CN219288017U

CN219288017U - Heat dissipation device for heat dissipation of electronic device

Info

Publication number: CN219288017U
Application number: CN202223430597.2U
Authority: CN
Inventors: 沈珂
Original assignee: Suzhou Lingenthalpy Energy Technology Co ltd
Current assignee: Suzhou Lingenthalpy Energy Technology Co ltd
Priority date: 2022-12-21
Filing date: 2022-12-21
Publication date: 2023-06-30
Anticipated expiration: 2032-12-21

Abstract

The utility model discloses a heat dissipation device for heat dissipation of an electronic device, which comprises: at least one tube set having a closed circuit with a liquid medium therein, one portion of the tube set being a heat sink for thermally conductive connection with the electronic device and the other portion being a heat sink for dissipating heat to the outside. The utility model provides a heat pipe radiating device suitable for a high-limited chassis, wherein a heat absorbing part of the heat pipe radiating device can be clung to the surface of an electronic component, and an efficient heat absorbing contact interface is formed as a traditional radiator. Because the flexible plasticity of nest of tubes, its radiating part can extend to the quick-witted case lateral wall and rise to the quick-witted case outside, and the structure of nest of tubes flattening can be convenient buckle to realize utilizing the theory of operation of heat pipe to carry out efficient heat dissipation work, have more efficient radiating efficiency than traditional fin radiator, compare traditional water cooling system, need not power water pump, work safe and reliable has the outstanding characteristic of maintenance-free.

Description

Heat dissipation device for heat dissipation of electronic device

Technical Field

The present utility model relates to the field of heat pipe devices for dissipating heat from electronic components, and more particularly, to a heat dissipating device for dissipating heat from an electronic component.

Background

When a large number of electronic components are applied, heat is generated, and conventionally, an air-cooled fin heat exchanger is used for heat dissipation. As shown in fig. 6, such a heat sink generally has a metal structure attached to a heat generating device, and long straight ribs are formed on the other side of the metal structure to remove heat by forced air convection. In order to enhance the performance, a plurality of water pipes are embedded into a radiator, and cooling water is driven to circulate by a liquid pump, so that heat is better dispersed to the whole metal block, the temperature uniformity is improved, and the radiator is more beneficial to heat dissipation. However, this increases the power consumption of the apparatus, and there is a possibility that the circulation pump is damaged, and once it is damaged, the circulation cooling system stops operating, and the electronic components may be damaged due to high temperature.

Disclosure of Invention

The utility model provides a heat dissipation device for heat dissipation of an electronic device, which overcomes the defects of the prior art, has a simple structure and can be applied to large-scale production.

The utility model provides a heat dissipation device for heat dissipation of an electronic device, comprising:

at least one tube set having a closed or non-closed tube with a liquid medium therein, one portion of the tube set being a heat sink for thermally conductive connection with the electronic device and the other portion being a heat sink for dissipating heat to the outside.

The utility model provides a heat pipe radiating device suitable for a highly-limited chassis, wherein a heat absorbing part of the heat pipe radiating device can be clung to the surface of the electronic component, and a high-efficiency heat absorbing contact interface is formed as a traditional radiator. Because the flexible plasticity of nest of tubes, its radiating part can extend to the quick-witted case lateral wall and rise to the quick-witted case outside, and the flat structure of nest of tubes can be convenient buckle, and other spare parts can be convenient evaded when occupation space is few to realize utilizing the theory of operation of heat pipe to carry out efficient heat dissipation work, have more efficient radiating efficiency than traditional fin radiator, compare traditional water cooling system, need not power water pump, work safe and reliable has maintenance-free outstanding characteristic.

The heat sink is laterally torsionable and may have fins to enhance air heat transfer as a condensing portion of the heat pipe to dissipate heat to the environment. The heat absorbing portion is in direct contact with the heat source or in contact with the heat source through a metal plate welded to the heat absorbing portion. Because the tube group is softer, can buckle to a certain extent, consequently can twist reverse, be convenient for the arrangement in the quick-witted incasement more.

The heat dissipation part serving as the condensation part can be welded with a metal plate, is attached to the liquid cooling plate and is organically combined with the liquid cooling device, so that the liquid cooling heat dissipation is enhanced.

Further, the heat absorbing portion has a mounting portion adapted to the mounting surface of the electronic component heat sink.

Furthermore, the mounting part comprises a connecting piece, one surface of the connecting piece is connected with the heat absorbing part in an adapting way, and the other surface of the connecting piece is connected with the mounting surface of the radiator of the electronic component in an adapting way.

Further, the tube group comprises at least one flat tube assembly, and the flat tube assembly is a flat tube with a plurality of mutually isolated and parallel pore channels.

Further, the flat tubes of the heat absorbing part are horizontally arranged in parallel.

Further, the flat tube plane of the heat dissipation part is twisted by 90 degrees relative to the flat tube plane of the heat absorption part, and the flat tube plane of the heat dissipation part faces the same direction and the two sides are aligned.

Further, the heat dissipation part and the heat absorption part form an included angle structure of 0-180 degrees.

Further, the heat dissipation part and the heat absorption part form an included angle structure of 90 degrees.

Further, a fan is further installed on the heat dissipation portion.

Further, the pipe group comprises at least two flat pipes, and the heads and the tails of all the flat pipes are connected through short connecting pipes in sequence to form a pipeline which is closed in series.

Drawings

In order to better understand the technical solutions in the present application, the following description will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.

Fig. 1 is a schematic structural diagram of a heat pipe heat dissipation device according to the present utility model;

FIG. 2 is a schematic diagram of an application of a heat pipe heat dissipation device according to the present utility model;

FIG. 3 is a schematic diagram of a heat pipe heat dissipation device according to another embodiment of the present utility model;

FIG. 4 is a schematic diagram of a single tube set of a heat pipe heat dissipation device according to another embodiment of the present utility model;

FIG. 5 is a schematic diagram of another heat pipe heat dissipation device according to the present utility model;

fig. 6 is a schematic structural diagram of a heat sink for electronic components in the prior art.

Wherein:

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

at least one tube set having a closed circuit with a liquid medium therein, one portion of the tube set being a heat sink for thermally conductive connection with the electronic device and the other portion being a heat sink for dissipating heat to the outside.

As shown in fig. 1, in this example, two tube sets are included: the first tube group 1 and the second tube group 2 are aluminum alloy flat tubes (the flat tubes are provided with a plurality of parallel small pipelines), and each tube has a first heat absorbing part 11 and a second heat absorbing part 21 which are horizontally and transversely arranged in parallel, and a first heat radiating part 12 and a second heat radiating part 22 which are twisted by 90 degrees and are in a serpentine laminated structure. Header connectors 31 are mounted at both ends of the two tube sets, and then the two tube sets are connected end to end through a connecting pipeline 32 to form a closed pipeline, and a filling port 33 for liquid medium capable of gas-liquid phase change is mounted on the connecting pipeline 32. This example can be used in a flattened chassis 4 as shown in fig. 2, in which a circuit board in the chassis 4 has a first heat-generating electronic component 44 on an upper side and two juxtaposed second heat-generating electronic components 43 on a lower side, and the first heat absorbing portion 11 of the first tube group 1 is directly flatly attached to the surface of the first heat-generating electronic component 44, and the second heat absorbing portion 21 of the second tube group 2 is thermally conductively connected to the surface of the second heat-generating electronic component 43 through two metal connectors 23. The rear (left side) of the chassis 4 has a partition plate 42, and the heat dissipation parts (the first heat dissipation part 12, the second heat dissipation part 22) of the first tube group 1 and the second tube group 2 are provided in the space between the rear housing of the chassis 4 and the

partition plate

42, and 4 heat dissipation fans 41 are attached to the rear housing of the chassis 4.

When the heating electronic component works, the surface temperature of the heating electronic component is increased, so that liquid medium in the heat absorption part of the tube group absorbs heat and evaporates to generate liquid-gas phase change, gas carries heat to move to the end of the heat dissipation part, and liquid in the heat dissipation part flows to the heat absorption part, so that alternate pulsation circulation of gas and liquid is formed in the tube group, and the heat of the heating electronic component can be used for driving the liquid to circulate without driving a pump, so that efficient heat dissipation work is performed. The heat dissipation fan 41 is arranged to meet the heat dissipation requirement of the high-power component, and can be selected according to the actual working condition.

The first tube set 1 and the second tube set 2 may not be connected in series, and they may be connected end to form a closed loop, so that the first tube set 1 and the second tube set 2 are completely independent. In some embodiments, the first tube set 1 and the second tube set 2 may be set independently, and the end ports at the front and the tail ends of the first tube set and the second tube set are closed to form a non-closed structure.

In a specific implementation, the heat absorbing part is provided with a mounting part which is matched with the mounting surface of the radiator of the electronic component. In general, in the case of an aluminum alloy flat tube, the flat surface of the flat tube can already be in good contact with the surface of the electronic component, so that the mounting portion does not need to be additionally machined, but in some cases, the mounting portion can be provided for better adaptation and fixed connection.

Furthermore, the mounting part can further comprise a connecting piece, one surface of the connecting piece is connected with the heat absorbing part in an adapting way, and the other surface of the connecting piece is connected with the mounting surface of the radiator of the electronic component in an adapting way. Such as the connector 23 shown in fig. 1 and 2.

In practical application, the tube group can be formed by arranging a plurality of thin tubes in parallel, or can directly adopt a novel aluminum alloy porous flat tube, for example, the tube group comprises at least one flat tube component, and the flat tube component is a flat tube with a plurality of mutually isolated and parallel pore channels.

As shown in fig. 1, the flat tubes at the heat absorbing portions (the first heat absorbing portion 11 and the second heat absorbing portion 21) are all arranged in parallel horizontally.

The flat tube plane of the heat dissipation part is twisted by 90 degrees relative to the flat tube plane of the heat absorption part, the flat tube plane of the heat dissipation part faces the same direction and the two sides of the flat tube plane are aligned, namely, the flat tube plane is in a serpentine bending structure, and the laminated structure is more beneficial to greatly increasing the heat dissipation area in a certain space and facilitating heat dissipation.

In a specific implementation, according to actual needs, the heat dissipation part and the heat absorption part form an included angle structure of 0-180 degrees. In fig. 1, an included angle of 90 ° is formed between the heat dissipation portion and the heat absorption portion, and the heat dissipation portion is also in a horizontal state. In the example of fig. 3, the heat sink is twisted to a vertically placed state.

In some embodiments, a fan may be further installed on the heat dissipation portion to perform forced convection heat dissipation.

In the example of fig. 3, two tube sets are also connected in series, and a single tube set is shown in fig. 4, and is made of a porous flat tube, firstly the flat tube makes a horizontal turn from the middle part, so that the flat tube becomes a horizontal U-shaped structure, then the head and tail parts are bent upwards for the same length to form a vertical state, then the vertical part is twisted by 90 degrees, so that the flat tube plane of the vertical part forms an angle of 90 degrees with the flat tube plane of the horizontal part, and finally the vertical part is subjected to serpentine folding, and the two ends of the head and the tail parts are upward and flush, as shown in fig. 4. The proper position in the horizontal part can be used as a heat absorption part to be in heat conduction connection with the surface of the electronic element, the head part and the tail part are used as heat dissipation parts, and the snakelike folding part can effectively increase the heat dissipation area in the minimum space so as to meet the requirement of the internal space of the case. In fig. 3, two tube groups constitute a closed circuit connected in series by a communication pipe 32 and a header connection 31. Similar to fig. 1, the difference is in the direction of the

heat radiating portions

12 and 22. An example of the application of fig. 3 is shown in fig. 5. The heat absorption part is horizontally arranged in the case 4, the flat tube plane part is horizontally arranged and is in tight heat conduction connection with the surface of an electronic element needing heat dissipation, the heat dissipation part is vertically arranged and is connected with the case at the rear end of the case 4, and a heat dissipation fan can be additionally arranged.

It should be noted that, in the description of the present application, the terms "first," "second," and the like are used for descriptive purposes only and to distinguish between similar objects, and there is no order of preference between the two, nor should they be construed as indicating or implying relative importance. Furthermore, in the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but instead should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are incorporated herein by reference for the purpose of completeness. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended to forego such subject matter, nor should the applicant be deemed to have such subject matter not considered to be part of the subject matter of the disclosed application.

Claims

1. A heat dissipating device for dissipating heat from an electronic device, comprising:

2. The heat dissipating device for use in dissipating heat from an electronic component as recited in claim 1, wherein the heat sink portion has a mounting portion adapted to a mounting surface of the electronic component heat sink.

3. The heat dissipating device for electronic component heat dissipation according to claim 2, wherein the mounting portion comprises a connecting member having one side adapted to be connected to the heat sink portion and the other side adapted to be connected to the electronic component heat sink mounting surface.

4. The heat dissipating apparatus for use in heat dissipation of electronic devices of claim 2, wherein the tube stack comprises at least one flat tube assembly that is a flat tube having a plurality of parallel channels spaced apart from each other.

5. The heat dissipating apparatus for a heat sink of claim 4 wherein the flat tubes of the heat sink are each disposed in parallel and horizontally.

6. The heat dissipating device for dissipating heat from an electronic component as recited in claim 5, wherein the flat tube plane of the heat dissipating portion is twisted by 90 ° with respect to the flat tube plane of the heat absorbing portion, and the flat tube planes of the heat dissipating portion face in the same direction and are aligned on both sides.

7. The heat dissipating device for dissipating heat from an electronic component as recited in claim 2, wherein the heat dissipating portion and the heat absorbing portion have an angle between 0 ° and 180 °.

8. The heat dissipating device for use in heat dissipation of an electronic device as recited in claim 4, wherein the heat dissipating portion has an angle of 90 ° with respect to the heat absorbing portion.

9. The heat dissipating apparatus for use in heat dissipation of an electronic device as recited in claim 4, wherein a fan is further mounted on the heat dissipating portion.

10. The heat dissipating apparatus for an electronic device as recited in claim 4, wherein the tube set comprises at least two flat tubes, and wherein the ends of all flat tubes are connected in sequence through connecting short tubes to form a serially closed tube.