CN207320771U - A kind of bus duct with control high-low pressure busbar installation temperature function - Google Patents
A kind of bus duct with control high-low pressure busbar installation temperature function Download PDFInfo
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- CN207320771U CN207320771U CN201721309773.3U CN201721309773U CN207320771U CN 207320771 U CN207320771 U CN 207320771U CN 201721309773 U CN201721309773 U CN 201721309773U CN 207320771 U CN207320771 U CN 207320771U
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Abstract
The utility model discloses a kind of bus duct with control high-low pressure busbar installation temperature function, including upper casing and lower casing, installing plate one and installing plate two are installed with respectively on the inner wall of the upper casing and lower casing, card slot one is offered on the inner wall of the installing plate one, the position that card slot one is corresponded on two inner wall of installing plate offers card slot two, temperature sensor is installed with the inner bottom wall of the installing plate one, the upper surface of the upper casing is welded with the lower surface of heat-conducting plate, the upper surface of the heat-conducting plate is bonded with the lower surface of thermal insulation board, the upper surface of the thermal insulation board is fixedly connected with the lower surface of heat sink.This has the bus duct of control high-low pressure busbar installation temperature function, by being installed with temperature sensor on installing plate one, the temperature of bus duct can be detected in real time, shown by liquid crystal display, temperature during busbar is installed convenient for users to both bus ducts, is operated easy to user.
Description
Technical field
Bus duct technical field is the utility model is related to, is specially that one kind has control high-low pressure busbar installation temperature function
Bus duct.
Background technology
Bus duct, is a kind of metal device for the closing being made of copper, aluminium busbar column, for for each element of decentralized system
Distribute relatively high power, due to building, factory etc. it is various building electric power needs, and it is this need increased trend year by year,
Using original circuit wiring pattern, i.e. poling mode, when construction, brings many difficulties, moreover, when distribution system to be changed,
It is become simple, some are nearly impossible, however, if using bus duct, being very easy to that mesh can be reached
, in addition also building can be made to become more beautiful.For economic aspect, bus duct is in itself compared with cable, price one
A bit, but construction cost can be made conveniently using bus duct compared with the various annexes comprising distribution and whole electric system
Preferably more, particularly current capacity it is big in the case of, situation is with regard to more obvious.
The material of bus duct is typically metal, at the same temperature the heat absorption capacity of metal than plastics and it is wooden will be strong,
And temperature range of the bus duct when installing busbar needs to control in five degrees below zero to 40 degree, and existing bus duct does not have more
The function of standby control bus installation temperature, is not easy to the installation that operating personnel carry out busbar in bus duct.
Utility model content
(1) technical problem solved
In view of the deficiencies of the prior art, the utility model provides a kind of with control high-low pressure busbar installation temperature function
Bus duct, solve the problems, such as to propose in background technology.
(2) technical solution
In order to achieve the above object, the utility model is achieved by the following technical programs:One kind has control high-low pressure
Busbar installs the bus duct of temperature function, including upper casing and lower casing, is installed with respectively on the inner wall of the upper casing and lower casing
Installing plate one and installing plate two, offer card slot one on the inner wall of the installing plate one, corresponding card on two inner wall of installing plate
The position of groove one offers card slot two, and temperature sensor is installed with the inner bottom wall of the installing plate one, the upper casing
Upper surface is welded with the lower surface of heat-conducting plate, and the upper surface of the heat-conducting plate is bonded with the lower surface of thermal insulation board, the thermal insulation board
Upper surface be fixedly connected with the lower surface of heat sink.
The inside of the heat-conducting plate offers water channel, and the water inlet end of the water channel and water outlet are respectively positioned on the right side of heat-conducting plate
Face, and the water inlet end of water channel is located at the rear side of its water outlet, the inside of the heat sink offers cavity, the right side of the heat-conducting plate
Side and positioned at water channel water inlet end and water outlet between be installed with water pump, the water outlet of the water pump and the water inlet of water channel
End connection, the water inlet end of the water pump fix the water outlet for being communicated with communicating pipe one, and the water inlet end of the communicating pipe one is through scattered
The right side wall of hot plate is simultaneously connected with the inside of cavity, and the water inlet end for being communicated with communicating pipe two, institute are fixed in the water outlet of the water channel
The water outlet for stating communicating pipe two also extends through the right side wall of heat sink and is connected with the inside of cavity, and the water inlet end of communicating pipe one and
The water outlet of communicating pipe two is located at the both ends of heat sink right flank respectively.
The upper surface of the heat sink is provided with radiator fan, and the corner of radiator fan and heat sink upper surface corner are equal
It is fixed by screws, the position that the heat sink upper surface corresponds to radiator fan offers nine bar shapeds being spaced substantially equidistant
Notch, the right flank of the heat sink are installed with indicator light.
The output terminal of the temperature sensor is electrically connected with the input terminal of processor, and the input terminal of the processor is also distinguished
It is electrically connected with feedback module and the input terminal of adjustment module, output terminal and water pump, radiator fan and the indicator light of the processor
Input terminal be electrically connected, the output terminal of the processor is electrically connected the input terminal of contrast module and liquid crystal display, institute
State that processor is also two-way to be electrically connected with memory module, the input terminal of the output terminal of the temperature sensor also with contrast module is electrically connected
Connect, the output terminal of the contrast module is electrically connected with the input terminal of feedback module.
Preferably, the adjustment module includes node one and node two, and the output terminal of node one and node two with place
The input terminal for managing device is electrically connected.
Preferably, the heat-conducting plate is copper coin, and the water channel is in continuous S-shaped.
Preferably, the area of the thermal insulation board upper surface is identical with the area of heat sink lower surface, the thermal insulation board following table
The area in face is identical with the area of heat-conducting plate upper surface, and the thermal insulation board is vacuum insulation panel.
Preferably, the water pump is micro pump, the model CSP24120 of the water pump.
Preferably, model MSP430G2x53, the MSP430G2x13 mixed signal microprocessor of the processor, it is described
The packaging pin of processor is 32 feet, and the maximum operating frequency of the processor is 16MHz, and the processor has 24 supports
The I/O pins of touch-sensing, the operating voltage range of the processor is 1.8 to 3.6 volts.
Preferably, the air intake of the radiator fan is directed toward the upper surface of heat sink, the both ends difference of the bar v notch v
Positioned at the front and back of heat sink.
Preferably, the model WRM-101 of the temperature sensor, the temperature-measuring range of the temperature sensor is 0-1350
Degree Celsius.
(3) beneficial effect
The utility model provides a kind of bus duct with control high-low pressure busbar installation temperature function, and possessing following has
Beneficial effect:
(1), the bus duct of temperature function should be installed with control high-low pressure busbar, by being fixedly mounted on installing plate one
There is temperature sensor, the temperature of bus duct can be detected in real time, be shown by liquid crystal display, it is easy to use
Both persons bus duct installs temperature during busbar, is operated easy to user.
(2), should be electrically connected with the bus duct of control high-low pressure busbar installation temperature function by the input terminal of processor
There is the output terminal of adjustment module, the setting of bus duct temperature can be carried out using node one and node two, easy to user by mother
The temperature control of wire casing is in the temperature of needs.
(3), should be opened up with the bus duct of control high-low pressure busbar installation temperature function by the inside of heat sink free
Chamber, the right flank of heat-conducting plate and positioned at water channel water inlet end and water outlet between be installed with water pump, pass through water in coolant
Pump circulates between cavity and water channel, and the heat that the coolant in water channel absorbs upper casing by heat-conducting plate heat conduction enters in cavity,
The air velocity on heat sink in bar v notch v is accelerated in radiator fan operating, accelerates heat and distributes, in cavity under coolant temperature
Entered back into after drop in water channel and absorb the heat of upper casing, can effectively cooled down for bus duct, solve what is proposed in background technology
Problem.
(4), should be bonded with the bus duct of control high-low pressure busbar installation temperature function by the upper surface of heat-conducting plate
The lower surface of thermal insulation board, the upper surface of thermal insulation board are fixedly connected with the lower surface of heat sink, are thermally shielded, avoided using thermal insulation board
Heat transfer in heat sink enters in heat-conducting plate and improves the temperature of heat-conducting plate, influences heat exchange efficiency.
Brief description of the drawings
Fig. 1 is the utility model structure right view;
Fig. 2 is Section A-A figure in the utility model Fig. 1;
Fig. 3 is Tthe utility model system structure diagram;
Fig. 4 is the structure diagram of the utility model water channel.
In figure:1 upper casing, 2 lower casings, 3 installing plates one, 4 installing plates two, 5 card slots one, 6 card slots two, 7 temperature sensors, 8 are led
Hot plate, 9 thermal insulation boards, 10 heat sinks, 11 water channels, 12 cavitys, 13 water pumps, 14 communicating pipes one, 15 communicating pipes two, 16 radiator fans,
17 v notch vs, 18 indicator lights, 19 processors, 20 feedback modules, 21 adjustment modules, 22 contrast modules, 23 liquid crystal displays, 24
Memory module, 25 nodes one, 26 nodes two.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained, shall fall within the protection scope of the present invention.
- 4 are please referred to Fig.1, the utility model provides a kind of technical solution:One kind has control high-low pressure busbar installation temperature
One 3 He of installing plate is installed with respectively on the inner wall of the bus duct of function, including upper casing 1 and lower casing 2, upper casing 1 and lower casing 2
Installing plate 24, offers card slot 1 on the inner wall of installing plate 1, the position that card slot 1 is corresponded on 24 inner wall of installing plate opens up
There is card slot 26, temperature sensor 7, the model WRM- of temperature sensor 7 are installed with the inner bottom wall of installing plate 1
101, the temperature-measuring range of temperature sensor 7 is 0-1350 degrees Celsius, and temperature sensor 7 refers to that temperature can be experienced and is converted into can use
The sensor of signal is exported, the temperature inside the bus duct, the upper surface welding of upper casing 1 are detected in real time using temperature sensor 7
There is the lower surface of heat-conducting plate 8, the upper surface of heat-conducting plate 8 is bonded with the lower surface of thermal insulation board 9, and the upper surface of thermal insulation board 9, which is fixed, to be connected
The lower surface of heat sink 10 is connected to, the area of 9 upper surface of thermal insulation board is identical with the area of 10 lower surface of heat sink, under thermal insulation board 9
The area on surface is identical with the area of 8 upper surface of heat-conducting plate, and thermal insulation board 9 is vacuum insulation panel, and vacuum insulation panel is vacuum heat-preserving
One kind in material, is combined by filling core and vacuum protection top layer, it is effectively prevented from hot caused by cross-ventilation
Transmit, therefore thermal conductivity factor can be greatly lowered, less than 0.035w/ (㎡ .k), and any ODS materials are not contained, there is ring
Guarantor and energy-efficient characteristic, are current efficient thermal insulation materials state-of-the-art in the world, are thermally shielded, avoided using thermal insulation board 9
Heat transfer in heat sink 10 enters in heat-conducting plate 8 and improves the temperature of heat-conducting plate 8, influences heat exchange efficiency.
The inside of heat-conducting plate 8 offers water channel 11, and heat-conducting plate 8 is copper coin, and water channel 11 is in continuous S-shaped, the water inlet of water channel 11
End and water outlet are respectively positioned on the right flank of heat-conducting plate 8, and the water inlet end of water channel 11 is located at the rear side of its water outlet, heat sink 10
Inside offers cavity 12, and water is installed between the right flank of heat-conducting plate 8 and water inlet end positioned at water channel 11 and water outlet
Pump 13, the water outlet of water pump 13 is connected with the water inlet end of water channel 11, and water pump 13 is micro pump, the model of water pump 13
CSP24120, the small volume of the pump housing, is suitably applied on bus duct, and the water inlet end of water pump 13, which is fixed, is communicated with communicating pipe 1
Water outlet, the water inlet end of communicating pipe 1 through heat sink 10 right side wall and connected with the inside of cavity 12, water channel 11
The water inlet end for being communicated with communicating pipe 2 15 is fixed in water outlet, and the water outlet of communicating pipe 2 15 also extends through the right side wall of heat sink 10 simultaneously
Connected with the inside of cavity 12, and the water outlet of the water inlet end of communicating pipe 1 and communicating pipe 2 15 are right positioned at heat sink 10 respectively
The both ends of side, the injection coolant in water channel 11 and cavity 12, coolant can be water, and the work of water pump 13 makes cavity 12 and water
Coolant in road 11 forms circulation, persistently radiates for the bus duct.
The upper surface of heat sink 10 is provided with radiator fan 16, and the corner of radiator fan 16 and 10 upper surface of heat sink
Corner is fixed by screws, and the position that 10 upper surface of heat sink corresponds to radiator fan 16 offers nine and is spaced substantially equidistant
Bar v notch v 17, the right flank of heat sink is installed with indicator light 18, and the air intake of radiator fan 16 is directed toward heat sink 10
Upper surface, the both ends of bar v notch v 17 are located at the front and back of heat sink 10 respectively, and coolant is by water pump 13 in cavity
Circulated between 12 and water channel 11, the heat that the coolant in water channel 11 absorbs upper casing 1 by 8 heat conduction of heat-conducting plate enters cavity 12
Interior, the air velocity on heat sink 10 in bar v notch v 17 is accelerated in the operating of radiator fan 16, accelerates heat and distributes, cold in cavity 12
But liquid temperature degree enters back into water channel 11 heat for absorbing upper casing 1 after declining.
The output terminal of temperature sensor 7 is electrically connected with the input terminal of processor 19, and the input terminal of processor 19 is also electric respectively
It is connected with feedback module 20 and the input terminal of adjustment module 21, the output terminal of processor 19 and water pump 13, radiator fan 16 and refers to
Show that the input terminal of lamp 18 is electrically connected, indicator light 18 lights when water pump 13 works with radiator fan 16, water pump 13 and radiator fan 16
Indicator light 18 is closed when not working, and the output terminal of processor 19 is electrically connected the defeated of contrast module 22 and liquid crystal display 23
Enter end, processor 19 is also two-way to be electrically connected with memory module 24, and the output terminal of temperature sensor 7 is also defeated with contrast module 22
Enter end to be electrically connected, the output terminal of contrast module 22 is electrically connected with the input terminal of feedback module 20, and temperature is set using adjustment module 21
Degree, is adjusted in information deposit memory module 24, the work of water pump 13 cools down for bus duct, and temperature sensor 7 is detected in bus duct
Temperature, is contrasted by 22 contrasting detection temperature of contrast module and design temperature, and temperature does not reach design temperature water pump 13 and heat dissipation
16 continuous firing of fan radiates, and reaches design temperature water pump 13 and radiator fan 16 is stopped, adjustment module 21 includes
Node 1 and node 2 26, and input terminal of the output terminal of node 1 and node 2 26 with processor 19 is electrically connected, place
Model MSP430G2x53, the MSP430G2x13 mixed signal microprocessor of device 19 is managed, the packaging pin of processor 19 is 32
Foot, the maximum operating frequency of processor 19 is 16MHZ, and processor 19 has the I/O pins of 24 support touch-sensings, processor
19 operating voltage range is 1.8 to 3.6 volts.
In use, user is adjusted in information deposit memory module 24, water by using 21 design temperature of adjustment module
The work of pump 13 cools down for bus duct, and temperature sensor 7 detects the temperature in bus duct, passes through 22 contrasting detection temperature of contrast module
Contrasted with design temperature, temperature does not reach design temperature water pump 13 and 16 continuous firing of radiator fan radiates, and reaches setting
Temperature water pump 13 and radiator fan 16 are stopped.
In conclusion the bus duct of temperature function should be installed with control high-low pressure busbar, by solid on installing plate 1
Dingan County is equipped with temperature sensor 7, the temperature of bus duct can be detected in real time, be shown by liquid crystal display 23
Come, temperature during busbar is installed convenient for users to both bus ducts, is operated easy to user.
This has the bus duct of control high-low pressure busbar installation temperature function, is electrically connected with by the input terminal of processor 19
The output terminal of adjustment module 21, can carry out the setting of bus duct temperature, easy to user using node 1 and node 2 26
By the temperature control of bus duct in the temperature of needs.
This has the bus duct of control high-low pressure busbar installation temperature function, and cavity is offered by the inside of heat sink 10
12, the right flank of heat-conducting plate 8 and positioned at water channel 11 water inlet end and water outlet between be installed with water pump 13, lead in coolant
Cross water pump 13 and circulated between cavity 12 and water channel 11, the coolant in water channel 11 absorbs the heat of upper casing 1 by 8 heat conduction of heat-conducting plate
Amount enters in cavity 12, and the air velocity on heat sink 10 in bar v notch v 17 is accelerated in the operating of radiator fan 16, accelerates heat and dissipates
Send out, coolant temperature enters back into water channel 11 heat for absorbing upper casing 1 in cavity 12 after declining, and can be effectively bus duct drop
Temperature, solves the problems, such as to propose in background technology.
This has bus duct of control high-low pressure busbar installation temperature function, by the upper surface of heat-conducting plate 8 be bonded with every
The lower surface of hot plate 9, the upper surface of thermal insulation board 9 are fixedly connected with the lower surface of heat sink 10, are thermally shielded using thermal insulation board 9,
Avoid the heat transfer in heat sink 10 from entering in heat-conducting plate 8 and improve the temperature of heat-conducting plate 8, influence heat exchange efficiency.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Non-exclusive inclusion, so that process, method, article or equipment including a series of elements not only will including those
Element, but also including other elements that are not explicitly listed, or further include as this process, method, article or equipment
Intrinsic key element.In the absence of more restrictions.The electric elements occurred in this article with extraneous main controller and
220V alternating currents are electrically connected, and main controller can be the conventionally known equipment that computer etc. plays control.
While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from the principle of the utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (8)
1. a kind of bus duct with control high-low pressure busbar installation temperature function, including upper casing (1) and lower casing (2), it is described on
Installing plate one (3) and installing plate two (4), the installing plate one (3) are installed with the inner wall of shell (1) and lower casing (2) respectively
Inner wall on offer card slot one (5), the position that card slot one (5) is corresponded on described two (4) inner wall of installing plate offers card slot two
(6), and it is characterized in that:Temperature sensor (7) is installed with the inner bottom wall of the installing plate one (3), the upper casing (1)
Upper surface is welded with the lower surface of heat-conducting plate (8), and the upper surface of the heat-conducting plate (8) is bonded with the lower surface of thermal insulation board (9), institute
The upper surface for stating thermal insulation board (9) is fixedly connected with the lower surface of heat sink (10);
The inside of the heat-conducting plate (8) offers water channel (11), and the water inlet end of the water channel (11) and water outlet are respectively positioned on heat conduction
The right flank of plate (8), and the water inlet end of water channel (11) is located at the rear side of its water outlet, the inside of the heat sink (10) offers
Cavity (12), the right flank of the heat-conducting plate (8) and positioned at water channel (11) water inlet end and water outlet between be installed with water
Pump (13), the water outlet of the water pump (13) is connected with the water inlet end of water channel (11), and the water inlet end of the water pump (13), which is fixed, to be connected
Be connected with the water outlet of communicating pipe one (14), the water inlet end of the communicating pipe one (14) through heat sink (10) right side wall and with sky
The water inlet end for being communicated with communicating pipe two (15), the connection are fixed in the inside connection of chamber (12), the water outlet of the water channel (11)
The water outlet of pipe two (15) also extends through the right side wall of heat sink (10) and is connected with the inside of cavity (12), and communicating pipe one (14)
Water inlet end and the water outlet of communicating pipe two (15) respectively be located at heat sink (10) right flank both ends;
The upper surface of the heat sink (10) is provided with radiator fan (16), and the corner of radiator fan (16) and heat sink (10)
Upper surface corner is fixed by screws, and the position that heat sink (10) upper surface corresponds to radiator fan (16) offers
Nine bar v notch vs (17) being spaced substantially equidistant, the right flank of the heat sink are installed with indicator light (18);
The output terminal of the temperature sensor (7) is electrically connected with the input terminal of processor (19), the input of the processor (19)
End is also electrically connected feedback module (20) and the input terminal of adjustment module (21), the output terminal and water of the processor (19)
The input terminal for pumping (13), radiator fan (16) and indicator light (18) is electrically connected, and the output terminal of the processor (19) is electrically connected respectively
The input terminal of contrast module (22) and liquid crystal display (23) is connected to, the processor (19) is also two-way to be electrically connected with memory module
(24), input terminal of the output terminal of the temperature sensor (7) also with contrast module (22) is electrically connected, the contrast module (22)
Output terminal be electrically connected with the input terminal of feedback module (20).
2. a kind of bus duct with control high-low pressure busbar installation temperature function according to claim 1, its feature exist
In:The adjustment module (21) includes node one (25) and node two (26), and the output of node one (25) and node two (26)
The input terminal with processor (19) is held to be electrically connected.
3. a kind of bus duct with control high-low pressure busbar installation temperature function according to claim 1, its feature exist
In:The heat-conducting plate (8) is copper coin, and the water channel (11) is in continuous S-shaped.
4. a kind of bus duct with control high-low pressure busbar installation temperature function according to claim 1, its feature exist
In:The area of thermal insulation board (9) upper surface is identical with the area of heat sink (10) lower surface, thermal insulation board (9) lower surface
Area it is identical with the area of heat-conducting plate (8) upper surface, the thermal insulation board (9) is vacuum insulation panel.
5. a kind of bus duct with control high-low pressure busbar installation temperature function according to claim 1, its feature exist
In:The water pump (13) is micro pump, the model CSP24120 of the water pump (13).
6. a kind of bus duct with control high-low pressure busbar installation temperature function according to claim 1, its feature exist
In:Model MSP430G2x53, the MSP430G2x13 mixed signal microprocessor of the processor (19), the processor
(19) packaging pin is 32 feet, and the maximum operating frequency of the processor (19) is 16MHz, and the processor (19) has 24
A I/O pins for supporting touch-sensing, the operating voltage range of the processor (19) is 1.8 to 3.6 volts.
7. a kind of bus duct with control high-low pressure busbar installation temperature function according to claim 1, its feature exist
In:The air intake of the radiator fan (16) is directed toward the upper surface of heat sink (10), the both ends difference of the bar v notch v (17)
Front and back positioned at heat sink (10).
8. a kind of bus duct with control high-low pressure busbar installation temperature function according to claim 1, its feature exist
In:The model WRM-101 of the temperature sensor (7), the temperature-measuring range of the temperature sensor (7) are Celsius for 0-1350
Degree.
Priority Applications (1)
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CN201721309773.3U CN207320771U (en) | 2017-10-12 | 2017-10-12 | A kind of bus duct with control high-low pressure busbar installation temperature function |
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CN201721309773.3U CN207320771U (en) | 2017-10-12 | 2017-10-12 | A kind of bus duct with control high-low pressure busbar installation temperature function |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107508227A (en) * | 2017-10-12 | 2017-12-22 | 威腾电气集团股份有限公司 | A kind of bus duct with control high-low pressure bus installation temperature |
CN108819004A (en) * | 2018-06-25 | 2018-11-16 | 界首市连生塑业有限公司 | A kind of plastic processing intelligent temperature control equipment |
-
2017
- 2017-10-12 CN CN201721309773.3U patent/CN207320771U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107508227A (en) * | 2017-10-12 | 2017-12-22 | 威腾电气集团股份有限公司 | A kind of bus duct with control high-low pressure bus installation temperature |
CN108819004A (en) * | 2018-06-25 | 2018-11-16 | 界首市连生塑业有限公司 | A kind of plastic processing intelligent temperature control equipment |
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