CN115297671A - Heat dissipation module, heat dissipation system and server system - Google Patents
Heat dissipation module, heat dissipation system and server system Download PDFInfo
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- CN115297671A CN115297671A CN202210733429.6A CN202210733429A CN115297671A CN 115297671 A CN115297671 A CN 115297671A CN 202210733429 A CN202210733429 A CN 202210733429A CN 115297671 A CN115297671 A CN 115297671A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 165
- 239000007788 liquid Substances 0.000 claims abstract description 274
- 238000001816 cooling Methods 0.000 claims abstract description 150
- 239000012530 fluid Substances 0.000 claims abstract description 51
- 238000012546 transfer Methods 0.000 claims abstract description 9
- 230000003247 decreasing effect Effects 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims description 2
- 238000005192 partition Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 27
- 230000002708 enhancing effect Effects 0.000 description 10
- 238000007664 blowing Methods 0.000 description 5
- 239000012809 cooling fluid Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000004904 shortening Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The application discloses a heat dissipation module, a heat dissipation system and a server system. The heat dissipation module comprises a liquid cooling assembly and an air cooling assembly, wherein the liquid cooling assembly is provided with a liquid cooling cavity, a first liquid hole and a second liquid hole, the first liquid hole is communicated with the liquid cooling cavity, and the liquid cooling assembly comprises a plurality of first column fins arranged in the liquid cooling cavity; the air cooling assembly comprises a plurality of heat dissipation columns correspondingly connected with the first column fins, and the heat dissipation columns extend out of the liquid cooling cavity. Through the arrangement, liquid in the liquid cooling assembly flows among the plurality of first column fins to dissipate heat in the process that the liquid flows from the first liquid hole to the second liquid hole in the liquid cooling cavity, the heat dissipation columns in the air cooling assembly absorb heat in the first column fins and extend to the outside of the liquid cooling cavity to dissipate heat through air-cooled airflow, and the liquid cooling assembly and the air cooling assembly jointly act to improve the heat dissipation efficiency of the heat dissipation module; simultaneously, the setting of a plurality of first column fins in the liquid cooling intracavity has also effectively increased the quantity of runner in the thermal module group, has increased heat transfer area, has reduced the flow impedance, has promoted the heat transfer effect of fluid with the thermal module group simultaneously.
Description
Technical Field
The application mainly relates to liquid cooling heat dissipation technical field, especially relates to the heat dissipation technical field to high heat flux density liquid cooling board.
Background
The rapid development of artificial intelligence, cloud computing and big data technology makes the performance requirements of actual business on the bottom IT infrastructure higher and higher, directly leads to the trend that the power consumption of infrastructures such as servers and the like is rapidly increased, and the traditional air cooling mode is difficult to meet the heat dissipation requirement under the current high heat flux density.
Liquid cooling heat dissipation is gradually outstanding in high heat flux density heat dissipation solutions by virtue of the outstanding advantages of efficient heat dissipation, energy conservation, low noise, environmental protection, invisible elevation influence and the like, and a new revolution is brought to the development of servers and data centers. The liquid cooling plate, as a key component of the liquid cooling system, has a flow and heat transfer efficiency which directly determines the performance of the liquid cooling system.
In the prior art, the liquid cooling plates in the liquid cooling system generally have the problems of single flow passage quantity, large flow impedance and limited heat exchange effect between the fluid and the liquid cooling plates.
Disclosure of Invention
The application mainly provides a heat dissipation module, a heat dissipation system and a server system, and aims to solve the problems that the number of liquid cooling plate runners is single, the flow resistance is large, and the heat exchange effect between fluid and a liquid cooling plate is limited.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a heat dissipation module, including: the liquid cooling assembly is provided with a liquid cooling cavity, a first liquid hole and a second liquid hole, and the first liquid hole and the second liquid hole are communicated with the liquid cooling cavity;
the air cooling assembly comprises a plurality of heat dissipation columns correspondingly connected with the first column fins, and the heat dissipation columns extend out of the liquid cooling cavity.
The plurality of first column fins are distributed in the liquid cooling cavity in a plurality of rows along the flowing direction from the first liquid holes to the second liquid holes, and the first column fins in two adjacent rows are also distributed in a staggered manner.
The first column fin comprises a flow incoming part and a back flow part which are connected, the flow incoming part faces to one side where the first liquid hole is located, and the back flow part faces to one side where the second liquid hole is located;
the cross section area of the flow-incoming portion in the flow direction from the first liquid hole to the second liquid hole is gradually increased, the cross section area of the back-flow portion in the flow direction is gradually decreased, and the length dimension of the flow-incoming portion in the flow direction is smaller than the length dimension of the back-flow portion in the flow direction.
The outer wall surface of the inflow part is an arc surface, the outer wall surface of the back flow part is a conical surface, and the joint of the arc surface and the conical surface is in transition through an arc.
Wherein a ratio of a length dimension of the back flow portion in the flow direction to a length dimension of the inflow portion in the flow direction is 1.2 or more and 3 or less.
Wherein, the outer wall of the inflow part and/or the back flow part is provided with a plurality of interference flow grooves.
The turbulence grooves are arranged along the circumferential extension of the first column fin, and the turbulence grooves are arranged at intervals in a stacking mode in the direction perpendicular to the circumferential direction.
Wherein, the vortex groove includes first vortex sub-groove and second vortex sub-groove, first vortex sub-groove with second vortex sub-groove interval set up in first post fin along with the both sides that the vertical direction of flow direction carried on the back mutually.
Wherein a distance between the first spoiler groove and the second spoiler groove is maintained or gradually decreased along the flow direction.
Wherein the first turbolator groove and the second turbolator groove are symmetrically arranged about the central axis of the first cylindrical fin.
Wherein the turbulent flow groove is arranged around the inflow part and/or the back flow part along the circumferential direction of the first column fin.
Wherein, the turbulence groove encircles along the circumference of first post fin the portion that comes sets up, just the both ends of turbulence groove still extend to the back flow portion.
Wherein, the vortex groove is for following the circumference of first post fin encircles the portion of coming the stream with the annular that the portion of backflowing set up, the vortex groove is in the portion of backflowing will the portion of backflowing separates into a plurality of heat transfer boards that are interval range upon range of setting.
The first column fin is provided with a containing cavity connected with the heat dissipation column, and the side wall of the containing cavity is an equal-thickness wall and is defined by the containing cavity and the turbulence groove.
The liquid cooling assembly further comprises second cylindrical fins arranged on two sides of the first cylindrical fins in the opposite direction to the vertical direction of the flowing direction at intervals, and the second cylindrical fins are reduced in a preset proportion relative to the first cylindrical fins.
The second cylindrical fins are arranged on two opposite sides of the back flow part along the vertical direction.
The liquid cooling assembly further comprises a shunting pool and a converging pool, the shunting pool is communicated between the first liquid hole and the liquid cooling cavity, and the converging pool is communicated between the liquid cooling cavity and the second liquid hole;
the flow dividing pool is provided with a third liquid hole communicated with the liquid cooling cavity, and the hole area of the third liquid hole is larger than that of the first liquid hole; the confluence tank is provided with a fourth liquid hole communicated with the liquid cooling cavity, and the hole area of the fourth liquid hole is larger than that of the second liquid hole.
The third liquid hole and the fourth liquid hole are long holes, and the length dimension in the direction perpendicular to the flow direction is greater than or equal to the length dimension of each row of the first column fins in the perpendicular direction.
The flow dividing pool is also provided with a first guide slope surface, and the first guide slope surface is used for guiding the liquid entering from the first liquid hole to flow to the third liquid hole; the confluence tank is further provided with a second guide slope surface, and the second guide slope surface is used for guiding the liquid entering from the fourth liquid hole to flow to the second liquid hole.
The liquid cooling assembly comprises a bottom plate and an cover plate, the bottom plate and the cover plate are connected to form the liquid cooling cavity, the first liquid hole and the second liquid hole are formed in the two ends, opposite to each other, of the bottom plate respectively, the flow distribution pool and the flow convergence pool are arranged on the bottom plate, the first column fin is connected with the bottom plate and the cover plate, and one side, deviating from the cover plate, of the bottom plate is used for contacting a heat source.
The air cooling assembly further comprises a radiating fin arranged on one side of the liquid cooling assembly, and the radiating fin is connected with the radiating column.
Wherein, radiating fin includes the edge radiating column's extending direction distributes and is a plurality of first fins of interval setting, a plurality of first fin connection radiating column.
The radiating fins further comprise second fins connected to two sides of the first fins, and the second fins are further connected with the liquid cooling assembly.
Wherein the heat-dissipating stud passes through the first plurality of fins and extends to a side of the first plurality of fins facing away from the liquid cooling assembly.
The first column fin is provided with a containing cavity connected with the heat dissipation column, and a heat conduction material is filled in an assembly gap between the heat dissipation column and the containing cavity.
Wherein, the heat dissipation column is a phase-change heat transfer pipe.
In order to solve the above technical problem, another technical solution adopted by the present application is: there is provided a heat dissipation system, which includes a blowing member for providing an air flow blowing through the air cooling assembly and any one of the heat dissipation modules as described above.
In order to solve the above technical problem, the present application adopts another technical solution: there is provided a server system comprising a server host and any one of the heat dissipation modules described above, wherein one side of the liquid cooling assembly contacts a heat source on the server host.
The beneficial effect of this application is: different from the prior art, the application discloses a heat dissipation module, a heat dissipation system and a server system. The heat dissipation module comprises a liquid cooling assembly and an air cooling assembly, wherein the liquid cooling assembly comprises a liquid cooling cavity, a first liquid hole, a second liquid hole and a plurality of first column fins, the first liquid hole is communicated with the liquid cooling cavity, and the first column fins are arranged in the liquid cooling cavity; the air cooling assembly comprises a heat dissipation column correspondingly connected with the first column fin, and the heat dissipation column extends out of the liquid cooling cavity. Through the arrangement, liquid in the liquid cooling assembly flows among the plurality of first column fins to dissipate heat in the process of flowing from the first liquid hole to the second liquid hole in the liquid cooling cavity, the heat dissipation columns in the air cooling assembly absorb heat in the first column fins and extend to the outside of the liquid cooling cavity to dissipate heat through air cooling airflow, and the liquid cooling assembly and the air cooling assembly jointly act to improve the heat dissipation efficiency of the heat dissipation module; meanwhile, the number of flow channels in the heat dissipation module is effectively increased due to the arrangement of the first column fins in the liquid cooling cavity, the heat exchange area is increased, the flow impedance is reduced, and the heat exchange efficiency of the fluid and the heat dissipation module is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is a schematic structural diagram of a heat dissipation module according to a first embodiment of the present disclosure;
FIG. 2 isbase:Sub>A schematic cross-sectional view taken along line A-A of the heat dissipation module of FIG. 1;
FIG. 3 is a schematic cross-sectional view of the heat dissipation module B-B of FIG. 2;
FIG. 4 is a cross-sectional view of the heat dissipation module C-C of FIG. 3;
FIG. 5 is a schematic structural diagram of a cover plate in the heat dissipation module of FIG. 1;
FIG. 6 is a schematic view of the streaming shedding phenomenon of fluid flowing around a cylinder;
FIG. 7 is a schematic structural diagram of a bottom plate, a first stud fin and a heat-dissipating stud of the heat-dissipating module of FIG. 2;
FIG. 8 is a schematic fluid bypass of the first pillar fin of FIG. 7;
FIG. 9 is a schematic cross-sectional view taken along line B-B of another embodiment of the heat dissipation module of FIG. 1;
FIG. 10 is a schematic diagram illustrating the turbulence-enhancing effect of the second cylindrical fin of FIG. 9;
FIG. 11 is a schematic structural diagram of a first embodiment of a first pillar fin in a second embodiment of a heat dissipation module;
FIG. 12 is a schematic cross-sectional view of one embodiment of the first pillar fin of FIG. 11;
FIG. 13 is a schematic cross-sectional view of another embodiment of the first pillar fin of FIG. 11;
FIG. 14 is a cross-sectional view of a second embodiment of a first stud fin of a second embodiment of a heat dissipation module;
FIG. 15 is a schematic fluid flow-around diagram of the first column of fins of FIG. 13;
FIG. 16 is a schematic diagram of the structure and fluid flow of a liquid cooling chamber in a second embodiment of a heat dissipation module;
FIG. 17 is a schematic diagram of a first pillar fin of a third embodiment of a heat dissipation module;
FIG. 18 is a schematic cross-sectional view taken along line C-C of a third embodiment of a heat dissipation module;
FIG. 19 is a schematic diagram showing the structure and fluid flow of a liquid cooling chamber in a third embodiment of a heat dissipation module;
FIG. 20 is a schematic fluid bypass of the first cylindrical fin of FIG. 17;
FIG. 21 is a schematic structural diagram of an embodiment of a heat dissipation system provided herein;
fig. 22 is a schematic structural diagram of an embodiment of a server system provided in the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first", "second" and "third" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to imply that the number of indicated technical features is significant. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1 to 5, fig. 1 isbase:Sub>A schematic structural diagram ofbase:Sub>A first embodiment ofbase:Sub>A heat dissipation module provided in the present application, fig. 2 isbase:Sub>A schematic sectional diagram ofbase:Sub>A-base:Sub>A in an embodiment of the heat dissipation module of fig. 1, fig. 3 isbase:Sub>A schematic sectional diagram ofbase:Sub>A heat dissipation module B-B of fig. 2, fig. 4 isbase:Sub>A schematic sectional diagram ofbase:Sub>A heat dissipation module C-C of fig. 3, and fig. 5 isbase:Sub>A schematic structural diagram ofbase:Sub>A cover plate in the heat dissipation module of fig. 1.
The application provides a heat dissipation module 300, the heat dissipation module 300 includes a liquid cooling assembly 100 and an air cooling assembly 200. The liquid cooling assembly 100 comprises a liquid cooling cavity 10, a first liquid hole 11 and a second liquid hole 12 which are communicated with the liquid cooling cavity 10, and a plurality of first column fins 20 arranged in the liquid cooling cavity 10; the air-cooling assembly 200 includes a plurality of heat-dissipating studs 210 correspondingly connected to the first stud fins 20, and the heat-dissipating studs 210 extend out of the liquid-cooling chamber 10.
At least one side of the liquid cooling assembly 100 is used to contact a heat source, for example, the heat source may be a processor or a memory in a server; the first liquid hole 11 is used for accessing liquid, and the liquid enters from the first liquid hole 11, passes through the liquid cooling chamber 10 and the plurality of first column fins 20 in the liquid cooling chamber 10, and flows out from the second liquid hole 12; and then after liquid cooling subassembly 100 contacts the heat source, the heat is transmitted to liquid cooling chamber 10 and a plurality of first post fin 20, and a plurality of first post fin 20 can effectively increase the heat transfer area of liquid cooling subassembly 100 for the heat can be taken away with the liquid cooling fluid more efficiently, and the heat dissipation post 210 that corresponds with first post fin 20 and is connected still can further lead the heat outside liquid cooling chamber 10, in order to dispel the heat through the forced air cooling.
The heat dissipation module 300 provided by the application can effectively improve the heat dissipation efficiency of the heat dissipation module 300 by combining the liquid flowing heat dissipation in the liquid cooling assembly 100 and the air cooling airflow heat dissipation in the air cooling assembly 200. Meanwhile, the plurality of first column fins 20 arranged in the liquid cooling chamber 10 in the liquid cooling assembly 100 enable liquid in the liquid cooling chamber 10 to form a plurality of flow channels between the plurality of first column fins 20 when the liquid flows to the second liquid hole 12 from the first liquid hole 11, so that the number of flow channels in the heat dissipation module 300 is effectively increased, the heat exchange area is increased, and the heat exchange effect of the heat dissipation module 300 is improved.
Referring to fig. 1 to 4, the heat dissipation module 300 includes a liquid cooling assembly 100 and an air cooling assembly 200, the liquid cooling assembly 100 mainly includes a base plate 30, a cover plate 40 and a first pillar fin 20, and the air cooling assembly 200 mainly includes a heat dissipation pillar 210 and a heat dissipation fin 220.
Specifically, the base plate 30 and the cover plate 40 of the liquid cooling module 100 have a substantially rectangular parallelepiped structure. The connection between the base plate 30 and the cover plate 40 forms a liquid-cooled chamber 10, the liquid-cooled chamber 10 being adapted to contain a flow of liquid-cooled fluid therein. A plurality of first column fins 20 are distributed in the liquid cooling cavity 10, the first column fins 20 are connected to the bottom plate 30, and the first column fins 20 and the bottom plate 30 are integrally designed. Preferably, the first pillar fin 20 is connected between the base plate 30 and the cover plate 40, that is, an end surface of the first pillar fin 20 near one end of the cover plate 40 is in contact connection with the cover plate 40. In other embodiments, the first pillar fin 20 may be spaced apart from the cover plate 40. The side of the base plate 30 remote from the cover plate 40 is adapted to contact a heat source.
The bottom plate 30 and the cover plate 40 are sealed by welding to form the closed liquid cooling chamber 10. Alternatively, the bottom plate 30 and the cover plate 40 may be welded by high frequency diffusion welding.
Alternatively, the liquid cooling assembly 100 may also be formed by other structural members, for example, the whole liquid cooling assembly is integrally cast, so long as the liquid cooling cavity 10, the first liquid hole 11, the second liquid hole 12 and the first pillar fin 20 are formed, and the structure of the liquid cooling assembly 100 that can be specifically implemented is not limited in this application.
The first column fin 20 is provided with a containing cavity 21, the air cooling assembly 200 includes a plurality of heat dissipation columns 210, the containing cavity 21 in the first column fin 20 is used for containing and connecting the heat dissipation columns 210, and the heat dissipation columns 210 are respectively and correspondingly assembled and connected in the containing cavities 21 of the first column fins 20. One end of the heat dissipation pillar 210 is assembled in the accommodating cavity 21 of the first pillar fin 20, and a heat conduction material (not shown) is filled in an assembly gap between the heat dissipation pillar 210 and the accommodating cavity 21, so that it can be understood that the thermal contact resistance can be effectively reduced by filling the assembly gap with the heat conduction material, which is beneficial to transferring heat of the first pillar fin 20 to the heat dissipation pillar 210. The heat-dissipating stud 210 is a phase-change heat transfer tube, for example, the heat-dissipating stud 210 may be a heat pipe. Preferably, the heat-dissipating stud 210 is a stainless steel heat pipe, so that the assembling strength can be enhanced.
In this embodiment, the heat dissipating stud 210 has a cylindrical structure, and the accommodating cavity 21 of the first stud fin 20 is also configured as a circular hole corresponding to the shape of the heat dissipating stud 210, so as to facilitate better assembly and connection between the heat dissipating stud 210 and the first stud fin 20. Alternatively, the heat dissipation cylinder 210 may be configured in other shapes, for example, the heat dissipation cylinder 210 may be configured in any shape such as a triangular prism, a quadrangular prism, an elliptic cylinder, and the like, and the accommodating cavity 21 of the first pillar fin 20 may also be configured in any shape corresponding to the heat dissipation cylinder 210.
Referring to fig. 1, 2 and 4, one end of the heat dissipating stud 210 is fitted into the receiving cavity 21 of the first stud fin 20 and connected to the base plate 30, and the other end extends through the cover plate 40 to a side of the cover plate 40 away from the base plate 30. Specifically, the cover plate 40 is provided with a plurality of first receiving holes 41 at positions corresponding to the plurality of heat-dissipating studs 210, and the first receiving holes 41 are circular holes corresponding to the shapes of the heat-dissipating studs 210 (as shown in fig. 5). The other end of the heat radiation column 210 extends to a side away from the base plate 30 through the plurality of first receiving holes 41. The cover plate 40 and the heat dissipation post 210 are sealed by welding. One end of the heat dissipation pillar 210 is connected to the inside of the first pillar fin 20, and the other end extends to the outside of the liquid cooling assembly 100, i.e. a part of the heat dissipation pillar 210 is located in the liquid cooling chamber 10, and the other part is exposed in the air, so that a part of heat of the heat source can be dissipated through the part of the heat dissipation pillar 210 exposed in the air.
The air cooling assembly 200 includes a heat dissipating fin 220 disposed on one side of the liquid cooling assembly 100, and the heat dissipating fin 220 is connected to a portion of the heat dissipating column 210 exposed to the air. Specifically, the heat dissipation fin 220 includes a plurality of first fins 221 and two second fins 222, the plurality of first fins 221 are distributed along the extending direction of the heat dissipation column 210, that is, axially, and the plurality of first fins 221 are stacked at intervals, and a plurality of layers are distributed in the extending direction of the heat dissipation column 210. The first fins 221 have the same shape and are each in the form of a rectangular sheet. The first fins 221 are provided with a plurality of second receiving holes 2211 corresponding to the plurality of heat dissipation columns 210, the second receiving holes 2211 are circular corresponding to the plurality of heat dissipation columns 210, and the heat dissipation columns 210 penetrate through the second receiving holes 2211 of the plurality of first fins 221 arranged at intervals in a stacked manner and extend to one side of the plurality of first fins 221 departing from the liquid cooling assembly 100. The edge of the heat dissipation pillar 210 contacting the second receiving hole 2211 is fixed and assembled by welding or the like. The two second fins 222 are respectively distributed on two opposite sides of the plurality of first fins 221, the end face of the second fin 222 close to the first fin 221 is in contact connection with the plurality of first fins 221, and the end face of the second fin 222 close to one end of the cover plate 40 is in contact connection with the cover plate 40.
It can be understood that the arrangement of the heat dissipating posts 210 and the heat dissipating fins 220 in the air cooling assembly 200 enables a part of heat of the heat source to be transferred to the heat dissipating posts 210 through the first post fins 20, and then transferred to the first fins 221 and the second fins 222 exposed in the air by utilizing the heat conduction function of the heat dissipating posts 210, and dissipated by the convection function of the air cooling airflow, thereby implementing the air cooling heat dissipating function of the heat dissipating module 300.
Referring to fig. 1 and 4, a bottom plate 30 of the liquid cooling assembly 100 is provided with a first liquid hole 11 and a second liquid hole 12, the first liquid hole 11 and the second liquid hole 12 are respectively disposed at two opposite ends of the bottom plate 30, and both the first liquid hole 11 and the second liquid hole 12 are in fluid communication with the liquid cooling chamber 10. The external liquid pipe is respectively connected with the first liquid hole 11 and the second liquid hole 12, the liquid cooling fluid flows into the liquid cooling chamber 10 from the first liquid hole 11 along with the liquid pipe connected to the first liquid hole 11, flows from the first liquid hole 11 to the second liquid hole 12 among the plurality of first column fins 20 in the liquid cooling chamber 10, and flows out of the liquid cooling chamber 10 from the second liquid hole 12, so that a part of heat of the heat source is taken out of the heat dissipation module 300, and the liquid cooling heat dissipation function is realized. The first column fins 20 are distributed in multiple rows in the liquid cooling chamber 10 along the flowing direction from the first liquid hole 11 to the second liquid hole 12, and the first column fins 20 in two adjacent rows are distributed in a staggered manner. It can be understood that the first cylindrical fin 20 is distributed in the liquid cooling chamber 10 in the flow direction in the form of staggered rows, which can enhance the turbulence between the fluid in the liquid cooling chamber 10 and the wall surface of the first cylindrical fin 20, and further enhance the flow and heat transfer.
In this embodiment, the first and second liquid holes 11 and 12 are circular holes. Alternatively, the first liquid hole 11 and the second liquid hole 12 may be provided in other shapes, for example, the first liquid hole 11 and the second liquid hole 12 may be provided in any shape such as an elliptical hole, a square hole, a diamond hole, and the like.
Referring to fig. 4, the liquid cooling assembly 100 further includes a diversion pool 50 and a confluence pool 60, both the diversion pool 50 and the confluence pool 60 are disposed on the bottom plate 30, wherein the diversion pool 50 is disposed at a side close to the first liquid hole 11 and communicated between the first liquid hole 11 and the liquid cooling chamber 10; the confluence tank 60 is disposed at a side close to the second liquid hole 12 and connected between the second liquid hole 12 and the liquid cooling chamber 10. The flow dividing pool 50 is mainly used for collecting and redistributing the liquid cooling fluid entering the first liquid hole 11 from an external liquid pipe, and the liquid flow of a plurality of different flow channels formed among the first column fins 20 in the liquid cooling cavity 10 is uniformly configured through the flow dividing pool 50, so that the phenomenon of flow short circuit is prevented, and a stronger flow and heat exchange level are generated. Similarly, the confluence tank 60 is provided at an end close to the second hole 12, so that the liquid-cooling fluid is collected in the confluence tank 60 and then flows out from the second hole 12. The confluence cell 60 has a similar structure to that of the diversion cell 50.
Specifically, the flow dividing pool 50 is provided with a third liquid hole 51 communicated with the liquid cooling chamber 10, and the flow converging pool 60 is provided with a fourth liquid hole 61 communicated with the liquid cooling chamber 10, that is, the third liquid hole 51 and the fourth liquid hole 61 are respectively connected to a port at one end of the liquid cooling chamber 10 through the flow dividing pool 50 and the flow converging pool 60. The hole area of the third liquid hole 51 is larger than that of the first liquid hole 11, and the hole area of the fourth liquid hole 61 is larger than that of the second liquid hole 12. A first guide slope surface 52 is arranged in the flow dividing pool 50, and the first guide slope surface 52 is used for guiding the liquid entering the flow dividing pool 50 from the first liquid hole 11 to flow to the third liquid hole 51; the sink 60 is provided with a second guiding ramp 62, the second guiding ramp 62 being adapted to guide the liquid entering the sink 60 from the fourth liquid hole 61 towards the second liquid hole 12. It can be understood that the side surface of the flow dividing pool 50 is communicated with the first liquid hole 11 by using a smaller opening, the top surface is communicated with the liquid cooling cavity 10 by using a larger third liquid hole 51, and an inclined first guide slope surface 52 is arranged on the flow path from the small opening to the large opening, so that the flow resistance/loss can be reduced, and the liquid flowing out from the large opening has a certain initial dividing speed along the flow direction, which is beneficial to enhancing the heat exchange strength of the fluid.
In this embodiment, the third liquid hole 51 and the fourth liquid hole 61 are both elongated holes (as shown in fig. 3), and the length dimension of the third liquid hole 51 and the fourth liquid hole 61 in the direction perpendicular to the liquid flowing direction is greater than or equal to the length dimension of each row of the first pillar fins 20 in the direction perpendicular to the flowing direction. Therefore, the liquid gathered in the flow dividing pool 50 can flow through all the first column fins 20 when flowing to the liquid cooling chamber 10, that is, the liquid flows through the outer wall surfaces of the first column fins 20 in the liquid cooling chamber 10, and further the uniform allocation of the liquid flow is realized.
The liquid cooling fluid flows in the liquid cooling chamber 10 for heat exchange, wherein the disturbance of the fluid is strengthened by the plurality of first column fins 20 arranged in the liquid cooling chamber 10, so that more heat can be taken away by the fluid, and the heat exchange efficiency is further improved.
Optionally, the first liquid hole 11, the second liquid hole 12, the diversion pool 50 and the confluence pool 60 may also be disposed on the cover plate 40, and are not described again.
Referring to fig. 6 to 8, fig. 6 is a schematic view illustrating a fluid flowing around a cylinder and flowing around and escaping, fig. 7 is a schematic view illustrating an assembly structure of a bottom plate, a first pillar fin and a heat dissipation pillar in the heat dissipation module of fig. 2, and fig. 8 is a schematic view illustrating a fluid flowing around of the first pillar fin in fig. 7.
As shown in fig. 6, it is a phenomenon of fluid flowing around a cylinder to cause fluid flowing around the cylinder to flow around the cylinder. The outer wall surface of the cylinder is circular, the sectional area of the front half part of the cylinder is gradually reduced in the flowing direction, and the sectional area of the rear half part of the cylinder is gradually increased. When fluid flows through the section of the front half part of the cylinder, the flow cross section is reduced, the flow velocity is increased, the pressure is reduced, the pressure is increased again in the rear half part, at the moment, the fluid in the boundary layer overcomes the pressure increase by the momentum of the fluid, the fluid flows forwards, the velocity distribution tends to be smooth, the fluid layer close to the wall is difficult to overcome the rising pressure due to the small momentum, the local part of the velocity gradient at the wall surface which becomes 0 is finally generated, and then the backflow opposite to the original flow direction is generated, and the vortex bundle are caused. As can be seen from FIG. 6, a small portion of the vortex beam is distributed on the near wall surface, and the vortex beam at the position can exchange heat with the wall surface strongly due to the disturbance process; in addition, most vortex beams are distributed on the far wall surface, but the turbulence of the vortex beams is only between the inner parts of the fluid, the participation of the wall surface of the cylinder is lacked, the strengthening effect on heat exchange is limited, and the flow resistance is increased to a certain extent.
In view of this, in the present embodiment, the first pillar fin 20 is non-cylindrical in shape. Specifically, the first column fin 20 includes an inflow portion 22 and a back flow portion 23, the inflow portion 22 faces the side where the first liquid hole 11 is located, the back flow portion 23 faces the side where the second liquid hole 12 is located, wherein a cross-sectional area of the inflow portion 22 in the direction of flowing the liquid gradually increases, a cross-sectional area of the back flow portion 23 in the direction of flowing the liquid gradually decreases, a length of the inflow portion 22 along the flowing direction is a first dimension R1, a length of the back flow portion 23 along the flowing direction is a second dimension R2, and the first dimension R1 is smaller than the second dimension R2, so that a dimension of the back flow portion 23 in the flowing direction is relatively increased, so that the back flow portion 23 can extend to the far wall surface as shown in fig. 6, so that vortex bundle disturbance at the far wall surface sufficiently contacts with an outer wall surface of the back flow portion 23, thereby enhancing a heat exchange effect, and reducing a flow resistance, which not only effectively increases a heat exchange area contacting with the vortex bundle, but also facilitates reducing a flow resistance, further enhancing a heat exchange efficiency, thereby enhancing a heat exchange effect between the first column fin 20 and a fluid flow resistance, and reducing a fluid flow resistance.
Referring to fig. 7 and 8, the first cylindrical fin 20 is substantially conical, an outer wall surface of the inflow portion 22 is an arc surface, an outer wall surface of the back flow portion 23 is a tapered surface, and a connection portion between the inflow portion 22 and the back flow portion 23 passes through an arc. Wherein, the ratio of the length dimension of the back flow portion 23 along the flow direction to the length dimension of the incoming flow portion 22 along the flow direction is greater than or equal to 1.2 and less than or equal to 3, that is, the ratio of the second dimension R2 to the first dimension R1 is greater than or equal to 1.2 and less than or equal to 3, for example, the ratio is 1.2, 1.5, 1.8, 2.0, 2.3, 2.5, 2.8 or 3.0, so that the back flow portion 23 can extend to the "vortex beam disturbance zone at the far wall surface" to sufficiently participate in the heat exchange.
The arc surface can play a role in stable transition of the fluid flowing around from front to back, and the conical surface extends towards the back flow side, so that far wall surface vortex beams can be reduced, all vortex beams are distributed close to the conical outer wall surface, the effective near wall vortex beam number is increased while the convection area is increased, the heat exchange strength and the heat exchange degree between the fluid and the outer wall surface of the first column fin 20 are higher, and the heat exchange is strengthened; in addition, the reduction of the number of the far wall surface vortex beams also reduces the internal consumption between the fluids, reduces the flow loss and further improves the flow efficiency.
Alternatively, the outer wall surface of the inflow portion 22 may also be an elliptical arc surface or a conical surface, and the back flow portion 23 may also be an arc surface.
Referring to fig. 9 and 10, fig. 9 is a schematic cross-sectional view of a second embodiment B-B of the heat dissipation module of fig. 1, and fig. 10 is a schematic view of a turbulent flow enhancing effect of a second pillar fin of fig. 9.
As shown in fig. 9, in another embodiment, the liquid cooling assembly 100 in the heat dissipation module 300 may further include a plurality of second column fins 70, the second column fins 70 are disposed at intervals on two opposite sides of the first column fin 20 in the vertical direction of the liquid flowing direction, preferably, the second column fins 70 are disposed on two opposite sides of the back flow portion 23 of the first column fin 20 in the vertical direction of the liquid flowing direction, that is, one second column fin 70 is disposed on each of two sides of the back flow portion 23 of the first column fin 20. The second pillar fin 70 is reduced relative to the first pillar fin 20 by a predetermined ratio, that is, the second pillar fin 70 has the same structure as the first pillar fin 20 except that the size of the second pillar fin is smaller than that of the first pillar fin 20. It can be understood that the second column fins 70 can further increase the heat exchange area of the fluid, and also increase the disturbance degree in the liquid cooling chamber 10, thereby further improving the heat exchange effect.
Referring to fig. 10, the second cylindrical fins 70 are disposed on two sides of the back flow portion 23 of the first cylindrical fin 20, and when the incoming flow liquid flows the second cylindrical fins 70 (as shown by the dotted line in fig. 10), under the "blocking" of the second cylindrical fins 70, a part of the incoming flow is folded toward the first cylindrical fin 20 on the near side, and a certain "jet impact" effect is generated on the outer wall surface of the first cylindrical fin 20, so that the heat exchange is stronger; the other part of the flow is folded towards the first pillar fin 20 at the far side of the downstream, so that the flow of the incoming flow of the first pillar fin 20 at the downstream is more concentrated, namely the flow is increased, and the flow velocity is increased, thereby enhancing the heat exchange.
Furthermore, a plurality of third column fins, fourth column fins and the like can be arranged according to the same topological principle, so that the heat exchange effect is further enhanced. The third cylindrical fin is arranged on two sides of the second cylindrical fin 70, the fourth cylindrical fin is arranged on two sides of the third cylindrical fin, and certain fractal characteristics are provided among the plurality of cylindrical fins, which is not described herein again.
Referring to fig. 11, fig. 11 is a schematic structural diagram of a first embodiment of a first pillar fin in a second embodiment of a heat dissipation module, fig. 12 is a schematic cross-sectional diagram of the first embodiment of the first pillar fin in fig. 11, fig. 13 is a schematic cross-sectional diagram of another embodiment of the first pillar fin in fig. 11, fig. 14 is a schematic cross-sectional diagram of the second embodiment of the first pillar fin in the second embodiment of the heat dissipation module, fig. 15 is a schematic fluid bypass diagram of the first pillar fin in fig. 13, and fig. 16 is a schematic structural diagram and fluid flow diagram of a liquid cooling chamber in the second embodiment of the heat dissipation module.
Compared with the heat dissipation module 300 in the first embodiment, the difference between the heat dissipation module 300 in the present embodiment and the heat dissipation module 300 in the first embodiment is only that the structure of the first pillar fin 20 is different from that in the first embodiment, and the rest of the structures are the same as those in the first embodiment, and are not repeated herein.
In the present embodiment, the shape of the first pillar fin 20 is the same as that in the first embodiment, except that a plurality of turbulence grooves 24 may be provided on the outer wall of the inflow portion 22 and/or the back flow portion 23 of the first pillar fin 20. Specifically, the spoiler 24 extends along the circumferential direction of the first pillar fin 20, and the plurality of spoiler 24 is stacked in a direction perpendicular to the circumferential direction of the first pillar fin 20. The provision of the plurality of turbulence grooves 24 increases the flow area of the fluid, and increases the heat exchange area between the fluid and the wall surface of the first cylindrical fin 20, and the turbulence grooves 24 are also advantageous for enhancing the turbulence degree of the fluid near the first cylindrical fin 20.
In an embodiment, as shown in fig. 11, a plurality of spoiler grooves 24 are disposed on the first pillar fin 20, the spoiler grooves 24 are disposed in a stacked manner in a direction perpendicular to a circumferential direction of the first pillar fin 20, the spoiler grooves 24 include a first spoiler groove 241 and a second spoiler groove 242, and the first spoiler groove 241 and the second spoiler groove 242 are disposed at two opposite sides of the first pillar fin 20 in a direction perpendicular to a flowing direction of the liquid. The distance between the first spoiler groove 241 and the second spoiler groove 242 may be constant along the flow direction of the liquid (as shown in fig. 12), or may be gradually decreased along the flow direction of the liquid (as shown in fig. 13). Alternatively, the first spoiler slot 241 and the second spoiler slot 242 may be symmetrically disposed, that is, the first spoiler slot 241 and the second spoiler slot 242 have the same shape and are symmetrical with respect to the accommodating chamber 21.
In another embodiment, as shown in fig. 14, a plurality of turbulent flow grooves 24 are provided on the first columnar fin 20, and the plurality of turbulent flow grooves 24 are arranged in a manner of being stacked in a direction perpendicular to the circumferential direction of the first columnar fin 20. The turbulence groove 24 surrounds the setting of the incoming flow portion 22 along the circumference of the first column fin 20, and both ends of the turbulence groove 24 all extend to the back flow portion 23, so that the cross section of the turbulence groove 24 is arc-shaped.
Taking the first cylindrical fin 20 in fig. 13 as an example, as shown in fig. 15, when the fluid flows around the first cylindrical fin 20, a part of the fluid passes through the turbulent flow groove 24, and when the fluid enters the turbulent flow groove 24, a vortex beam is generated on the inner wall surface of the channel, so as to enhance the heat exchange in the channel; when the fluid passes through the turbulent flow grooves 24, the fluid meets or collides with the fluid or the vortex beam at the outer edge, so that larger disturbance is generated near the wall surface of the first cylindrical fin 20, and the heat exchange outside the channel is enhanced.
As shown in fig. 16, under the effect of the turbulent flow groove 24, not only the flow area and the heat exchange area are increased, but also the fluid near the first column fin 20 has a more severe disturbance degree, thereby greatly enhancing the convective heat exchange strength.
Further, a plurality of second column fins 70 may be disposed in the heat dissipation module 300, and the second column fins 70 are reduced by a predetermined ratio relative to the first column fins 20, that is, the second column fins 70 have the same structure as the first column fins 20, and are also provided with the turbulent flow groove 24. The second cylindrical fins 70 are disposed in the same manner as in the first embodiment of the heat dissipation module 300, and similarly, third cylindrical fins, fourth cylindrical fins, etc. may also be disposed, which are not described herein again.
Referring to fig. 17 to 20, fig. 17 is a schematic structural view of a first pillar fin in a third embodiment of a heat dissipation module, fig. 18 is a schematic cross-sectional view of C-C in the third embodiment of the heat dissipation module, fig. 19 is a schematic structural view and a schematic fluid flow diagram of a liquid cooling chamber in the third embodiment of the heat dissipation module, and fig. 20 is a schematic fluid bypass diagram of the first pillar fin in fig. 17.
Compared with the heat dissipation module 300 in the first embodiment, the difference between the heat dissipation module 300 in the present embodiment is that the structure of the first pillar fin 20 is different from that in the second embodiment, and the rest of the structure is the same as that in the first embodiment, which is not described herein again.
Referring to fig. 17 and 18, the shape of the first cylindrical fin 20 in the present embodiment is the same as that in the second embodiment, a plurality of turbulence grooves 24 are disposed on each first cylindrical fin 20, and the plurality of turbulence grooves 24 are stacked in a direction perpendicular to the circumferential direction of the first cylindrical fin 20. The difference is that the spoiler groove 24 in this embodiment is a ring groove disposed around the inflow portion 22 and the back flow portion 23 along the circumferential direction of the first pillar fin 20, and the spoiler groove 24 divides the back flow portion 23 into a plurality of heat exchange plates 231 stacked at intervals in the back flow portion 23. It can be understood that the turbulence groove 24 is annularly arranged along the accommodating cavity 21 to form a ring groove, the front half part of the ring groove is arc-shaped, and the rear half part of the ring groove is conical, so that the heat exchange area in the turbulence groove 24 is further increased, and the heat exchange strength is further enhanced.
Further, the annular spoiler groove 24 is disposed such that the sidewall 211 of the accommodating cavity 21 defined by the accommodating cavity 21 and the spoiler groove 24 is an equal-thickness wall (as shown in fig. 20), that is, the sidewall 211 of the accommodating cavity 21 is an annular wall with an equal wall thickness. It can be understood that when the side wall 211 of the accommodating cavity 21 is set to be of an equal thickness, the larger the partial area of the turbulent flow groove 24 located in the back flow portion 23 is, that is, the larger the space between the heat exchange plates 231 of the back flow portion 23 is, the more beneficial the fluid is to achieve efficient transition in the back flow portion 23. As shown in fig. 19, in the downstream flow area of the liquid cooling chamber 10, the fluid on both sides can realize a transverse span through the turbulent flow groove 24 and gradually converge toward the second liquid hole 12, thereby enhancing the heat exchange and simultaneously shortening the flow path and further reducing the flow impedance.
Referring to fig. 20, when the fluid flows around the turbulence grooves 24, vortex beams are also generated in the turbulence grooves 24 located in the back flow portion 23, that is, vortex beams are generated between two adjacent heat exchange plates 231, and since the vortex beams are distributed in the channels, the vortex beams can directly disturb the wall surfaces at the top and bottom of each channel, that is, the plate surfaces of the heat exchange plates 231, thereby further enhancing the heat exchange strength.
Further, a second pillar fin 70, a third pillar fin, a fourth pillar fin, etc. may also be disposed in the heat dissipation module 300, and the above-mentioned various pillar fins have certain fractal characteristics, and the structure thereof is the same as that of the first pillar fin 20. The arrangement of the various pillar fins is the same as that in the first embodiment of the heat dissipation module 300, and will not be described herein again.
Referring to fig. 21, fig. 21 is a schematic structural diagram of an embodiment of a heat dissipation system provided in the present application.
Referring to fig. 21, the present application provides a heat dissipation system 400, the heat dissipation system 400 includes a blowing component 410 and a heat dissipation module 300, and the heat dissipation module 300 may be any one of the heat dissipation modules 300 in the above embodiments of the heat dissipation module 300 provided in the present application. The blowing member 410 is used for providing airflow for the heat dissipation module 300 to blow through the air cooling assembly 200, so that heat in the heat dissipation column 210 and the heat dissipation fins 220 is dissipated under the convection action of the air cooling airflow provided by the blowing member 410, and further, the heat dissipation efficiency is improved.
Referring to fig. 22, fig. 22 is a schematic structural diagram of an embodiment of a server system provided in the present application.
Referring to fig. 22, the present application provides a server system 500, where the server system 500 includes a server host 510 and a heat sink module 300, and the heat sink module 300 may be any one of the heat sink modules 300 in the embodiments of the heat sink module 300 provided in the present application. Wherein the liquid cooling assembly 100
The side of the bottom plate 30 away from the air-cooled assembly 200 contacts the heat source of the server host 510, and the heat sink module 300 passes through the liquid-cooled assembly 100
The heat dissipation function of the air-cooling assembly 200 dissipates the heat absorbed by the server host 510, thereby satisfying the heat dissipation requirement of the server system 500.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.
Claims (28)
1. A heat dissipation module, comprising:
the liquid cooling assembly is provided with a liquid cooling cavity, a first liquid hole and a second liquid hole, and the first liquid hole and the second liquid hole are communicated with the liquid cooling cavity;
the air cooling assembly comprises a plurality of heat dissipation columns correspondingly connected with the first column fins, and the heat dissipation columns extend out of the liquid cooling cavity.
2. The heat dissipation module of claim 1, wherein the first column fins are distributed in a plurality of rows in the liquid cooling chamber along a flowing direction from the first liquid hole to the second liquid hole, and the first column fins in two adjacent rows are further distributed in a staggered manner.
3. The heat dissipation module of claim 1 or 2, wherein the first pillar fin comprises an inflow portion and a back flow portion connected with each other, the inflow portion faces a side where the first liquid hole is located, and the back flow portion faces a side where the second liquid hole is located;
the cross-sectional area of the flow-coming part in the flow direction from the first liquid hole to the second liquid hole is gradually increased, the cross-sectional area of the back flow part in the flow direction is gradually decreased, and the length dimension of the flow-coming part in the flow direction is smaller than the length dimension of the back flow part in the flow direction.
4. The heat dissipation module of claim 3, wherein the outer wall surface of the inflow portion is a circular arc surface, the outer wall surface of the back flow portion is a tapered surface, and a connection between the circular arc surface and the tapered surface is formed by a circular arc transition.
5. The heat dissipation module of claim 4, wherein a ratio of a length dimension of the back flow portion in the flow direction to a length dimension of the back flow portion in the flow direction is greater than or equal to 1.2 and less than or equal to 3.
6. The heat dissipation module of claim 3, wherein the outer wall of the inflow portion and/or the back flow portion is provided with a plurality of interference grooves.
7. The heat dissipation module of claim 6, wherein the turbulent flow grooves extend along a circumferential direction of the first stud fin, and a plurality of the turbulent flow grooves are stacked at intervals along a direction perpendicular to the circumferential direction.
8. The heat dissipation module of claim 7, wherein the turbulator slot comprises a first turbulator slot and a second turbulator slot, and the first and second turbulator slots are spaced apart from each other on two sides of the first pillar fin along a direction perpendicular to the flow direction.
9. The heat dissipation module of claim 8, wherein a spacing between the first turbulator slot and the second turbulator slot remains constant or gradually decreases along the flow direction.
10. The heat dissipation module of claim 8 or 9, wherein the first and second turbulator slots are symmetrically disposed about a central axis of the first pillar fin.
11. The heat dissipation module of claim 7, wherein the turbulent flow channel is disposed around the inflow portion and/or the back flow portion in a circumferential direction of the first pillar fin.
12. The heat dissipation module of claim 11, wherein the turbulent flow groove is disposed around the inflow portion along a circumferential direction of the first pillar fin, and both ends of the turbulent flow groove further extend to the back flow portion.
13. The heat dissipation module of claim 11, wherein the turbulence channel is a ring groove disposed around the inflow portion and the back flow portion along the circumferential direction of the first pillar fin, and the portion of the turbulence channel in the back flow portion partitions the back flow portion into a plurality of heat exchange plates disposed in a spaced-apart and stacked manner.
14. The heat dissipation module of claim 13, wherein the first stud fin is provided with a receiving cavity connected to the heat dissipation stud, and a sidewall of the receiving cavity defined by the receiving cavity and the turbulence groove is a uniform-thickness wall.
15. The heat dissipation module of claim 3, wherein the liquid cooling assembly further comprises second cylindrical fins spaced apart from and disposed on opposite sides of the first cylindrical fin in a direction perpendicular to the flow direction, the second cylindrical fins being reduced in a predetermined ratio with respect to the first cylindrical fin.
16. The heat dissipation module of claim 15, wherein the second cylindrical fins are disposed on opposite sides of the back flow portion along the vertical direction.
17. The heat dissipation module of claim 2, wherein the liquid-cooled assembly further comprises a flow-splitting cell and a flow-joining cell, the flow-splitting cell is in communication with the first liquid hole and the liquid-cooled cavity, and the flow-joining cell is in communication with the liquid-cooled cavity and the second liquid hole;
the flow dividing pool is provided with a third liquid hole communicated with the liquid cooling cavity, and the hole area of the third liquid hole is larger than that of the first liquid hole; the confluence tank is provided with a fourth liquid hole communicated with the liquid cooling cavity, and the hole area of the fourth liquid hole is larger than that of the second liquid hole.
18. The heat dissipation module of claim 17, wherein the third fluid hole and the fourth fluid hole are elongated holes, and a length dimension in a direction perpendicular to the flow direction is equal to or greater than a length dimension of each row of the first pillar fins in the perpendicular direction.
19. The heat dissipation module of claim 17, wherein the flow distribution tank further comprises a first guide slope for guiding the liquid entering from the first liquid hole to the third liquid hole; the confluence tank is further provided with a second guide slope surface, and the second guide slope surface is used for guiding the liquid entering from the fourth liquid hole to flow to the second liquid hole.
20. The heat dissipation module of claim 19, wherein the liquid cooling assembly comprises a bottom plate and a cover plate, the bottom plate and the cover plate are connected to form the liquid cooling cavity, the first liquid hole and the second liquid hole are respectively disposed at two opposite ends of the bottom plate, the flow distribution pool and the flow collection pool are disposed on the bottom plate, the first pillar fin is connected to the bottom plate and the cover plate, and a side of the bottom plate facing away from the cover plate is used for contacting a heat source.
21. The heat dissipation module of claim 1, wherein the air-cooled assembly further comprises fins disposed on one side of the liquid-cooled assembly, the fins being connected to the heat dissipation post.
22. The heat dissipation module of claim 21, wherein the heat dissipation fins comprise a plurality of first fins distributed along an extending direction of the heat dissipation post and disposed at intervals, and the plurality of first fins are connected to the heat dissipation post.
23. The heat dissipation module of claim 22, wherein the fins further comprise second fins connected to opposite sides of the first fins, the second fins further connected to the liquid cooling assembly.
24. The heat dissipation module of claim 22, wherein the heat dissipation post extends through the first plurality of fins to a side of the first plurality of fins facing away from the liquid cooled assembly.
25. The heat dissipation module of claim 1, wherein the first pillar fin is provided with a receiving cavity connected to the heat dissipation pillar, and a heat conduction material is filled in an assembly gap between the heat dissipation pillar and the receiving cavity.
26. The heat dissipation module of claim 1, wherein the heat dissipation stud is a phase change heat transfer tube.
27. A heat dissipation system, comprising a blower for providing an air flow over the air-cooled assembly and the heat dissipation module of any of claims 1-26.
28. A server system comprising a server host and the heat dissipation module of any of claims 1-26, wherein one side of the liquid cooled component contacts a heat source on the server host.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210733429.6A CN115297671A (en) | 2022-06-24 | 2022-06-24 | Heat dissipation module, heat dissipation system and server system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210733429.6A CN115297671A (en) | 2022-06-24 | 2022-06-24 | Heat dissipation module, heat dissipation system and server system |
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| CN115297671A true CN115297671A (en) | 2022-11-04 |
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| CN202210733429.6A Pending CN115297671A (en) | 2022-06-24 | 2022-06-24 | Heat dissipation module, heat dissipation system and server system |
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