CN211982360U - Micro-channel heat sink with turbulence device - Google Patents
Micro-channel heat sink with turbulence device Download PDFInfo
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- CN211982360U CN211982360U CN201922124048.4U CN201922124048U CN211982360U CN 211982360 U CN211982360 U CN 211982360U CN 201922124048 U CN201922124048 U CN 201922124048U CN 211982360 U CN211982360 U CN 211982360U
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Abstract
The utility model relates to a take microchannel heat sink of vortex device, including the heat sink body that has the inner chamber, the inner chamber of heat sink body is equipped with many microchannels that supply the coolant liquid to flow through, along the even multiunit vortex device that has arranged of coolant liquid flow direction in the microchannel. The utility model provides a pair of microchannel heat sink with vortex device because its vortex device that sets up makes the coolant liquid produce the swirl in the microchannel, breaks the boundary layer that flows, strengthens the mixing of cold and hot fluid, improves radiating efficiency.
Description
Technical Field
The utility model relates to a heat sink equipment technical field, concretely relates to take microchannel heat sink of vortex device.
Background
With the continuous improvement of the manufacturing process of high-power switching devices, the switching devices with higher power and higher frequency are more and more applied to industrial products, and the problem of heat dissipation of the switching devices is the core for ensuring the long-term safe and stable operation of the switching devices. The microchannel heat sink belongs to a typical application of passive cooling heat dissipation, and is one of effective methods for solving high heat flow density dissipation in a micro heat transfer element. By increasing the heat exchange area, the disturbance of the flowing fluid is increased, and the flow velocity of the cooling working medium is increased, so that the heat exchange efficiency of the radiator can be improved to a certain extent.
At present, microchannel heat sinks with left and right groove structures exist, but the heat sink processing of the structure is relatively complex. There are also thermal channel heat sinks with periodically distributed tooth-shaped spoilers, which, although designed to enhance heat dissipation, increase the pressure loss of the entire device. Although the heat dissipation performance of the heat sink can be improved by the design, the change of the structure of the heat sink is relatively simple, and the cooling requirement of a high-power switching device cannot be met.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problem, an object of the present invention is to provide a novel microchannel heat sink with a turbulent device, which can make the fluid working medium break the flow boundary layer in the microchannel more easily by the design of the structure, generate vortex at the rear of the turbulent column, enhance the mixing of the cold and hot fluids in the microchannel, and improve the heat dissipation efficiency.
In order to achieve the above purpose, the technical solution of the present invention is as follows: the utility model provides a take microchannel heat sink of vortex device, is including the heat sink body that has the inner chamber, the inner chamber of heat sink body is equipped with many microchannels that supply the coolant liquid to flow through, along the even multiunit vortex device that has arranged of coolant liquid flow direction in the microchannel.
The utility model has the advantages that: the utility model provides a pair of microchannel heat sink with vortex device because its vortex device that sets up makes the coolant liquid produce the swirl in the microchannel, breaks the boundary layer that flows, strengthens the mixing of cold and hot fluid, improves radiating efficiency.
On the basis of the technical scheme, the utility model discloses can also do following improvement.
Further, each group of flow disturbing devices comprises one or more flow disturbing devices, each flow disturbing device comprises a first flow disturbing sheet and a second flow disturbing sheet, the first flow disturbing sheet is vertically arranged, the lower end of the first flow disturbing sheet is fixed on the bottom wall of the micro-channel, the upper end of the first flow disturbing sheet is connected with the lower end face of the second flow disturbing sheet, and the upper end face of the second flow disturbing sheet inclines from bottom to top to downstream along the flowing direction of the cooling liquid.
The beneficial effect of adopting the further scheme is that: the turbulent flow device can enable the cooling liquid to generate vortexes and turbulent flows in the micro-channel, so that a flow boundary layer is broken, the mixing of cold and hot fluids is enhanced, and the heat dissipation efficiency is improved. Compared with a straight-through heat sink, the spoiler design with the structure can not only continuously interrupt the flow of the fluid along the horizontal direction of the flow of the fluid and promote the heat conducted by the heat source to carry out multiple and sufficient convective heat transfer on the cooling fluid, but also can generate the convective heat transfer effect along the vertical direction of the flow of the fluid, so that compared with the traditional straight-through heat sink, the heat sink has higher heat transfer capability.
Further, the first spoilers are arranged in parallel along the flowing direction of the cooling liquid, and the second spoilers are arranged perpendicular to the first spoilers.
The beneficial effect of adopting the further scheme is that: the first spoiler of the spoiler device located below generates small resistance to the cooling liquid, and the spoiler located above generates large resistance to the cooling liquid, so that the cooling liquid generates vortex and turbulence. The combined spoiler design can effectively generate multi-vortex at the rear end of each spoiler which is periodically distributed, and the distribution characteristic of the flow field of the multi-vortex determines that the distribution characteristic of the temperature field of the multi-vortex is better than that of the traditional straight-through heat sink.
Furthermore, the first spoiler is in the shape of a right trapezoid, the right-angle side of the right trapezoid is fixed on the bottom wall of the micro channel, and the oblique side of the right trapezoid is connected with the lower end face of the second spoiler.
The beneficial effect of adopting the further scheme is that: the design ensures that the spoiler has turbulence function and simultaneously has less choked flow as much as possible. Compared with the combination mode of a vertical structure and a horizontal structure, the combination mode can effectively reduce the resistance of the fluid working medium in the flowing process. Compared with a straight-through heat sink, the structure design can generate certain resistance to the fluid working medium, but the structure design can fully mix cold fluid and hot fluid to strengthen the heat exchange effect.
Further, the second spoiler is in an isosceles trapezoid shape or a rectangular shape and is arranged at the upper end of the first spoiler in an axisymmetrical manner with the first spoiler as an axis.
The beneficial effect of adopting the further scheme is that: the axial symmetry shape enables the spoiler to have a symmetrical effect on the cooling liquid, which is beneficial to the uniform flow of the cooling liquid in the flow channel, and does not generate the phenomenon of overhigh local temperature of the heat source, which is effective for the effective heat dissipation of the heat sink. The second spoiler adopts the structural design of isosceles trapezoid or rectangle, compares in the heat sink of through type, can effectually break the fluid boundary layer, accelerates the intensive mixing of cold, hot-fluid.
Furthermore, each group of the flow disturbing devices are arranged in an axial symmetry mode, and each group of the flow disturbing devices are arranged along the central line of the micro channel. Preferably, each group of the turbulence devices comprises three turbulence generators, the three turbulence generators are distributed at the vertex positions of an isosceles triangle, and the central line of the isosceles triangle is superposed with the central line of the microchannel. When each group of the turbulence devices comprises one turbulence generator, the turbulence generator is of an axisymmetric structure, and the symmetric axis of the turbulence generator is superposed with the central line of the micro-channel. When each group of the turbulence devices comprises three turbulence generators, the three turbulence generators are respectively distributed at the vertex positions of the isosceles triangles, and the central lines of the isosceles triangles are superposed with the central line of the micro-channel.
The beneficial effect of adopting the further scheme is that: the above-mentioned axially symmetric shape enables the effect of the turbulators on the coolant to be symmetric. The design of the mechanism can enable fluid to generate fluid vortexes behind each flow disturbing device, and through periodic arrangement, the vortexes can effectively accelerate mixing of cold fluid and hot fluid, so that the heat exchange effect of the whole heat sink is improved.
Further, the micro-channels are mutually parallel straight flow channels, and the cross section of the micro-channel perpendicular to the flowing direction of the cooling liquid is rectangular. Specifically, the bottom wall of the microchannel is the long side of the rectangle, and the length-width ratio of the rectangle is 2: 1.
The beneficial effect of adopting the further scheme is that: the micro-channels are parallel to each other, so that heat transfer of the heat sink body is more uniform, the vertical cross sections of the micro-channels are rectangular, the flow of cooling liquid can be smoother, and a larger space is also provided for the subsequent arrangement of the turbulence devices. Through simulation, the heat sink cross section velocity field flow diagram shows that compared with a straight-through type microchannel heat sink, the structure adopting the proportion can form obvious induced vortexes besides main vortexes in the cross section direction, and the induced vortexes gradually move towards the lower wall surface in the development process of the flow direction, so that the velocity gradient of the wall surface boundary layer is increased, meanwhile, the thickness of the boundary layer can be reduced and damaged, and the thermal resistance of the boundary layer is reduced.
The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings. The detailed description of the present invention is given by the following examples and the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation to the invention. In the drawings:
fig. 1 is a front view of a microchannel heat sink with a turbulator according to an embodiment of the present invention;
fig. 2 is a front view of a microchannel heat sink with turbulators according to another embodiment of the present invention;
fig. 3 is a detailed view of a microchannel with a microchannel heat sink of a turbulent device according to an embodiment of the present invention;
FIG. 4 is a detailed view of a microchannel with a microchannel heat sink having a turbulator in accordance with another embodiment of the present invention;
fig. 5 is a detail view of a spoiler with a microchannel heat sink of a spoiler according to an embodiment of the present invention;
fig. 6 is a detail view of a spoiler with a microchannel heat sink according to another embodiment of the present invention;
FIG. 7 is a temperature distribution diagram of the same section of a microchannel heat sink with a flow perturbation device (left) and a conventional heat sink without a flow perturbation device (right);
figure 8 is a microchannel heat sink along microchannel runner cross section velocity vector diagram with turbulator provided by the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a heat sink body; 2. a microchannel; 3. a flow disturbing device; 31. a first spoiler; 32. a second spoiler.
Detailed Description
The principles and features of the present invention are described below in conjunction with the accompanying fig. 1-8, the examples given are intended to illustrate the present invention and are not intended to limit the scope of the invention.
As shown in fig. 1-8, the utility model provides a take microchannel heat sink of vortex device, including heat sink 1 that has the inner chamber, heat sink 1's inner chamber is equipped with many microchannels 2 that supply the coolant liquid to flow through, evenly distributed has multiunit vortex device 3 along the coolant liquid flow direction in microchannel 2.
The utility model provides a pair of microchannel heat sink with vortex device because its vortex device 3 that sets up makes the coolant liquid produce the swirl in microchannel 2, breaks the boundary layer that flows, strengthens the mixing of cold and hot fluid, improves radiating efficiency.
Preferably, each set of the flow perturbation devices 3 comprises one or more flow disrupters, each flow disrupter comprises a first flow perturbation plate 31 and a second flow perturbation plate 32, the first flow perturbation plate 31 is vertically arranged, the lower end of the first flow perturbation plate 31 is fixed on the bottom wall of the micro-channel 2, the upper end of the first flow perturbation plate is connected with the lower end surface of the second flow perturbation plate 32, and the upper end surface of the second flow perturbation plate 32 inclines from bottom to top to downstream along the flowing direction of the cooling liquid. The turbulent flow device 3 can make the cooling liquid generate vortex and turbulent flow in the micro-channel 2, thereby breaking a flow boundary layer, enhancing the mixing of cold and hot fluids and improving the heat dissipation efficiency. Compared with a straight-through heat sink, the spoiler design with the structure can not only continuously interrupt the flow of the fluid along the horizontal direction of the flow of the fluid and promote the heat conducted by the heat source to carry out multiple and sufficient convective heat transfer on the cooling fluid, but also can generate the convective heat transfer effect along the vertical direction of the flow of the fluid, so that compared with the traditional straight-through heat sink, the heat sink has higher heat transfer capability.
Preferably, the first spoilers 31 are arranged in parallel in the direction in which the coolant flows, and the second spoilers 32 are arranged perpendicularly to the first spoilers 31. The first spoiler 31 of the spoiler 3 located below generates a small resistance to the coolant, and the spoiler located above generates a large resistance to the coolant, and makes the coolant generate a vortex and a turbulent flow. The combined spoiler design can effectively generate multiple vortexes at the rear end of each spoiler which is periodically distributed, the distribution characteristics of flow fields of the multiple vortexes determine that the distribution characteristics of temperature fields of the combined spoiler are better than those of a traditional straight-through type heat sink, for example, a left graph in fig. 7 is a heat sink heat intensity field cloud chart with a spoiler, and a right graph is a heat sink heat intensity field cloud chart without the spoiler, and the design can generate certain pressure loss, but the energy loss can be accepted for an active heat exchange mode.
Preferably, the first spoiler 31 is a right trapezoid, a right-angled side of the right trapezoid is fixed on the bottom wall of the microchannel 2, and a hypotenuse of the right trapezoid is connected with the lower end surface of the second spoiler 32. The design ensures that the spoiler has turbulence function and simultaneously has less choked flow as much as possible. Compared with the combination mode of a vertical structure and a horizontal structure, the combination mode can effectively reduce the resistance of the fluid working medium in the flowing process. Compared with a straight-through heat sink, the structure design can generate certain resistance to the fluid working medium, but the structure design can fully mix cold fluid and hot fluid to strengthen the heat exchange effect.
Preferably, the second spoiler 32 has an isosceles trapezoid or a rectangular shape, and is disposed at the upper end of the first spoiler 31 in an axisymmetrical manner with respect to the first spoiler 31. The axial symmetry shape enables the spoiler to have a symmetrical effect on the cooling liquid, which is beneficial to the uniform flow of the cooling liquid in the flow channel, and does not generate the phenomenon of overhigh local temperature of the heat source, which is effective for the effective heat dissipation of the heat sink. The second spoiler adopts the structural design of isosceles trapezoid or rectangle, compares in the heat sink of through type, can effectually break the fluid boundary layer, accelerates the intensive mixing of cold, hot-fluid.
Preferably, each group of the flow disturbing devices 3 is arranged in an axisymmetric manner, and each group of the flow disturbing devices 3 is arranged along the center line of the micro-channel 2. Preferably, each set of the flow perturbation devices 3 comprises three flow disrupters, the three flow disrupters are distributed at the vertex positions of an isosceles triangle, and the central line of the isosceles triangle coincides with the central line of the micro-channel 2. When each group of the spoiler devices 3 comprises one spoiler, the spoilers are in an axisymmetric structure, and the symmetric axis of the spoiler is superposed with the central line of the micro-channel 2. When each group of the turbulence devices 3 comprises three turbulence generators, the three turbulence generators are respectively distributed at the vertex positions of the isosceles triangles, and the central lines of the isosceles triangles are superposed with the central line of the micro-channel 2.
The above-mentioned axially symmetric shape enables the effect of the turbulators on the coolant to be symmetric. The design of the mechanism can enable fluid to generate fluid vortexes behind each flow disturbing device, and through periodic arrangement, the vortexes can effectively accelerate mixing of cold fluid and hot fluid, so that the heat exchange effect of the whole heat sink is improved.
Preferably, the microchannels 2 are straight flow channels parallel to each other, and the cross section of the microchannel 2 perpendicular to the flow direction of the cooling liquid is rectangular. Specifically, the bottom wall of the microchannel 2 is the long side of the rectangle, and the length-width ratio of the rectangle is 2: 1. The micro-channels 2 are parallel to each other, so that the heat transfer of the heat sink body 1 is more uniform, the vertical cross sections of the micro-channels 2 are rectangular, the flow of cooling liquid can be smoother, and a larger space is also provided for the subsequent arrangement of the turbulence devices 3. Through simulation, a velocity field flow diagram (figure 8) of the cross section of the heat sink shows that compared with a straight-through type microchannel heat sink, the structure adopting the proportion can form obvious induced vortexes besides main vortexes in the cross section direction, and the induced vortexes gradually move towards the lower wall surface in the development process of the flow direction, so that the velocity gradient of the wall surface boundary layer is increased, meanwhile, the thickness of the boundary layer can be reduced and damaged, and the thermal resistance of the boundary layer is reduced.
Preferably, the heat sink body 1 is made of a non-metallic material, silicon.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way; the present invention can be smoothly implemented by those skilled in the art according to the drawings and the above description; however, those skilled in the art should understand that changes, modifications and variations made by the above-described technology can be made without departing from the scope of the present invention, and all such changes, modifications and variations are equivalent embodiments of the present invention; meanwhile, any changes, modifications, evolutions, etc. of the above embodiments, which are equivalent to the actual techniques of the present invention, still belong to the protection scope of the technical solution of the present invention.
Claims (7)
1. The utility model provides a take microchannel heat sink of vortex device which characterized in that: comprises a heat sink body (1) with an inner cavity, the inner cavity of the heat sink body (1) is provided with a plurality of micro-channels (2) for cooling liquid to flow through, a plurality of groups of turbulence devices (3) are uniformly distributed in the microchannel (2) along the flowing direction of the cooling liquid, each group of turbulence devices (3) comprises one or more turbulence generators, each turbulence generator comprises a first turbulence plate (31) and a second turbulence plate (32), the first turbulence plates (31) are vertically arranged, the lower end of the baffle is fixed on the bottom wall of the micro-channel (2), the upper end of the baffle is connected with the lower end surface of the second spoiler (32), the upper end surface of the second spoiler (32) inclines downwards from bottom to top along the flowing direction of the cooling liquid, the first spoilers (31) are arranged in parallel in the direction in which the cooling liquid flows, and the second spoilers (32) are arranged perpendicularly to the first spoilers (31).
2. The microchannel heat sink with turbulator according to claim 1, wherein the first turbulator (31) is a right trapezoid, the right-angled side of the right trapezoid is fixed on the bottom wall of the microchannel (2), and the oblique side of the right trapezoid is connected to the lower end face of the second turbulator (32).
3. The microchannel heat sink with turbulator according to claim 1, wherein the second spoiler (32) is in the shape of an isosceles trapezoid or a rectangle, and is disposed at the upper end of the first spoiler (31) with the first spoiler (31) as an axis symmetry.
4. The microchannel heat sink with flow perturbation device as claimed in any of claims 1 to 3, wherein the microchannels (2) are straight channels parallel to each other and the cross section of the microchannels (2) perpendicular to the direction of the coolant flow is rectangular.
5. The microchannel heat sink with turbulator according to claim 4, wherein the bottom wall of the microchannel (2) is the long side of the rectangle, and the length-width ratio of the rectangle is 2: 1.
6. The microchannel heat sink with turbulator according to claim 4, wherein when each set of turbulators (3) comprises one turbulator, the turbulator has an axisymmetric structure, and the symmetry axis of the turbulator coincides with the upper and lower projection of the center line of the microchannel (2).
7. The microchannel heat sink with turbulator according to claim 4, wherein when each set of turbulators (3) comprises three turbulators, the three turbulators are respectively distributed at the vertex positions of an isosceles triangle, and the central line of the isosceles triangle coincides with the up-down projection of the central line of the microchannel (2).
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| CN201922124048.4U CN211982360U (en) | 2019-12-02 | 2019-12-02 | Micro-channel heat sink with turbulence device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113891546A (en) * | 2021-11-02 | 2022-01-04 | 中国电子科技集团公司第二十九研究所 | Printed circuit board embedded with reinforced structure micro-channel and preparation method thereof |
| CN113973460A (en) * | 2021-11-05 | 2022-01-25 | 天津航空机电有限公司 | Regenerative cooling heat protection case |
| WO2023045275A1 (en) * | 2021-09-27 | 2023-03-30 | 中兴通讯股份有限公司 | Heat dissipation assembly and heat dissipater |
-
2019
- 2019-12-02 CN CN201922124048.4U patent/CN211982360U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023045275A1 (en) * | 2021-09-27 | 2023-03-30 | 中兴通讯股份有限公司 | Heat dissipation assembly and heat dissipater |
| CN113891546A (en) * | 2021-11-02 | 2022-01-04 | 中国电子科技集团公司第二十九研究所 | Printed circuit board embedded with reinforced structure micro-channel and preparation method thereof |
| CN113973460A (en) * | 2021-11-05 | 2022-01-25 | 天津航空机电有限公司 | Regenerative cooling heat protection case |
| CN113973460B (en) * | 2021-11-05 | 2023-10-20 | 天津航空机电有限公司 | Regenerative cooling thermal protection case |
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