CN116234266A

CN116234266A - Radiating assembly and electronic equipment

Info

Publication number: CN116234266A
Application number: CN202310330893.5A
Authority: CN
Inventors: 请求不公布姓名
Original assignee: Changzhou Weitu Fluid Technology Co ltd
Current assignee: Changzhou Weitu Fluid Technology Co ltd
Priority date: 2023-03-30
Filing date: 2023-03-30
Publication date: 2023-06-06

Abstract

The invention relates to the technical field of heat management, in particular to a heat dissipation assembly and electronic equipment, wherein the heat dissipation assembly comprises a liquid cooling sheet and a fan; the liquid cooling sheet is provided with a layer structure body and a micropump, the layer structure body is formed by bending a runner base body made of high polymer materials, and a flow path for flowing liquid cooling working medium is formed in the runner base body; the layer structure body is provided with a straight main body section and a bending main body section in the extending direction, and the micropump is used for driving the liquid cooling working medium to flow in the layer structure body along the flow path; the heat radiation component is characterized in that the runner base body is bent into the layered structure body and is integrated with the fan, and the layered structure body is subjected to air cooling, so that the liquid cooling plate serving as a micro-channel heat sink can also form a heat exchanger, the integration level is high, the volume is small, the weight is light, the application scene of the heat radiation component which is required to be light can be met, meanwhile, the contact area between the liquid cooling plate and high-speed air flow in a limited space is greatly increased by the layered structure body, namely the heat radiation area is increased, and the whole heat radiation efficiency of the heat radiation component is high.

Description

Radiating assembly and electronic equipment

Technical Field

The present invention relates to the field of thermal management, and more particularly, to a heat dissipation assembly, and in addition, to an electronic device having the heat dissipation assembly.

Background

The rapid development of electronic information technology and the rapid improvement of the technical level of electronic components push electronic equipment to gradually develop towards the direction of intellectualization and integration, innovative intelligent terminal products are also layered endlessly, but the problem of how to efficiently dissipate heat is brought along with the rapid development, the intelligent terminal products usually generate heat seriously in the use process, and if the heat cannot be timely dissipated, the working performance and the service life of the products are influenced by the excessively high heat, so that the user experience is greatly damaged.

Micro-channel heat sink is a highly efficient thermal management technology, which works on the principle of heat transfer using micro-channels. Microchannel heat sinks are typically composed of a series of embedded dense micro-channels that can transfer heat through internal fluid circulation. Because the surface area of the microchannel is much larger than the volume and the heat transfer distance is shorter, it can provide higher heat transfer efficiency. When the heat source heats the microchannel heat sink, heat will be transferred through the micro-channels to the liquid flowing along the way. The liquid will carry this heat to the heat exchanger and then be cooled by a series of coolers and fans, eventually releasing the heat to the surrounding environment;

since the micro-channel heat sink flows liquid instead of air, it is much more efficient in heat dissipation than conventional heat dissipation. However, the micro-channel heat sink is required to be provided with an independent heat exchanger for use, the micro-channel heat sink, the heat exchanger and the power pump are connected through an external pipeline to form a flow path for circulating heat dissipation working medium, the structure is relatively loose, and the whole heat dissipation system is complex in structure and large in volume due to arrangement and connection of the pipelines; in addition, the heat sink is usually made of metal materials with excellent thermal conductivity, such as aluminum, copper-based alloy, and the like, and complex morphology is processed on the metal matrix or micro channels are built in the metal matrix, so that the difficulty is considered to be great, and the manufacturing cost is high, meanwhile, the density of the metal materials is high, the mass of the metal-based heat sink is high, and the applicability is lacking in some application scenes which require the light weight of products.

Disclosure of Invention

The invention aims to solve the technical problems that: in order to solve the defects in the prior art, a heat dissipation assembly is provided at present to solve the problems that the existing micro-channel heat sink is required to be provided with an independent heat exchanger, which is not beneficial to the light weight of products, and meanwhile, the structure is loose and the volume is large; in addition, the electronic equipment comprising the heat dissipation assembly is also provided.

The technical scheme adopted for solving the technical problems is as follows: a heat dissipation assembly comprises a liquid cooling plate and a fan;

the liquid cooling sheet is provided with a layer structure body and a micro pump, the layer structure body is formed by bending a runner base body made of high polymer materials, a flow path for flowing liquid cooling working medium is formed in the runner base body, and the micro pump is fixedly connected with the runner base body;

the layer structure body is provided with at least one straight line main body section extending along a straight line and at least one bending main body section extending along a non-straight line in the extending direction, the layer structure body is provided with an installation part in an extending mode, the flow path at least passes through the straight line main body section and the bending main body section, and the micropump is used for driving the liquid cooling working medium to flow in the layer structure body along the flow path;

the fan is fixed on the mounting part and is used for generating air flow to the layered structure.

Further, the layer structure body is in a tortuous shape, the tortuous layer structure body comprises a plurality of layer units which are distributed at intervals, and the tail ends of the former in two adjacent layer units are connected with the head end of the latter through the tortuous units; the layer unit comprises at least one straight body section or/and at least two bending body sections, and the detour unit comprises at least one bending body section.

Further, the detour unit comprises at least one straight body section.

Further, the layer units are arranged at intervals in the thickness direction of the flow channel substrate.

Further, the end part of one end of the layer structure body is a straight line main body section, and the installation part extends out of the straight line main body section of the end part of the layer structure body.

Further, the layer structure is provided with an overflow hole.

Further, the runner base body is provided with a first surface and a second surface which are oppositely arranged, the distance between the first surface and the second surface defines the thickness, and a plurality of protruding parts are protruding on the first surface and/or the second surface.

Further, the outside of the runner matrix is provided with at least one liquid inlet and at least one liquid outlet which are communicated with the flow path, the liquid inlet is communicated with the liquid outlet of the micro pump, and the liquid outlet is communicated with the liquid inlet of the micro pump;

the micropump and the flow path are matched to form a closed circulating heat dissipation flow channel, the heat dissipation flow channel is filled with liquid cooling working medium, and the micropump is used for providing power for circulating flow of the liquid cooling working medium.

Further, the flow channel matrix is formed by at least two layers of membrane materials made of high polymer materials, all the membrane materials are laminated and sealed together to form at least one closed space, and the closed space forms the flow channel;

the thickness of the flow channel substrate is 0.1-2 mm, and the equivalent diameter of the flow channel is 10-1 mm.

The invention also provides electronic equipment comprising the heat dissipation assembly.

The beneficial effects of the invention are as follows: the heat radiation component of the invention adopts the structure that the runner base body is bent into the layer structure body and is integrated with the fan to perform air cooling on the layer structure body, so that the liquid cooling sheet serving as a micro-channel heat sink can also form a heat exchanger, the integration level is high, the volume is small, the weight is light, the application scene of the heat radiation component which is required to be light can be met, meanwhile, the contact area of the liquid cooling sheet and high-speed air flow in a limited space is greatly increased by the layer structure body, namely the heat radiation area is increased, and the whole heat radiation efficiency of the heat radiation component is high.

Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments of the present application, which proceeds with reference to the accompanying drawings.

Drawings

The invention will be further described with reference to the drawings and examples.

FIG. 1 is a schematic view of a flow channel substrate before bending in example 1;

FIG. 2 is a schematic diagram of a layer structure in example 1;

FIG. 3 is a second schematic diagram of the layer structure of example 1;

FIG. 4 is a schematic diagram III of the layer structure in example 1;

FIG. 5 is a schematic view showing a structure in which the micropump of embodiment 1 is fixedly connected to the flow channel substrate;

FIG. 6 is a schematic diagram of a heat dissipating assembly with the air outlet direction of the fan in embodiment 1 along the bending axis direction of the runner base;

FIG. 7 is a schematic view of the flow channel substrate of example 1 with an overflow hole;

FIG. 8 is a schematic diagram of a heat dissipating assembly with the air outlet direction of the fan in embodiment 1 being substantially perpendicular to the bending axis direction of the runner base;

FIG. 9 is a schematic view of the flow channel substrate in embodiment 2 raised toward the first surface and the second surface to form a plurality of protrusions;

fig. 10 is a schematic view of a heat dissipating assembly of a flow channel substrate bent to form a layer structure with a protrusion in example 2.

In the figure: 1. the liquid flow channel comprises a flow channel substrate, 11, a flow channel, 12, a bulge, 13, a liquid inlet, 14, a liquid outlet, 15, an overflow hole, 1a, a sealing cover substrate, 1b and a flow channel substrate;

2. a layer structure body 21, a straight main body section 22, a bending main body section 23, an installation part 2a, a layer unit 2b and a roundabout unit;

3. a fan;

4. a micropump 41, a fluid inlet 42 and a fluid outlet;

5. a heating element.

Detailed Description

The invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the invention and therefore show only those features which are relevant to the invention, and orientation and reference (e.g., up, down, left, right, etc.) may be used solely to aid in the description of the features in the drawings. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the claimed subject matter is defined only by the appended claims and equivalents thereof.

Example 1

As shown in fig. 1-8, a heat dissipating assembly includes a liquid cooling fin and a fan 3;

the liquid cooling sheet is provided with a layer structure body 2 and micro pumps 4, the number of the micro pumps 4 can be configured according to actual requirements, for example, the micro pumps 4 are provided with one or two or more than two, the layer structure body 2 is formed by bending a runner base body 1, the runner base body 1 can be in a patch shape, a flow path 11 for flowing liquid cooling working medium is arranged in the runner base body 1, and the micro pumps 4 are fixedly connected with the runner base body 1 as shown in fig. 1;

the flow channel base 1 has a structure of the flow channel 3 disclosed in publication No. CN 212910536U. In this embodiment, the flow channel substrate 1 is formed by at least two layers of film materials, all the film materials are laminated and sealed together to form at least one closed space, and the closed space forms the flow channel 11, specifically, the flow channel substrate 1 is formed by three layers of polymer film materials, namely, two

sealing substrates

1a and 1b, the flow channel substrate 1b is provided with holes or/and grooves, the two sealing substrates 1a respectively seal the two sides of the flow channel substrate 1b to form a closed space, and the closed space forms the flow channel 11, as shown in fig. 5, the material forming the flow channel substrate 1 is polymer materials, such as PC, PP, PET, or is a functional material formed by compounding a plurality of polymer materials, and the specific type is not limited herein, so that the polymer materials forming the flow channel substrate 1 do not react with the liquid cooling working medium filled in the flow channel 11. The high polymer material is easy to obtain, low in cost, relatively mature in lamination and sealing process between the high polymer film materials, easy to realize interlayer high-strength sealing connection, simple in batch forming process, and free of electromagnetic shielding and signal interference and influence on normal use of the electronic equipment. In addition, the excellent flexibility of the runner base body 1 is also provided, the runner base body 1 is formed into a flexible patch shape, can be bent and twisted, and can be molded, shaped and formed into a set shape by heating and pressurizing each layer of film material forming the runner base body 1 or the runner base body 1 after sealing molding;

the thickness of the flow channel substrate 1 is 0.1mm to 2mm, and the equivalent diameter of the flow channel 11 is 10 μm to 1mm. The microchannel formed by sealing the polymer film material has heat exchange efficiency comparable to that of a metal material, the dimension of the flow path 11 is controlled at the magnitude of the microchannel, and the microchannel has the characteristic of large surface area to volume ratio, so that the heat exchange efficiency of the liquid cooling plate is further improved, and meanwhile, the whole liquid filling amount is small and the mass is light.

The runner base body 1 is bent and shaped in multiple sections to form a layer interval structure, the layer structure 2 is provided with at least one straight line main body section 21 extending along a straight line and at least one bending main body section 22 extending along a non-straight line in the extending direction, the bending main body section 22 extending along the non-straight line can be particularly but not limited to the bending main body section 22 extending along a circular arc line or a parabola, the layer structure 2 is provided with an installation part 23 extending out, the flow path 11 at least passes through the straight line main body section 21 and the bending main body section 22, and the micropump 4 is used for driving the liquid cooling working medium to flow in the layer structure 2 along the flow path 11;

the layer structure body 2 is in a tortuous shape, the tortuous layer structure body 2 comprises a plurality of layer units 2a which are distributed at intervals, and the tail ends of the former in two adjacent layer units 2a are connected with the head end of the latter through a tortuous unit 2 b; the layer units 2a include at least one straight body section 21 or/and at least two bending body sections 22, the roundabout unit 2b includes at least one bending body section 22, the number of the layer units 2a can be adjusted according to the implementation requirement, the layer units 2a can be but are not limited to be arranged at intervals along the thickness direction of the runner base 1, the layer structure 2 is illustrated by the layer structure 2 having three layer units 2a, and the layer structure 2 can be but is not limited to the following three forms:

first layer structure 2 form: the layer units 2a are composed of a straight main body section 21, the roundabout unit 2b is composed of a bending main body section 22, the bending main body section 22 can be specifically a bending main body section 22 extending along an arc line or a parabola, two adjacent layer units 2a can be arranged in parallel with each other, and two adjacent layer units 2a can be also arranged at equal intervals along the thickness direction of the runner base body 1, as shown in fig. 2;

second layer structure 2 form: the upper and lower layer units 2a are each composed of a straight main body section 21, the detour unit 2b is composed of a bending main body section 22, and the bending main body section 22 may be a bending main body section 22 extending along an arc or a parabola; the middle layer unit 2a is formed by a plurality of bending main body sections 22 extending along an arc line or a parabola, and the middle layer unit 2a can also be regarded as being formed by one bending main body section 22 extending along a wavy line; the middle layer unit 2a may also be respectively contacted with the upper and lower layer units 2a to be supported between the upper and lower layer units 2a, thereby improving the strength of the layer structure 2, as shown in fig. 3;

third layer structure 2 form: the upper and lower layer units 2a are each composed of a straight main body section 21, the detour unit 2b is composed of a bending main body section 22, and the bending main body section 22 may be a bending main body section 22 extending along an arc or a parabola; the middle layer unit 2a is composed of a plurality of bent body sections 22 extending in an arc or a parabola and a straight body section 21, and both ends of the straight body section 21 in the extending direction thereof are respectively connected with the adjacent bent body sections 22, as shown in fig. 4;

it should be noted that the roundabout unit 2b further includes at least one straight main body section 21, that is, the roundabout unit 2b may be formed by combining the straight main body section 21 and the bending main body section 22, and one or two or more bending main body sections 22 in the same roundabout unit 2b may be provided, which is not limited in this embodiment.

The micro pump 4 is fixedly connected to the flow channel substrate 1, for example, the micro pump 4 may be fixed to the flow channel substrate 1 by bonding or welding to improve the integration level. In this embodiment, the inlet port 41 and the outlet port 42 of the micro pump 4 are located on the same side of the micro pump 4, the side of the micro pump 4 where the inlet port 41 and the outlet port 42 are located is fixedly connected with the runner base 1, and covers the liquid inlet 13 and the liquid outlet 14, so that the inlet port 41 and the liquid outlet 14 are communicated, and the outlet port 42 is communicated with the liquid inlet 13; the micropump 4 and the flow path 11 are matched to form a closed circulating heat dissipation flow path, the closed circulating heat dissipation flow path is filled with liquid cooling working medium, and the micropump 4 is used for providing power for circulating flow of the liquid cooling working medium. The effect that can reach is that the micro pump 4 realizes fixed connection through the mode that the face is connected with runner base member 1, does not need to set up external connecting line, simultaneously, the mode of face is connected more easily realizes reliable connection and seal. The micro pump 4 may be, but not limited to, a micro piezoelectric pump, and specifically, a liquid cooling heat dissipation module, a liquid cooling heat dissipation system and a power pump in an electronic device disclosed in chinese patent publication No. CN111818770a may also be used, which will not be described herein, as shown in fig. 5.

It should be noted that, the closed circulation heat dissipation flow channel formed by the cooperation of the micro pump 4 and the flow channel 11 may be a single-path closed circulation heat dissipation flow channel or a branched closed circulation heat dissipation flow channel with branches, and the branched closed circulation heat dissipation flow channel includes at least two branches intersecting each other and communicating with each other, which is not limited herein;

the closed circulation flow path formed by the cooperation of at least one micropump 4 and the flow path 11 may be one or a plurality of independent flow paths, or a plurality of flow paths having intersecting flow paths 11.

Meanwhile, when the number of the micropumps 4 is plural, the micropumps can be arranged in a serial or parallel mode according to actual requirements.

In addition, the micropump 4 is preferably fixedly connected to the rectilinear body section 21 of the layer structure 2 shaped, set, formed by the runner base 1 and as far away from the heat source as possible.

The fan 3 is fixed to the mounting portion 23 for generating an air flow toward the layer structure 2 so that the air blown out of the fan 3 can sweep the surface of the layer structure 2. The types of the fans 3 may be, but not limited to, axial fans 3, centrifugal fans 3, mixed flow fans 3 or cross flow fans 3, and in principle, the type and model of the fans 3 are selected according to the application scenario, but it is necessary to ensure that after the fans 3 are fixedly connected with the mounting portion 23, the fans 3 have an air outlet direction toward the layer structure 2, and in this embodiment, the centrifugal fans 3 are illustrated, and compared with the centrifugal fans 3, the degree of microminiaturization is higher, and the fans are lighter and thinner, such as the ultra-thin miniature heat dissipation fans 3 for notebook computers:

the end part of one end of the layer structure body 2 is a linear main body section 21, and an installation part 23 extends out of the linear main body section 21 of the end part of the layer structure body 2; for example, the mounting portion 23 extends from the lowermost layer unit 2a of the layer structure 2, and the heating element 5 (heat source) can be attached to the uppermost layer unit 2 a.

The heating element 5 is partially attached to the layer structure body 2 and forms heat exchange, the heating element 5 can be specifically attached to the linear main body section 21 of the layer structure body 2, then the circulating flow of the liquid cooling working medium is used for conducting local heat to the whole layer structure body 2, the fan 3 is used for exhausting air towards the layer structure body 2, and high-speed air flow passes through the surface of the layer structure body 2 to take away heat, so that efficient heat dissipation is realized. Preferably, the air outlet direction of the fan 3 is formed in a bending axis direction of the layer structure 2 by bending and shaping the air outlet direction substantially along the flow path base 1. So that when the fan 3 blows air towards the layer structure body 2, the high-speed air flow can sweep over the surfaces of the layer units 2a of the layer structure body 2, thereby increasing the effective heat dissipation area and being beneficial to improving the heat dissipation efficiency, as shown in fig. 6. Of course, this should not be taken as a limitation, for example, when the air outlet direction of the fan 3 is bent and shaped substantially perpendicular to the flow channel base 1 to form the bending axis direction of the layer structure 2, the flow channel base 1 may be provided with the through holes 15, so that when the air outlet direction of the fan 3 is toward the layer structure 2, the high-speed air flow can sweep the opposite surfaces of the layer units 2a of the layer structure 2, and the through holes 15 must avoid the flow channel 11; that is, the layer structure 2 is perforated with the flow-through holes 15 so as to arrange the fans 3, as shown in fig. 7 to 8.

The heat dissipation assembly of the embodiment adopts the structure that the runner base body 1 is bent into the layered structure body 2 and is integrated with the fan 3 to perform air cooling on the layered structure body 2, so that the liquid cooling sheet serving as a micro-channel heat sink can also form a heat exchanger, the integration level is improved, the volume is small, and the light weight of the heat dissipation assembly can be realized.

The runner base 1 of the liquid cooling sheet is made of polymer materials, the weight is light, the application scene of the product light weight requirement is met, meanwhile, the runner base 1 made of polymer materials is excellent in flexibility, bendable and torsionable, and can be molded in a heating and pressurizing mode, the layer structure body 2 is formed, the contact area between the liquid cooling sheet and high-speed air flow in a limited space is greatly increased by the layer structure body 2, namely the heat dissipation area is increased, and the whole heat dissipation efficiency of the heat dissipation assembly is high.

Example 2

Embodiment 2 is basically the same as the principle structure of embodiment 1, except that the flow channel base 1 has a first surface and a second surface disposed opposite to each other, the distance between the first surface and the second surface defining a thickness, and the first surface and/or the second surface has a plurality of protrusions 12 protruding therefrom, as shown in fig. 9 to 10; the shape, size, number, arrangement, etc. of the projections 12 can be adjusted according to actual conditions; the air flow can take away more heat when passing through the convex part 12, which is beneficial to improving the heat dissipation efficiency.

Example 3

An electronic device comprising the heat dissipation assembly of

embodiment

1 or 2.

The above-described preferred embodiments according to the present invention are intended to suggest that, from the above description, various changes and modifications can be made by the worker in question without departing from the technical spirit of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.

Claims

1. A heat dissipating assembly, characterized in that: comprises a liquid cooling sheet and a fan (3);

the liquid cooling sheet is provided with a layer structure body (2) and a micro pump (4), the layer structure body (2) is formed by bending a runner base body (1) made of high polymer materials, a flow path (11) for flowing liquid cooling working medium is formed in the runner base body (1), and the micro pump (4) is fixedly connected with the runner base body (1);

the layer structure body (2) is provided with at least one straight line main body section (21) extending along a straight line and at least one bending main body section (22) extending along a non-straight line in the extending direction, the layer structure body (2) is provided with an installation part (23) in an extending mode, the flow path (11) at least passes through the straight line main body section (21) and the bending main body section (22), and the micro pump (4) is used for driving liquid cooling working medium to flow in the layer structure body (2) along the flow path (11);

the fan (3) is fixed on the mounting part (23) and is used for generating air flow to the layered structure (2).

2. The heat dissipating assembly of claim 1, wherein: the layer structure body (2) is in a tortuous shape, the tortuous layer structure body (2) comprises a plurality of layer units (2 a) which are distributed at intervals, and the tail ends of the two adjacent layer units (2 a) are connected with the head end of the other layer unit through a tortuous unit (2 b); the layer unit (2 a) comprises at least one straight body section (21) or/and at least one bent body section (22), and the roundabout unit (2 b) comprises at least one bent body section (22).

3. The heat dissipating assembly of claim 2, wherein: the roundabout unit (2 b) further comprises at least one rectilinear body section (21).

4. The heat dissipating assembly of claim 2, wherein: the layer units (2 a) are arranged at intervals in the thickness direction of the flow channel substrate (1).

5. The heat dissipating assembly of claim 1, wherein: the end part of one end of the layer structure body (2) is a linear main body section (21), and the mounting part (23) extends out of the linear main body section (21) of the end part of one end of the layer structure body (2).

6. The heat dissipating assembly of claim 1, wherein: the layer structure (2) is penetrated with an overflow hole (15).

7. The heat dissipating assembly of claim 1, wherein: the flow channel base body (1) has a first surface and a second surface which are arranged opposite to each other, the distance between the first surface and the second surface defining a thickness, and the first surface and/or the second surface being provided with a plurality of projections (12) protruding therefrom.

8. The heat dissipating assembly of any of claims 1-7, wherein: the outside of the runner base body (1) is provided with at least one liquid inlet (13) and at least one liquid outlet (14) which are communicated with the flow path (11), the liquid inlet (13) is communicated with a liquid outlet (42) of the micro pump (4), and the liquid outlet (14) is communicated with a liquid inlet (41) of the micro pump (4);

the micro pump (4) and the flow path (11) are matched to form a closed circulating heat dissipation flow path, the heat dissipation flow path is filled with liquid cooling working medium, and the micro pump (4) is used for providing power for circulating flow of the liquid cooling working medium.

9. The heat dissipating assembly of any of claims 1-7, wherein: the flow passage base body (1) is formed by at least two layers of membrane materials made of high polymer materials, all the membrane materials are laminated and sealed together to form at least one closed space, and the closed space forms the flow passage (11);

the thickness of the flow passage base body (1) is 0.1-2 mm, and the equivalent diameter of the flow passage (11) is 10-1 mm.

10. An electronic device, characterized in that: a heat sink assembly comprising any of claims 1-9.