CN207854374U - Lathe electric cabinet - Google Patents
Lathe electric cabinet Download PDFInfo
- Publication number
- CN207854374U CN207854374U CN201721884170.6U CN201721884170U CN207854374U CN 207854374 U CN207854374 U CN 207854374U CN 201721884170 U CN201721884170 U CN 201721884170U CN 207854374 U CN207854374 U CN 207854374U
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- Prior art keywords
- babinet
- chilling plate
- semiconductor chilling
- cold
- wind turbine
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Abstract
The utility model discloses a kind of lathe electric cabinets, including babinet, heat shield, semiconductor chilling plate, cooling mechanism and cold scattering mechanism；The semiconductor chilling plate is embedded in the side wall of the babinet, and the chill surface and heating surface of semiconductor chilling plate are located at the inner side and outer side of babinet, and the heat shield is installed on the surrounding of semiconductor chilling plate for filling up the gap between babinet and semiconductor chilling plate；The cooling mechanism and cold scattering mechanism are respectively arranged in the lateral surface and medial surface of the side wall of the babinet, and the heat-absorbent surface of cooling mechanism is bonded with the heating surface of the semiconductor chilling plate and the suction huyashi-chuuka (cold chinese-style noodles) of cold scattering mechanism is bonded with the chill surface of semiconductor chilling plate；The side wall of the babinet is equipped with multigroup refrigeration mechanism formed by the heat shield, semiconductor chilling plate, cooling mechanism and cold scattering mechanism.The utility model improves the heat dissipation performance of electric cabinet, completely cuts off influence of the external environment to control system, while improving the safe class of electric cabinet.
Description
Technical field
The utility model is related to numerical control machine tool technique fields, and in particular to a kind of lathe electric cabinet.
Background technology
Numerically-controlled machine tool is the abbreviation of numerically-controlled machine tool, is a kind of automated machine tool equipped with program control system.The control
System processed can be handled logically with control coding or other symbolic instruction regulated procedures, and be decoded, with code
Digital representation, numerical control device is inputted by information carrier.Various control signals are sent out by numerical control device through calculation process, are controlled
The action of lathe, shape and size by drawing, automatically processes part.And control system is installed on electric cabinet
In, electric cabinet separates external environment and control system, and external environment is avoided so that control system is stablized the influence of numerical control device
Work.
Application No. is：The patent of CN201620220573.X discloses a kind of numerically-controlled machine tool of built-in electronic box air-conditioning system.
It includes closed electronic box and the air-conditioning system for cooling down closed electronic box, and closed electronic box is connect with air-conditioning system；Institute
It includes cooling fan to state air-conditioning system, and the cooling fan includes air-supply flabellum coolant delivery pipeline heat dissipation pipe fitting and heat radiating fin
Radiate pipe fitting and radiating fin group of piece group is both provided with multiple, and multiple heat dissipation pipe fittings are arranged in parallel and are series at coolant liquid and convey
Pipeline, radiating fin group are set between two adjacent heat dissipation pipe fittings；The air-conditioning system further includes the parent plate that leaks out, and is leaked out
Parent plate is provided with wind conveying pipe road, and one end of wind conveying pipe road is provided with air outlet, and air-supply flabellum is set to the side of air outlet, institute
Air outlet is stated to be connected with closed electronic box.
In place of above-mentioned built-in electronic box air-conditioning comes with some shortcomings, for example it serves as the medium of heat transmission by coolant liquid, and
Coolant delivery pipeline can cause coolant delivery pipeline to rupture, cool down by use or accident collision etc. for a long time
The case where liquid is revealed, coolant delivery pipeline, which once ruptures, will cause cooling system to lose refrigerating function, more seriously, cold
But liquid is leaked into electric cabinet and causes serious damage to internal circuit, it could even be possible to fire thus occurs.In addition, its
Cooling principle is using coolant liquid by the heat transfer to radiating fin inside electric cabinet, using wind turbine to radiating fin into
Row wind cooling temperature lowering.Its cooling-down effect is not apparent enough, cannot be satisfied the requirement of the big numerically-controlled machine tool of calorific value.
Utility model content
For the defects in the prior art, the utility model provides a kind of lathe electric cabinet, to improve the heat dissipation of electric cabinet
Performance completely cuts off influence of the external environment to control system, while improving the safe class of electric cabinet.
The utility model provides a kind of lathe electric cabinet, including babinet, heat shield, semiconductor chilling plate, cooling mechanism and
Cold scattering mechanism；The semiconductor chilling plate is embedded in the side wall of the babinet, and the chill surface of semiconductor chilling plate and fever
Face is located at the inner side and outer side of babinet, and the heat shield is installed on the surrounding of semiconductor chilling plate for filling up babinet and half
Gap between conductor cooling piece；The cooling mechanism and cold scattering mechanism be respectively arranged in the side wall of the babinet lateral surface and
Medial surface, and the heat-absorbent surface of cooling mechanism is bonded with the heating surface of the semiconductor chilling plate and the suction of cold scattering mechanism is cold
Face is bonded with the chill surface of semiconductor chilling plate；The side wall of the babinet be equipped with it is multigroup by the heat shield, semiconductor chilling plate,
The refrigeration mechanism that cooling mechanism and cold scattering mechanism are formed.
Preferably, the cooling mechanism includes radiator, the first wind turbine and the second wind turbine；First assembling is in institute
The air intake in the front and the first wind turbine of stating the heat dissipation grid of radiator is opposite with heat dissipation grid, and second assembling is in described
Radiate grid side and the second wind turbine outlet air end with radiate grid it is opposite；The heat sink of the radiator is fixed on the babinet
Side wall, and the heat-absorbent surface of heat sink is bonded with the heating surface of the semiconductor chilling plate.The air intake of first wind turbine will dissipate
In most of heat diffusion to air of hot grid, the temperature of heat dissipation grid is made to reduce；Second wind turbine accelerates the sky inside heat dissipation grid
Air-flow is logical, makes heat diffusion faster, improves the heat-sinking capability of heat dissipation grid.
Preferably, second wind turbine is equipped with the same side that multiple and multiple second wind turbines are respectively positioned on heat dissipation grid.
The heat-sinking capability of radiator is further improved, in time takes away the heat of heat sink, ensures the heating surface of semiconductor chilling plate
Temperature control in the normal temperature range.
Preferably, thermal conducting agent is filled between the heat-absorbent surface of the heat sink and the heating surface of the semiconductor chilling plate.
Thermal conducting agent is heat conductive silica gel, and the temperature of heating surface is expeditiously transmitted on heat sink, improves the efficiency of heat transfer.
Preferably, the cold scattering mechanism includes cooler and third wind turbine；The third assembling is in the cooler
Cold scattering grid front, and the outlet air end of third wind turbine is opposite with cold scattering grid；The cold radiation plate of the cooler is fixed on described
The side wall of babinet, and the cold scattering face of cold radiation plate is bonded with the chill surface of the semiconductor chilling plate.Cooler is by semiconductor system
The cold air of cold chill surface is efficiently transferred in air, and third wind turbine accelerates the diffusion of general mood, improves in babinet
The cycle of portion's air-flow prevents box interior temperature uneven, and local temperature is excessively high.
Preferably, thermal conducting agent is filled between the cold scattering face of the cold radiation plate and the chill surface of the semiconductor chilling plate.
Preferably, further include controller, the first temperature sensor and operation panel；The controller and the first temperature sensing
Device is mounted on the inside of the babinet, and the operation panel is installed on the lateral surface of the roof of the babinet, and is controlled
The input terminal of device is conductively connected with first temperature sensor and operation panel respectively, the output end of controller respectively with it is described
Semiconductor chilling plate, the first wind turbine, the second wind turbine and third wind turbine are conductively connected.Opening for refrigeration mechanism is set by control panel
Dynamic temperature, controller detect the temperature of box house by the first temperature sensor, when the temperature of box house is warm higher than starting
After degree, controller makes cooling piece, the first wind turbine, the second wind turbine and third blower fan work cool down, to make the temperature in babinet
Degree remains at start-up temperature once, and the control system of lathe is made to work normally.
Preferably, first temperature sensor set there are two and one of them be installed on the roof of the babinet, separately
An outer bottom wall for being installed on babinet.For large-scale numerically-controlled machine tool, the volume of babinet is larger, and internal temperature may go out
Existing ladder distribution carries out temperature acquisition to the upper and lower part in babinet simultaneously by two the first temperature sensors, makes temperature
Detection is more accurate.
Preferably, the medial surface of the roof is equipped with the output end conduction with the controller of headlamp and headlamp
Connection.At dark or night, headlamp is opened by operation panel, keeps good sight.
Preferably, the lateral surface of the roof is additionally provided with display and second temperature sensor, and the display with
The output end of the controller is conductively connected, and the second temperature sensor and the input terminal of the controller are conductively connected.It is logical
It crosses the first temperature sensor and second temperature sensor box house and external temperature are shown on display, and shows
Show that device also shows the rotating speed of the first wind turbine, the second wind turbine and third wind turbine, can intuitively see the first wind turbine, second
The working condition of wind turbine and third wind turbine, the convenient failure for finding wind turbine in time and not rotating.
The beneficial effects of the utility model are embodied in：
The utility model includes babinet, heat shield, semiconductor chilling plate, cooling mechanism and cold scattering mechanism, the semiconductor
Cooling piece is embedded in the side wall of the babinet.Babinet is other than dodge gate, without others ventilation opening, the temperature of box house
Be transmitted to external environment by semiconductor chilling plate, and then keep babinet completely separated with the external world, avoid external environment dust,
Steam etc. enters babinet, provides a good working environment for the machine tool control system of box house, keeps its work more steady
It is fixed.The surrounding that the heat shield is installed on semiconductor chilling plate is used to fill up the gap between babinet and semiconductor chilling plate, every
Backing not only improves the leakproofness of babinet, it is often more important that completely separates the heating surface of semiconductor chilling plate and chill surface
It opens, substantially increases the refrigeration effect of semiconductor chilling plate, prevent box house from being ganged up with external, lose refrigerating capacity.Institute
The side wall for stating babinet is equipped with multigroup refrigeration machine formed by the heat shield, semiconductor chilling plate, cooling mechanism and cold scattering mechanism
Structure.The quantity that refrigeration mechanism is rationally designed according to the calorific value of the size of babinet and control system, is allowed to meet control system
Radiating requirements especially meet the radiating requirements of the large-scale numerically-controlled machine tool either big control system of calorific value.
Description of the drawings
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific implementation mode or attached drawing needed to be used in the description of the prior art are briefly described.In all the appended drawings, similar
Element or part are generally identified by similar reference numeral.In attached drawing, each element or part might not be according to actual ratios
It draws.
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the vertical view of Fig. 1；
Fig. 3 is the left view of Fig. 1；
Fig. 4 is the structural schematic diagram after removal cooling mechanism in Fig. 3；
Fig. 5 is the enlarged drawing at A in Fig. 1.
In attached drawing, 1- babinets, 2- heat shields, 3- semiconductor chilling plates, 4- thermal conducting agents, 5- cooling mechanisms, 6- radiators, 7-
First wind turbine, the second wind turbines of 8-, 9- heat dissipation grid, 10- heat sinks, 11- cold scatterings mechanism, 12- coolers, 13- third wind turbines, 14-
Cold scattering grid, 15- cold radiation plates, 16- headlamps, 17- dodge gates, 18- controllers, the first temperature sensors of 19-, 20- operation panels,
21- second temperature sensors, 22- displays
Specific implementation mode
The embodiment of technical solutions of the utility model is described in detail below in conjunction with attached drawing.Following embodiment is only
For clearly illustrating the technical solution of the utility model, therefore it is only used as example, and this practicality cannot be limited with this
Novel protection domain.
It should be noted that unless otherwise indicated, technical term or scientific terminology used in this application should be this reality
The ordinary meaning understood with novel one of ordinary skill in the art.
As shown in Figure 1, a kind of lathe electric cabinet is present embodiments provided, including babinet 1, heat shield 2, semiconductor chilling plate
3, cooling mechanism 5 and cold scattering mechanism 11.Semiconductor chilling plate 3 is embedded in the side wall of babinet 1, and the system of semiconductor chilling plate 3
Huyashi-chuuka (cold chinese-style noodles) and heating surface are located at the inner side and outer side of babinet 1.Babinet 1 is other than dodge gate 17, no others ventilation openings,
Temperature inside babinet 1 is transmitted to external environment by semiconductor chilling plate 3, and then keeps babinet 1 completely separated with the external world, avoids
The dust of external environment, steam etc. enter babinet 1, for the machine tool control system inside babinet 1 provide a good job
Environment makes its work more stablize.Semiconductor chilling plate 3 is also thermoelectric module, when direct current passes through two kinds of different semiconductors
Material in series at galvanic couple when, the both ends of galvanic couple can absorb respectively heat and release heat, may be implemented refrigeration purpose.
It avoids using refrigerating fluid as heat-conducting medium, the case where damaging the circuit inside babinet 1 is revealed from without refrigerating fluid,
Improve safe class.Heat shield 2 be installed on the surrounding of semiconductor chilling plate 3 for fill up babinet 1 and semiconductor chilling plate 3 it
Between gap, heat shield 2 not only improves the leakproofness of babinet 1, it is often more important that by the heating surface and system of semiconductor chilling plate 3
Huyashi-chuuka (cold chinese-style noodles) completely separates, and substantially increases the refrigeration effect of semiconductor chilling plate 3, prevents babinet 1 is inside and outside from ganging up,
Lose refrigerating capacity.Cooling mechanism 5 and cold scattering mechanism 11 are respectively arranged in the lateral surface and medial surface of the side wall of babinet 1, and
The heat-absorbent surface of cooling mechanism 5 is bonded with the heating surface of semiconductor chilling plate 3 and the suction huyashi-chuuka (cold chinese-style noodles) of cold scattering mechanism 11 and semiconductor system
Cold 3 chill surface fitting.Semiconductor chilling plate 3 by cooling mechanism 5 by the heat diffusion to air of heating surface, by dissipating
The cold air of chill surface is diffused into babinet 1 by cold structure 11.
As shown in Figure 3 and Figure 5, cooling mechanism 5 includes radiator 6, the first wind turbine 7 and the second wind turbine 8.Wherein radiator 6
Including heat dissipation grid 9 and heat sink 10, heat dissipation grid 9 include multiple heat sink strips, and multiple heat sink strips are mutually parallel and vertically fixed connect
It is connected to the back side of heat sink 10, the front of heat sink 10 is heat-absorbent surface.First wind turbine 7 is being installed on the heat dissipation grid 9 of radiator 6 just
The air intake of face and the first wind turbine 7 is opposite with heat dissipation grid 9, and front here refers to being put down with what the end of multiple heat sink strips was formed
Face.Second wind turbine 8 is installed on the side of heat dissipation grid 9 and the outlet air end of the second wind turbine 8 is opposite with heat dissipation grid 9, side here
It is for the front of heat dissipation grid 9.The heat sink 10 of radiator 6 is fixed on the side wall of babinet 1, and the suction of heat sink 10
Hot face is bonded with the heating surface of semiconductor chilling plate 3.The air intake of first wind turbine 7 arrives the most of heat diffusion for the grid 9 that radiate
In air, the temperature of heat dissipation grid 9 is made to reduce；Second wind turbine 8 accelerates the air circulation inside heat dissipation grid 9, makes heat diffusion more
Soon, the heat-sinking capability of heat dissipation grid 9 is improved.Wherein the first wind turbine 7 and the second wind turbine 8 and heat dissipation grid 9 between and heat sink 10 with
It is bolted between the side wall of babinet 1.Second wind turbine 8 is equipped with multiple and multiple second wind turbines 8 and is respectively positioned on heat dissipation grid 9
The same side.The heat-sinking capability of radiator 6 is further improved, in time takes away the heat of heat sink 10, guarantee is partly led
The temperature control of the heating surface of body cooling piece 3 is in the normal temperature range.The heat-absorbent surface of heat sink 10 and semiconductor chilling plate 3
Thermal conducting agent 4 is filled between heating surface.Thermal conducting agent 4 is heat conductive silica gel, and the temperature of heating surface is expeditiously transmitted to heat sink
On 10, the efficiency of heat transfer is improved.
As shown in figure 5, cold scattering mechanism 11 includes cooler 12 and third wind turbine 13.Wherein cooler 12 includes cold scattering grid 14
With cold radiation plate 15, cold scattering grid 14 include multiple cold scattering items, and multiple cold scattering items are mutually parallel and are vertically fixedly connected on cold radiation plate
The front at 15 back side, cold radiation plate 15 is cold scattering face.Third wind turbine 13 is installed on the front of the cold scattering grid 14 of cooler 12, and
The outlet air end of third wind turbine 13 is opposite with cold scattering grid 14.The cold radiation plate 15 of cooler 12 is fixed on the side wall of babinet 1, and cold scattering
The cold scattering face of plate 15 is bonded with the chill surface of semiconductor chilling plate 3.Cooler 12 is by the cold air of the chill surface of semiconductor chilling plate 3
It is efficiently transferred in air, third wind turbine 13 accelerates the diffusion of general mood, improves the cycle of 1 internal gas flow of babinet, prevents
Only 1 internal temperature of babinet is uneven, and local temperature is excessively high.The cold scattering face of cold radiation plate 15 and the chill surface of semiconductor chilling plate 3 it
Between be filled with thermal conducting agent 4.
As shown in Figure 1, Figure 2 and Figure 4, lathe electric cabinet provided in this embodiment further includes controller 18, the first temperature biography
Sensor 19 and operation panel 20.Controller 18 and the first temperature sensor 19 are mounted on the inside of babinet 1, wherein the first temperature
Sensor 19 set there are two and one of them be installed on the roof of babinet 1, another is installed on the bottom wall of babinet 1.For
For large-scale numerically-controlled machine tool, the volume of babinet 1 is larger, and internal temperature is likely to occur ladder distribution, passes through two first temperature
It spends sensor 19 and temperature acquisition is carried out to the upper and lower part in babinet 1 simultaneously, keep temperature detection more accurate.Operation panel 20
Be installed on the lateral surface of the roof of babinet 1, and the input terminal of controller 18 respectively with the first temperature sensor 19 and operation
Panel 20 is conductively connected, the output end of controller 18 respectively with semiconductor chilling plate 3, the first wind turbine 7, the second wind turbine 8 and third
Wind turbine 13 is conductively connected.The start-up temperature of refrigeration mechanism is set by control panel, controller 18 passes through the first temperature sensor
Temperature inside 19 detection babinets 1, after the temperature inside babinet 1 is higher than start-up temperature, controller 18 makes cooling piece, the first wind
Machine 7, the second wind turbine 8 and the work of third wind turbine 13 cool down, to make the temperature in babinet 1 remain at start-up temperature one
Under, so that the control system of lathe is worked normally.The medial surface of roof be equipped with headlamp 16 and headlamp 16 with controller 18
Output end be conductively connected.At dark or night, headlamp 16 is opened by operation panel 20, keeps good and regards
Line.The lateral surface of roof is additionally provided with display 22 and second temperature sensor 21, and the output of display 22 and controller 18
End is conductively connected, and second temperature sensor 21 and the input terminal of controller 18 are conductively connected.Pass through 19 He of the first temperature sensor
The inside and outside temperature of babinet 1 is shown on display 22 by second temperature sensor 21, and display 22 is also by
The rotating speed of one wind turbine 7, the second wind turbine 8 and third wind turbine 13 is shown, can intuitively see the first wind turbine 7, the second wind turbine 8
With the working condition of third wind turbine 13, the convenient failure for finding wind turbine in time and not rotating.
The refrigeration machine that heat shield 2, semiconductor chilling plate 3, cooling mechanism 5 and cold scattering mechanism 11 in the present embodiment are formed
The side wall of structure, babinet 1 is provided with multigroup such refrigeration mechanism, and every group of refrigeration mechanism is controlled by controller 18.According to
The calorific value of the size and control system of babinet 1 rationally designs the quantity of refrigeration mechanism, is allowed to meet the heat dissipation need of control system
It asks, especially meets the radiating requirements of the large-scale numerically-controlled machine tool either big control system of calorific value.
Finally it should be noted that：The above various embodiments is only to illustrate the technical solution of the utility model, rather than limits it
System；Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should
Understand：It still can be with technical scheme described in the above embodiments is modified, either to which part or whole
Technical characteristic carries out equivalent replacement；And these modifications or replacements, this practicality that it does not separate the essence of the corresponding technical solution are new
The range of each embodiment technical solution of type, should all cover in the claim of the utility model and the range of specification.
Claims (10)
1. a kind of lathe electric cabinet, it is characterised in that：Including babinet, heat shield, semiconductor chilling plate, cooling mechanism and cold scattering machine
Structure；The semiconductor chilling plate is embedded in the side wall of the babinet, and the chill surface of semiconductor chilling plate and heating surface difference
Positioned at the inner side and outer side of babinet, the heat shield is installed on the surrounding of semiconductor chilling plate for filling up babinet and semiconductor system
Gap between cold；The cooling mechanism and cold scattering mechanism are respectively arranged in lateral surface and the inside of the side wall of the babinet
Face, and the heat-absorbent surface of cooling mechanism be bonded with the heating surface of the semiconductor chilling plate and the suction huyashi-chuuka (cold chinese-style noodles) of cold scattering mechanism with
The chill surface of semiconductor chilling plate is bonded；The side wall of the babinet is equipped with multigroup by the heat shield, semiconductor chilling plate, heat dissipation
The refrigeration mechanism that mechanism and cold scattering mechanism are formed.
2. lathe electric cabinet according to claim 1, it is characterised in that：The cooling mechanism includes radiator, the first wind
Machine and the second wind turbine；First assembling in the radiator heat dissipation grid front and the first wind turbine air intake with
The grid that radiate are opposite, and second assembling is in the outlet air end of the side of the heat dissipation grid and the second wind turbine and heat dissipation grid phase
It is right；The heat sink of the radiator is fixed on the side wall of the babinet, and the heat-absorbent surface of heat sink and the semiconductor refrigerating
The heating surface of piece is bonded.
3. lathe electric cabinet according to claim 2, it is characterised in that：Second wind turbine is equipped with multiple and multiple the
Two wind turbines are respectively positioned on the same side of heat dissipation grid.
4. lathe electric cabinet according to claim 2, it is characterised in that：The heat-absorbent surface of the heat sink and the semiconductor
Thermal conducting agent is filled between the heating surface of cooling piece.
5. lathe electric cabinet according to claim 2, it is characterised in that：The cold scattering mechanism includes cooler and third wind
Machine；The third assembling is in the front of the cold scattering grid of the cooler, and the outlet air end of third wind turbine and cold scattering grid phase
It is right；The cold radiation plate of the cooler is fixed on the side wall of the babinet, and the cold scattering face of cold radiation plate and the semiconductor refrigerating
The chill surface of piece is bonded.
6. lathe electric cabinet according to claim 5, it is characterised in that：The cold scattering face of the cold radiation plate and the semiconductor
Thermal conducting agent is filled between the chill surface of cooling piece.
7. lathe electric cabinet according to claim 5, it is characterised in that：Further include controller, the first temperature sensor and
Operation panel；The controller and the first temperature sensor are mounted on the inside of the babinet, and the operation panel is installed on
On the lateral surface of the roof of the babinet, and the input terminal of controller respectively with first temperature sensor and operation panel
It is conductively connected, the output end of controller is conductive with the semiconductor chilling plate, the first wind turbine, the second wind turbine and third wind turbine respectively
Connection.
8. lathe electric cabinet according to claim 7, it is characterised in that：First temperature sensor set there are two and
One of them is installed on the roof of the babinet, another is installed on the bottom wall of babinet.
9. lathe electric cabinet according to claim 7, it is characterised in that：The medial surface of the roof be equipped with headlamp and
Headlamp is conductively connected with the output end of the controller.
10. lathe electric cabinet according to claim 7, it is characterised in that：The lateral surface of the roof is additionally provided with display
And second temperature sensor, and the output end of the display and the controller is conductively connected, the second temperature sensing
The input terminal of device and the controller is conductively connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721884170.6U CN207854374U (en) | 2017-12-28 | 2017-12-28 | Lathe electric cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721884170.6U CN207854374U (en) | 2017-12-28 | 2017-12-28 | Lathe electric cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207854374U true CN207854374U (en) | 2018-09-11 |
Family
ID=63419753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721884170.6U Expired - Fee Related CN207854374U (en) | 2017-12-28 | 2017-12-28 | Lathe electric cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207854374U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519970A (en) * | 2019-09-09 | 2019-11-29 | 珠海格力电器股份有限公司 | Radiating assembly, electric cabinet and air conditioning unit |
| CN111251062A (en) * | 2020-03-13 | 2020-06-09 | 常州机电职业技术学院 | Cooling device for intelligent mechanical lathe machining |
-
2017
- 2017-12-28 CN CN201721884170.6U patent/CN207854374U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519970A (en) * | 2019-09-09 | 2019-11-29 | 珠海格力电器股份有限公司 | Radiating assembly, electric cabinet and air conditioning unit |
| CN111251062A (en) * | 2020-03-13 | 2020-06-09 | 常州机电职业技术学院 | Cooling device for intelligent mechanical lathe machining |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180911 Termination date: 20181228 |