CN216626419U

CN216626419U - Integral radiator for power electronic heat radiation

Info

Publication number: CN216626419U
Application number: CN202122244738.0U
Authority: CN
Inventors: 翁林
Original assignee: Shanghai Chongyu Computer Technology Co ltd
Current assignee: Shanghai Chongyu Computer Technology Co ltd
Priority date: 2021-09-16
Filing date: 2021-09-16
Publication date: 2022-05-27
Anticipated expiration: 2031-09-16

Abstract

The utility model relates to an integral radiator for power electronic heat dissipation, which comprises a heat dissipation plate (1) contacted with a power electronic component and a plurality of heat dissipation fins (2) contacted with a refrigerant, wherein the heat dissipation plate (1) and the heat dissipation fins (2) are integrally formed, one side of the heat dissipation plate (1) is provided with a contact area matched with the power electronic component, the other side of the heat dissipation plate is provided with a heat dissipation area (3) used for flowing of the refrigerant, the heat dissipation fins (2) are distributed in the heat dissipation area (3), the two sides of the heat dissipation area (3) on the heat dissipation plate (1) are respectively provided with a refrigerant inlet (4) and a refrigerant outlet (5), and the refrigerant inlet (4), the heat dissipation area (3) and the refrigerant outlet (5) are sequentially communicated. Compared with the prior art, the radiator has the advantages that the radiating fins and the radiating plate are integrated, so that the heat exchange efficiency of the radiator is greatly improved, the energy is saved, the size is reduced, and the manufacturing cost is reduced.

Description

Integral radiator for power electronic heat radiation

Technical Field

The utility model relates to the field of radiators, in particular to an integral radiator for power electronic heat dissipation.

Background

Due to the advantages of the power electronic technology, the power electronic technology is widely applied to the fields of flexible direct current (alternating current) transmission, high-voltage direct current transmission, motor driving, communication rooms, reactive compensation and the like of a power system, and has huge development potential. In power electronic devices, power electronic components generate a large amount of heat during operation, so that the problem of heat dissipation of power electronic equipment becomes more and more prominent, and therefore, heat sinks are very important in power electronic technology.

When the heat sink is made of aluminum alloy, the heat sink is usually manufactured separately from a portion (simply referred to as a heat dissipation plate) in contact with power electronics and a heat dissipation plate in contact with a refrigerant due to technical limitations. The heat sink plate and the heat sink are then connected in different ways. Such as brazing, laser welding, stir welding, extrusion, and heat transfer glue, among others. The radiating fins connected with the radiating plate in the above modes are manufactured by a stamping method, and the radiating fins manufactured by the method have the advantages of thin thickness (the thickness can be less than 0.2 mm), large surface area and the like. However, such stamped fins also have certain disadvantages: for example, the price of the die is high, most radiating fins are formed by single design circulation, most radiating fins cannot bear the load, and the pressure drop of a refrigerant is large when the heat transfer area of each radiating fin is large. The radiator is also manufactured by integrally extruding and molding the radiating fins and the radiating plate, the thickness and the spacing of the radiating fins manufactured by the method are larger than 1 mm, the radiating fins can only be arranged in a rectangular shape and also need to be continuously arranged in equal length, the radiating fins have low heat transfer efficiency, cannot bear load and can generate larger flow loss.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an integral heat radiator for power electronic heat dissipation.

The purpose of the utility model is realized by the following technical scheme:

the utility model provides a whole radiator for power electronic heat dissipation, whole radiator is including being used for the heating panel and a plurality of the fin that is used for contacting with the refrigerant with the contact of power electronic components, heating panel and fin integrated into one piece, one side of heating panel is equipped with the contact zone with power electronic components looks adaptation, and the opposite side is equipped with the radiating area that is used for the refrigerant to flow, and a plurality of fins distribute in the radiating area, be equipped with refrigerant entry and refrigerant export respectively in the both sides of radiating area on the heating panel, refrigerant entry, radiating area and refrigerant export communicate in proper order. The power electronic components can be replaced by power electronics for short. The number and the types of the radiating fins can be added and arranged according to requirements and actual conditions.

The heat dissipation area comprises one or more of an inlet flow guide section, an enhanced fluid heat exchange section, a flow resistance reduction section and an outlet flow guide section, namely only cooling fins with enhanced heat exchange functions can be arranged, so that the whole heat dissipation area only has the enhanced fluid heat exchange section, and also only cooling fins with flow resistance reduction functions can be arranged, so that the whole heat dissipation area only has the flow resistance reduction section, and the cooling fins with different shapes can be arranged in functional sections with different numbers and different functions. The functional sections adopt radiating fins with different designs.

The heat dissipation area is a single-channel whole-block arrangement, and the specific shape of the whole block can be square or round and the like.

One setting way at this time is: refrigerant entry and refrigerant export are the diagonal setting, along refrigerant entry to refrigerant export the direction in proper order will be located the refrigerant and enter the heat dissipation district between the refrigerant export and be imported water conservancy diversion section, reduce flow resistance section and export water conservancy diversion section, the region that is located the corner also divides into and reduces flow resistance section (this section can be regarded as the water conservancy diversion section simultaneously), and remaining region is whole to be divided into and strengthens the fluid heat transfer section. Each area is provided with the radiating fins in different shapes, so that the areas respectively realize the effects of guiding flow, strengthening fluid heat exchange and reducing flow resistance, for example, the radiating fins of the flow resistance reducing section have the function of reducing separation loss generated when the flow changes direction.

Or the heat dissipation district is the snakelike setting of single channel, and whole heat dissipation district is divided into parallel arrangement and the channel that communicates in proper order this moment, still has bellied strip heating panel part that is between the adjacent channel, when connecting apron and heating panel, except that heat dissipation district is the heating panel and the fin of frame form all around, be strip heating panel between the channel in addition and can with the apron connection, the fin both had been with the function that fluid matter heat transfer also played connection heating panel and apron this moment, thereby the radiator can bear very high fluid pressure.

One setting way at this time is: the reinforced fluid heat exchange section, the flow guide section, the flow resistance reducing section (which is positioned at a corner and can be used as the flow guide section), the reinforced fluid heat exchange section and the flow guide section are sequentially arranged, wherein the reinforced fluid heat exchange section and the flow guide section can also be alternately arranged.

Or the radiating areas are arranged in parallel in multiple channels, radiating fins with different functions are additionally arranged in each flow channel, correspondingly, a refrigerant inlet and a refrigerant outlet are respectively formed in the two ends of each channel, and the specific arrangement can refer to the layout of the single channel whole block.

Or the radiating area is in multi-channel serpentine arrangement, radiating fins with different functions are additionally arranged in each flow channel, correspondingly, a refrigerant inlet and a refrigerant outlet are respectively formed in the two ends of each channel, and the layout of the serpentine arrangement of the single channel can be referred to in the specific arrangement.

The radiating fins positioned on the inlet flow guide section and the incoming flow direction of the refrigerant at the refrigerant inlet are distributed in an included angle.

The radiating fins positioned on the outlet flow guide section and the refrigerant outlet are distributed in the same included angle with the refrigerant flowing direction.

The cross section of the radiating fins positioned on the reinforced fluid heat exchange section adopts one or more of a round shape, a spindle cone shape, a strip shape, a streamline shape or a V shape. When the radiating fins in the shapes are distributed, the front ends of the radiating fins and the incoming flow direction of the refrigerant form a large attack angle, the radiating fins in the shapes break a boundary layer, and the exchange between far-field fluid and fluid in the boundary layer is increased, so that the aim of increasing the convection heat transfer coefficient of a fluid-solid interface is achieved macroscopically.

The radiating fins positioned on the reinforced fluid heat exchange section are formed by two strip-shaped fins which are distributed in a splayed shape, or are formed by two triangular prisms with trapezoidal side surfaces and connecting and distributing the trapezoidal side surfaces and the radiating area. The radiating fins in the shape change the flow velocity of refrigerant fluid flowing through the front end and the rear end of the radiating fins, so that vortexes are generated under the static pressure difference, and the vortexes are utilized to help the downstream radiating fins to achieve the purposes of increasing heat transfer and reducing flow resistance or flow guide energy.

The cross section of the radiating fin positioned at the flow resistance reducing section is in one or more of a shape with two pointed ends, an oval shape, a strip shape or a streamline shape.

The streamline shape of the cooling fins at the section with reduced flow resistance is defined by the formula of National Advisory Committee for Aeronoutics (NACA), and the parameters of the formula can be optimized according to the required flow field (turbulent flow or laminar flow), resistance coefficient, separation position of the flow boundary layer and the like. And the ratio of the major axis to the minor axis of the oval-shaped fins is greater than 3. The length to diameter ratio in the cylindrical fins is between 0.5 and 20.

The plurality of radiating fins are uniformly or non-uniformly arranged.

The adjacent radiating fins arranged in sequence along the flowing direction of the refrigerant are distributed with included angles. Especially, the radiating fins with streamline or strip-shaped cross sections are distributed at a certain angle, and the wake flow of the upstream radiating fins can be utilized to help the downstream radiating fins not to generate flow separation, so that the separation prevention effect (similar to the tail wings of racing cars) is realized, the flow resistance is reduced, the heat transfer is increased, and the like.

The thickness of the individual fins decreases gradually from the inside to the outside in the depth direction of the heat dissipation area. This arrangement is to facilitate the casting process.

The heat dissipation plate part provided with the heat dissipation area is arranged in a non-uniform thickness mode, namely the depth of the heat dissipation area is changed, and the depth of the heat dissipation area can be changed in consideration of the temperature and the heat dissipation capacity of a refrigerant. For example, when the refrigerant is a two-phase flow, the density of the fluid gradually decreases in the flow direction. The flow cross-sectional area of the flow channel can be adjusted by adjusting the thickness of the radiating plate, so that the optimal heat transfer coefficient is kept and the flow resistance is reduced.

The whole radiator also comprises a cover plate, and the cover plate is in contact with the surface of the radiating plate on which the radiating area is arranged to form a closed circulation area for the flowing of the refrigerant to prevent the refrigerant from leaking. For example, when the heat dissipation area is configured as shown in embodiment 1 (i.e., a heat dissipation area is formed by recessing an area on the heat dissipation plate), the cover plate may be used to seal the refrigerant.

If the height of the radiating fin is consistent with the depth of the radiating area, and the cover plate is covered on the radiating plate, the cover plate is not only in contact with the radiating plate (the contact part is a peripheral frame of the radiating area), but also in contact with the radiating fin, and at the moment, the radiating fin, the radiating plate and the cover plate can be completely fixed through a brazing technology. The radiating fins transfer heat with the refrigerant and simultaneously have the function of connecting the radiating plate and the cover plate. This connection has two benefits, 1) the projected area of the connection between the heat sink and the cover plate is increased, thereby improving the pressure resistance of the whole radiator. Can bear refrigerant with high pressure. 2) The stress points of the radiating fins are increased, and the anti-collision capacity of the radiating fins is enhanced (the radiating fins are collided due to certain pressure of the refrigerant in the moving process, and the radiating fins and the cover plate are connected into a whole and the cover plate also supports the radiating fins), so that the whole integral radiator is more stable and firm.

The heat dissipation area can be obtained by sinking a part of the heat dissipation plate, and can also be directly a plane.

The heat dissipation plate is provided with a channel which is respectively communicated with the refrigerant inlet and the refrigerant outlet in a penetrating way, the other opening of the channel is arranged on the surface of the contact area, and the channel is used for being communicated with the external refrigerant.

When the integral radiator further comprises a cover plate, the cover plate can also be provided with a channel respectively communicated with the refrigerant inlet and the refrigerant outlet in a penetrating way for introducing the refrigerant and flowing out the refrigerant.

One or more of carbon nanotubes (carbon nano tubes) or copper nanofibers are grown on the surface of the contact area adapted to the power electronics. The carbon nanotubes and copper nanofibers can increase the thermal conductivity of the power electronic components and the surface of the heat sink.

The diameter of the carbon nano tube and the copper nano fiber is less than 1 micron.

The carbon nano-tube grows by adopting a chemical vapor deposition method (chemical vapor deposition), and the copper nano-fiber grows by adopting an Electrochemical deposition method (Electrochemical deposition).

The utility model can adopt aluminum alloy material to make the integral radiator, and the radiating fins can also have the bearing function. So long as the bottom surface of the heat radiating fin (which is a plane where the heat radiating fin is not connected to the bottom surface of the heat radiating region) is flush with the other bottom surface of the heat radiating plate, and then brazed with the cover plate. The thickness of the radiating plate can be adjusted according to the radiating requirement, the incoming flow direction of the refrigerant and the position, and the thickness of the radiating plate can also be adjusted together.

The aluminum alloy material comprises a castable aluminum alloy material or a castable and brazeable aluminum alloy material. After the integral radiator is cast by the material, an additional accessory can be fixed on the integral radiator by means of brazing.

In the aluminum alloy material capable of being cast and brazed, the weight proportion of zinc element is less than 10%, the weight proportion of magnesium element is less than 6%, the weight proportion of silicon element is less than 2%, and the biological weight proportion of copper element is less than 3%. The four elements are key elements, wherein the weight ratio of one element or two elements or three elements can be as small as 0.

When the aluminum alloy material is adopted for casting, the specific casting process is as follows: firstly, the aluminum alloy is melted, and the melting temperature is between 450 and 900 ℃. And then pouring molten aluminum water into the mold. Gravity casting, low or high pressure casting, lost wax casting, or semi-solid casting may be used. After demoulding, the casting can be directly quenched and then subjected to aging to increase the strength, or naturally cooled and demoulded and then subjected to additional heat treatment.

The integral radiator comprises a heat dissipation plate and heat dissipation fins, wherein one side of the heat dissipation plate is a plane in contact with a power electronic component, the other side of the heat dissipation plate is provided with a heat dissipation area, the heat dissipation fins are distributed in the heat dissipation area, the heat dissipation plate and the power electronic component are in heat conduction through contact, a refrigerant can be gas or liquid, the refrigerant is input from the outside through a refrigerant inlet and enters the heat dissipation area to perform radiation and convection heat transfer with the heat dissipation plate, and the specific heat dissipation process is as follows: the energy of the power electronic component is firstly transmitted to the surface of the contact area of the heat dissipation plate, and is transmitted to the refrigerant through the heat dissipation plate and the heat dissipation fins, and the refrigerant moves to take away the heat. The heat dissipation plate and the heat dissipation fins are integrated, no additional connection is needed, the radiator can be integrally cast, and the radiator can be brazed. The integrally cast and brazeable radiator greatly avoids the design obstacles of the radiating fins, the shapes of the radiating fins can be adjusted according to requirements, such as increasing the flow guiding function, reducing the flow resistance function and increasing the convection heat transfer function, meanwhile, the radiating fins have the heat transfer function and can also bear the bearing function, so that the refrigerant allowable pressure of the radiator is greatly improved, the size of the radiator, the thickness of the radiating plate, the depth of a radiating area, the size of a contact area, the shape of the contact area and the height of the radiating fins are adjusted according to the transmission path of the radiating capacity, the optimal heat conduction efficiency of the integral radiator is realized, and the radiating fins positioned at the section with reduced flow resistance can reduce flow separation and reduce flow loss.

Compared with the prior art, the utility model has the following advantages:

1) the radiating fin and the radiating plate are integrated, so that the thermal contact resistance between the radiating fin and the radiating plate is removed, and the heat exchange efficiency of the radiator is greatly improved.

2) The radiating fin designed by the utility model can enhance the flowing assistance of the refrigerant according to the requirement, such as increasing the flow guiding function, reducing the flow resistance function and increasing the convection heat transfer function.

3) The carbon nano tubes or the nano copper fibers can be attached to the surface of the heat dissipation plate in the contact area by a chemical vapor deposition method or an electrochemical deposition method, so that the heat conduction of the power electronic component and the surface of the heat dissipation plate is increased.

4) The utility model designs the size range of the heat dissipation plate and the heat dissipation fin, the draft angle of the die and reduces the manufacturing cost aiming at the casting process.

5) The heat dissipation plate designed by the utility model can be made of castable aluminum alloy material, and the aluminum alloy material can be brazed at the same time, so that the designed heat dissipation plate can be used for heat transfer and can also be used for structural support, thereby reducing the requirement on the thickness of the heat dissipation plate at a heat dissipation area and reducing the thermal resistance of the heat dissipation plate.

6) The radiator designed by the utility model can bear high refrigerant pressure.

In conclusion, the utility model can save energy, reduce the volume, reduce the pressure drop of the refrigerant and reduce the manufacturing cost.

Drawings

FIG. 1 is a schematic view of the structure of the side of the integrated heat sink in contact with the refrigerant;

fig. 2 is a schematic structural diagram of a side of the integrated heat sink in contact with the power electronic component (i.e., a side provided with a contact region);

FIG. 3 is a cross-sectional view of an integral heat sink having fins of different heights;

FIG. 4 is a schematic diagram showing the division of the heat dissipation area and the arrangement of the heat dissipation fins;

FIG. 5 is a schematic view of the distribution of streamline fins distributed at an included angle;

FIG. 6 is a perspective view of several different shapes of fins located in the enhanced fluid heat exchange section (a is circular, b is fusiform, c is bar, d is streamlined, e is V-shaped);

FIG. 7 is a top view of several different shapes of fins located in the enhanced fluid heat exchange section (a is circular, b is fusiform, c is bar, d is streamlined, and e is V-shaped);

FIG. 8 is a perspective view of a first heat sink with varying flow rates of coolant fluid at front and rear ends of the heat sink;

FIG. 9 is a top view of a first heat sink with varying flow rates of coolant fluid at front and back ends of the heat sink;

FIG. 10 is a perspective view of a second heat sink with varying flow rates of coolant fluid at front and rear ends of the heat sink;

FIG. 11 is a top view of a second heat sink with varying flow rates of coolant fluid at front and back ends of the heat sink;

FIG. 12 is a perspective view of a first type of fins of unequal heights in the axial direction;

FIG. 13 is a perspective view of a second type of axially unequal height fins;

FIG. 14 is a schematic view of the positional relationship of the cover plate and the integral heat sink;

fig. 15 is a schematic structural view of an integral heat sink with a serpentine heat dissipation area.

In the figure: 1-a heat sink; 2-a heat sink; 3-a heat dissipation area; 301-inlet flow guide section; 302-an enhanced fluid heat exchange section; 303-reduced flow resistance section; 304-an exducer section; 4-refrigerant inlet; 5-refrigerant outlet; 6-cover plate.

Detailed Description

The utility model is described in detail below with reference to the figures and specific embodiments.

Example 1

As shown in fig. 1, 2, 3, 4, 14 (4, 5 in fig. 1, 2 can also exchange positions), an integral heat sink for power electronic heat dissipation is provided, the integral heat sink is square, and comprises a heat dissipation plate 1 for contacting with a power electronic component, a plurality of heat dissipation fins 2 for contacting with a refrigerant and a cover plate 6, the heat dissipation plate 1 and the heat dissipation fins 2 are integrally formed, one side of the heat dissipation plate 1 is provided with a contact area adapted to the power electronic component, the contact area is a plane, the other side is provided with a heat dissipation area 3 for flowing the refrigerant, the plurality of heat dissipation fins 2 are distributed in the heat dissipation area 3, the bottom surface of the heat dissipation fins 2 is flush with the portion of the heat dissipation plate 1 around the heat dissipation area 3, two sides of the heat dissipation area 3 are respectively provided with a refrigerant inlet 4 and a refrigerant outlet 5, a channel is arranged on the heat dissipation plate 1 at a position corresponding to the refrigerant inlet 4 and the refrigerant outlet 5 and penetrates to the side of the contact area (i.e. the refrigerant is introduced into the heat dissipation area from the side of the contact area, and leave from the side of the contact area), the refrigerant inlet 4, the heat dissipation area 3 and the refrigerant outlet 5 are sequentially communicated, the cover plate 6 is in contact with the side of the heat dissipation area 3 on the heat dissipation plate 1, the heat dissipation area is arranged in the middle of the heat dissipation plate and is square, the refrigerant inlet 4 and the refrigerant outlet 5 are respectively arranged on the diagonal lines of the heat dissipation area and occupy the corners of the heat dissipation area, and two corners of the heat dissipation area are arc-shaped. The plurality of fins 2 are arranged uniformly or non-uniformly.

As shown in fig. 4, in this embodiment, the heat dissipation area 3 having a square shape is divided into a plurality of areas, including an inlet flow guiding section 301, an enhanced fluid heat exchange section 302, a flow resistance reducing section 303 and an outlet flow guiding section 304, the refrigerant inlet 4 is diagonally arranged from the refrigerant outlet 5, the heat dissipation area between the refrigerant inlet 4 and the refrigerant outlet 5 is sequentially divided into the inlet flow guiding section 301, the flow resistance reducing section 303 and the outlet flow guiding section 304 along the direction from the refrigerant inlet 4 to the refrigerant outlet 4, the areas at the corners are also divided into the flow resistance reducing section 303 (also used for flow guiding), the remaining areas are the enhanced fluid heat exchange section 302, that is, the inlet flow guiding section 301 and the outlet flow guiding section 304 respectively occupy a quarter circle (respectively including the refrigerant inlet and the refrigerant outlet) with selectable radius, the flow resistance reducing section 303 at the middle part of the heat dissipation area has a diamond shape, the two reduced flow resistance sections 303 at the corners do not communicate with the reduced flow resistance section 303 at the middle. The cooling fins 2 at the inlet flow guide section 301 and the incoming flow direction of the refrigerant at the refrigerant inlet 4 are distributed at an included angle, and the cooling fins 2 at the outlet flow guide section 304 and the outgoing flow direction of the refrigerant at the refrigerant outlet 5 are distributed at an included angle. The inlet guide section 301 is sequentially provided with fusiform radiating fins with the same upper bottom size and lower bottom size and fusiform radiating fins with the upper bottom size smaller than the lower bottom size, the flow resistance reducing section 303 in the middle is provided with streamline radiating fins, the flow resistance reducing section 303 at the corners is provided with boomerang radiating fins, and the reinforced fluid heat exchange section 302 is provided with integral truncated cone-shaped radiating fins with the upper bottom size smaller than the lower bottom size.

As shown in fig. 6 and 7, the cross section of the heat dissipation fins 2 in the fluid-reinforced heat exchange section 302 may be one or more of circular (as shown by a, specifically oval), spindle-shaped (as shown by b), strip-shaped (as shown by c), streamline-shaped (as shown by d), or V-shaped (as shown by e), and when such heat dissipation fins are placed in the heat dissipation area, the angle of the heat dissipation fins needs to be adjusted so that the incoming flow direction is from right to left in fig. 6 and 7.

As shown in fig. 8 and 9, the heat sink 2 located in the reinforced fluid heat exchange section 302 is formed by two bar-shaped fins distributed in a splayed shape, i.e. the front ends of the two bar-shaped fins are not connected, or as shown in fig. 10 and 11, the heat sink 2 located in the reinforced fluid heat exchange section 302 is formed by two triangular prisms with trapezoidal side surfaces and connecting and distributing the trapezoidal side surfaces and the heat dissipation area 3. When such a heat sink is placed in the heat dissipation area, the angle of the heat sink needs to be adjusted so that the incoming flow direction is from bottom to top in fig. 8, 9, 10, and 11.

The cross section of the heat sink 2 at the flow resistance reducing section 303 is in one or more of a shape with two pointed ends, an ellipse, a strip or a streamline, as shown in fig. 4, the cross section is in an L shape, two sides of the L shape are basically parallel to the side edges of the heat dissipation area, and the two sides of the L shape are in smooth transition. The streamline shape adopted by the heat sink 2 located in the reduced flow resistance section 303 is defined by the formula of National Advisory Committee for Aeronoutics (NACA).

The cross section of the heat sink located in the inlet guide section 301 and the outlet guide section 304 may be spindle-shaped fins, or may be spindle-shaped fins with different sizes.

The radiating fins on the radiating area except for the inlet guide flow section 301, the fluid-reinforced heat exchange section 302, the flow resistance reducing section 303 and the outlet guide flow section 304 can be in the shape of a circular truncated cone.

As shown in fig. 5, the adjacent cooling fins 2 arranged in sequence along the refrigerant flowing direction are distributed with an included angle, especially the cooling fins 2 with a streamline or strip cross section.

As shown in fig. 12 and 13, in the depth direction of the heat dissipation area 3, the thickness of the single heat dissipation fin 2 gradually decreases from the inside to the outside, that is, the thickness of the heat dissipation fin gradually changes from the joint with the bottom surface of the heat dissipation area to the outside, fig. 12 shows a heat dissipation fin in which both the upper and lower bottom surfaces are streamlined, but the size of the streamline of the upper bottom surface (assumed as the bottom surface not connected with the bottom surface of the heat dissipation area) is larger than that of the lower bottom surface, and fig. 13 shows a heat dissipation fin in the form of a circular truncated cone, with the bottom surface having a small diameter located on the outside and the bottom surface having a large diameter connected with the bottom surface of the heat dissipation area. The design can be used as a draft angle for casting technology.

As shown in fig. 3, the portion of the heat dissipation plate 1 where the heat dissipation area 3 is disposed is set to have a non-uniform thickness, that is, the depth of the heat dissipation area 3 is changed, and the heights of different heat dissipation fins 2 are also changed, and the heights of the heat dissipation fins 2 generally increase gradually along the flowing direction of the refrigerant, or the thickness of the heat dissipation plate decreases gradually along the flowing direction of the refrigerant.

One or more of carbon nanotubes or copper nanofibers grow on the surface of the contact area, the carbon nanotubes grow by adopting a chemical vapor deposition method, the copper nanofibers grow by adopting an electrochemical deposition method, selected parameters are set according to the existing commonly used parameters in the deposition process, and the parameters of the deposition such as the thickness, the width, the length and the like are adjusted according to the requirements.

The integral radiator is made of aluminum alloy materials, the aluminum alloy materials comprise castable aluminum alloy materials or castable and brazable aluminum alloy materials, the weight proportion of zinc element is less than 10%, the weight proportion of magnesium element is less than 6%, the weight proportion of silicon element is less than 2%, and the weight proportion of copper element is less than 3%, and the castable aluminum alloy materials are made of the existing aluminum alloy which is commonly used as a casting process.

When the cooling device is used, the contact area of the power electronic component and the integral radiator is tightly contacted or directly adhered and fixed or the power electronic component is fixed on the integral radiator by adopting a clamp or a screw hole is arranged on the integral radiator to fix the power electronic component on the integral radiator and the like (specifically, the prior art can be referred to), then, a refrigerant is introduced from a refrigerant inlet, and after the refrigerant enters a heat dissipation area, due to the existence of the heat dissipation fins, the distribution condition in the heat dissipation area and the shape selected by the heat dissipation fins according to the distribution position, the refrigerant has serious turbulence and the like, the heat dissipation effect is better realized, and then, the heat transmitted from the power electronic component is taken away by the refrigerant and flows out from a refrigerant outlet. One side of the heat dissipation plate is in contact with the power electronic component, and the other side of the heat dissipation plate is in contact with a refrigerant to conduct radiation and convection heat transfer, so that energy transfer is conducted, the refrigerant can be gas, liquid or two-phase flow, and the heat dissipation plate are directly connected, so that the heat transfer coefficient and the heat transfer area of a solid and the refrigerant can be increased, and the heat transfer efficiency of the radiator and the refrigerant is further increased.

Example 2

As shown in fig. 15, an integral heat sink for dissipating heat from power electronics is a square whole, and includes a heat dissipating plate 1 contacting with power electronics components, and a plurality of heat dissipating fins 2 and cover plates contacting with a coolant, the heat dissipating plate 1 and the heat dissipating fins 2 are integrally formed, one side of the heat dissipating plate 1 is provided with a contact area adapted to the power electronics components, the contact area is a plane, the other side is provided with an open heat dissipating area 3 in a concave manner, the heat dissipating fins 2 are distributed in the heat dissipating area 3, the bottom surface of the heat dissipating fins 2 is flush with the portion of the heat dissipating plate 1 located around the heat dissipating area 3, the heat dissipating plate 1 is provided with a coolant inlet 4 and a coolant outlet 5 respectively penetrating through two sides of the heat dissipating area 3, the coolant inlet 4, the heat dissipating area 3 and the coolant outlet 5 are sequentially communicated, the coolant inlet 4 and the coolant outlet 5 are respectively located on a diagonal line of the heat dissipating plate in this embodiment, the heat dissipation area sets up the middle part at the heating panel, be snakelike setting, whole heat dissipation area is divided into parallel arrangement and the channel that communicates in proper order promptly, set gradually the cylinder form fin that is used for strengthening fluid heat transfer, the spindle shape fin that is used for the water conservancy diversion, cylinder form fin, spindle shape fin and cylinder form fin along the flow direction of refrigerant in every channel, later set up the fin that is the dartlike form of circling round that is used for reducing fluid resistance and water conservancy diversion in the corner, then repeat above-mentioned setting mode, the number and the row number of fin can set up according to actual conditions.

The integral radiator is prepared by selecting an aluminum alloy material which can be cast and brazed, wherein the weight proportion of zinc element is 6-7%, the weight proportion of silicon element is less than 0.5%, the weight proportion of magnesium element is 0.25-0.45%, and the weight proportion of copper element is 0.35-0.65%. The radiator of the embodiment adopts IGBT power electronic heat radiation, ethylene glycol is adopted as refrigerating fluid, the heat radiation capacity is 4kW, the flow rate of the refrigerating fluid is less than 0.2kg/s, and the pressure drop of the radiator is less than 60 kpa.

Example 3

The whole radiator for power electronic heat dissipation is the same as that in embodiment 1 except that a cover plate is provided with two channels at positions corresponding to a refrigerant inlet and a refrigerant outlet at two sides of a heat dissipation area for respectively flowing in and flowing out of a refrigerant (at the moment, the heat dissipation plate is not provided with a channel, namely, the side of a contact area is not provided with an opening).

Example 4

The integral radiator for power electronic heat dissipation is characterized in that heat dissipation areas are arranged in parallel in multiple channels, the arrangement in each channel can be carried out according to embodiment 1, and the rest of details can also be arranged according to embodiment 1.

Example 5

A whole radiator for power electronic heat dissipation is characterized in that a heat dissipation area is arranged in a multi-channel serpentine shape, the arrangement in each channel can be carried out according to embodiment 2, and the rest of details can also be arranged according to embodiment 2.

The embodiments described above are intended to facilitate the understanding and use of the utility model by those skilled in the art. It will be readily apparent to those skilled in the art that various modifications to these embodiments may be made, and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above embodiments, and those skilled in the art should make improvements and modifications within the scope of the present invention based on the disclosure of the present invention.

Claims

1. The utility model provides a whole radiator for power electronics is radiating, its characterized in that, whole radiator is including being used for with heating panel (1) and a plurality of fin (2) that are used for contacting with the refrigerant of power electronic components contact, heating panel (1) and fin (2) integrated into one piece, one side of heating panel (1) is equipped with the contact zone with power electronic components looks adaptation, and the opposite side is equipped with radiating area (3) that are used for the refrigerant to flow, and a plurality of fin (2) distribute in radiating area (3), the both sides of radiating area (3) are equipped with refrigerant entry (4) and refrigerant export (5) respectively, refrigerant entry (4), radiating area (3) and refrigerant export (5) communicate in proper order.

2. An integrated heat sink for power electronics heat dissipation according to claim 1, wherein the heat dissipation area (3) comprises one or more of an inlet flow guiding section (301), an enhanced fluid heat exchange section (302), a reduced flow resistance section (303) and an outlet flow guiding section (304).

3. The integrated heat sink for power electronic heat dissipation according to claim 2, wherein the heat dissipation fins (2) at the inlet flow guide section (301) and the incoming flow direction of the refrigerant at the refrigerant inlet (4) are distributed at an included angle;

the heat radiating fins (2) positioned on the outlet flow guide section (304) and the refrigerant outlet (5) are distributed in the way that the flow-removing directions of the refrigerant form an included angle.

4. An integral heat sink for power electronics heat dissipation according to claim 2, characterized in that the cross-section of the fins (2) at the enhanced fluid heat exchange section (302) is one or more of circular, spun-cone, bar, streamlined or V-shaped;

the radiating fins (2) positioned on the reinforced fluid heat exchange section (302) are formed by two strip-shaped fins which are distributed in a splayed shape, or are formed by two triangular prisms with trapezoidal side surfaces and connecting and distributing the trapezoidal side surfaces and the radiating area (3);

the cross section of the radiating fin (2) positioned at the flow resistance reducing section (303) adopts one or more shapes of two pointed ends, an ellipse, a strip shape or a streamline shape.

5. -integral heat sink for power electronics heat dissipation according to claim 1, characterized in that the heat dissipation area (3) is provided in a single-channel monolithic block;

or the heat dissipation area (3) is arranged in a single-channel snake shape;

or the heat dissipation areas (3) are arranged in parallel in a multi-channel manner;

or the heat dissipation area (3) is arranged in a multi-channel snake shape.

6. The integral heat sink for power electronic heat dissipation according to claim 1, wherein the adjacent heat dissipation fins (2) arranged in sequence along the flow direction of the cooling medium are distributed at an included angle.

7. A unitary heat sink for dissipating heat from power electronics according to claim 1, characterised in that the thickness of the individual fins (2) decreases progressively from the inside outwards in the depth direction of the heat dissipating area (3).

8. An integral heat sink for dissipating heat from power electronics as claimed in claim 1, characterized in that the part of the heat sink plate (1) where the heat dissipating section (3) is located is arranged with unequal thickness.

9. An integrated heat sink for dissipating heat from power electronics according to claim 1, characterized in that the integrated heat sink further comprises a cover plate (6), wherein the cover plate (6) is in contact with the side of the heat sink plate (1) on which the heat dissipating areas (3) are provided.

10. The integral heat sink for dissipating heat from power electronics as claimed in claim 1, wherein one or more of carbon nanotubes or copper nanofibers are grown on the surface of the contact area adapted to the power electronics to enhance heat transfer.