CN217060874U

CN217060874U - Microcomputer cabinet

Info

Publication number: CN217060874U
Application number: CN202220680658.1U
Authority: CN
Inventors: 唐标; 洪卫
Original assignee: Heyuan Yongjia Industry Co ltd
Current assignee: Heyuan Yongjia Industry Co ltd
Priority date: 2022-03-25
Filing date: 2022-03-25
Publication date: 2022-07-26
Anticipated expiration: 2032-03-25

Abstract

The utility model discloses a microcomputer case, which comprises a case main body, an electronic mainboard and a heat dissipation assembly, wherein the case main body comprises a top cover, a middle frame and a back plate, and the top cover and the back plate are respectively arranged on two sides of the middle frame through screws; the electronic main board is arranged between the middle frame and the back board, and a chip is integrated on the electronic main board; the heat dissipation assembly is located in the middle frame and comprises a heat dissipation fan, the heat dissipation fan is installed on one surface, facing the middle frame, of the top cover through a fan support, the air inlet end of the heat dissipation fan is arranged towards the top cover, the air outlet end of the heat dissipation fan faces the electronic main board, and a ventilation opening is formed in the side edge of the middle frame. The utility model relates to a microcomputer machine case passes through the screw and adorns the top cap of chassis main part, backplate respectively in the two sides of center, and the equipment is simple, and the chip on the electronic motherboard is located with the protection between backplate and the center to the electronic motherboard, through set up radiator unit in the chassis main part in order dispelling the heat, installs radiator fan on the top cap through setting up fan bracket, and the installation is succinct, simple structure, and small, portable.

Description

Microcomputer cabinet

Technical Field

The utility model relates to a computer hardware technical field especially relates to a microcomputer machine case.

Background

The case is a part of computer accessories, and in order to meet the work requirement and/or game requirement of large memory consumption, the general case has large volume, complex structure, complex assembly steps, complex hardware arrangement, complex internal wiring, large occupied space and inconvenience in carrying.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a microcomputer machine case with simple structure is provided in order to simplify the equipment step, portable.

In order to solve the technical problem, the purpose of the utility model is realized through following technical scheme: the case body comprises a top cover, a middle frame and a back plate, wherein the top cover and the back plate are respectively arranged on two sides of the middle frame through screws; the electronic main board is arranged between the middle frame and the back board, and a chip is integrated on the electronic main board; the heat dissipation assembly is contained in the case main body and located in the middle frame and comprises a heat dissipation fan, the heat dissipation fan is installed on one surface, facing the middle frame, of the top cover through a fan support, the air inlet end of the heat dissipation fan is arranged towards the top cover, the air outlet end of the heat dissipation fan faces the electronic mainboard, and a ventilation opening is formed in the side edge of the middle frame.

The further technical scheme is as follows: one end of the top cover is bent to form a side plate parallel to one side edge of the middle frame, the side plate is fixedly connected with one side edge of the middle frame through a screw, and an opening is formed in the side plate corresponding to the ventilation opening.

The further technical scheme is as follows: the side plate is provided with screw hole sites for screws to be arranged so that the case body is fixed in the main case body, the middle frame is a columnar body and is of a main body hollow structure, the side plate is connected with the left side edge of the middle frame, the input and output support is installed on the rear side edge of the middle frame, the input and output support is close to one side of the back plate, a connecting plate connected with the back plate is formed, and the input and output support corresponds to a connecting port of the main case body and is provided with a port through hole.

The further technical scheme is as follows: the periphery of the heat radiation fan is provided with screw connection holes along the height direction, the heat radiation fan is positioned between the top cover and the fan support, and the tail end of a screw passes through the screw connection holes after passing through the fan support so that the fan support and the heat radiation fan are connected with the top cover.

The further technical scheme is as follows: the fan support comprises two supporting rods, the two supporting rods are respectively arranged on two sides of the cooling fan, and the supporting rods are provided with slotted holes corresponding to the screw connecting holes.

The further technical scheme is as follows: the heat dissipation assembly further comprises a CPU heat dissipation module, the CPU heat dissipation module comprises a CPU flitch and a radiator, the CPU flitch is horizontally arranged on the electronic mainboard and used for being attached and connected with the CPU, the radiator is connected with the CPU flitch, and the radiator is close to the vent.

The further technical scheme is as follows: the electronic main board is characterized in that a second support is arranged between the electronic main board and the back board, a connecting column of the second support penetrates through the electronic main board and is located in the middle frame, the CPU pasting board is provided with a hole site corresponding to the connecting column, the fan support corresponds to the hole site and is provided with a through hole, and the tail of a connecting piece penetrates through the through hole and then passes through the hole site to be placed in the connecting column so that the fan support and the CPU pasting board are connected with the second support.

The further technical scheme is as follows: the outer surface cover of connecting piece is equipped with the spring, the spring is located between fan bracket and the CPU flitch.

The further technical scheme is as follows: and one side of the electronic mainboard is provided with a golden finger which extends out of the middle frame.

The further technical scheme is as follows: the microcomputer case further comprises a golden finger protection sleeve, and one side of the golden finger protection sleeve is recessed to form a slot for inserting one side of the electronic mainboard provided with the golden finger.

The utility model has the advantages of: the utility model relates to a microcomputer machine case passes through the top cap of screw with chassis main body, the backplate is installed respectively in the two sides of center, the equipment step is convenient succinct, electronic component such as chip is integrated in electronic motherboard, and electronic motherboard locates between backplate and the center, set up the electronic component on electronic motherboard with the protection, through set up radiator unit in chassis main body in order dispelling the heat, avoid the high temperature and influence electronic component's work, install radiator fan on the top cap through setting up fan bracket, radiator fan's air-out end is direct to dispel the heat towards electronic motherboard, and the heat dissipation efficiency is improved, thereby need not to increase quick-witted case volume and dispel the heat with the help, and small, the occupation space is little, and convenient carrying, and the installation step is simple and fast, the whole structure is simple.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a microcomputer case according to an embodiment of the present invention;

fig. 2 is a schematic structural view of a microcomputer case at another angle according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a CPU heat dissipation module of a microcomputer case according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of another angle of a CPU heat dissipation module of a microcomputer case according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a microcomputer case according to an embodiment of the present invention;

FIG. 6 is a schematic view of the assembly of the golden finger protective sleeve of the microcomputer case shown in FIG. 5;

FIG. 7 is a schematic view of the microcomputer housing shown in FIG. 5 without a back plate;

FIG. 8 is a schematic structural view of the microcomputer case shown in FIG. 5 with a middle frame omitted;

fig. 9 is a schematic structural view of the microcomputer case shown in fig. 5 without a middle frame and an electronic motherboard.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 9, fig. 1 is a schematic structural diagram of a microcomputer case provided in an embodiment of the present invention, the microcomputer case includes a case main body 11, an electronic motherboard 12 and a heat dissipation assembly 13, the case main body 11 includes a top cover 111, a middle frame 112 and a back plate 113, and the top cover 111 and the back plate 113 are respectively mounted on two sides of the middle frame 112 through screws; the electronic main board 12 is disposed between the middle frame 112 and the back plate 113, and a chip is integrated on the electronic main board 12; the heat dissipation assembly 13 is accommodated in the case body 11 and located in the middle frame 112, and includes a heat dissipation fan 131, the heat dissipation fan 131 is installed on one surface of the top cover 111 facing the middle frame 112 through a fan bracket 14, an air inlet end of the heat dissipation fan 131 is arranged toward the top cover 111, an air outlet end of the heat dissipation fan 131 faces the electronic motherboard 12, and a ventilation opening 101 is formed in a side edge of the middle frame 112.

Wherein, the top cover 111 is formed with an air inlet 102 corresponding to the air inlet end of the heat dissipation fan 131, the side of the middle frame 112 is provided with a ventilation opening 101 for rapid heat dissipation, the microcomputer case is provided with the top cover 111 and the back plate 113 of the case main body 11 respectively mounted on two sides of the middle frame 112 through screws, the assembly steps are convenient and simple, electronic components such as chips are integrated on the electronic main board 12, the electronic main board 12 is arranged between the back plate 113 and the middle frame 112 to protect the electronic components arranged on the electronic main board 12, the heat dissipation assembly 13 is arranged in the case main body 11 for heat dissipation to avoid the work of the electronic components affected by over-high temperature, the heat dissipation fan 131 is mounted on the top cover 111 through the fan bracket 14, the air outlet end of the heat dissipation fan 131 directly faces the electronic main board 12 for heat dissipation, the heat dissipation efficiency is improved, thereby the case volume does not need to be increased to help heat dissipation, the portable solar water heater is small in size, small in occupied space, convenient to carry, simple and fast in installation steps and simple in overall structure.

Specifically, in this embodiment, one end of the top cover 111 is bent to form a side plate 1111 parallel to one side of the middle frame 112, the side plate 1111 is fixedly connected to one side of the middle frame 112 through a screw, and the side plate 1111 is provided with an opening corresponding to the ventilation opening 101. The side plates 1111 are fixedly connected with the side edges of the middle frame 112, so that the top cover 111 is connected with the middle frame 112 more stably and firmly.

Preferably, a screw hole position is formed in the side plate 1111 to allow a screw to be set so as to fix the case body 11 in the main case body, the middle frame 112 is a cylindrical body and has a main hollow structure, the side plate 1111 is connected with the left side edge of the middle frame 112, an input/output bracket 114 is installed on the rear side edge of the middle frame 112, a connecting plate 1141 connected with the back plate 113 is formed on one side of the input/output bracket 114 close to the back plate 113, and a port through hole 1142 is formed at a connecting port of the input/output bracket 114 corresponding to the main case body. The middle frame 112 is formed by enclosing four sides, and includes a left side, a right side, a front side and a rear side. The mainframe box is a large mainframe box of a desktop computer, and the side plate 1111 is provided with screw holes to facilitate the connection of the main case body 11 and the mainframe box, so that the microcomputer case can be installed in the mainframe box to improve the memory and the unique display of the mainframe box, thereby realizing the dual use functions of independent use and cooperation with the mainframe box of the microcomputer case, and improving the use effect and the application range of the microcomputer case. The connecting plate 1141 may be disposed between the electronic motherboard 12 and the back plate 113, and is fixed by screws, so that the input/output bracket 114 is fixedly mounted on the rear side of the middle frame 112.

Specifically, the heat dissipation assembly 13 further includes a CPU heat dissipation module 132, the CPU heat dissipation module 132 includes a CPU board 133 and a heat sink 134, the CPU board 133 is horizontally disposed on the electronic motherboard 12, and is configured to be attached to and connected to the CPU, the heat sink 134 is connected to the CPU board 133, and the heat sink 134 is close to the vent 101. The CPU can be integrated on the electronic motherboard 12, and the CPU attachment plate 133 of the CPU heat dissipation module 132 is attached to the CPU to dissipate heat from the CPU, thereby improving heat dissipation efficiency and heat dissipation effect, dissipating heat without enlarging the volume of the case, and facilitating reduction of the volume of the case of the microcomputer, the CPU attachment plate 133 can conduct heat to the heat sink 134 to dissipate heat better, and the heat sink 134 is disposed near the ventilation opening 101 to increase the heat dissipation speed. The heat sink 134 may include a heat dissipation substrate 1341 and a plurality of heat dissipation fins 1342 vertically disposed on the heat dissipation substrate 1341, wherein the heat dissipation substrate 1341 is connected to one end of the CPU board 133, the heat dissipation fins 1342 are distributed at intervals to form a heat dissipation air duct, and the heat dissipation air duct is disposed facing the vent 101.

Specifically, a second support 15 is arranged between the electronic main board 12 and the back board 13, a connecting column 151 of the second support 15 penetrates through the electronic main board 12 and is located in the middle frame 112, a hole is formed in the CPU attachment board 133 corresponding to the connecting column 151, a through hole is formed in the fan support 14 corresponding to the hole, and the tail of the connecting piece 16 penetrates through the through hole and then is placed in the connecting column 151 through the hole so that the fan support 14 and the CPU attachment board 133 are connected with the second support 15. The connecting member 16 may be a connecting screw, and the second bracket 15 includes a main frame and a connecting post 151 vertically disposed on the main frame.

Preferably, the outer surface of the connecting member 16 is sleeved with a spring 17, and the spring 17 is located between the fan bracket 14 and the CPU board 133. One end of the spring 17 is connected with one surface, close to the electronic mainboard 12, of the fan support 14, the other end of the spring 17 is connected with one surface, far away from the electronic mainboard 12, of the CPU flitch 133, and the spring 17 is arranged to buffer and absorb shock between the fan support 14 and the CPU flitch 133, so that double buffering and absorbing shock is carried out on the case main body 11 and parts inside the case main body 11, parts inside the case main body 11 are effectively protected, the safety of the parts is guaranteed, the microcomputer case is well protected, and damage to the parts inside the microcomputer case caused by movement shock and collision in the carrying process is avoided.

Specifically, a gold finger 121 is disposed on one side of the electronic motherboard 12 and extends out of the middle frame 112. The microcomputer case further comprises a golden finger protection sleeve 18, wherein one side of the golden finger protection sleeve 18 is recessed to form a slot 181 for inserting one side of the electronic mainboard 12 provided with the golden finger 121.

Specifically, the periphery of the heat dissipation fan 131 is provided with screw connection holes along the height direction of the heat dissipation fan 131, the heat dissipation fan 131 is located between the top cover 111 and the fan support 14, and the tail end of a screw passes through the screw connection holes after passing through the fan support 14 and then is connected with the top cover 111, so that the fan support 14 and the heat dissipation fan 131 are connected with the top cover 111. Preferably, the fan bracket 14 includes two support rods 141, the two support rods 141 are respectively disposed at two sides of the heat dissipation fan 131, and the support rods 141 are provided with slots corresponding to the screw connection holes. The tail end of the screw is inserted into the corresponding screw connection hole through the slot hole of the support rod 141 and then connected with the top cover 111, so that the heat dissipation fan 131 is limited between the fan bracket 14 and the top cover 111 through the fan bracket 14, the heat dissipation fan 131 is better fixed on the top cover 111, the installation and operation are convenient and simple, the maintenance and the replacement are convenient, and meanwhile, the two support rods 141 of the fan bracket 14 are respectively positioned at two sides of the heat dissipation fan 131, so as to avoid covering the air outlet end.

To sum up, the utility model relates to a microcomputer machine case passes through the screw with machine case main body's top cap, the backplate is installed respectively in the two sides of center, the equipment step is convenient succinct, electronic component such as chip is integrated in electronic motherboard, and electronic motherboard locates between backplate and the center, with the electronic component of protection setting on electronic motherboard, through set up radiator unit in the machine case main body in order to dispel the heat, avoid the high temperature and influence electronic component's work, install radiator fan on the top cap through setting up fan support, radiator fan's air-out end is direct to dispel the heat to electronic motherboard, and the heat dissipation efficiency is improved, thereby need not to increase machine case volume and dispel the heat with the help, and small in size, and small space occupation, and convenient to carry, and the installation step is simple swift, and the whole structure is simple.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope of the present invention, and these modifications or replacements should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A microcomputer case, comprising:

the case body comprises a top cover, a middle frame and a back plate, wherein the top cover and the back plate are respectively arranged on two sides of the middle frame through screws;

the electronic main board is arranged between the middle frame and the back board and is integrated with a chip;

the heat dissipation assembly is contained in the case body and located in the middle frame and comprises a heat dissipation fan, the heat dissipation fan is installed on one side, facing the middle frame, of the top cover through a fan support, the air inlet end of the heat dissipation fan is arranged towards the top cover, the air outlet end of the heat dissipation fan faces the electronic mainboard, and ventilation openings are formed in the side edges of the middle frame.

2. The chassis of claim 1, wherein one end of the top cover is bent to form a side plate parallel to one side of the middle frame, the side plate is fixedly connected to one side of the middle frame by a screw, and the side plate is provided with an opening corresponding to the vent.

3. The microcomputer cabinet as claimed in claim 2, wherein the side plate has screw holes for screws to be set, so that the cabinet body is fixed in the main cabinet body, the middle frame is a cylindrical body and has a hollow structure, the side plate is connected to a left side of the middle frame, an input/output bracket is mounted on a rear side of the middle frame, a connecting plate connected to the back plate is formed on a side of the input/output bracket close to the back plate, and the input/output bracket has port through holes corresponding to a connecting port of the main cabinet body.

4. The microcomputer cabinet of claim 1, wherein the periphery of the heat dissipation fan is provided with screw connection holes along the height direction thereof, the heat dissipation fan is positioned between the top cover and the fan bracket, and the fan bracket and the heat dissipation fan are connected with the top cover by passing the tail end of a screw through the screw connection holes after passing through the fan bracket.

5. The housing of claim 4, wherein the fan bracket includes two support rods, the two support rods are respectively disposed on two sides of the heat dissipation fan, and the support rods are provided with slots corresponding to the screw connection holes.

6. The chassis of claim 1, wherein the heat sink assembly further comprises a CPU heat sink module, the CPU heat sink module comprising a CPU board and a heat sink, the CPU board being horizontally disposed on the electronic motherboard for attachment to a CPU, the heat sink being connected to the CPU board, and the heat sink being disposed adjacent to the vent.

7. The microcomputer cabinet as claimed in claim 6, wherein a second bracket is disposed between the electronic main board and the back board, a connection post of the second bracket passes through the electronic main board and is located in the middle frame, the CPU patch board is provided with a hole corresponding to the connection post, the fan bracket is provided with a through hole corresponding to the hole, and the fan bracket and the CPU patch board are connected to the second bracket by passing a tail of a connection member through the through hole and then being inserted into the connection post through the hole.

8. The microcomputer cabinet of claim 7, wherein the outer surface of the connecting member is sleeved with a spring, and the spring is located between the fan bracket and the CPU board.

9. The chassis of claim 1, wherein a gold finger is provided on one side of the electronic motherboard and extends outside the middle frame.

10. The microcomputer cabinet of claim 9, further comprising a golden finger protection case, wherein one side of the golden finger protection case is recessed to form a slot for inserting one side of the electronic motherboard provided with the golden finger.