CN220171504U - Memory radiator formed by welding multiple materials - Google Patents
Memory radiator formed by welding multiple materials Download PDFInfo
- Publication number
- CN220171504U CN220171504U CN202321135375.XU CN202321135375U CN220171504U CN 220171504 U CN220171504 U CN 220171504U CN 202321135375 U CN202321135375 U CN 202321135375U CN 220171504 U CN220171504 U CN 220171504U
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- China
- Prior art keywords
- memory
- heat dissipation
- flow channel
- communicated
- reflux
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- 239000000463 material Substances 0.000 title claims abstract description 17
- 238000003466 welding Methods 0.000 title claims abstract description 7
- 230000017525 heat dissipation Effects 0.000 claims abstract description 46
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 43
- 238000001816 cooling Methods 0.000 claims abstract description 22
- 238000009434 installation Methods 0.000 claims abstract description 20
- 239000000498 cooling water Substances 0.000 claims abstract description 5
- 238000010992 reflux Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000000110 cooling liquid Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a multi-material welding forming memory radiator, which comprises a plurality of memory radiating groups and connecting pipes, wherein the memory radiating groups comprise: the first installation block is provided with a water inlet flow channel and a water outlet flow channel; the second installation block is provided with a connecting runner; the memory cooling fins are provided with cooling water channels, wherein two ends of the cooling water channels of the memory cooling fins are respectively communicated with the water inlet flow channel and the connecting flow channel, and two ends of the cooling water channels of the memory cooling fins are respectively communicated with the water outlet flow channel and the connecting flow channel; two adjacent memory heat dissipation groups are respectively arranged as a first heat dissipation group and a second heat dissipation group, one end of a connecting pipe is communicated with a water outlet flow passage of the first heat dissipation group, and the other end of the connecting pipe is communicated with a water inlet flow passage of the second heat dissipation group. The scheme can be adapted to the middle of two CPU slots and the two sides of the two CPU slots are respectively provided with a plurality of memory slots or the middle of two CPU slots and a main board at one side of one CPU slot.
Description
Technical Field
The utility model relates to the technical field of memory radiators, in particular to a multi-material welding-formed memory radiator.
Background
The server main board has various arrangement designs, wherein one server main board is provided with two CPU slots, the middle of the two CPU slots and two sides of the two CPU slots are respectively provided with a plurality of memory slots or the middle of the two CPU slots and one side of one CPU slot. In order to pursue better performance, servers begin to perform water cooling heat dissipation on the memory banks in the market, but the existing memory heat dissipation module using water cooling heat dissipation is not suitable for the above-arranged server motherboard.
Disclosure of Invention
The utility model aims to solve the technical problems that: a multi-material welding formed memory radiator is provided to solve one or more technical problems in the prior art, and at least provides a beneficial choice or creation condition.
The utility model solves the technical problems as follows:
a memory radiator formed by welding multiple materials is characterized in that: including a plurality of memory cooling groups and connecting pipe, memory cooling group includes:
the first installation block is provided with a water inlet flow channel and a water outlet flow channel;
a second mounting block provided with a connecting flow passage;
a plurality of memory cooling fins provided with cooling water channels; one end of the heat dissipation water channel is communicated with the connecting flow channel, wherein the other ends of the heat dissipation water channels of the memory heat dissipation fins are communicated with the water inlet flow channel, and the other ends of the heat dissipation water channels of the memory heat dissipation fins are communicated with the water outlet flow channel;
the connecting pipe is connected with the water inlet flow passage and the water outlet flow passage of the two internal storage heat dissipation groups.
Through the technical scheme, the memory radiating groups are respectively and correspondingly distributed in the memory slots near the CPU slots so as to be matched with the middle of the two CPU slots and the main boards of which the two sides of the two CPU slots are respectively provided with the memory slots or the middle of the two CPU slots and one side of one CPU slot.
As a further improvement of the above technical solution, the number of the memory heat dissipation groups is set to three.
As a further improvement of the technical scheme, the device also comprises a reflux assembly, wherein the reflux assembly comprises a plurality of reflux blocks and a plurality of reflux pipes; the reflux blocks are arranged in one-to-one correspondence with the first installation blocks, one of the reflux blocks is communicated with the water outlet flow passage at one end, and the reflux pipe is communicated with the two reflux blocks.
As a further improvement of the technical scheme, the reflux block is fixedly connected with the first installation block.
As a further improvement of the technical scheme, the reflux block and the corresponding first installation block are integrally formed.
As a further improvement of the above technical solution, the number of the memory cooling fins is an odd number.
As a further improvement of the above technical solution, the number of the memory cooling fins communicated with the water inlet flow channel is equal to the number of the memory cooling fins communicated with the water outlet flow channel.
As a further improvement of the above technical solution, the connecting pipe comprises two connecting sections, two inclined sections and an intermediate section, the inclined sections being arranged between the connecting sections and the intermediate section.
As a further improvement of the technical scheme, the second installation block is provided with an installation wing plate in a protruding mode, the installation wing plate is provided with a second installation hole, and the first installation block is provided with a first installation hole.
As a further improvement of the technical scheme, the memory radiating fin is a copper member, and the first mounting block and the second mounting block are stainless steel members.
The beneficial effects of the utility model are as follows: the memory radiating components are correspondingly distributed in the memory slots near the CPU slots so as to be matched with the middle of the two CPU slots and the two sides of the two CPU slots, wherein the two sides of the two CPU slots are respectively provided with a plurality of memory slots or the middle of the two CPU slots and a main board at one side of one CPU slot.
The utility model is used in the technical field of memory radiators.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the drawings described are only some embodiments of the utility model, but not all embodiments, and that other designs and drawings can be obtained from these drawings by a person skilled in the art without inventive effort.
FIG. 1 is a schematic overall structure of an embodiment of the present utility model;
fig. 2 is a schematic cross-sectional view of an embodiment of the present utility model.
In the figure, 100, a first mounting block; 110. a water inlet flow passage; 120. a water outlet flow passage; 130. a first mounting hole; 200. a second mounting block; 210. a connecting runner; 220. mounting wing plates; 221. a second mounting hole; 300. memory radiating fins; 310. a heat dissipation water channel; 400. a reflow block; 500. a connecting pipe; 510. a connection section; 520. an inclined section; 530. an intermediate section.
Detailed Description
The conception, specific structure, and technical effects produced by the present utility model will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, features, and effects of the present utility model. It is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and that other embodiments obtained by those skilled in the art without inventive effort are within the scope of the present utility model based on the embodiments of the present utility model. In addition, all coupling/connection relationships mentioned herein do not refer to direct connection of the components, but rather, refer to the fact that a more optimal coupling structure may be formed by adding or subtracting coupling aids depending on the particular implementation. The technical features in the utility model can be interactively combined on the premise of no contradiction and conflict.
In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
Referring to fig. 1 and 2, a multi-material welding-formed memory radiator includes a plurality of memory radiating groups and a connection pipe 500.
The number of the memory heat dissipation groups is set to be a plurality of, and the memory heat dissipation groups are arranged along a straight line. Specifically, in this embodiment, the number of the memory heat dissipation groups is three, the three memory heat dissipation groups are arranged at intervals in a straight line, and the three memory heat dissipation groups are arranged side by side. In other embodiments, the number of the memory heat dissipation groups may be set to one, two, four, etc. according to actual needs.
The memory heat dissipation group includes a first mounting block 100, a second mounting block 200, and a memory heat sink 300.
Specifically, the first mounting block 100 is provided with a rectangular block structure, and the first mounting block 100 is provided with the water outlet flow channel 120 and the water inlet flow channel 110 in a circular channel shape (in other embodiments, the water outlet flow channel 120 and the water inlet flow channel 110 may be provided with a rectangular channel structure or a channel structure in other shapes). The water outlet flow passage 120 and the water inlet flow passage 110 are disposed parallel to each other.
Specifically, the second mounting block 200 has a rectangular block structure, and the second mounting block 200 is provided with a connecting flow channel 210 having a circular channel shape (in other embodiments, the connecting flow channel 210 may be provided as a rectangular channel structure or a channel structure having another shape).
In this embodiment, the memory cooling fin 300 is disposed between the second mounting block 200 and the first mounting block 100, and two ends of the memory cooling fin 300 are fixedly connected with the second mounting block 200 and the first mounting block 100 respectively, specifically, two ends of the memory cooling fin 300 are fixed with the second mounting block 200 and the first mounting block 100 respectively through a welding process.
The number of the memory fins 300 is set to be plural, and the plural memory fins 300 are arranged along a straight line. Specifically, in the present embodiment, the number of memory fins 300 is set to be an odd number, such as three, five, seven, etc., and the memory bank is located between two adjacent memory fins 300.
The heat dissipation water channels 310 extending along a straight line are formed inside the memory heat dissipation fins 300, wherein two ends of the heat dissipation water channels 310 of the memory heat dissipation fins 300 are respectively communicated with the connecting flow channel 210 and the water inlet flow channel 110, and two ends of the heat dissipation water channels 310 of the memory heat dissipation fins 300 are respectively communicated with the connecting flow channel 210 and the water outlet flow channel 120.
In the present embodiment, the number of the memory fins 300 communicating with the water inlet channel 110 is equal to the number of the memory fins 300 communicating with the water outlet channel 120.
Specifically, in the present embodiment, two adjacent memory heat dissipation groups are respectively set as a second heat dissipation group and a first heat dissipation group, the connection pipe 500 is disposed between the adjacent second heat dissipation group and the first heat dissipation group, the water outlet channel 120 of the first heat dissipation group is communicated with one end of the connection pipe 500, and the water inlet channel 110 of the second heat dissipation group is communicated with the other end of the connection pipe 500.
In this embodiment, the memory radiator further includes a reflux component for connecting to a peripheral liquid cooling device.
The return assembly includes return pipes (return pipes are not shown in the drawings) and return blocks 400, and the number of return blocks 400 and the number of return pipes are each set to be plural.
The plurality of memory heat dissipation groups are disposed in one-to-one correspondence with the plurality of reflow blocks 400, and the reflow blocks 400 are fixedly connected with the first mounting block 100 (specifically, in this embodiment, the reflow blocks 400 are integrally formed with the first mounting block 100).
The reflow block 300 is provided with a reflow passage therein. The water outlet channel 120 of the first mounting block 100 at one end is communicated with the corresponding backflow block 400, and the backflow pipe is mounted between two adjacent backflow blocks 400 and communicated with backflow channels of the two backflow blocks 400.
The reflow block 400 is integrally formed with the corresponding first mounting block 100.
The number of the memory fins 300 communicating with the water inlet flow channel 110 is set to be a first number, and the number of the memory fins 300 communicating with the water outlet flow channel 120 is set to be a second number, and the first number is equal to the second number.
The connection tube 500 includes an intermediate section 530, an inclined section 520, and a connection section 510. The number of the inclined sections 520 and the middle section 510 is two, the connecting section 510 is connected with one end of the inclined section 520, the middle section 530 is connected with the other end of the inclined section 520, and the two inclined sections 520 and the two connecting sections 510 are symmetrically arranged about the middle section 530, and by arranging the connecting pipe 500 into a plurality of parts and arranging the inclined sections 520, the inclined sections 520 increase the overall length of the connecting pipe 500, so that the cooling liquid flowing inside the connecting pipe 500 has longer flowing time, and the cooling of the cooling liquid is facilitated.
The second mounting block 200 protrudes with a mounting wing plate 220, the mounting wing plate 220 is provided with second mounting holes 221, and the number of the second mounting holes 221 in the same second mounting block 200 is two, and the two second mounting holes 221 are arranged along a straight line.
The first mounting block 100 is provided with first mounting holes 130, specifically, the number of first mounting holes 130 of the same first mounting block 100 is set to one (in other embodiments, the number of first mounting holes 130 of the same first mounting block 100 may be set to two or the like). That is, the same memory heat dissipation group is provided with a first mounting hole 130 and two second mounting holes 221, and the stability of the memory heat dissipation group can be improved by arranging three holes.
The memory heat sink 300 is a copper member, and the first and second mounting blocks 100 and 200 are each provided with a stainless steel member.
The memory heat sink 300 is configured as a copper member, so that the memory heat sink 300 has better heat conduction capability, so that the heat of the memory can be transferred to the cooling liquid flowing in the memory heat sink 300 more.
The memory radiating components are correspondingly distributed in the memory slots near the CPU slots so as to be matched with the middle of the two CPU slots and the two sides of the two CPU slots, wherein the two sides of the two CPU slots are respectively provided with a plurality of memory slots or the middle of the two CPU slots and a main board at one side of one CPU slot. The memory radiator of the scheme can be adapted to the server main board so as to meet the requirements of clients.
While the preferred embodiment of the present utility model has been described in detail, the utility model is not limited to the embodiments, and various equivalent modifications and substitutions can be made by those skilled in the art without departing from the spirit of the utility model, and these modifications and substitutions are intended to be included in the scope of the present utility model as defined in the appended claims.
Claims (10)
1. A memory radiator formed by welding multiple materials is characterized in that: including a plurality of memory cooling groups and connecting pipe, memory cooling group includes:
the first installation block is provided with a water inlet flow channel and a water outlet flow channel;
a second mounting block provided with a connecting flow passage;
a plurality of memory cooling fins provided with cooling water channels; one end of the heat dissipation water channel is communicated with the connecting flow channel, wherein the other ends of the heat dissipation water channels of the memory heat dissipation fins are communicated with the water inlet flow channel, and the other ends of the heat dissipation water channels of the memory heat dissipation fins are communicated with the water outlet flow channel;
the connecting pipe is connected with the water inlet flow passage and the water outlet flow passage of the two internal storage heat dissipation groups.
2. The multi-material solder-formed memory heatsink of claim 1, wherein: the number of the memory heat dissipation groups is three.
3. The multi-material solder-formed memory heatsink of claim 1, wherein: the device also comprises a reflux assembly, wherein the reflux assembly comprises a plurality of reflux blocks and a plurality of reflux pipes; the reflux blocks are arranged in one-to-one correspondence with the first installation blocks, one of the reflux blocks is communicated with the water outlet flow passage at one end, and the reflux pipe is communicated with the two reflux blocks.
4. A multi-material solder-formed memory heat sink as claimed in claim 3, wherein: the reflux block is fixedly connected with the first installation block.
5. The multi-material solder-formed memory heatsink of claim 4, wherein: the reflux block and the corresponding first installation block are integrally formed.
6. The multi-material solder-formed memory heatsink of claim 1, wherein: the number of memory cooling fins is odd.
7. The multi-material solder-formed memory heatsink of claim 1, wherein: the number of the memory cooling fins communicated with the water inlet flow channel is equal to the number of the memory cooling fins communicated with the water outlet flow channel.
8. The multi-material solder-formed memory heatsink of claim 1, wherein: the connecting pipe comprises two connecting sections, two inclined sections and an intermediate section, wherein the inclined sections are arranged between the connecting sections and the intermediate section.
9. The multi-material solder-formed memory heatsink of claim 1, wherein: the second installation piece is outstanding to have the installation pterygoid lamina, and the installation pterygoid lamina is equipped with the second mounting hole, and first installation piece is equipped with first mounting hole.
10. The multi-material solder-formed memory heatsink of claim 1, wherein: the memory radiating fin is a copper component, and the first mounting block and the second mounting block are stainless steel components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321135375.XU CN220171504U (en) | 2023-05-11 | 2023-05-11 | Memory radiator formed by welding multiple materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321135375.XU CN220171504U (en) | 2023-05-11 | 2023-05-11 | Memory radiator formed by welding multiple materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220171504U true CN220171504U (en) | 2023-12-12 |
Family
ID=89066568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321135375.XU Active CN220171504U (en) | 2023-05-11 | 2023-05-11 | Memory radiator formed by welding multiple materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220171504U (en) |
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2023
- 2023-05-11 CN CN202321135375.XU patent/CN220171504U/en active Active
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