CN109906021B - Cold plate and heat dissipation device for radar - Google Patents
Cold plate and heat dissipation device for radar Download PDFInfo
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- CN109906021B CN109906021B CN201910220751.7A CN201910220751A CN109906021B CN 109906021 B CN109906021 B CN 109906021B CN 201910220751 A CN201910220751 A CN 201910220751A CN 109906021 B CN109906021 B CN 109906021B
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Abstract
The disclosed embodiments relate to a cold plate and a heat dissipation device for radar. The cold plate comprises a cooling liquid inlet, a cooling liquid outlet, a first flow channel and a plurality of micro-channel structures, wherein the first flow channel is communicated between the cooling liquid inlet and the cooling liquid outlet and is in a step shape; the plurality of microchannel structures are arranged in parallel in the first flow channel. All the micro-channels are connected in parallel in a stepped mode, cooling liquid is uniformly distributed among all the micro-channels, the flow balance of the cooling liquid of all the micro-channels is guaranteed, and the heat exchange efficiency is improved.
Description
Technical Field
The disclosure relates to the technical field of liquid cooling of phased array radar antennas, in particular to a cold plate and a heat dissipation device for a radar.
Background
The active phased array radar is widely applied to the fields of ground air defense, airborne early warning, shipboard fire control and the like with the unique advantages. With the improvement of the index requirements of high gain, high power, light weight and the like, the heat flux density of an internal microwave power device is continuously increased, the heat productivity of part of chips exceeds 100W/cm2, and the heat flux density of the T/R assembly predicted by the U.S. naval in the future is likely to break through 1000W/cm 2. Such high heat flux densities, if not dissipated in a timely manner, can have a fatal effect on the overall performance of the radar system. At present, a micro-channel cold plate heat dissipation technology becomes the leading factor of an active phased array radar cooling technology.
In the related technology, in the design of a micro-channel cold plate, a cold plate flow channel generally flows through a power supply and a T/R assembly in an S shape, a local rectangular micro-channel is designed under each transmitting channel power amplification chip of the T/R assembly, and the channels are connected in series.
With regard to the above technical solutions, the inventors have found that at least some of the following technical problems exist: for example, the micro channels below each transmitting channel of the T/R assembly are connected in series, which may cause heat accumulation, i.e. the temperature of the power amplifier chip of the latter channel is always higher than that of the former channel, which may cause the temperature consistency of the power amplifier chips of different transmitting channels of the T/R assembly to be poor, thereby affecting the electrical performance of the antenna; the micro-channel structure below the power amplifier chip is rectangular, so that the heat exchange coefficient of the cooling liquid and the micro-channel is not high, and the heat exchange effect is poor; the S-shaped flow channel below the power supply is not ideal for heat source heat dissipation effect of distributed heat sources, and too many flow channels can increase the pressure of cooling liquid at the inlet of the cold plate, which increases the power requirement of the liquid supply pump. Accordingly, there is a need to ameliorate one or more of the problems with the related art solutions described above.
It is noted that this section is intended to provide a background or context to the embodiments of the disclosure that are recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.
Disclosure of Invention
It is an object of embodiments of the present disclosure to provide a cold plate and a heat dissipating device for a radar that overcome, at least to some extent, one or more of the problems due to limitations and disadvantages of the related art.
According to a first aspect of embodiments of the present disclosure, there is provided a cold plate comprising:
a coolant inlet;
a coolant outlet;
the first flow channel is communicated between the cooling liquid inlet and the cooling liquid outlet and is in a step shape; and
a plurality of microchannel structures disposed in parallel within the first flow channel.
In one embodiment of the present disclosure, the microchannel structure includes a plurality of spaced heat dissipating ribs, each of the heat dissipating ribs being curved.
In an embodiment of the present disclosure, the heat dissipation ribs are wavy.
In an embodiment of the present disclosure, widths of the first flow channels in a direction from the coolant inlet to the coolant outlet are sequentially decreased or sequentially increased.
In an embodiment of the present disclosure, the cold plate further comprises:
a second flow passage communicating between the coolant inlet and the first flow passage;
at least one first flow-guiding column located at the inlet of the second flow channel;
at least one second flow-directing column located within the second flow channel;
the diameter of the first guide column is smaller than that of the second guide column.
In one embodiment of the present disclosure, the second flow passage includes an inlet, an outlet, and a flow passage communicating between the inlet and the outlet, the flow passage having a size larger than the inlet and the outlet.
In an embodiment of the present disclosure, along a direction from an inlet to an outlet of the second flow passage, the second flow passage is divided into a first section, a second section and a third section which are connected in sequence;
the space between the plurality of second guide columns positioned in the first section is a first space; the distance between the plurality of second guide columns in the second section is a second distance; the distance between the second guide columns in the third section is a third distance;
wherein the first pitch is greater than the second pitch, and the third pitch is greater than the first pitch.
In an embodiment of the present disclosure, the cold plate includes an upper cover plate and a lower base plate, the first flow channel and the second flow channel are formed between the upper cover plate and the lower base plate, and the upper cover plate and the lower base plate are welded by diffusion welding.
In an embodiment of the present disclosure, the upper cover plate and the lower base plate are provided with exhaust holes at the cooling liquid inlet and/or the cooling liquid outlet.
According to a second aspect of embodiments of the present disclosure, there is provided a heat dissipating device for a radar, including:
at least one cold plate as described in the above embodiments, the cold plate surface comprising a first region for mounting a first heat generating device and a second region for mounting a second heat generating device;
the first flow channel corresponds to the first area, and the second flow channel corresponds to the second area.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
in the embodiment of the disclosure, by the cold plate and the heat dissipation device, the first flow channel of the cold plate is in the shape of the ladder, and the plurality of micro-channel structures are connected in parallel in the shape of the ladder, so that the balance of the flow of the cooling liquid of each micro-channel structure is ensured, the heat accumulation is avoided, the temperature consistency of the power amplifier chips of different emission channels of the T/R assembly is better, and the electrical property of the antenna is further improved.
In addition, the wavy heat dissipation rib structure of the micro-channel structure increases the heat exchange coefficient of the cooling liquid and the heat dissipation ribs, and improves the heat exchange effect.
The plurality of flow guide columns of the second flow channel enhance the heat exchange effect of the distributed heat source, reduce the pressure loss of the cooling liquid at the position, avoid fluid vortex and ensure the welding strength of the cold plate.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.
FIG. 1 shows a schematic structural view of a cold plate in an exemplary embodiment of the present disclosure;
FIG. 2 illustrates a schematic structural view of a cold plate in an exemplary embodiment of the present disclosure;
FIG. 3 illustrates a schematic structural view of a cold plate in an exemplary embodiment of the present disclosure;
FIG. 4 illustrates a schematic structural view of a cold plate in an exemplary embodiment of the present disclosure;
FIG. 5 shows a schematic structural view of a heat sink for a radar in an exemplary embodiment of the present disclosure;
fig. 6 shows a schematic structural view of a cold plate in an exemplary embodiment of the present disclosure.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Furthermore, the drawings are merely schematic illustrations of embodiments of the disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted. Some of the block diagrams shown in the figures are functional entities and do not necessarily correspond to physically or logically separate entities.
First, a cold plate is provided in this example embodiment. Referring to fig. 1, the cold plate may include a cooling fluid inlet 1, a cooling fluid outlet 2, a first flow channel 3 and a plurality of micro-channel structures 4, wherein the first flow channel 3 is communicated between the cooling fluid inlet 1 and the cooling fluid outlet 2, and the first flow channel 3 is stepped; a plurality of microchannel structures 4 are arranged in parallel in the first flow channel 3.
Through the cold plate, the micro-channels are connected in parallel in a stepped manner, and the cooling liquid is uniformly distributed among the micro-channels, so that the flow balance of the cooling liquid of each micro-channel is ensured.
Next, each part of the above-described cold plate in the present exemplary embodiment will be described in more detail with reference to fig. 1 to 4.
In one embodiment, the cooling liquid enters the first flow channel 3 from the cooling liquid inlet 1, and flows out from the cooling liquid outlet 2 after flowing through the first flow channel 3, and the cooling liquid inlet 1 and the cooling liquid outlet 2 may be located in the same side direction of the cold plate, or may be located in different side directions of the cold plate. The structure of the first flow channel 3 is a stepped structure, and more than two micro-channel structures 4 are included in the stepped first flow channel 3, and the specific number of the micro-channel structures can be determined according to the size and the number of the heat sources.
In one embodiment, the microchannel structure 4 may include a plurality of spaced heat dissipation ribs 5, each heat dissipation rib 5 is curved, and the curved heat dissipation ribs 5 may increase a heat exchange coefficient between the cooling liquid and the heat dissipation rib 5, enhance a heat exchange capability, and improve a heat exchange effect. For example, in a specific example, the heat dissipation ribs 5 may have a wavy shape, and more specifically, the wavy shape may be a shape formed by repeatedly and adjacently arranging large circles and small circles in a tangent manner.
In one embodiment, the widths of the first flow channels 3 in the direction from the coolant inlet 1 to the coolant outlet 2 are sequentially decreased or sequentially increased. As shown in fig. 1, the cooling liquid enters the section 6 of the microchannel structure 4 in the first flow channel 3, and the widths of the first flow channel 3 in the direction from the cooling liquid inlet 1 to the cooling liquid outlet 2 are sequentially reduced; the coolant flows out of the section 7 of the microchannel structure 4, and the width of the first flow channel 3 increases in the direction from the coolant inlet 1 to the coolant outlet 2. Through the ladder-shaped parallel connection of the micro-channel structures 4, the cooling liquid is uniformly distributed in each micro-channel structure 4, the balance of the flow of the cooling liquid in each micro-channel structure 4 is ensured, and meanwhile, the difference of the heat dissipation capacity of different positions on the surface of the cold plate is small, and the heat dissipation capacity is uniform.
In some embodiments, on the basis of the above-mentioned embodiments, in order to save space, a micro-channel structure 4 may be further provided near the inlet and/or outlet of the first flow channel 3, and the micro-channel structure 4 is connected in series with each micro-channel structure 4 in the first flow channel 3. For example, as shown in fig. 2, the cold plate includes a coolant inlet 1, a coolant outlet 2, a first flow channel 3, a first microchannel structure 8, and a plurality of second microchannel structures 9. The first microchannel structure 8 is communicated between the cooling liquid inlet 1 and the first flow channel 3, the first flow channel 3 is communicated between the first microchannel structure 8 and the cooling liquid outlet 2, the plurality of second microchannel structures 9 are arranged in the first flow channel 3 in parallel, and the first flow channel 3 is in a step shape. The cooling liquid enters the first micro-channel structure 8 from the cooling liquid inlet 1, flows through the first micro-channel structure 8 and then enters the first flow channel 3, and in the first flow channel 3, the cooling liquid uniformly flows through the second micro-channel structures 9; the cooling liquid flows through the first flow channel 3 and then flows out from the cooling liquid outlet 2.
In one embodiment, as shown in fig. 3, the cold plate may further include a second flow passage 10, at least one first flow post 11, and at least one second flow post 12. The second flow channel 10 is communicated between the coolant inlet 1 and the first flow channel 3, the first guide column 11 is located at the inlet of the second flow channel 10, the second guide column 12 is located in the second flow channel 10, and the diameter of the first guide column 11 is smaller than that of the second guide column 12. The specific number of the first guide pillars 11 and 12 may be determined according to the distribution of the heat source, and the embodiment of the present disclosure is not limited. The flow guide columns are arranged in the flow channel, so that efficient heat dissipation of heat sources in distributed distribution is realized, the compressive strength of the cold plate is enhanced, the generation of fluid vortexes in the flow channel is avoided, and the utilization efficiency of cooling liquid is improved. Generally, the size of the channel inlet is smaller, the diameter of the first guide column 11 of the channel inlet is smaller than that of the second guide column 12 in the channel, the flowing resistance of the cooling liquid can be reduced, and the flow speed of the cooling liquid entering the channel is ensured.
In one particular example, the second flow channel 10 includes an inlet 13, an outlet 14, and a flow channel 15 communicating between the inlet and the outlet, the flow channel 15 having a size greater than the inlet 13 and the outlet 14. In the direction from the inlet 13 to the outlet 14 of the second flow passage 10, the second flow passage 10 is divided into a first section 16, a second section 17 and a third section 18 which are connected in sequence; the distance between the second guide columns 12 in the first section 16 is a first distance; the distance between the second guide columns 12 in the second section 17 is a second distance; the distance between the second guide columns 12 in the third section 18 is a third distance; wherein the first pitch is greater than the second pitch, and the third pitch is greater than the first pitch. As shown in fig. 3, the first section 16, the second section 17 and the third section 18 are separated by a dashed line in the figure. The flow channel in the first section 16 is narrow, and in order to ensure the flow rate and the flow velocity of the cooling liquid, the intervals between the plurality of second guide columns 12 positioned in the first section 16 are large; the inner flow channel of the second section 17 is widened, and the space between the second guide columns 12 of the second section 17 is reduced for controlling the flow velocity, improving the utilization efficiency of the cooling liquid and improving the heat exchange effect; the flow channel in the third section 18 is continuously wider, and in order to ensure that the cooling liquid is uniformly spread in the flow channel, the distance between the second guide columns 12 in the third section 18 is increased.
In one embodiment, as shown in fig. 4, the cold plate may further include an upper cover plate 19 and a lower plate 20, the first flow channel 3 and the second flow channel 10 are formed between the upper cover plate 19 and the lower plate 20, and the upper cover plate 19 and the lower plate 20 are connected by welding, not limited thereto, such as diffusion welding. In a specific example, the first flow channel 3 and the second flow channel 10 may be symmetrically disposed in the upper cover plate 19 and the lower base plate 20 by a process in advance, and then the upper cover plate 19 and the lower base plate 20 are connected by diffusion welding, so that a complete flow channel structure is formed between the upper cover plate 19 and the lower base plate 20.
In one embodiment, the upper and lower cover plates 19, 20 are provided with exhaust holes 21 at the coolant inlet 1 and/or the coolant outlet 2. In the process of welding, namely the upper cover plate 19 and the lower base plate 20, the cooling liquid flow channel structure is in a closed state, and in the welding process, the temperature of the flow channel rises to cause the internal pressure of the flow channel to change, so that the welding effect is directly influenced, therefore, the exhaust holes 21 are arranged on the upper cover plate 19 and the lower base plate 20 at the cooling liquid inlet 1 and/or the cooling liquid outlet 2, and the air in the cooling liquid flow channel can be ensured to be exhausted in time in the welding process. After the welding is completed, the coolant inlet 1 and the coolant outlet 2 are opened, so that a complete flow channel structure including the first flow channel 3 and the second flow channel 10 is formed.
According to a second aspect of an embodiment of the present disclosure, there is also provided in this example embodiment a heat dissipation apparatus for a radar, comprising at least one cold plate as described in the above embodiments, the cold plate surface comprising a first region 22 for mounting a first heat generating device and a second region 23 for mounting a second heat generating device; the first flow channel 3 corresponds to the first region 22, and the second flow channel 10 corresponds to the second region 23.
The first heat generating device may be a T/R component of the radar, and the second heat generating device may be a power supply of the T/R component. The active phased array radar antenna adopts a highly integrated design technology, an active subarray is used as a basic replaceable unit for an open array surface, a T/R component and a power supply thereof in the subarray are the most main power consumption devices, and heat generated by the T/R component and the power supply thereof needs to be dissipated with cooling liquid in a liquid cooling plate through heat exchange. The micro-channel structures 4 in the first flow channel 3 are connected in parallel in a stepped manner, so that the balance of the flow of the cooling liquid flowing through the micro-channel structures 4 is ensured, and the problem of temperature difference of power amplifier chips of different emission channels of the T/R component is solved; the wavy heat dissipation ribs 5 in the micro-channel structure 4 increase the heat exchange coefficient between the cooling liquid and the heat dissipation ribs 5, and the problem that the high heat flux power amplifier chip is difficult to dissipate heat is solved; the first flow guide column 11 and the second flow guide column 12 in the second flow channel below the power supply realize high-efficiency heat dissipation of power consumption devices in dispersed distribution, enhance the compressive strength of the cold plate, avoid the generation of inner cavity fluid vortex and improve the utilization efficiency of cooling liquid.
In a specific example, the number and arrangement of the first region 22 and the second region 23 of the heat sink may be specifically set and adjusted according to radar conditions, which is not limited in this embodiment of the disclosure. As shown in fig. 5, fig. 5 is a schematic structural diagram of a heat sink for radar, in which one end of a surface of a cold plate may include two symmetrical first regions 22 and the other end may include two symmetrical second regions 23, a first heat generating device mounted in the first region may be a T/R component of radar, and a second heat generating device mounted in the second region 23 may be a power supply source of the T/R component. As shown in fig. 6, fig. 6 is a schematic structural view of a cold plate corresponding to fig. 5, and the cold plate shown in fig. 6 includes two first flow channels 3 and two second flow channels 10. The two first flow channels 3 are symmetrically arranged at one end of the cold plate and are communicated with each other; the two second flow channels 10 are symmetrically arranged at the other end of the cold plate and are respectively communicated with the cooling liquid inlet 1 and the cooling liquid outlet 2. The cooling liquid flows in from a cooling liquid inlet 1 of the cold plate, flows through a second flow channel 10 below a power supply source, exchanges heat generated by a dispersed heat source of the power supply source, then flows through a first flow channel 3 below one T/R component along a planned flow channel, exchanges heat generated by a transmitting channel power amplification chip of the T/R component, sequentially flows through the first flow channel 3 below the other T/R component and the second flow channel 10 below the other power supply source, takes away the heat generated by the first flow channel 3 and the second flow channel 10, and finally flows out from a cooling liquid outlet 2 of the cold plate, so that heat exchange between the cold plate and all heat sources on the cold plate is completed.
It is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like in the foregoing description are used for indicating or indicating the orientation or positional relationship illustrated in the drawings, merely for the convenience of describing the disclosed embodiments and for simplifying the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and therefore should not be considered limiting of the disclosed embodiments.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless specifically limited otherwise.
In the embodiments of the present disclosure, unless otherwise specifically stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present disclosure can be understood by those of ordinary skill in the art as appropriate.
In the embodiments of the present disclosure, unless otherwise expressly specified or limited, the first feature "on" or "under" the second feature may comprise the first and second features being in direct contact, or may comprise the first and second features being in contact, not directly, but via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
Claims (7)
1. A cold plate, comprising:
a coolant inlet;
a coolant outlet;
the first flow channel is communicated between the cooling liquid inlet and the cooling liquid outlet and is in a step shape; and
a plurality of microchannel structures disposed in parallel within the first flow channel;
a second flow passage communicating between the coolant inlet and the first flow passage;
at least one first flow-guiding column located at the inlet of the second flow channel;
at least one second flow-directing column located within the second flow channel;
the diameter of the first guide column is smaller than that of the second guide column;
the second flow passage comprises an inlet, an outlet and a flow passage communicated between the inlet and the outlet, and the size of the flow passage is larger than that of the inlet and the outlet;
the second flow channel is divided into a first section, a second section and a third section which are connected in sequence along the direction from the inlet to the outlet of the second flow channel;
the space between the plurality of second guide columns positioned in the first section is a first space; the distance between the plurality of second guide columns in the second section is a second distance; the distance between the second guide columns in the third section is a third distance;
wherein the first pitch is greater than the second pitch, and the third pitch is greater than the first pitch.
2. The cold plate of claim 1, wherein the micro-channel structure comprises a plurality of spaced heat dissipating ribs, each of the heat dissipating ribs being curved.
3. The cold plate of claim 2, wherein the heat dissipating ribs are wavy.
4. The cold plate of claim 1, wherein the first flow channels sequentially decrease in width or sequentially increase in width along a direction from the coolant inlet to the coolant outlet.
5. The cold plate of claim 1, wherein the cold plate comprises an upper cover plate and a lower base plate, the first and second flow passages are formed between the upper cover plate and the lower base plate, and the upper cover plate and the lower base plate are welded by diffusion welding.
6. The cold plate of claim 5, wherein the upper and lower plates are provided with vent holes at the coolant inlet and/or the coolant outlet.
7. A heat sink for a radar comprising at least one cold plate according to any one of claims 1 to 6, the cold plate surface comprising a first region for mounting a first heat generating device and a second region for mounting a second heat generating device;
the first flow channel corresponds to the first area, and the second flow channel corresponds to the second area.
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| CN201910220751.7A CN109906021B (en) | 2019-03-22 | 2019-03-22 | Cold plate and heat dissipation device for radar |
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| CN110351980A (en) * | 2019-06-21 | 2019-10-18 | 加弘科技咨询(上海)有限公司 | A kind of liquid cold plate device |
| CN110165355B (en) * | 2019-07-02 | 2020-11-24 | 电子科技大学 | 3D printing integrated radiator and application thereof in phased array antenna |
| CN110430728A (en) * | 2019-07-31 | 2019-11-08 | 联想(北京)有限公司 | Cooling device and electronic equipment |
| CN110678043B (en) * | 2019-09-30 | 2021-01-19 | 潍柴动力股份有限公司 | Liquid cooling radiator and motor controller |
| CN113301762B (en) * | 2020-05-22 | 2023-02-28 | 西安黄河机电有限公司 | Heat abstractor and phased array radar structure |
| WO2022041428A1 (en) * | 2020-08-31 | 2022-03-03 | 远景动力技术(江苏)有限公司 | Battery pack and cold plate therefor |
| CN112201918A (en) * | 2020-11-10 | 2021-01-08 | 中国电子科技集团公司第二十研究所 | Liquid cooling plate for active phased array radar antenna array surface |
| CN114007386A (en) * | 2021-10-29 | 2022-02-01 | 珠海格力节能环保制冷技术研究中心有限公司 | Heat abstractor and frequency conversion cabinet |
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| CN206024381U (en) * | 2016-08-22 | 2017-03-15 | 阳光电源股份有限公司 | Radiating liquid cooling apparatus and the power electronic equipment with the radiating liquid cooling apparatus |
| CN106288918A (en) * | 2016-10-07 | 2017-01-04 | 南京艾科美热能科技有限公司 | A kind of typing runner cold drawing |
| CN107454811A (en) * | 2017-09-19 | 2017-12-08 | 湖北友诚热工设备有限公司 | A kind of cooled plate |
| CN107677152B (en) * | 2017-09-19 | 2020-06-19 | 电子科技大学 | Microchannel liquid cooling board |
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Effective date of registration: 20220704 Address after: 710000 in courtyard 21, Xingfu North Road, Xincheng District, Xi'an City, Shaanxi Province Patentee after: Xi'an Huanghe Electric Appliance Manufacturing Co.,Ltd. Address before: No.21 Xingfu North Road, Xincheng District, Xi'an, Shaanxi 710043 Patentee before: SHAANXI HUANGHE GROUP Co.,Ltd. |