CN2833699Y - Modified water-cooled radiator structure - Google Patents

Modified water-cooled radiator structure Download PDF

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Publication number
CN2833699Y
CN2833699Y CN 200520109006 CN200520109006U CN2833699Y CN 2833699 Y CN2833699 Y CN 2833699Y CN 200520109006 CN200520109006 CN 200520109006 CN 200520109006 U CN200520109006 U CN 200520109006U CN 2833699 Y CN2833699 Y CN 2833699Y
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CN
China
Prior art keywords
lid
water
radiator structure
cooling type
type radiator
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200520109006
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Chinese (zh)
Inventor
郑家俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaichuang Research Co Ltd
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Cooler Master Co Ltd
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Priority to CN 200520109006 priority Critical patent/CN2833699Y/en
Application granted granted Critical
Publication of CN2833699Y publication Critical patent/CN2833699Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides an improved water-cooled radiator structure which is arranged on an electronic heating component and comprises a water-cooled head component and at least one heat pipe, wherein the water-cooled head component comprises a first cover body and a second cover body connected to the first cover body, and supporting parts which are mutually corresponding are respectively formed on both ends of each cover body. The supporting parts are respectively used for water pipe joints to connect; a channel part is formed between the first cover body and the second cover body and is used for one end of the heat pipe to arrange. Accordingly, the utility model can simultaneously carry out the heat radiation according to different heating components in order to make the heating components continuously work under the admissible working temperature; in addition, the utility model can be widely used for the heat conduction and radiation of thin electronic products.

Description

A kind of improved water-cooling type radiator structure
Technical field
The utility model relates to a kind of improved water-cooling type radiator structure, relates in particular to a kind of electronic heating component that is used for, and can dispel the heat at different heat generating components simultaneously, so that its heat generating component can continue running under the working temperature of allowing; And can be widely used in the water-cooling type radiator structure that the slimming electronic product is led heat radiation.
Background technology
At present, the central processing unit of previous calculation machine (CPU), chipset and peripheral electronic package running speed are slow, add the air cooled heat sinks that radiator fan is constituted with radiator, come as the equipment of heat radiation promptly enough, but in recent years along with frequency constantly promotes, and frequency and heat are proportional, therefore, above-mentioned heating radiator is subject to the space constraint of casing, more and more is difficult to follow the lifting of central processing unit and chipset running speed, and effectively solves the problem of heat radiation; In addition, disturbing people's noise and high power consumption in that high-revolving radiator fan produces, also is the problem that present dealer was difficult to overcome, so have the water-cooling type radiator of high radiating effect and low noise, can provide another solution of heat radiation.
Known a kind of water-cooling type radiator structure, as the novel patent application case of TaiWan, China numbers 93208254, it includes airtight water cover, base and plume body, wherein this airtight water cover inside has the spatial accommodation of inserting for chilled water, be provided with at its end face, the water outlet screw, spiral shell is intrinsic respectively on described screw advances, titting water outlet, this advances, be connected with the water pipe that is communicated with chilled water on the titting water outlet, and be formed with flanging in the lower end of this airtight water cover, be provided with a big open-work in these base central authorities, this big open-work is that heat supply post body wears cooperation, to be combined into a water-cooling type radiator structure, the central processing unit of computing machine is led the effect of heat radiation, stablize user mode and make central processing unit can be one.
Yet, known water-cooling type radiator structure, basically still have following problem, because this airtight water cover and plume body are to be the vertical setting, when being installed in it on circuit board, to occupy most usage space, and make integrally-built volume quite huge, deviate from mutually with the demand of electronic product " light, thin, short, little "; In addition, this water-in and water-out pipe adapter is to be fixed on the end face of airtight water cover in the mode of being spirally connected, no matter be in manufacture process or assembling process complexity therefore, all need spend long man-hour, and make that cost can't effectively obtain to reduce; Again, this water-in and water-out pipe adapter is to protrude out the internal face side that exceeds airtight water cover to obtain to effectively setting firmly, and so will produce bubble phenomenon in the outer peripheral edges place of water pipe head, and cause the liquid holdup problem, significantly reduces the flow velocity of liquid and the heat that can take away; Moreover this water-cooling type radiator only can be led heat radiation to single electronic heating component, and reduces its practicality and economic benefit.
Summary of the invention
Fundamental purpose of the present utility model is the defective that overcomes above-mentioned prior art, and a kind of improved water-cooling type radiator structure is provided, and it can dispel the heat at different heat generating components simultaneously, so that its heat generating component can continue running under the working temperature of allowing; And can be widely used in slimming electronic product lead heat radiation.
The purpose of this utility model realizes by following technical proposals, improved water-cooling type radiator structure provided by the utility model, in order to be installed on the electronic heating component, it includes a water-cooled member and at least one heat pipe, wherein this water-cooled member includes first lid and is connected in second lid of first lid, two ends of each lid have been formed separately the mutual corresponding carrier that divides, described carrier is that water supply pipe joint connects respectively, and be formed with a channel part between first lid and second lid, its described heat pipe one end is to be located in the channel part of a described water-cooled member.
Compared with prior art, the advantage that the utlity model has is:
1. this water-cooled member is simple in structure, only is first lid, second lid, water pipe head and heat pipe, saves fixation kits such as packing ring and screw, can significantly reduce cost.
2. manufacture process and combination installing are simple and easy, and only need time processing each component groups can be established to finish.
3. this water pipe head can be arranged in parallel with first lid and second lid, so that the whole height of this water-cooled member is reduced to is minimum, and is fit to the making and the use of slimming.
4. this water pipe head and heat pipe are organized when establishing mutually in first lid and second lid, can be located in simultaneously between the two, need not to lock separately or weld, and the finished product that more generally locking group of tight ness rating is established are better.
5. this water pipe head inwall and channel part height do not have drop, so fluid does not produce the problem of bubble phenomenon and liquid holdup when flowing.
Relevant feature of the present utility model and technology contents see also following detailed description and accompanying drawing, and appended diagram only provides reference and explanation, is not to be used for the utility model is limited.
Description of drawings
Fig. 1 is a three-dimensional exploded view of the present utility model;
Fig. 2 is a combination synoptic diagram of the present utility model;
Fig. 3 is an assembled sectional view of the present utility model;
Fig. 4 is the user mode figure that the utility model is applied to computer main frame panel;
Fig. 5 is the cut-open view of Fig. 4;
Fig. 6 is the assembled sectional view of another embodiment of the utility model.
Primary clustering symbol description: a water-cooled member 1; First lid 11; Last carrier 111; Last folder is established portion 112; Following carrier 121; Following folder is established portion 122; Second lid 12; Titting water outlet 13; Admitting pipe joint 14; Channel part 15; Clearance space 16; Heat pipe 2,2 '; Endothermic section 21; Heat unit 22; Heat-conducting block 3; Computer main frame panel 4; Central processing unit 41; North bridge chips 42; South Bridge chip 43; Heat exchanger 5; First communicating pipe 51; Water-cooled row 52; Second communicating pipe 53; Pump 54; Third connecting pipe 55.
Embodiment
See also Fig. 1 to Fig. 3, shown is that accompanying drawing is respectively three-dimensional exploded view of the present utility model, combination synoptic diagram and assembled sectional view, improved water-cooling type radiator structure provided by the utility model, it mainly includes a water-cooled member 1 and at least one heat pipe 2, wherein:
A described water-cooled member 1 is to be H shape, it includes first lid 11 and is connected in second lid 12 of first lid, 11 belows, rear side two ends of first lid 11 and second lid 12 be formed separately mutual correspondence on carrier 111 and carrier 121 down, this upper and lower carrier 111,121 all is a semicircular arc, and it is to connect for a titting water outlet 13 and an admitting pipe joint 14 respectively; Between first lid 11 and second lid 12, be formed with a channel part 15, should go up carrier 111 in addition is to be arranged with in first lid 11, following carrier 121 then is to be arranged with in second lid 12, so that the inner edge equal diameters of the height of channel part 15 and titting water outlet 13 and admitting pipe joint 14, do not produce bubble phenomenon when making liquid flow, so that flowing velocity is more smooth and easy; Moreover, the front side of first lid 11 and second lid 12 two ends protrude out respectively mutual correspondence on folder establish portion 112 and down folder establish portion 122, its folder is established portion 112,122 and is a semicircular arc.
Described heat pipe 2 makes and can take the shape of the letter U, its inside is provided with capillary structure and working fluid, the outside then is formed with endothermic section 21 and heat unit 22, this heat unit 22 makes in the channel part 14 that is located in a water-cooled member 1, and the external profile diameter of heat pipe 2 is less than channel part 14 height, when heat pipe 2 folders are pulled when last folder is established portion 112 and folder is established portion 122 down, in between the inwall of the outer wall of heat pipe 2 and first lid 11 and second lid 12, to be formed with a clearance space 16 (as shown in Figure 5), this clearance space 16 make for liquid circulation and with the fast speed belt of heat of heat pipe 2 heat units 22 from, so that its inner working fluid is condensed into liquid rapidly, by the capillary attraction of capillary structure liquid is taken back the endothermic section 21 of heat pipe 2 again, so, to constitute the circulation heat radiation of a heat pipe.
In addition, the endothermic section 21 of this heat pipe 2 is to be connected with a heat-conducting block 3, this heat-conducting block 3 makes this endothermic section 21 have more broad endotherm area for made with copper, aluminium or other material with thermal conductive resin, is attached at even covering on the surface of heat generating component.
When group is established, make earlier after the upper and lower carrier 111,121 of this lid 11,12 respectively and upper and lower folder are established solids such as applying tin cream on portion 112,122 surfaces, again titting water outlet 13, admitting pipe joint 14 and heat pipe 2 are placed the following carrier 121 of second lid 12 respectively and press from both sides down and establish in the portion 122, again first lid, 11 correspondences are installed in the place, top of second lid 12, behind heated baking, can make each member finish tight binding combination.
See also Fig. 4 and Fig. 5, shown accompanying drawing is respectively the utility model and is applied to the user mode figure of computer main frame panel and the cut-open view of Fig. 4, water-cooling type radiator of the present utility model can be applicable on the computer main frame panel 4, this computer main frame panel 4 has central processing unit 41, north bridge chips 42 (Memory ControllerHub), South Bridge chip 43 (I/O Controller Hub) memory modules, adapter card module and other can provide the electronic heating component of various difference in functionalitys, after second lid, 12 bottom surfaces of this water-cooled member 1 apply heat-conducting medium (figure does not show), again it is attached on the surface of central processing unit 41, respectively 3 of this heat-conducting blocks that are connected in heat pipe 2 are attached at respectively on the end face of north bridge chips 41 and South Bridge chip 42, titting water outlet 13 and oral siphon joint 14 with a water-cooled member 1 is connected to a heat exchanger 5 again, this heat exchanger 5 included for first communicating pipe 51 in regular turn, water-cooled row 52, second communicating pipe 53, a pump 54 and a third connecting pipe 55, by the respectively combination installing of this member, can form a path that circulates for liquid at each component inside, with to central processing unit 41, electronic heating components such as north bridge chips 42 and South Bridge chip 43 are led thermolysis.
See also Fig. 6, shown in accompanying drawing be the cut-open view of another embodiment of the utility model, the utility model is except that the kenel that can be the foregoing description, also this heat pipe 2 can be arranged to single L shaped or constitute by two L shaped heat pipe 2 ' institutes, do corresponding laying and arrangement according to actual demand fully, present embodiment is two L shaped heat pipes, this heat pipe 2 respectively ' an end be equiped with a heat-conducting block 3 respectively, attach on the electronic heating component by each heat-conducting block 3, can reach the equal effect of above-mentioned enforcement.
In sum, the utility model embodiment can reach desired purpose really and use effect.Yet above-mentioned accompanying drawing that discloses and explanation only are embodiment of the present utility model, and be non-for limiting embodiment of the present utility model; Allly be familiar with this skill and divide the personage, it complies with feature category of the present utility model, and other equivalence of being done changes or modifies, and all should be encompassed in the claimed claim of following the application.

Claims (11)

1, a kind of improved water-cooling type radiator structure is characterized in that it comprises:
An one water-cooled member, second lid that it includes first lid and is connected in first lid, respectively two ends of this lid are formed separately the carrier of mutual correspondence, and its carrier water supply pipe joint respectively connects, and is formed with a channel part between first lid and second lid; And
At least one heat pipe, the one end makes in the channel part that is located in a described water-cooled member.
2, improved water-cooling type radiator structure according to claim 1 is characterized in that a described water-cooled member makes and is H shape.
3, improved water-cooling type radiator structure according to claim 1, it is characterized in that described carrier make by last carrier and down carrier constituted, carrier makes and is arranged with in first lid on this, this time carrier then makes and is arranged with in second lid.
4, improved water-cooling type radiator structure according to claim 3 is characterized in that respectively this carrier is to be a semicircular arc.
5, improved water-cooling type radiator structure according to claim 1 is characterized in that the height of this channel part and the inner edge equal diameters of water pipe head.
6, improved water-cooling type radiator structure according to claim 1, a side that it is characterized in that this first lid and second lid is provided with the folder of mutual correspondence and establishes portion, and this folder portion of establishing makes for described heat pipe and installs binding.
7, improved water-cooling type radiator structure according to claim 6, wherein this folder portion of establishing makes by the last folder portion of establishing and descends folder to establish portion and constituted, should go up the folder portion of establishing is convexly set in first lid, this time folder portion of establishing is convexly set in second lid, to be formed with clearance space respectively between the outer wall of heat pipe and first lid and second cover body.
8, improved water-cooling type radiator structure according to claim 7 is characterized in that respectively this folder portion of establishing is a semicircular arc.
9, improved water-cooling type radiator structure according to claim 1 is characterized in that respectively this lid and is to be engaged by tin cream between this water pipe head and the heat pipe respectively.
10, improved water-cooling type radiator structure according to claim 1 is characterized in that this heat pipe is L-shaped or any of U-shaped.
11, improved water-cooling type radiator structure according to claim 1 is characterized in that it also includes a heat-conducting block, and its heat-conducting block is connected in the other end of heat pipe.
CN 200520109006 2005-06-08 2005-06-08 Modified water-cooled radiator structure Expired - Fee Related CN2833699Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200520109006 CN2833699Y (en) 2005-06-08 2005-06-08 Modified water-cooled radiator structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200520109006 CN2833699Y (en) 2005-06-08 2005-06-08 Modified water-cooled radiator structure

Publications (1)

Publication Number Publication Date
CN2833699Y true CN2833699Y (en) 2006-11-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200520109006 Expired - Fee Related CN2833699Y (en) 2005-06-08 2005-06-08 Modified water-cooled radiator structure

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102478931A (en) * 2010-11-23 2012-05-30 英业达股份有限公司 Detachable liquid cooling heat dissipation module
CN102843896A (en) * 2011-06-21 2012-12-26 英业达股份有限公司 Cooling device
CN103763889A (en) * 2014-01-07 2014-04-30 成都科普尔电子散热器有限公司 Cooling device for machine room
CN106155241A (en) * 2015-04-03 2016-11-23 深圳市万景华科技有限公司 Heat abstractor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102478931A (en) * 2010-11-23 2012-05-30 英业达股份有限公司 Detachable liquid cooling heat dissipation module
CN102843896A (en) * 2011-06-21 2012-12-26 英业达股份有限公司 Cooling device
CN103763889A (en) * 2014-01-07 2014-04-30 成都科普尔电子散热器有限公司 Cooling device for machine room
CN103763889B (en) * 2014-01-07 2016-04-06 成都科普尔电子散热器有限公司 For the heat abstractor of machine room
CN106155241A (en) * 2015-04-03 2016-11-23 深圳市万景华科技有限公司 Heat abstractor

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: KAICHUANG RESEARCH CO., LTD.

Free format text: FORMER OWNER: XUNKAI INTERNATIONAL CO., LTD.

Effective date: 20120229

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20120229

Address after: Delaware

Patentee after: Kaichuang Research Co., Ltd.

Address before: Taiwan, China

Patentee before: Xunkai International Co., Ltd.

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20061101

Termination date: 20130608