CN2648495Y - Case with radiating device of chip for computer - Google Patents
Case with radiating device of chip for computer Download PDFInfo
- Publication number
- CN2648495Y CN2648495Y CNU032693729U CN03269372U CN2648495Y CN 2648495 Y CN2648495 Y CN 2648495Y CN U032693729 U CNU032693729 U CN U032693729U CN 03269372 U CN03269372 U CN 03269372U CN 2648495 Y CN2648495 Y CN 2648495Y
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- CN
- China
- Prior art keywords
- water
- pipe
- radiator
- heat
- cabinet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model relates to a case with radiating device of chip of computer. A shell is arranged at the position where a case power supply is arranged on the rear panel of an ATX case; a computer power supply is fixed on the internal side surface of the shell that faces to the case and a radiator is arranged in the shell; the radiator leads the heat of the water in the radiator to be dissipated by using the wind blown from a power supply fan and the circulating water passes through an water outlet pipe, a water guiding pipe and a pipelining brancher of the radiator and then enters a CPU, a north bridge and a display chip heat receiver; the heat receiver takes a flat shape and is covered on the computer chip; the heat that the chip generates is absorbed by the water in a heat receiver through a substrate; the temperature of the water raises and the water in the heat receiver flows out and then aggregates in the pipelining brancher, and then enters the radiator after passing through the water guiding pipe and a water inlet pipe of the radiator; the water becomes the cold water by dissipating the heat in the water and then flows out from the water outlet pipe of the radiator, and in this way, a circulation can achieve the purpose of dissipating the heat of the computer chip. The utility model has all the functions of the standard ATX case; the extra power consumption is not generated, the noises are not generated, the structure is simple, the cost is low and the defect that the mode of arranging other water cooling radiators and liquid cold radiators in the case is complicated is overcome while the radiator which is arranged in the utility model dissipates the heat of the computer chip.
Description
One, affiliated technical field
The utility model relates to a kind of radiator fan that replaces computer chip (CPU, north bridge, display chip), specifically a kind ofly provides the computer cabinet of refrigerating plant for computer chip (CPU, north bridge, display chip).
Two, background technology
At present, computer cabinet is generally all kinds of integrated circuit boards of computing machine, light soft or hard dish, power supplys etc. provide an installation, the framework that hangs, be not provided as the CPU on the integrated circuit board, north bridge, the heat abstractor of three main heat production chips of display chip, the heat radiation of these three elements is generally all adopted air-cooled, produce radiating effect by the radiator fan that is fixed on these three chips to its blowing, increase along with computer chip power, the heat that produces is also increasing, for the fan of chip cooling is also done bigger and bigger, rotating speed is more and more higher, but big fan and high rotating speed also bring high noisy and vibration simultaneously.Noise brings interference for the computing machine user, and vibration brings hidden danger for computing machine stable operation.The also useful liquid cooling in current computer market, water-cooled are the device of computer chip heat radiation, but generally to provide power for the liquid circulation with power pump, and add fan at the liquid radiator place be the liquid heat radiation, the advantage of this device is a good heat dissipation effect, shortcoming is that cooling system produces new noise, and complex structure, cost height, power consumption is arranged, in cabinet, install complicated.
Three, summary of the invention
For overcoming the noise of existing air-cooled radiator, overcome the deficiency that existing liquid cooling, water-filled radiator produce the new high two class heating radiators of noise, complex structure, cost, this use is novel to provide a kind of novel cabinet that has the computer chip heat abstractor, this cabinet adherence to standard ATX cabinet design specifications, all functions with standard A TX cabinet, when the heating radiator of An Zhuaning is the computer chip heat radiation therein, do not need extra power consumption, do not produce noise, simple in structure, cost is low, and has overcome other water, liquid cooling heat radiator complex installation mode in cabinet.
The technical scheme that the utility model technical solution problem is adopted is: the cabinet of being made up of ATX cabinet, heat abstractor that has the computer chip heat abstractor, the chassis power supply place is installed on ATX cabinet rear panel is provided with housing, outside flanging is arranged, so that housing and cabinet are fixed together and increase the intensity of housing on the housing; The bottom panel of housing has a hole, and a side of housing is with holes
Shape, housing is to cabinet medial surface stationary computer power supply; Heat abstractor is made up of heating radiator, CPU heat dump, north bridge heat dump, display chip heat dump, flowing water splitter, aqueduct, and heating radiator is installed in the housing.The heat dissipating package device is made up of heating radiator, CPU heat dump, north bridge heat dump, display chip heat dump, flowing water splitter, aqueduct.The structure of heating radiator is, up and down between two rectangular parallelepiped water tanks that keep flat, and many water guide flat tubes of two rows in parallel, water guide flat tube inner chamber body communicates with two water tank cavity bodies up and down, between two flat tubes, is welding " it " font scale that dispels the heat regularly.Upper surface at upper water box one end upwards welds a filler pipe, and the filler pipe inner chamber body communicates with the upper water box inner chamber body, and filler pipe top exterior walls mantle fiber to screw the filler pipe lid, on the filler pipe tops capping, is drilled with a plurality of pores, for ventilation.Filler pipe is welding radiator inleting pipe near upper water box proximal points one side, and water inlet pipe communicates with filler pipe, and passes housing
Cabinet inside is stretched in the hole of side.At the lower surface of the lower header other end, weld radiator outlet pipe downwards, rising pipe communicates with radiator bottom header.Rising pipe passes the hole of housing bottom panel and stretches into cabinet inside.At heating radiator stator of radiator header casing filler pipe opposite end welding, the hole of passing for setscrew is arranged, on the stator corresponding to fixing chassis power supply hole on the housing backboard.The CPU heat dump is slightly longer than north bridge heat dump, structure is identical, with the rectangle copper coin as substrate, along four edges of substrate, follow volt flat water tank thereon to substrate one face down bonding, a welding of water tank water inlet pipe, other end welding rising pipe, the water tank cavity height degree that the welding rising pipe is one is slightly less than other end height, and the water tank outer rim that the welding rising pipe is is curved.The difference of display chip heat dump and north bridge heat dump is, substrate is a right angle triangular prism, and tank weld is on the inclined-plane of triangular prism, and water inlet pipe is one flat to bend pipe, and other is identical.The flowing water splitter is the triangular cavity of a flat, and water pipe of weldering on the rib body of the opposite of this rib, welds three water pipes on the one rib.The outer wall of the inlet/outlet pipe head of heating radiator, CPU heat dump, north bridge heat dump, display chip heat dump, flowing water splitter, adopt groove design, insert being connected of aqueduct and firm inlet/outlet pipe and aqueduct with convenient, after aqueduct inserts these inlet/outlet pipes, block aqueduct at groove with snap ring.The aqueduct that connects said modules uses water white emulsion tube or nonrigid plastic pipe.
Heating radiator is fixed in the housing, the wind that goes out with the power supply wind is the water-cooled in the heating radiator, cold water flows out through heating radiator bottom rising pipe, enter the flowing water splitter by plastic tube, be divided into three strands by the flowing water splitter, pass through the water inlet pipe of the below of plastic tube and three heat dumps again, flow into three heat dumps, heat dump is covered on the computer chip, the heat that chip produces conducts to the water in the heat dump water tank by the heat dump substrate, and the water heating temperature rises, and flows out through heat dump top rising pipe, enter the flowing water splitter by plastic tube, after the flowing water splitter converges three strands of hot water, again by flowing water splitter rising pipe, plastic tube, the radiator inleting pipe inflow radiator becomes cold water after the wind heat radiation that power supply fan blows out, flowed out by heating radiator bottom water delivering orifice, so circulation is reached for the purpose of computer chip refrigeration again.
The beneficial effects of the utility model are, in all functions that realize the common computer cabinet, utilize its subsidiary heat abstractor to dispel the heat for computer chip, and do not produce noise, do not produce vibration, simple in structure, cost is low, heat abstractor does not need extra power consumption.
Four, description of drawings
Fig. 1 is heating radiator 1 front view;
Fig. 2 is the right view of Fig. 1;
Fig. 3 is the A-A cut-open view of Fig. 1;
Fig. 4 is CPU heat dump 2 front views;
Fig. 5 is north bridge heat dump 3 front views;
Fig. 6 is display chip heat dump 4 front views;
Fig. 7 is the left view of Fig. 4;
Fig. 8 is the left view of Fig. 5;
Fig. 9 is the left view of Fig. 6;
Figure 10 is flowing water splitter 5 front views;
Figure 11 is the left view of Figure 10;
Figure 12 is the utility model general structure synoptic diagram;
Figure 13 is the partial rear view of Figure 12:
Figure 14 is the left view of Figure 12;
Figure 15 is that Figure 12 C is to housing 12 synoptic diagram that save other structure;
Figure 16 is the vertical view of Figure 15.
Five, embodiment
As Fig. 1～shown in Figure 11, heat abstractor is by heating radiator 1, CPU heat dump 2, north bridge heat dump 3, display chip heat dump 4, flowing water splitter 5, aqueduct 6 is formed, heating radiator 1 is installed on the housing 12, between the upper water box 1-4 and lower header 1-7 of heating radiator 1, many water guide flat tube 1-5 of two rows in parallel, water guide flat tube 1-5 inner chamber body and upper water box 1-4, lower header 1-7 inner chamber body communicates, article two, be that " it " font connects between flat tube 1-5, upper surface at upper water box 1-4 one end is provided with filler pipe 1-2, filler pipe 1-2 inner chamber body communicates with upper water box 1-4 inner chamber body, filler pipe lid 1-1 is tightened on the filler pipe 1-2 of top exterior walls mantle fiber, has a plurality of pores on the filler pipe lid 1-1 capping; Filler pipe 1-2 is connected to radiator inleting pipe 1-3 near upper water box 1-4 proximal points one side, and water inlet pipe 1-3 head is provided with groove, and water inlet pipe 1-3 communicates with filler pipe 1-2; Water inlet pipe 1-3 passes housing 12
Cabinet inside is stretched in the hole of side; The lower surface of lower header 1-7 one end, be provided with the radiator outlet pipe 1-8 that head is provided with groove, rising pipe 1-8 communicates with radiator bottom header 1-7 and cabinet inside is stretched in the hole of passing housing 12 bottom panels, be provided with stator 1-9 in heating radiator 1 upper water box 1-4 one side, stator 1-9 is provided with fixed orifice and corresponding to a fixing hole of chassis power supply 8 on housing 12 backboards; CPU heat dump 2 is slightly longer than north bridge heat dump 3, and structure is identical, with the rectangle copper coin as substrate 2-2, flat water tank 2-3 is located on the substrate 2-2, flat water tank 2-3 taps into water pipe 2-4, other end welding rising pipe 2-1, and water inlet pipe 2-4, rising pipe 2-1 end are equipped with groove; Flowing water splitter 5 is the triangular cavity of a flat, one end of cavity is provided with three inlet/outlet pipe 5-1 of head band groove, the other end is provided with the inlet/outlet pipe 5-3 of a head band groove, radiator outlet pipe 1-8 links to each other with the flowing water splitter 5 that is positioned at cabinet by aqueduct 6, and flowing water splitter 5 links to each other with CPU heat dump 2, north bridge heat dump 3, display chip heat dump 4 by aqueduct 6.
As Figure 12～the utility model shown in Figure 16 the chassis power supply place is installed on standard A TX cabinet rear panel 11 and is provided with housing 12, outside flanging is arranged on the housing 12, so that housing 12 is fixed together with cabinet and increases the intensity of housing 12, the bottom panel of housing 12 has a hole, and a side of housing 12 is with holes
Shape, housing 12 is to cabinet medial surface stationary computer power supply 8; Heating radiator 1 by stator 1-9 and pass water inlet pipe 1-3, rising pipe 1-8 that housing 12 enters cabinet inside be fixed on housing 12 inside, over against the place of chassis power supply fan 7, heat radiation recirculated water is injected by heating radiator filler pipe 1-2, enter flowing water splitter 5 through radiator outlet pipe 1-8 and aqueduct 6, be split up into three strands, water inlet pipe by aqueduct 6 and each heat dump bottom flows into CPU heat dump 2, north bridge heat dump 3 and display chip heat dump 4 respectively.Three heat dumps cover on the corresponding computer chip, and the heat that chip produces during computer operation conducts to the water in the heat dump water tank by the heat dump substrate, and the water heating temperature rises, and the rising pipe through heat dump top flows out.Three strands of hot water that flow out from the rising pipe of three heat dumps, entering flowing water splitter 5 through aqueduct 6 converges and is one, again through aqueduct 6, radiator inleting pipe 1-3 inflow radiator upper water box 1-4, flow to heating radiator water guide flat tube 1-5 again, heat in the water is by water guide flat tube 1-5 wall, and heat radiation scale 1-6 is given in conduction.Heat radiation scale 1-6 is crossed in the wind that power supply fan 7 blows out, and takes away the heat of water among the water guide flat tube 1-5, and water temperature reduces back inflow radiator lower header 1-7, flows out by radiator outlet pipe 1-8 again, and so circulation is reached for the purpose of computer chip refrigeration.The adding amount of heat radiation recirculated water is as the criterion with the water surface distance filler pipe 1-2 1.5cm suitable for reading among the heating radiator filler pipe 1-2.Because of water temperature changes the variation that causes the volume change of water and then cause filler pipe 1-2 upper chamber internal gas pressure, regulate in the work by the pore on the capping of filler pipe lid 1-1.Filler pipe lid 1-1 plays the unexpected danger of flowing out of the water that prevents in the heating radiator 1 simultaneously.For guaranteeing flowing of water, heating radiator 1 position will be higher than the position of three heat dumps.
Claims (4)
1. cabinet that has the computer chip heat abstractor, include the ATX cabinet, it is characterized in that: also include heat abstractor, go up installation chassis power supply place at ATX cabinet rear panel (11) and be provided with housing (12), housing has outside flanging on (12), the bottom panel of housing (12) has a hole, and a side of housing (12) is with holes
Shape, housing (12) is to cabinet medial surface stationary computer power supply (8); Heat abstractor is by heating radiator (1), CPU heat dump (2), north bridge heat dump (3), display chip heat dump (4), flowing water splitter (5), aqueduct (6) is formed, heating radiator (1) is installed on the housing (12), between the upper water box (1-4) and lower header (1-7) of heating radiator (1), two row's many water guide flat tubes (1-5) in parallel, water guide flat tube (1-5) inner chamber body and upper water box (1-4), lower header (1-7) inner chamber body communicates, article two, be that " it " font connects between flat tube (1-5), upper surface at upper water box (1-4) end is provided with filler pipe (1-2), filler pipe (1-2) inner chamber body communicates with upper water box (1-4) inner chamber body, filler pipe lid (1-1) is tightened on the filler pipe (1-2) of top exterior walls mantle fiber, has a plurality of pores on filler pipe lid (1-1) capping; Filler pipe (1-2) is connected to radiator inleting pipe (1-3) near upper water box (1-4) proximal points one side, and water inlet pipe (1-3) head is provided with groove, and water inlet pipe (1-3) communicates with filler pipe (1-2); Water inlet pipe (1-3) passes housing (12)
Cabinet inside is stretched in the hole of side; The lower surface of lower header (1-7) end, be provided with the radiator outlet pipe (1-8) that head is provided with groove, rising pipe (1-8) communicates with radiator bottom header (1-7) and cabinet inside is stretched in the hole of passing housing (12) bottom panel, be provided with stator (1-9) in heating radiator (1) upper water box (1-4) side, stator (1-9) is provided with fixed orifice and corresponding to a fixing hole of chassis power supply (8) on housing (12) backboard; CPU heat dump (2) is slightly longer than north bridge heat dump (3), structure is identical, with the rectangle copper coin as substrate (2-2), flat water tank (2-3) is located on the substrate (2-2), flat water tank (2-3) taps into water pipe (2-4), other end welding rising pipe (2-1), water inlet pipe (2-4), rising pipe (2-1) end are equipped with groove; Flowing water splitter (5) is the triangular cavity of a flat, one end of cavity is provided with three inlet/outlet pipes (5-1) of head band groove, the other end is provided with the inlet/outlet pipe (5-3) of a head band groove, radiator outlet pipe (1-8) links to each other with the flowing water splitter (5) that is positioned at cabinet by aqueduct (6), and flowing water splitter (5) links to each other with CPU heat dump (2), north bridge heat dump (3), display chip heat dump (4) by aqueduct (6).
2, the cabinet that has the computer chip heat abstractor according to claim 1, it is characterized in that: water tank (2-3) the inner chamber body height that rising pipe (2-1) is is slightly less than other end height, and water tank (2-3) outer rim that welding rising pipe (2-1) is is curved.
3. the cabinet that has the computer chip heat abstractor according to claim 1, it is characterized in that: display chip heat dump (4) upper substrate (4-2) is a right angle triangular prism, water tank (4-3) is welded on the inclined-plane of triangular prism, and water inlet pipe (4-4) is one flat to bend pipe.
4. the cabinet that has the computer chip heat abstractor according to claim 1, it is characterized in that: the outlet of radiator outlet pipe (1-8) is higher than heat dump water inlet pipe (2-4), and radiator inleting pipe (1-3) water inlet is higher than the water delivering orifice of heat dump rising pipe (2-1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032693729U CN2648495Y (en) | 2003-08-05 | 2003-08-05 | Case with radiating device of chip for computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032693729U CN2648495Y (en) | 2003-08-05 | 2003-08-05 | Case with radiating device of chip for computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2648495Y true CN2648495Y (en) | 2004-10-13 |
Family
ID=34330225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU032693729U Expired - Fee Related CN2648495Y (en) | 2003-08-05 | 2003-08-05 | Case with radiating device of chip for computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2648495Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105511579A (en) * | 2015-12-29 | 2016-04-20 | 符于江 | Heat dissipation bag and computer water-cooling heat dissipation system |
| CN105739645A (en) * | 2016-01-12 | 2016-07-06 | 蚌埠学院 | Computer case and computer employing same |
| CN106125872A (en) * | 2016-07-29 | 2016-11-16 | 华南理工大学 | A kind of bus type heat pipe type water-cooling heat radiating system |
| CN112286323A (en) * | 2020-11-10 | 2021-01-29 | 上海英众信息科技有限公司 | Notebook computer water-cooling heat dissipation device and use method thereof |
-
2003
- 2003-08-05 CN CNU032693729U patent/CN2648495Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105511579A (en) * | 2015-12-29 | 2016-04-20 | 符于江 | Heat dissipation bag and computer water-cooling heat dissipation system |
| CN105739645A (en) * | 2016-01-12 | 2016-07-06 | 蚌埠学院 | Computer case and computer employing same |
| CN106125872A (en) * | 2016-07-29 | 2016-11-16 | 华南理工大学 | A kind of bus type heat pipe type water-cooling heat radiating system |
| CN112286323A (en) * | 2020-11-10 | 2021-01-29 | 上海英众信息科技有限公司 | Notebook computer water-cooling heat dissipation device and use method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |