CN116234266A - Radiating assembly and electronic equipment - Google Patents

Abstract

The invention relates to the technical field of thermal management, in particular to a heat dissipation component and an electronic device. The heat dissipation component includes a liquid cooling plate and a fan; The channel base is formed by bending, and the inside of the channel base has a flow path for the flow of the liquid refrigerant; the layer structure has a straight main section and a bent main section in the direction of its extension, and the micropump is used to drive the liquid refrigerant along the flow. The channel flows in the layer structure; the heat dissipation component bends the flow channel matrix into a layer structure, and integrates a fan to cool the layer structure, so that the liquid cooling sheet itself as a microchannel heat sink can also form a The heat exchanger has high integration, small size, and light weight, which can meet the application scenarios that require lightweight heat dissipation components. That is, the heat dissipation area is increased, and the overall heat dissipation efficiency of the heat dissipation component is high.

Description

Cooling components and electronic equipment

technical field

The present invention relates to the technical field of heat management, in particular to a heat dissipation component, and also to an electronic device with the heat dissipation component.

Background technique

The rapid development of electronic information technology and the rapid improvement of the technical level of electronic components have promoted the gradual development of electronic equipment in the direction of intelligence and integration. Innovative intelligent terminal products are also emerging in an endless stream, but what follows is the problem of how to efficiently dissipate heat , Smart terminal products usually generate severe heat during use. If the heat cannot be dissipated in time, excessive heat will affect the performance and service life of the product and greatly damage the user experience.

Micro-channel heat sink is an efficient thermal management technology, and its working principle is to use tiny channels for heat transfer. Microchannel heat sinks typically consist of a series of embedded densely packed tiny channels that transfer heat through internal fluid circulation. Because the surface area of the microchannel is much larger than the volume, and the heat transfer distance is shorter, it can provide higher heat transfer efficiency. When a heat source heats a microchannel heat sink, heat is transferred through the tiny channels to the liquid flowing along it. The liquid will carry this heat to the heat exchanger, where it will be cooled down through a series of coolers and fans, and finally release the heat to the surrounding environment;

Since liquid flows instead of air in the microchannel heat sink, its heat dissipation efficiency is much higher than that of traditional heat dissipation methods. However, the micro-channel heat sink needs to be equipped with an independent heat exchanger. The micro-channel heat sink, heat exchanger and power pump are connected by external pipelines to form a flow path for the circulation of cooling fluid. The structure is relatively loose. The layout and connection of the whole heat dissipation system is complex and the volume is large; in addition, the heat sink is usually made of metal materials, such as aluminum, copper, copper-based alloys and other metal materials with excellent thermal conductivity, which need to be processed on the metal substrate It is conceivable that it is extremely difficult to produce complex shapes or build microchannels inside it, which also leads to high manufacturing costs. At the same time, the density of metal materials is high, and the mass of metal-based heat sinks is large. There is a lack of applicability in the application scenarios where quantification is required.

Contents of the invention

The technical problem to be solved by the present invention is: in order to solve the deficiencies in the prior art, a heat dissipation assembly is now provided to solve the problem that the existing microchannel heat sink needs to be equipped with an independent heat exchanger, which is not conducive to the lightweight of the product, and at the same time the structure Loose, bulky problems; In addition, an electronic device including the above-mentioned heat dissipation component is also provided.

The technical solution adopted by the present invention to solve the technical problem is: a heat dissipation assembly, including a liquid cooling plate and a fan;

The liquid-cooled sheet has a layer structure and a micropump. The layer structure is formed by bending a flow channel matrix made of a polymer material. The flow channel matrix has a flow path for the liquid cooling medium to flow inside. The micropump is fixedly connected with the flow channel substrate;

The layer structure has at least one linear main body section extending along a straight line and at least one bent main body section extending along a non-linear line in its extending direction, and the installation part extends from the layer structure body, and the flow path at least passes through the straight line The main body section and the bent main body section, the micropump is used to drive the liquid cooling working fluid to flow in the layer structure along the flow path;

The fan is fixed on the mounting part and is used to generate air flow to the layer structure.

Further, the layer structure is meandering, and the meandering layer structure includes a plurality of layer units distributed at intervals, and the tail end of the former among two adjacent layer units is connected to the head end of the latter through the meandering unit. connected; the layer unit includes at least one straight body section or/and at least two bent body sections, and the circuitous unit includes at least one bent body section.

Further, the detour unit further includes at least one straight body section.

Further, the layer units are arranged at intervals along the thickness direction of the channel base.

Further, one end of the layer structure is a straight main section, and the installation part extends from the straight main section at one end of the layer structure.

Further, the layer structure is penetrated with flow holes.

Further, the flow channel substrate has a first surface and a second surface opposite to each other, the distance between the first surface and the second surface defines a thickness, and the first surface and/or the second surface protrude with Several protrusions.

Further, the outside of the flow channel base has at least one liquid inlet and at least one liquid outlet connected to the flow path, the liquid inlet communicates with the outlet of the micropump, and the liquid outlet communicates with the micropump The inlet port is connected;

The micropump and the flow path cooperate to form a closed circulation heat dissipation flow channel, the heat dissipation flow channel is filled with liquid cooling working fluid, and the micro pump is used to provide power for the circulating flow of the liquid cooling working medium.

Further, the flow channel matrix is composed of at least two layers of membrane materials made of polymer materials, and all the membrane materials are laminated and sealed together to form at least one closed space, which constitutes the flow path;

The thickness of the channel base is 0.1mm-2mm, and the equivalent diameter of the channel is 10μm-1mm.

The present invention also provides an electronic device, including the above heat dissipation assembly.

The beneficial effects of the present invention are: the heat dissipation assembly of the present invention adopts the method of bending the flow channel base into a layered structure, and integrates a fan to air-cool the layered structure, so that the liquid cooling sheet itself as a microchannel heat sink It can form a heat exchanger with high integration, small size and light weight, which can meet the application scenarios that require lightweight heat dissipation components. At the same time, the layer structure greatly increases the contact area between the liquid cooling sheet and the high-speed airflow in a limited space , that is, the heat dissipation area is increased, and the overall heat dissipation efficiency of the heat dissipation component is high.

Other features of the present application and advantages thereof will become apparent through the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings.

Description of drawings

The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

Fig. 1 is the schematic diagram of the runner substrate before bending in embodiment 1;

Fig. 2 is the first schematic diagram of the layer structure in embodiment 1;

Fig. 3 is the second schematic diagram of the layer structure in embodiment 1;

Fig. 4 is the type schematic diagram three of the layer structure in embodiment 1;

Fig. 5 is the structural representation that the micropump in embodiment 1 is fixedly connected on the channel base;

6 is a schematic diagram of the heat dissipation assembly in which the air outlet direction of the fan in Embodiment 1 is generally along the bending axis of the flow channel base;

Fig. 7 is the schematic diagram that flow channel substrate in embodiment 1 is provided with flow hole;

8 is a schematic diagram of the heat dissipation assembly in which the air outlet direction of the fan in Embodiment 1 is substantially perpendicular to the direction of the bending axis of the flow channel substrate;

Fig. 9 is a schematic diagram of the flow channel base in embodiment 2 rising toward the first surface and the second surface to form several protrusions;

FIG. 10 is a schematic diagram of a heat dissipation assembly in Embodiment 2 in which the flow channel substrate formed with protrusions is bent to form a layered structure.

In the figure: 1, flow channel base, 11, flow path, 12, protrusion, 13, liquid inlet, 14, liquid outlet, 15, flow hole, 1a, capping base, 1b, flow channel base;

2. Layer structure, 21. Straight main body section, 22. Bending main body section, 23. Installation part, 2a, layer unit, 2b, circuitous unit;

3. Fan;

4. Micropump, 41, fluid inlet port, 42, fluid outlet port;

5. Heating element.

Detailed ways

The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, and only illustrate the basic structure of the present invention in a schematic manner, so they only show the composition related to the present invention, and directions and references (for example, up, down, left, right, etc.) can only Used to aid in the description of features in a drawing. Accordingly, the following Detailed Description is not to be taken in a limiting sense, and the scope of claimed subject matter should be defined only by the appended claims and their equivalents.

Example 1

As shown in Figure 1-8, a heat dissipation component includes a liquid cooling sheet and a fan 3;

The liquid cooling plate has a layer structure 2 and a micropump 4, and the number of the micropump 4 can be configured according to actual needs. The flow channel base 1 can be in the shape of a patch, and the inside of the flow channel base 1 has a flow path 11 for the flow of liquid refrigerant, and the micropump 4 is fixedly connected with the flow channel base 1, as shown in Figure 1;

The configuration of the flow channel base 1 is the configuration of the flow channel 3 disclosed in the publication number CN212910536U. In this embodiment, the flow channel base 1 is composed of at least two layers of membrane materials, and all the membrane materials are stacked and sealed together to form at least one closed space, which constitutes the flow path 11. Specifically, the flow channel base 1 is composed of three layers Composed of polymer membrane materials, they are two capping bases 1a and flow path base 1b respectively, the flow path base 1b has holes or/and grooves, and the two cover bases 1a respectively cover both sides of the flow path base 1b Make the hole or/and the groove form a closed space, the closed space constitutes the flow path 11, as shown in Figure 5, the material that constitutes the flow path matrix 1 is a polymer material, such as PC, PP, PET, etc., or The specific type of the functional material compounded by various polymer materials is not limited here. It is required that the polymer material constituting the flow channel matrix 1 does not have a physical and chemical reaction with the liquid cooling fluid filled in the flow channel 11 . Polymer materials are easy to obtain and low in cost. The lamination and sealing process between polymer membrane materials is relatively mature, and it is easy to realize high-strength sealing connection between layers. The batch molding process is simple. affect the normal use of electronic equipment. In addition, excellent flexibility is also endowed to the flow channel base 1. The flow channel base 1 is formed into a flexible patch shape, which can be bent and twisted, and can be molded by sealing or sealing each layer of film material constituting the flow channel base 1. The final runner substrate 1 is heated and pressurized to shape, shape, and form a set shape;

The thickness of the channel base 1 is 0.1 mm-2 mm, and the equivalent diameter of the channel 11 is 10 μm-1 mm. The microchannels sealed by polymer membranes have a heat transfer efficiency comparable to that of metal materials. The size of the flow path 11 is controlled at the level of microchannels. Using the characteristics of large surface area to volume ratio of microchannels is conducive to further improving liquid cooling. The heat exchange efficiency of the sheet is high, and at the same time, the overall liquid filling volume is small and the weight is light.

The flow channel base 1 is bent and shaped in multiple sections to form a layered spacer structure. The layered structure 2 has at least one linear main body section 21 extending along a straight line and at least one bent main body section extending along a non-linear line in its extending direction. 22. The bent body section 22 extending along a non-linear line can specifically be, but not limited to, a bent body section 22 extending along a circular arc or a parabola. The mounting part 23 extends from the layer structure 2, and the flow path 11 passes through at least a straight line. The main body section 21 and the bent main body section 22, the micropump 4 is used to drive the liquid cooling working fluid to flow in the layer structure 2 along the flow path 11;

The layer structure 2 is meandering, and the meandering layer structure 2 includes a plurality of layer units 2a distributed at intervals, and the tail end of the former in two adjacent layer units 2a is connected to the head end of the latter through the meandering unit 2b. Then; the layer unit 2a includes at least one straight body section 21 or/and at least two bent body sections 22, the detour unit 2b includes at least one bent body section 22, the number of layer units 2a can be adjusted according to the realization requirements, and the layer unit 2a can also be but not limited to be arranged at intervals along the thickness direction of the flow channel substrate 1. In this embodiment, the layer structure 2 has three layer units 2a for illustration. The layer structure 2 can be but not limited to the following three forms:

The first form of layer structure 2: the layer unit 2a is composed of a straight main body section 21, and the detour unit 2b is composed of a bent main body section 22. The bent main body section 22 can specifically be a bent main body extending along an arc or a parabola In section 22, two adjacent layer units 2a can be arranged parallel to each other, and two adjacent layer units 2a can also be arranged at equal intervals along the thickness direction of the flow channel substrate 1, as shown in FIG. 2 ;

The second form of layer structure 2: the upper and lower layer units 2a are composed of a straight body section 21, and the detour unit 2b is composed of a bent body section 22, which can specifically extend along an arc or a parabola The bent body section 22 of the middle layer unit 2a is composed of a plurality of bent body sections 22 extending along arcs or parabolas, and the layer unit 2a in the middle can also be regarded as a bent body extending along a wavy line The layer unit 2a in the middle can also be in contact with the upper and lower layer units 2a respectively to be supported between the upper and lower layer units 2a to improve the strength of the layer structure 2, as shown in Figure 3;

The third form of layer structure 2: the upper and lower layer units 2a are composed of a straight body section 21, and the detour unit 2b is composed of a bent body section 22, which can specifically extend along an arc or a parabola The bent body section 22 of the middle layer unit 2a is composed of a plurality of bent body sections 22 extending along arcs or parabolas and a straight body section 21, and the two ends of the straight body section 21 in its extending direction are respectively connected to Adjacent bent body segments 22 are connected, as shown in FIG. 4 ;

It is worth noting that the detour unit 2b also includes at least one straight body section 21, that is to say, the detour unit 2b can be composed of a straight body section 21 and a bent main section 22, and the bent main section 22 in the same detour unit 2b can be There are one or two or more than two, which is not limited in this embodiment.

The micropump 4 is fixedly connected to the flow channel substrate 1, for example, the micropump 4 can be fixed on the flow channel substrate 1 by bonding or welding to improve integration. In this embodiment, the inlet port 41 and the outlet port 42 of the micropump 4 are located on the same side of the micropump 4, and the side where the inlet port 41 and the outlet port 42 of the micropump 4 are located is fixedly connected to the flow channel substrate 1, and Cover the liquid inlet 13 and the liquid outlet 14, make the inlet 41 communicate with the outlet 14, and connect the outlet 42 with the inlet 13; the micropump 4 and the flow path 11 cooperate to form a closed circulation heat dissipation flow channel, The liquid-cooled working medium is filled in the closed-circulation cooling flow channel, and the micropump 4 is used to provide power for the circulating flow of the liquid-cooled working medium. The effect that can be achieved is that the micropump 4 and the flow channel base 1 are fixedly connected through a face-to-face connection, and no external connecting pipeline is required. At the same time, the face-to-face connection is easier to achieve reliable connection and sealing. The micropump 4 can be but not limited to a micro piezoelectric pump. Specifically, a liquid-cooled heat dissipation module, a liquid-cooled heat dissipation system, and a power pump in an electronic device disclosed in a Chinese patent with publication number CN111818770A can be used. For details, the details are shown in FIG. 5 .

It should be noted that the closed cycle heat dissipation flow channel formed by the cooperation of the micro pump 4 and the flow path 11 can be a single path closed cycle heat dissipation flow channel or a bifurcated closed cycle heat dissipation flow channel with branches, and a bifurcated closed cycle heat dissipation flow channel Including at least two branch roads that intersect and connect with each other, there is no limitation here;

The closed circulation flow path formed by at least one micropump 4 and the flow path 11 can be one, or multiple independent, or multiple cross flow paths 11 .

At the same time, when there are multiple micropumps 4, they can be set in series or in parallel according to actual needs.

In addition, the micropump 4 is preferably fixedly connected to the linear main body section 21 of the layered structure 2 shaped and shaped by the flow channel base 1 and kept as far away from the heat source as possible.

The fan 3 is fixed on the mounting part 23 and is used to generate air flow to the layer structure 2 so that the wind blown by the fan 3 can pass over the surface of the layer structure 2 . The type of fan 3 can be axial fan 3, centrifugal fan 3, mixed flow fan 3 or cross flow fan 3, which is not limited here. In principle, choose the appropriate type and model of fan 3 according to the application scenario, but it must be guaranteed After the fan 3 is fixedly connected to the installation part 23, it should have an air outlet direction toward the layer structure 2. The present embodiment uses the centrifugal fan 3 for illustration. In comparison, the centrifugal fan 3 has a higher degree of miniaturization and is more compact. Thin and light, such as ultra-thin miniature cooling fans for laptops3:

One end of the layer structure 2 is a linear body section 21, and a mounting part 23 extends from the linear body section 21 at one end of the layer structure 2; Part 23, the heating element 5 (heat source) can be pasted on the uppermost layer unit 2a.

Partial attachment of the heating element 5 and the layer structure 2 forms heat exchange. Specifically, the heating element 5 can be attached to the linear main section 21 of the layer structure 2, and then the local heat is conducted to the entire layer through the circulating flow of the liquid cooling medium The structure 2, the fan 3 blows air toward the layer structure 2, and the high-speed airflow passes over the surface of the layer structure 2 to take away heat, so as to realize efficient heat dissipation. Preferably, the air outlet direction of the fan 3 is generally bent and shaped along the flow channel base 1 to form the direction of the bending axis of the layer structure 2 . So that when the fan 3 blows air toward the layer structure 2, the high-speed airflow can pass over the surfaces of each layer unit 2a of the layer structure 2, increasing the effective heat dissipation area and improving the heat dissipation efficiency, as shown in FIG. 6 . Of course, this should not be used as a limitation. For example, when the air outlet direction of the fan 3 is bent and shaped substantially perpendicular to the flow channel base 1 to form the direction of the bending axis of the layer structure 2, it can pass through the flow channel base. 1, the flow hole 15 is opened, so that when the fan 3 is blown toward the layer structure 2, the high-speed airflow can pass over the opposite surfaces of the layer units 2a of the layer structure 2. Of course, the flow hole 15 must be Avoid the flow path 11 ; that is, the layer structure 2 is pierced with flow holes 15 for the convenience of arranging the fan 3 , as shown in FIGS. 7-8 .

The heat dissipation assembly of this embodiment adopts the method of bending the flow channel base 1 into a layered structure 2, and integrating a fan 3 to air-cool the layered structure 2, so that the liquid cooling sheet itself as a microchannel heat sink can also form a The heat exchanger improves integration and is small in size, which can reduce the weight of heat dissipation components.

In this embodiment, the flow channel base 1 constituting the liquid-cooled plate is made of polymer materials, which is light in weight and meets the application scenarios that require lightweight products. At the same time, the flow channel base 1 made of polymer materials also has excellent performance. It is flexible, bendable, twistable, and can be shaped and shaped by heating and pressurizing to form a layer structure 2, which greatly increases the liquid-cooled sheet and high-speed cooling in a limited space. The contact area of the airflow, that is, increases the heat dissipation area, and the overall heat dissipation efficiency of the heat dissipation component is high.

Example 2

The principle structure of embodiment 2 is basically the same as that of embodiment 1, the difference is that the flow channel substrate 1 has a first surface and a second surface oppositely arranged, the distance between the first surface and the second surface defines the thickness, and the first surface And/or the second surface protrudes with several protrusions 12, as shown in Figure 9-Figure 10; the shape, size, quantity and arrangement of the protrusions 12 can be adjusted according to the actual situation; the air flow passes through the protrusions 12 o'clock will take away more heat, which is conducive to improving heat dissipation efficiency.

Example 3

An electronic device includes the heat dissipation assembly in Embodiment 1 or 2.

The above-mentioned ideal embodiment according to the present invention is an inspiration. Through the above-mentioned description, relevant workers can make various changes and modifications within the scope of not departing from the technical idea of the present invention. The technical scope of the present invention is not limited to the content in the specification, but must be determined according to the scope of the claims.

Claims (10)

1. A cooling assembly, characterized in that: comprising a liquid cooling plate and a fan (3); The liquid-cooled sheet has a layer structure (2) and a micropump (4), the layer structure (2) is formed by bending a flow channel matrix (1) made of a polymer material, and the flow channel matrix ( 1) There is a flow path (11) for the flow of liquid refrigerant inside, and the micropump (4) is fixedly connected with the flow path base (1); The layer structure (2) has at least one linear main body section (21) extending along a straight line and at least one bent main body section (22) extending along a non-linear line in its extending direction, and the layer structure (2) The installation part (23) is extended, the flow path (11) passes through at least the straight body section (21) and the bent body section (22), and the micropump (4) is used to drive the liquid cooling working fluid along the flow path ( 11) flow within the layer structure (2); The fan (3) is fixed on the installation part (23), and is used to generate air flow to the layer structure (2). 2. The heat dissipation assembly according to claim 1, characterized in that: the layer structure (2) is meandering, and the meandering layer structure (2) includes a plurality of layer units (2a) distributed at intervals , the tail end of the former in two adjacent layer units (2a) connects with the head end of the latter through a detour unit (2b); the layer unit (2a) includes at least one straight body section (21) or/and at least A bent body section (22), the detour unit (2b) includes at least one bent body section (22). 3. The heat dissipation assembly according to claim 2, characterized in that the detour unit (2b) further comprises at least one straight body section (21). 4. The heat dissipation assembly according to claim 2, characterized in that the layer units (2a) are arranged at intervals along the thickness direction of the flow channel base (1). 5. The heat dissipation assembly according to claim 1, characterized in that: one end of the layer structure (2) is a straight body section (21), and the straight body section (21) at one end of the layer structure (2) 21) extending the installation part (23). 6. The heat dissipation assembly according to claim 1, characterized in that: the layer structure (2) is penetrated with flow holes (15). 7. The heat dissipation assembly according to claim 1, characterized in that: the flow channel base (1) has a first surface and a second surface oppositely arranged, and the distance between the first surface and the second surface defines a thickness , there are several protruding parts (12) protruding from the first surface and/or the second surface. 8. The heat dissipation assembly according to any one of claims 1-7, characterized in that: the outside of the flow channel base (1) has at least one liquid inlet (13) communicating with the flow path (11) and at least one A liquid outlet (14), the liquid inlet (13) communicates with the outlet fluid port (42) of the micropump (4), and the fluid inlet port (42) of the described fluid outlet (14) and the micropump (4) 41) connected; The micropump (4) and the flow path (11) cooperate to form a closed circulation heat dissipation channel, the heat dissipation flow channel is filled with a liquid-cooled working medium, and the micropump (4) is used to circulate the liquid-cooled working medium Provide power. 9. The heat dissipation assembly according to any one of claims 1-7, characterized in that: the flow channel base (1) is composed of at least two layers of membrane materials made of polymer materials, and all the membrane materials are laminated and sealed on the together forming at least one closed space constituting said flow path (11); The thickness of the channel base (1) is 0.1 mm-2 mm, and the equivalent diameter of the channel (11) is 10 μm-1 mm. 10. An electronic device, characterized by comprising the heat dissipation assembly according to any one of claims 1-9.

Images