CN101080158A - Heat radiator - Google Patents
Heat radiator Download PDFInfo
- Publication number
- CN101080158A CN101080158A CN 200610084144 CN200610084144A CN101080158A CN 101080158 A CN101080158 A CN 101080158A CN 200610084144 CN200610084144 CN 200610084144 CN 200610084144 A CN200610084144 A CN 200610084144A CN 101080158 A CN101080158 A CN 101080158A
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- water
- heat
- radiating fin
- fin group
- pipe
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Abstract
This invention relates to a radiation device, which utilizes a waterway to take away heat from a heat source including a radiation fin set, a water-cold pipe and a heat-conduction pipe, in which, the water-cold pipe and the heat conduction pipe are set through the radiation fin set. The radiation device also includes a base mounted with the heat conduction pipe to support the water-cold pipe and the radiation fin set, and the water-cold pipe also includes an intake pipe coupled with the base, part of the heat brought by the waterway is delivered to the heat conduction pipe via the base then to the fins via the heat conduction pipe and the other part of heat brought by the waterway is carried to the fin set via the water-cold pipe.
Description
Technical field
The relevant a kind of heat abstractor of the present invention, and the heat abstractor of relevant a kind of computer heat radiation particularly.
Background technology
Owing to during the computer system running, have used heat and produce, along with the increase of computer system speed, the used heat that the computer system running is produced also increases considerably thereupon again.The used heat that is produced between the computer system on-stream period if do not removed, will reduce the usefulness of computer system, even causes computer system to crash or damage.The used heat that produces when therefore needing a heat abstractor to remove the computer system running.For example, common heat abstractor is that a fin is installed on central processing unit (Central Processing Unit; CPU) on, other have a fan with wind to this fin, discharge computer inside with used heat that will be produced, and the cooling computer system.Because the design of this kind heat abstractor place internal system usually, so the temperature of its air intake is higher, can be up to 50 degree Celsius approximately.Therefore, for the central processing unit of high wattage, the cooling effectiveness of this kind heat abstractor will be had a greatly reduced quality.And, also have the high speed fan of use to carry out the heat radiation of computer system in order to eliminate the used heat that computer system is given birth to expeditiously, to reach the purpose of quick cooling computer system.Yet it is big that the fan that the noise that high speed fan produced is more general comes.
Therefore, need a kind of heat abstractor,, and reduce because of using the noise that fan produced with raising computer system radiating efficiency.
Summary of the invention
Therefore the purpose of this invention is to provide a kind of heat abstractor, in order to promote the radiating efficiency of computer.
Another object of the present invention provides a kind of heat abstractor, can independently be provided with and need not be attached on other objects.
A further object of the present invention provides a kind of heat abstractor, to reduce the use of fan in the computer cooling.
According to above-mentioned purpose of the present invention, a kind of heat abstractor is proposed, include a radiating fin group, pass a water cooling tube of radiating fin group, and a heat pipe that passes the radiating fin group.Heat pipe is a U type pipe.
Water cooling tube is a circuitous pipeline, and this circuitous pipeline passes the radiating fin group to and fro.Wherein water cooling tube, radiating fin group, and the material of heat pipe is a high-thermal conductive metal.
Another aspect of the present invention is a kind of heat abstractor, includes a pedestal, a radiating fin group, passes a water cooling tube of radiating fin group, and pass the radiating fin group, and be coupled in the heat pipe on the pedestal.Water cooling tube also comprises a water inlet pipe, and pedestal also comprises a semicircular base that scribbles a heat-conducting cream, and wherein the semicircular base of this pedestal is and water inlet pipe coupling water cooling tube, radiating fin group, heat pipe, and the material of water inlet pipe is a high-thermal conductive metal.Heat pipe is a U type pipe.Water cooling tube is a circuitous pipeline, and this circuitous pipeline passes the radiating fin group to and fro.The pedestal of this heat abstractor is installed on the radiator base.
Another aspect of the present invention is a cooling system, includes a heat abstractor and a circulating device.Heat abstractor includes a pedestal, a radiating fin group, passes a water cooling tube of radiating fin group, and passes the radiating fin group, and is coupled in the heat pipe on the pedestal.Circulating device includes a current pusher, is disposed at the water-cooled heat exchanger on the thermal source, and a plurality of water pipes, in order to connection water cooling tube, current pusher, and water-cooled heat exchanger, take away the heat that thermal source produces to form a water route.Water cooling tube also comprises a water inlet pipe, and pedestal also comprises a semicircular base that scribbles a heat-conducting cream, and wherein the semicircular base of pedestal is to be coupled with water inlet pipe.Pedestal is installed on the radiator base.Water cooling tube, radiating fin group, heat pipe, and the material of water inlet pipe is a high-thermal conductive metal.The current pusher comprises a water tank and a water pump.Heat pipe is a U type pipe.Water cooling tube is a circuitous pipeline, and this circuitous pipeline passes the radiating fin group to and fro.Thermal source is an electronic component.Electronic component is a South Bridge chip or a north bridge chips.Cooling system also comprises a fan, is disposed at contiguous heat abstractor place, with the radiating efficiency of further raising heat abstractor.
Heat abstractor of the present invention is in conjunction with the water-cooled type of cooling and the ventilation type type of cooling, therefore can promote the efficient of computer heat radiation effectively.And by the pedestal of heat abstractor, this heat abstractor can independently be assemblied in the optional position, to be used for cooling off computer apparatus.
Description of drawings
For above-mentioned and other purposes of the present invention, feature, advantage and embodiment can be become apparent, be elaborated as follows to preferred embodiment of the present invention referring now to accompanying drawing:
Fig. 1 is the schematic diagram according to a preferred embodiment of heat abstractor of the present invention.
Fig. 2 is the schematic diagram according to the another preferred embodiment of heat abstractor of the present invention.
Fig. 3 is according to the heat abstractor of the present invention schematic diagram of a preferred embodiment again.
Fig. 4 is the exploded perspective view of heat abstractor one preferred embodiment among Fig. 3.
Fig. 5 is the schematic diagram according to a preferred embodiment of cooling system of the present invention.
Fig. 6 is the schematic diagram according to the another preferred embodiment of cooling system of the present invention.
Embodiment
Describe preferred embodiment of the present invention in detail to clearly demonstrate spirit of the present invention below with reference to accompanying drawing, have in the technical field under any and know that usually the knowledgeable is after understanding preferred embodiment of the present invention, when can be by the technology of teachings of the present invention, change and modification, it does not break away from spirit of the present invention and scope.
With reference to Fig. 1, it is a kind of heat abstractor schematic diagram according to a preferred embodiment of the present invention.One heat abstractor 100 comprises a radiating fin group 120, a water cooling tube 110, and a heat pipe 130, to dispel the heat.Wherein water cooling tube 110 is circuitous pipelines, and water cooling tube 100 is to pass radiating fin group 120, the i.e. water-cooled row that formation is commonly called as to and fro.And heat pipe 130 is U type pipes, and heat pipe 130 runs through radiating fin group 120, and with water cooling tube 110, and radiating fin group 120 is incorporated on the heat pipe 130.Water cooling tube 110 has an inlet 112, and one goes out 114.Water cooling tube 110, radiating fin group 120, and the material of heat pipe 130 are high-thermal conductive metals.Above-mentioned high-thermal conductive metal is preferably copper or aluminium.
The current 200 that have a large amount of heats in the water route by inlet 112 inflows of water cooling tube 110, behind circuitous water cooling tube 110, are flowed out by the outlet 114 of water cooling tube 110.These current 200 with heat be via water cooling tube 110 with heat transferred to 120 dissipations of radiating fin group.And heat pipe 130 more can promote heat conducting efficient further.
With reference to Fig. 2, it is the schematic diagram according to the heat abstractor of the another preferred embodiment of the present invention.Heat abstractor 100 comprises a radiating fin group 120, a water cooling tube 110, a heat pipe 130, and a pedestal 140.Water cooling tube 110 is circuitous pipelines, and water cooling tube 110 passes radiating fin group 120, i.e. the water-cooled row that formation is commonly called as to and fro.And heat pipe 130 is U type pipes, and heat pipe 130 runs through radiating fin group 120, and with water cooling tube 110, and radiating fin group 120 is incorporated on the heat pipe 130, and heat pipe 130 is preferably and utilizes a soldering to be coupled on the pedestal 140.Water cooling tube 110, radiating fin group 120, and the material of heat pipe 130 are high-thermal conductive metals.Above-mentioned high-thermal conductive metal is preferably copper or aluminium.
The current 200 that have a large amount of heats in the water route are flowed through behind the pedestal 140, via pedestal 140, flow into the inlet 112 of cold water pipe 110, then through behind the circuitous water cooling tube 110, flow out via the outlet 114 of water cooling tube 110.
With reference to Fig. 3, heat abstractor 100 is to be installed on the radiator base 150.Water cooling tube 110 also includes a water inlet pipe 160, and this water inlet pipe 160 is preferably a copper plumbing.The pedestal 140 of heat abstractor 100 is coupled in water inlet pipe 160, and current 200 are to flow into water cooling tube 110 via water inlet pipe 160.Current 200 with a part of heat, be that the water route via pedestal 140 belows is sent to pedestal 140, be sent to heat pipe 130 via pedestal 140 again, be sent to radiating fin group 120 via heat pipe 130 again after, via 120 dissipations of radiating fin group.Current 200 with another part heat be via water cooling tube 110, be sent to radiating fin group 120 after, via 120 dissipations of radiating fin group.
With reference to Fig. 4, it is the exploded perspective view of heat abstractor among Fig. 3, so that the assembling mode of heat abstractor 100 to be described further.Have a groove 152 on the radiator base 150, and the water inlet pipe 160 of heat abstractor 100 is disposed in the groove 152, and is preferably and utilizes a soldering to be fixed in the groove 152.And the base bottom 142 of pedestal 140 belows is half rounded bottom surface that scribbles a heat-conducting cream, and combines with water inlet pipe 160 on being disposed at radiator base 150.And the heat pipe of U type heat pipe 130 bottom 132 is preferably and utilizes soldering to be fixed on the pedestal 140.Pedestal 140 is preferably and utilizes a plurality of screws 170, is fixed on the radiator base 150.
At this moment, current 200 with a part of heat, by the base bottom 142 that scribbles heat-conducting cream, be sent to pedestal 140 via water inlet pipe 160, be sent to the soldering heat pipe 130 of side thereon via pedestal 140 again, be sent to coupled radiating fin group 120 dissipations via heat pipe 130 again.The above-mentioned ventilation type heat exchange cooling process that is this heat abstractor 100.Current 200 flow into water cooling tube inlet 112 via water inlet pipe 160, behind the circuitous water cooling tube 110 of flowing through, flow out via water cooling tube outlet 114, and current 200 with another part heat, then be to be sent to coupled radiating fin group 120, be sent to dissipation in the atmosphere via radiating fin group 120 again via water cooling tube 110.Above-mentionedly be this heat radiation and adorn 100 water-cooled heat exchange cooling process.
With reference to Fig. 5, it is cooling system one a preferred embodiment schematic diagram of the present invention.Cooling system 400 also comprises a circulating device 300 except that heat abstractor 100.Circulating device 300 includes a water-cooled heat exchanger 310 (being the water-cooled head that is commonly called as) that is disposed on the thermal source 500, the water tank 320 with a water pump 330, and as a plurality of water pipes 340,342,344 that connect usefulness, and 346, the water route that has current 200 with formation is in 100 of circulating device 300 and heat abstractors.Water pump 330 and water tank 320 are collectively referred to as the current pusher.Thermal source 500 is electronic components, for example, is a South Bridge chip.Current 200 in the water route utilize water pump 330 to get from water tank 320, via water pipe 340, by the effect of gravity, flow to the water-cooled heat exchanger 310 that is disposed at thermal source 500 tops.Current 200 are taken away after the heat of thermal source 500 generations, via water pipe 342 reflow tanks 320, after flowing to heat abstractor 100 cooling via water pipe 344 from water tank 320 again, current 200 again via water pipe 346 from heat abstractor 100 reflow tanks 320, to carry out circulation next time.
With reference to Fig. 6, it is the another preferred embodiment schematic diagram of cooling system of the present invention.Cooling system 400 can have many variations, and for example, heat abstractor 100 can utilize pedestal 140 to be disposed on the radiator base 150, or independently is arranged at the optional position.Water-cooled heat exchanger 310 is configurable on the South Bridge chip of thermal source 500, and water tank 320 is also configurable on the north bridge chips of another thermal source 510.Cooling system 400 can also comprise a fan 180, is disposed at contiguous heat abstractor 100 places, to improve the radiating efficiency of heat abstractor 100 further.
By the invention described above preferred embodiment as can be known, use the present invention and have following advantage.Use heat abstractor of the present invention, can utilize the water-cooled and the air-cooled type of cooling simultaneously,, then increased the radiating efficiency of computer effectively if use on the cooling system of computer.But and this heat abstractor separate configurations optional position, so its range of application and also increase thereupon of elasticity.
Though the present invention discloses as above with a preferred embodiment; yet it is not in order to limit the present invention; those of ordinary skill under any in the technical field; without departing from the spirit and scope of the present invention; when can doing various change that is equal to and retouching, so protection scope of the present invention is when looking accompanying being as the criterion that the application's claim scope defined.
Claims (10)
1. heat abstractor comprises:
One radiating fin group;
One water cooling tube passes this radiating fin group setting; And
One heat pipe passes this radiating fin group setting.
2. heat abstractor as claimed in claim 1 is characterized in that this heat pipe is a U type pipe.
3. heat abstractor as claimed in claim 1 is characterized in that this water cooling tube is a circuitous pipeline, and this circuitous pipeline is to pass this radiating fin group setting to and fro.
4. heat abstractor as claimed in claim 1 it is characterized in that this water cooling tube, this radiating fin group, and the material of this heat pipe is a high-thermal conductive metal.
5. cooling system comprises:
One heat abstractor comprises:
One pedestal;
One radiating fin group;
One water cooling tube passes this radiating fin group setting;
One heat pipe passes this radiating fin group setting, and is coupled in this
On the pedestal; And
One circulating device comprises:
One current pusher;
One water-cooled heat exchanger is disposed on the thermal source; And
A plurality of water pipes, in order to connecting this water cooling tube, this current pusher, and this water-cooled heat exchanger, take away the heat that this thermal source produces to form a water route.
6. cooling system as claimed in claim 5 is characterized in that this water cooling tube also comprises a water inlet pipe, and this pedestal also comprises a semicircular base that scribbles a heat-conducting cream, wherein this semicircular base and this water inlet pipe coupling.
7. cooling system as claimed in claim 5 is characterized in that this pedestal is installed on the radiator base.
8. cooling system as claimed in claim 5 is characterized in that this current pusher comprises a water tank and a water pump.
9. cooling system as claimed in claim 5 is characterized in that this thermal source is an electronic component.
10. cooling system as claimed in claim 5 is characterized in that this cooling system also comprises a fan, is disposed at contiguous this heat abstractor place, with the radiating efficiency of further this heat abstractor of raising.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610084144 CN101080158A (en) | 2006-05-26 | 2006-05-26 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610084144 CN101080158A (en) | 2006-05-26 | 2006-05-26 | Heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101080158A true CN101080158A (en) | 2007-11-28 |
Family
ID=38907300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610084144 Pending CN101080158A (en) | 2006-05-26 | 2006-05-26 | Heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101080158A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103249281A (en) * | 2012-02-13 | 2013-08-14 | 华硕电脑股份有限公司 | Heat dissipating module |
| CN102053682B (en) * | 2009-10-28 | 2014-04-23 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation device |
| CN105005369A (en) * | 2015-07-21 | 2015-10-28 | 武汉名龙堂科技有限公司 | Split computer host cooling system |
| CN105431005A (en) * | 2015-11-19 | 2016-03-23 | 南车株洲电力机车研究所有限公司 | Heat exchange apparatus |
| CN106383561A (en) * | 2016-09-21 | 2017-02-08 | 陕西理工学院 | Computer CPU cooling apparatus |
| CN108235664A (en) * | 2018-02-05 | 2018-06-29 | 四川九洲电器集团有限责任公司 | A kind of closed cabinet of liquid metal self-loopa heat dissipation |
| CN109814691A (en) * | 2019-01-28 | 2019-05-28 | 合肥清若科技有限公司 | A kind of computer CPU acceleration radiator |
| CN110986651A (en) * | 2019-12-10 | 2020-04-10 | 常州大学 | Finned tube heat exchanger with heat exchange cavity in fin |
| CN111366020A (en) * | 2020-03-30 | 2020-07-03 | 厦门大学 | Extended water-cooled heat pipe radiator |
-
2006
- 2006-05-26 CN CN 200610084144 patent/CN101080158A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102053682B (en) * | 2009-10-28 | 2014-04-23 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation device |
| CN103249281A (en) * | 2012-02-13 | 2013-08-14 | 华硕电脑股份有限公司 | Heat dissipating module |
| CN105005369A (en) * | 2015-07-21 | 2015-10-28 | 武汉名龙堂科技有限公司 | Split computer host cooling system |
| CN105431005A (en) * | 2015-11-19 | 2016-03-23 | 南车株洲电力机车研究所有限公司 | Heat exchange apparatus |
| CN106383561A (en) * | 2016-09-21 | 2017-02-08 | 陕西理工学院 | Computer CPU cooling apparatus |
| CN108235664A (en) * | 2018-02-05 | 2018-06-29 | 四川九洲电器集团有限责任公司 | A kind of closed cabinet of liquid metal self-loopa heat dissipation |
| CN109814691A (en) * | 2019-01-28 | 2019-05-28 | 合肥清若科技有限公司 | A kind of computer CPU acceleration radiator |
| CN110986651A (en) * | 2019-12-10 | 2020-04-10 | 常州大学 | Finned tube heat exchanger with heat exchange cavity in fin |
| CN110986651B (en) * | 2019-12-10 | 2021-11-02 | 常州大学 | Finned tube heat exchanger with heat exchange cavity in fin |
| CN111366020A (en) * | 2020-03-30 | 2020-07-03 | 厦门大学 | Extended water-cooled heat pipe radiator |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |