CN107508227A - A kind of bus duct with control high-low pressure bus installation temperature - Google Patents
A kind of bus duct with control high-low pressure bus installation temperature Download PDFInfo
- Publication number
- CN107508227A CN107508227A CN201710945167.9A CN201710945167A CN107508227A CN 107508227 A CN107508227 A CN 107508227A CN 201710945167 A CN201710945167 A CN 201710945167A CN 107508227 A CN107508227 A CN 107508227A
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- China
- Prior art keywords
- water
- heat
- heat sink
- processor
- bus duct
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
- H02G5/06—Totally-enclosed installations, e.g. in metal casings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
- H02G5/10—Cooling
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of bus duct with control high-low pressure bus installation temperature, including upper casing and lower casing, the upper casing and lower casing, installing plate one and installing plate two are installed with respectively on the inwall of the upper casing and lower casing, neck one is offered on the inwall of the installing plate one, the position that neck one is corresponded on the inwall of installing plate two offers neck two, temperature sensor is installed with the inner bottom wall of the installing plate one, the upper surface of the upper casing is welded with the lower surface of heat-conducting plate, the upper surface of the heat-conducting plate is bonded with the lower surface of thermal insulation board, the upper surface of the thermal insulation board is fixedly connected with the lower surface of heat sink.This has the bus duct of control high-low pressure bus installation temperature, by being installed with temperature sensor on installing plate one, the temperature of bus duct can be detected in real time, shown by LCDs, both convenient use persons bus duct installs temperature during bus, is easy to user to operate.
Description
Technical field
The present invention relates to bus duct technical field, specially a kind of bus with control high-low pressure bus installation temperature
Groove.
Background technology
Bus duct, it is a kind of metal device for the closing being made up of copper, aluminium busbar post, for for each element of decentralized system
Distribute relatively high power, due to building, factory etc. it is various building electric power needs, and it is this need increased trend year by year,
Many difficulties are brought using original circuit wiring pattern, i.e. poling mode, during construction, moreover, when distribution system to be changed,
It is become simple, some are nearly impossible, however, if using bus duct, very easy can reaches mesh
, also building can be made to become more attractive in appearance in addition.For economic aspect, bus duct is in itself compared with cable, price one
A bit, but construction cost can be made conveniently using bus duct compared with the various annexes comprising distribution and whole power system
Preferably more, particularly current capacity it is big in the case of, situation is with regard to more obvious.
The material of bus duct is typically metal, at the same temperature the heat absorption capacity of metal than plastics and it is wooden will be strong,
And temperature range of the bus duct when installing bus needs to control in five degrees below zero to 40 degree, and existing bus duct does not have more
The function of standby control bus installation temperature, is not easy to the installation that operating personnel carry out bus in bus duct.
The content of the invention
(1) technical problem solved
In view of the shortcomings of the prior art, the invention provides a kind of bus with control high-low pressure bus installation temperature
Groove, solve the problems, such as to propose in background technology.
(2) technical scheme
To realize object above, the present invention is achieved by the following technical programs：One kind has control high-low pressure bus
The bus duct of temperature is installed, including upper casing and lower casing, the upper casing and lower casing, is fixed respectively on the inwall of the upper casing and lower casing
Installing plate one and installing plate two are installed, offer neck one on the inwall of the installing plate one, on the inwall of installing plate two
The position of corresponding neck one offers neck two, and temperature sensor is installed with the inner bottom wall of the installing plate one, described
The upper surface of upper casing is welded with the lower surface of heat-conducting plate, and the upper surface of the heat-conducting plate is bonded with the lower surface of thermal insulation board, described
The upper surface of thermal insulation board is fixedly connected with the lower surface of heat sink.
The inside of the heat-conducting plate offers water channel, and the water inlet end of the water channel and water side are respectively positioned on the right side of heat-conducting plate
Face, and the water inlet end of water channel is located at the rear side of its water side, the inside of the heat sink offers cavity, the right side of the heat-conducting plate
Side and positioned at water channel water inlet end and water side between be installed with water pump, the water side of the water pump and the water inlet of water channel
End connection, the water inlet end of the water pump fix the water side for being communicated with communicating pipe one, and the water inlet end of the communicating pipe one is through scattered
The right side wall of hot plate simultaneously connects with the inside of cavity, and the water inlet end for being communicated with communicating pipe two, institute are fixed in the water side of the water channel
The water side for stating communicating pipe two also extends through the right side wall of heat sink and connected with the inside of cavity, and the water inlet end of communicating pipe one and
The water side of communicating pipe two is located at the both ends of heat sink right flank respectively.
The upper surface of the heat sink is provided with radiator fan, and the corner of radiator fan and heat sink upper surface corner are equal
Connection is screwed, the position that the heat sink upper surface corresponds to radiator fan offers nine bar shapeds being spaced substantially equidistant
Breach, the right flank of the heat sink are installed with indicator lamp.
The output end of the temperature sensor is electrically connected with the input of processor, and the input of the processor is also distinguished
It is electrically connected with feedback module and the input of adjustment module, output end and water pump, radiator fan and the indicator lamp of the processor
Input electrical connection, the output end of the processor is electrically connected the input of contrast module and liquid crystal display, institute
State that processor is also two-way to be electrically connected with memory module, the input of the output end of the temperature sensor also with contrast module is electrically connected
Connect, the output end of the contrast module electrically connects with the input of feedback module.
Preferably, the adjustment module includes node one and node two, and the output end of node one and node two with place
Manage the input electrical connection of device.
Preferably, the heat-conducting plate is copper coin, and the water channel is in continuous S-shaped.
Preferably, the area of the thermal insulation board upper surface is identical with the area of heat sink lower surface, the thermal insulation board following table
The area in face is identical with the area of heat-conducting plate upper surface, and the thermal insulation board is vacuum insulation panel.
Preferably, the water pump is micro pump, the model CSP24120 of the water pump.
Preferably, model MSP430G2x53, the MSP430G2x13 mixed signal microprocessor of the processor, it is described
The packaging pin of processor is 32 pin, and the maximum operating frequency of the processor is 16MHZ, and the processor has 24 supports
The I/O pins of touch-sensing, the operating voltage range of the processor is 1.8 to 3.6 volts.
Preferably, the air intake of the radiator fan points to the upper surface of heat sink, the both ends difference of the bar v notch v
Positioned at the front and back of heat sink.
Preferably, the model WRM-101 of the temperature sensor, the temperature-measuring range of the temperature sensor is 0-1350
Degree Celsius.
(3) beneficial effect
The invention provides a kind of bus duct with control high-low pressure bus installation temperature, possesses following beneficial effect：
(1), the bus duct of temperature should be installed with control high-low pressure bus, by being installed with temperature on installing plate one
Sensor is spent, the temperature of bus duct can be detected in real time, be shown by LCDs, convenient use person two
Person's bus duct installs temperature during bus, is easy to user to operate.
(2), tune should be electrically connected with by the input of processor with the bus duct of control high-low pressure bus installation temperature
The output end of module is saved, the setting of bus duct temperature can be carried out using node one and node two, is easy to user by bus duct
Temperature control in the temperature of needs.
(3), cavity should be offered by the inside of heat sink with the bus duct of control high-low pressure bus installation temperature,
The right flank of heat-conducting plate and positioned at water channel water inlet end and water side between be installed with water pump, existed in coolant by water pump
Circulated between cavity and water channel, the heat that the coolant in water channel absorbs upper casing by heat-conducting plate heat conduction enters in cavity, radiating
Fan running accelerates the air velocity in bar v notch v on heat sink, accelerates heat and distributes, after coolant temperature declines in cavity
Enter back into water channel and absorb the heat of upper casing, can effectively cool for bus duct, solve the problems, such as to propose in background technology.
(4), should be bonded with the bus duct of control high-low pressure bus installation temperature by the upper surface of heat-conducting plate heat-insulated
The lower surface of plate, the upper surface of thermal insulation board are fixedly connected with the lower surface of heat sink, are thermally shielded using thermal insulation board, avoid radiating
Heat transfer in plate enters in heat-conducting plate and improves the temperature of heat-conducting plate, influences heat exchange efficiency.
Brief description of the drawings
Fig. 1 is structure right view of the present invention；
Fig. 2 is Section A-A figure in Fig. 1 of the present invention；
Fig. 3 is present system structural representation；
Fig. 4 is the structural representation of water channel of the present invention.
In figure：1 upper casing, 2 lower casings, 3 installing plates one, 4 installing plates two, 5 necks one, 6 necks two, 7 temperature sensors, 8 are led
Hot plate, 9 thermal insulation boards, 10 heat sinks, 11 water channels, 12 cavitys, 13 water pumps, 14 communicating pipes one, 15 communicating pipes two, 16 radiator fans,
17 v notch vs, 18 indicator lamps, 19 processors, 20 feedback modules, 21 adjustment modules, 22 contrast modules, 23 liquid crystal displays, 24
Memory module, 25 nodes one, 26 nodes two.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Fig. 1-4 are referred to, the present invention provides a kind of technical scheme：A kind of mother with control high-low pressure bus installation temperature
Installing plate one is installed with respectively on the inwall of wire casing, including upper casing 1 and lower casing 2, upper casing 1 and lower casing 2, upper casing 1 and lower casing 2
3 and installing plate 24, neck 1 is offered on the inwall of installing plate 1, and the position of neck 1 is corresponded on the inwall of installing plate 24
Neck 26 is offered, temperature sensor 7, the model of temperature sensor 7 are installed with the inner bottom wall of installing plate 1
WRM-101, the temperature-measuring range of temperature sensor 7 is 0-1350 degrees Celsius, and temperature sensor 7 refers to that temperature can be experienced and is converted into
The sensor of usable output signal, the temperature inside the bus duct, the upper surface of upper casing 1 are detected in real time using temperature sensor 7
The lower surface of heat-conducting plate 8 is welded with, the upper surface of heat-conducting plate 8 is bonded with the lower surface of thermal insulation board 9, and the upper surface of thermal insulation board 9 is consolidated
Surely the lower surface of heat sink 10 is connected with, the area of the upper surface of thermal insulation board 9 is identical with the area of the lower surface of heat sink 10, thermal insulation board
The area of 9 lower surfaces is identical with the area of the upper surface of heat-conducting plate 8, and thermal insulation board 9 is vacuum insulation panel, and vacuum insulation panel is that vacuum is protected
One kind in adiabator, it is to be combined by filling core and vacuum protection top layer, it is effectively prevented from caused by cross-ventilation
Heat transfer, therefore thermal conductivity factor can be greatly lowered, less than 0.035w/ (㎡ .k), and any ODS materials are not contained, have
Environmentally friendly and energy-efficient characteristic, it is current thermal insulation material state-of-the-art in the world, is thermally shielded, kept away using thermal insulation board 9
Exempt from the heat transfer in heat sink 10 to enter in heat-conducting plate 8 and improve the temperature of heat-conducting plate 8, influence heat exchange efficiency.
The inside of heat-conducting plate 8 offers water channel 11, and heat-conducting plate 8 is copper coin, and water channel 11 is in continuous S-shaped, the water inlet of water channel 11
End and water side are respectively positioned on the right flank of heat-conducting plate 8, and the water inlet end of water channel 11 is located at the rear side of its water side, heat sink 10
Inside offers cavity 12, and water is installed between the right flank of heat-conducting plate 8 and water inlet end positioned at water channel 11 and water side
Pump 13, the water side of water pump 13 connect with the water inlet end of water channel 11, and water pump 13 is micro pump, the model of water pump 13
CSP24120, the small volume of the pump housing, is suitably applied on bus duct, and the water inlet end of water pump 13, which is fixed, is communicated with communicating pipe 1
Water side, the water inlet end of communicating pipe 1 through heat sink 10 right side wall and connected with the inside of cavity 12, water channel 11
The water inlet end for being communicated with communicating pipe 2 15 is fixed in water side, and the water side of communicating pipe 2 15 also extends through the right side wall of heat sink 10 simultaneously
Connected with the inside of cavity 12, and the water side of the water inlet end of communicating pipe 1 and communicating pipe 2 15 are right positioned at heat sink 10 respectively
The both ends of side, the injection coolant in water channel 11 and cavity 12, coolant can be water, and the work of water pump 13 makes cavity 12 and water
Coolant in road 11 forms circulation, is persistently radiated for the bus duct.
The upper surface of heat sink 10 is provided with radiator fan 16, and the corner of radiator fan 16 and the upper surface four of heat sink 10
Angle is screwed connection, and the position that the upper surface of heat sink 10 corresponds to radiator fan 16 offers nine and is spaced substantially equidistant
Bar v notch v 17, the right flank of heat sink are installed with indicator lamp 18, and the air intake of radiator fan 16 points to heat sink 10
Upper surface, the both ends of bar v notch v 17 are located at the front and back of heat sink 10 respectively, and coolant is by water pump 13 in cavity 12
Being circulated between water channel 11, the heat that the coolant in water channel 11 absorbs upper casing 1 by the heat conduction of heat-conducting plate 8 enters in cavity 12,
The air velocity on heat sink 10 in bar v notch v 17 is accelerated in the operating of radiator fan 16, accelerates heat and distributes, is cooled down in cavity 12
Liquid temperature degree enters back into water channel 11 heat for absorbing upper casing 1 after declining.
The output end of temperature sensor 7 is electrically connected with the input of processor 19, and the input of processor 19 is also electric respectively
It is connected with feedback module 20 and the input of adjustment module 21, the output end of processor 19 and water pump 13, radiator fan 16 and refers to
Show the input electrical connection of lamp 18, indicator lamp 18 lights when water pump 13 works with radiator fan 16, water pump 13 and radiator fan 16
Indicator lamp 18 is closed when not working, and the output end of processor 19 is electrically connected the defeated of contrast module 22 and liquid crystal display 23
Enter end, processor 19 is also two-way to be electrically connected with memory module 24, the input of the output end of temperature sensor 7 also with contrast module 22
End electrical connection, the output end of contrast module 22 electrically connects with the input of feedback module 20, using the design temperature of adjustment module 21,
Adjust in information deposit memory module 24, the work of water pump 13 cools for bus duct, and temperature sensor 7 detects the temperature in bus duct
Degree, is contrasted by the contrasting detection temperature of contrast module 22 and design temperature, and temperature does not reach design temperature water pump 13 and radiation air
Fan 16 continuous firings to be radiated, reach design temperature water pump 13 and radiator fan 16 is stopped, adjustment module 21 includes section
Point 1 and node 2 26, and input of the output end of node 1 and node 2 26 with processor 19 electrically connects, processing
Model MSP430G2x53, the MSP430G2x13 mixed signal microprocessor of device 19, the packaging pin of processor 19 is 32 pin,
The maximum operating frequency of processor 19 is 16MHZ, and processor 19 has the I/O pins of 24 support touch-sensings, processor 19
Operating voltage range be 1.8 to 3.6 volts.
In use, user is stored in memory module 24 by using the design temperature of adjustment module 21, regulation information, water pump
13 work for bus duct cool, temperature sensor 7 detect bus duct in temperature, by the contrasting detection temperature of contrast module 22 with
Design temperature contrasts, and temperature does not reach design temperature water pump 13 and the continuous firing of radiator fan 16 is radiated, and reaches setting temperature
Degree water pump 13 and radiator fan 16 are stopped.
In summary, should be pacified with the bus duct of control high-low pressure bus installation temperature by being fixed on installing plate 1
Equipped with temperature sensor 7, the temperature of bus duct can be detected in real time, be shown by LCDs 23, side
Just temperature during both users bus duct installation bus, is easy to user to operate.
This has the bus duct of control high-low pressure bus installation temperature, and regulation is electrically connected with by the input of processor 19
The output end of module 21, the setting of bus duct temperature can be carried out using node 1 and node 2 26, is easy to user by mother
The temperature control of wire casing is in the temperature of needs.
This has the bus duct of control high-low pressure bus installation temperature, and cavity 12 is offered by the inside of heat sink 10,
The right flank of heat-conducting plate 8 and positioned at water channel 11 water inlet end and water side between be installed with water pump 13, pass through in coolant
Water pump 13 circulates between cavity 12 and water channel 11, and the coolant in water channel 11 absorbs the heat of upper casing 1 by the heat conduction of heat-conducting plate 8
Into in cavity 12, the air velocity on heat sink 10 in bar v notch v 17 is accelerated in the operating of radiator fan 16, accelerates heat and distributes,
Coolant temperature enters back into water channel 11 heat for absorbing upper casing 1 in cavity 12 after declining, and effectively can cool for bus duct,
Solve the problems, such as to propose in background technology.
This has the bus duct of control high-low pressure bus installation temperature, and thermal insulation board 9 is bonded with by the upper surface of heat-conducting plate 8
Lower surface, the upper surface of thermal insulation board 9 is fixedly connected with the lower surface of heat sink 10, is thermally shielded using thermal insulation board 9, avoids dissipating
Heat transfer in hot plate 10 enters in heat-conducting plate 8 and improves the temperature of heat-conducting plate 8, influences heat exchange efficiency.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply and deposited between these entities or operation
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Nonexcludability includes, so that process, method, article or equipment including a series of elements not only will including those
Element, but also the other element including being not expressly set out, or it is this process, method, article or equipment also to include
Intrinsic key element.In the absence of more restrictions.The electric elements occurred in this article with the external world main controller and
220V civil powers electrically connect, and main controller can be the conventionally known equipment that computer etc. plays control.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of changes, modification can be carried out to these embodiments, replace without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (8)
1. a kind of bus duct with control high-low pressure bus installation temperature, including upper casing (1) and lower casing (2), the upper casing (1)
With lower casing (2), installing plate one (3) and installing plate two (4) are installed with respectively on the inwall of the upper casing (1) and lower casing (2),
Neck one (5) is offered on the inwall of the installing plate one (3), the position of neck one (5) is corresponded on described (4) inwall of installing plate two
Put and offer neck two (6), and be characterised by：Temperature sensor is installed with the inner bottom wall of the installing plate one (3)
(7), the upper surface of the upper casing (1) is welded with the lower surface of heat-conducting plate (8), the upper surface of the heat-conducting plate (8) be bonded with every
The lower surface of hot plate (9), the upper surface of the thermal insulation board (9) are fixedly connected with the lower surface of heat sink (10)；
The inside of the heat-conducting plate (8) offers water channel (11), and the water inlet end of the water channel (11) and water side are respectively positioned on heat conduction
The right flank of plate (8), and the water inlet end of water channel (11) is located at the rear side of its water side, the inside of the heat sink (10) offers
Cavity (12), the right flank of the heat-conducting plate (8) and positioned at water channel (11) water inlet end and water side between be installed with water
Pump (13), the water side of the water pump (13) are connected with the water inlet end of water channel (11), and the water inlet end of the water pump (13), which is fixed, to be connected
Be connected with the water side of communicating pipe one (14), the water inlet end of the communicating pipe one (14) through heat sink (10) right side wall and with sky
The water inlet end for being communicated with communicating pipe two (15), the connection are fixed in the inside connection of chamber (12), the water side of the water channel (11)
The water side of pipe two (15) also extends through the right side wall of heat sink (10) and connected with the inside of cavity (12), and communicating pipe one (14)
Water inlet end and the water side of communicating pipe two (15) respectively be located at heat sink (10) right flank both ends；
The upper surface of the heat sink (10) is provided with radiator fan (16), and the corner of radiator fan (16) and heat sink (10)
Upper surface corner is screwed connection, and the position that heat sink (10) upper surface corresponds to radiator fan (16) offers
Nine bar v notch vs (17) being spaced substantially equidistant, the right flank of the heat sink are installed with indicator lamp (18).
The output end of the temperature sensor (7) is electrically connected with the input of processor (19), the input of the processor (19)
End is also electrically connected feedback module (20) and the input of adjustment module (21), the output end and water of the processor (19)
The input electrical connection of pump (13), radiator fan (16) and indicator lamp (18), the output end of the processor (19) are electrically connected respectively
The input of contrast module (22) and liquid crystal display (23) is connected to, the processor (19) is also two-way to be electrically connected with memory module
(24), input of the output end of the temperature sensor (7) also with contrast module (22) electrically connects, the contrast module (22)
Output end electrically connected with the input of feedback module (20).
A kind of 2. bus duct with control high-low pressure bus installation temperature according to claim 1, it is characterised in that：Institute
Stating adjustment module (21) includes node one (25) and node two (26), and the output end of node one (25) and node two (26) with
The input electrical connection of processor (19).
A kind of 3. bus duct with control high-low pressure bus installation temperature according to claim 1, it is characterised in that：Institute
It is copper coin to state heat-conducting plate (8), and the water channel (11) is in continuous S-shaped.
A kind of 4. bus duct with control high-low pressure bus installation temperature according to claim 1, it is characterised in that：Institute
It is identical with the area of heat sink (10) lower surface to state the area of thermal insulation board (9) upper surface, the area of thermal insulation board (9) lower surface
Identical with the area of heat-conducting plate (8) upper surface, the thermal insulation board (9) is vacuum insulation panel.
A kind of 5. bus duct with control high-low pressure bus installation temperature according to claim 1, it is characterised in that：Institute
It is micro pump to state water pump (13), the model CSP24120 of the water pump (13).
A kind of 6. bus duct with control high-low pressure bus installation temperature according to claim 1, it is characterised in that：Institute
Model MSP430G2x53, the MSP430G2x13 mixed signal microprocessor of processor (19) is stated, the processor (19)
Packaging pin is 32 pin, and the maximum operating frequency of the processor (19) is 16MHZ, and the processor (19) has 24 supports
The I/O pins of touch-sensing, the operating voltage range of the processor (19) is 1.8 to 3.6 volts.
A kind of 7. bus duct with control high-low pressure bus installation temperature according to claim 1, it is characterised in that：Institute
The air intake for stating radiator fan (16) points to the upper surface of heat sink (10), and the both ends of the bar v notch v (17) are respectively positioned at scattered
The front and back of hot plate (10).
A kind of 8. bus duct with control high-low pressure bus installation temperature according to claim 1, it is characterised in that：Institute
The model WRM-101 of temperature sensor (7) is stated, the temperature-measuring range of the temperature sensor (7) is 0-1350 degrees Celsius.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710945167.9A CN107508227A (en) | 2017-10-12 | 2017-10-12 | A kind of bus duct with control high-low pressure bus installation temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710945167.9A CN107508227A (en) | 2017-10-12 | 2017-10-12 | A kind of bus duct with control high-low pressure bus installation temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107508227A true CN107508227A (en) | 2017-12-22 |
Family
ID=60700932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710945167.9A Pending CN107508227A (en) | 2017-10-12 | 2017-10-12 | A kind of bus duct with control high-low pressure bus installation temperature |
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| CN110031120A (en) * | 2019-05-24 | 2019-07-19 | 马克威尔(广州)电气有限公司 | Bus temperature measuring equipment |
| CN114725871A (en) * | 2022-05-24 | 2022-07-08 | 艾博母线有限公司 | Internal temperature and humidity adjusting device and system for bus duct |
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| CN114725871B (en) * | 2022-05-24 | 2024-01-26 | 艾博母线有限公司 | Internal temperature and humidity adjusting device and system for bus duct |
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Application publication date: 20171222 |
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