in the chassis 200, a floating space is formed between the bottom of the extension side plate 30 connected to the pod 10 and the main board, and a buffer pad is disposed between the bottom of the extension side plate 30 and the main board, so as to improve protection of the main board.

As shown in fig. 2 and 3, in some embodiments, the number of the extension side plates 30 is two, two extension side plates 30 are adjacently disposed, and an open cavity 103 is defined by the two extension side plates 30 and the pod 10. Specifically, two adjacent extending side plates 30 are disposed on two adjacent sides of the pod 10 away from the air outlet 201 on the chassis 200, so as to form an open cavity 103 together with the pod 10, so as to form a blocking space 1000 for blocking heat together with the box wall 202. Moreover, the arrangement of the open cavity 103 makes the heat dissipation and flow guiding structure 100 itself have a cavity with an opening, which is more convenient for assembling and adapting with the chassis 200. In addition, the arrangement of the two extending side plates 30 supports the pod 10, and simultaneously limits the size of the blocking space 1000, so as to reduce the occupied space of the heat dissipation and flow guiding structure 100 relative to the chassis 200, thereby facilitating the assembly of other structures.

As shown in fig. 2-5, in some embodiments, the heat dissipation and flow guiding structure 100 further includes a heat dissipation fan 40, the heat dissipation fan 40 is accommodated in the isolation space 1000, an air inlet end of the heat dissipation fan 40 is communicated with the air inlet 101, and an air outlet end of the heat dissipation fan 40 is communicated with the air outlet 201. That is, the heat dissipation guiding structure 100 is configured with a heat sink, and the heat sink is a heat dissipation fan 40. Specifically, the heat dissipation fan 40 is located in the open cavity 103 and is mounted on the air guide sleeve 10. After the pod 10 and the extension side plate 30 are installed with respect to the chassis 200, the opening of the open cavity 103 faces the air outlet 201 of the chassis 200 and encloses with the wall 202 of the chassis 200 to form a blocking space 1000, so that the heat dissipation fan 40 is accommodated in the same space as the power consumption element 300 to dissipate heat of the power consumption element 300. The heat dissipation fan 40 rotates, so that the cold airflow outside the isolation space 1000 enters from the air inlet 101 and flows out from the air outlet 201 after passing through the isolation space 1000, thereby achieving heat dissipation. In practical use, the heat dissipation fan 40 has a fan frame 41, and the fan frame 41 is fixedly mounted with the airflow guiding cover 10, so as to ensure that the heat dissipation fan 40 has a stable rotating working environment. Just because the floating space and the buffer pad are arranged between the extended side plate 30 and the box wall 202 of the pod 10, the vibration generated by the operation of the cooling fan 40 can be partially consumed by the floating space and the buffer pad, so that the vibration transmitted from the cooling fan 40 to the case 200 is reduced, and the vibration transmitted from the case 200 to the cooling fan 40 is also reduced. Moreover, the formation of the recessed area 102 is caused by the raised portion 107 on the pod 10, so that the speed of the cooling fan 40 is adjusted, so as to absorb heat in other areas based on induced air, and to perform an auxiliary cooling effect on other areas.

As shown in fig. 2 and 3, in some embodiments, the edge of the air intake 101 facing away from the barrier space 1000 is provided with a wind deflector 106. Through the arrangement of the wind shield 106, the air inlet end of the heat dissipation fan 40 can be isolated from the air outlet end thereof, so that the hot air flow in the isolation space 1000 is ensured not to flow back from the air inlet 101 on the air guide sleeve 10, and the heat dissipation efficiency is improved. Moreover, provision of wind deflector 106 increases the contact area between nacelle 10 and cooling fan 40, further improving the reliability of assembly. In a specific embodiment, the air inlet 101 is disposed in a shape of a "square" and a wind shielding plate 106 is disposed at each of four corners of the air inlet 101. Wind guard 106 is disposed in an arc shape on a side facing an axis of air inlet 101, so as to improve the adaptability of air inlet 101 to the circular air inlet end of cooling fan 40. Meanwhile, the area of the hole surrounded by the wind shield 106 and the air inlet 101 is slightly larger than the air inlet area of the cooling fan 40, so that the air inlet volume of the cooling fan 40 is not affected, the deviation of the cooling fan 40 along the thickness direction of the case 200 is limited by the wind shield 106, and the assembly reliability is improved.

As shown in fig. 3, in some embodiments, the edge of the intake vent 101 facing the blocking space 1000 has an annular guide mounting frame 104, and the fan frame 41 of the heat dissipation fan 40 has a guide mounting groove into which the guide mounting frame 104 can be inserted. Particularly, the guide mounting frame 104 is matched with the guide mounting groove, so that the guide effect is achieved on the installation of the air guide sleeve 10 relative to the heat dissipation fan 40, and the installation convenience and accuracy of the air guide sleeve 10 are improved. The annular guide mounting frame 104 is in a closed annular shape, and the corresponding guide mounting groove is also in a closed annular shape. When the pod is installed, the guide mounting frame 104 is directly inserted into the guide mounting groove to restrain the pod 10 from shifting in the thickness direction of the chassis 200.

In another embodiment, as shown in fig. 3, the edge of the air inlet 101 facing the blocking space 1000 has a positioning post 105, and the fan frame 41 of the heat dissipation fan 40 has a positioning hole into which the positioning post 105 can be inserted. Through the matching of the positioning column 105 and the positioning hole, the installation positioning effect is achieved on the installation of the air guide sleeve 10 relative to the heat dissipation fan 40, the air guide sleeve 10 is ensured not to deviate relative to the heat dissipation fan 40, especially the air guide sleeve 10 is ensured not to deviate horizontally, and the installation accuracy is further improved. In a specific embodiment, the number of the positioning pillars 105 is two, and two positioning pillars 105 are disposed at two top corners of the air inlet 101. Meanwhile, the number of the positioning holes corresponding to the fan frame 41 is two. Of course, the number of the positioning columns 105 and the positioning holes may also be three or four, and the positioning columns and the positioning holes are arranged at intervals along the circumferential direction of the air inlet 101. In yet another specific embodiment, positioning post 105 is mounted on the side of windshield 106 facing barrier space 1000.

Of course, the positioning column 105 and the annular guide mounting frame 104 may be provided alternatively, as long as the heat dissipation fan 40 can be reliably mounted on the airflow guide housing 10.

As shown in fig. 4 and fig. 6, an embodiment of the present invention provides a chassis module, which includes a heat dissipation flow guiding structure 100 and a chassis 200, wherein the heat dissipation flow guiding structure 100 is installed in the chassis 200. Specifically, a blocking space 1000 is defined by the air guide sleeve 10 and the extended side plate 30 of the heat dissipation air guide structure 100 and the wall 202 of the chassis 200 together to accommodate the power consumption element 300. Meanwhile, the heat dissipation efficiency of the power dissipation element 300 is improved by dissipating heat from the heat dissipation fan 40 located in the isolation space 1000, and the heat dissipation efficiency of the whole chassis module, and even the whole server system, is improved by separating the power dissipation element 300 from other hardware structures and reducing the heat influence on other hardware structures.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A heat dissipation and flow guiding structure is characterized by comprising a flow guiding cover (10) used for being installed on a chassis (200);

a blocking space (1000) is formed between the air guide sleeve (10) and the wall (202) of the case (200), the blocking space (1000) is communicated with an air outlet (201) of the case (200), and the blocking space (1000) is used for installing a power consumption element (300); the air guide sleeve (10) is provided with an air inlet (101) communicated with the blocking space (1000), and the air inlet (101), the blocking space (1000) and the air outlet (201) are jointly constructed into a heat dissipation channel.

2. The structure of claim 1, wherein the air guide sleeve (10) has a raised portion on a side facing the air outlet (201), and the raised portion is configured with a raised space communicating with the blocking space (1000).

3. The structure of claim 2, wherein the elevated space is gradually enlarged from the air inlet (101) to the air outlet (201).

4. The heat dissipation and flow guidance structure according to claim 1, characterized in that an extension side plate (30) is disposed on a side of the air guide sleeve (10) facing away from the air inlet (101), the extension side plate (30) is connected with the box wall (202), and a floating space is provided between the extension side plate (30) and the box wall (202).

5. The structure of claim 4, further comprising a cushion received in the floating space, wherein the cushion is connected between the extension side plate (30) and the wall (202).

6. The heat dissipating and flow guiding structure of claim 4, wherein the number of the extending side plates (30) is two, two of the extending side plates (30) are adjacently arranged, and an open cavity (103) is defined by the two extending side plates (30) and the air guide sleeve (10).

7. The heat dissipation and flow guiding structure of claim 1, further comprising a heat dissipation fan (40), wherein the heat dissipation fan (40) is accommodated in the blocking space (1000), an air inlet end of the heat dissipation fan (40) is communicated with the air inlet (101), and an air outlet end of the heat dissipation fan (40) is communicated with the air outlet (201).

8. The structure for heat dissipation and flow guidance according to claim 7, wherein an edge of the air inlet (101) is provided with a wind deflector (106), and the wind deflector (106) is used for separating the air inlet end and the air outlet end.

9. The heat dissipating and guiding structure of claim 7, wherein the edge of the air inlet (101) facing the blocking space (1000) has an annular guide mounting frame (104), the fan frame (41) of the heat dissipating fan (40) has a guide mounting groove, and the guide mounting frame (104) is insertable into the guide mounting groove;

and/or a positioning column (105) is arranged on one side, facing the blocking space (1000), of the edge of the air inlet (101), and a positioning hole is formed in a fan frame (41) of the heat dissipation fan (40), and the positioning column (105) can be inserted into the positioning hole.

10. A chassis module, comprising the heat dissipation and flow guiding structure of any one of claims 1 to 9, and further comprising a chassis (200), wherein the heat dissipation and flow guiding structure (100) is installed in the chassis (200).