CN219872306U - Memory radiator - Google Patents
Memory radiator Download PDFInfo
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- CN219872306U CN219872306U CN202320926945.0U CN202320926945U CN219872306U CN 219872306 U CN219872306 U CN 219872306U CN 202320926945 U CN202320926945 U CN 202320926945U CN 219872306 U CN219872306 U CN 219872306U
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- Prior art keywords
- cooling
- waterway
- memory
- flow
- heatsink
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- 238000001816 cooling Methods 0.000 claims abstract description 95
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 238000005219 brazing Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 4
- 239000000110 cooling liquid Substances 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a memory radiator, which is provided with a first direction and a second direction which are perpendicular to each other; the radiator includes a plurality of through-flow components, and the through-flow component includes: the water-cooling connecting block is provided with a first waterway and a second waterway; the circulating connecting block is provided with a connecting waterway; the cooling pipes are provided with a plurality of cooling pipes, the two ends of each cooling pipe are respectively provided with a first through hole and a second through hole, the two ends of each cooling pipe are respectively connected with the water-cooling connecting block and the water-cooling connecting block, the first through holes of a plurality of cooling pipes are communicated with a first waterway, the first through holes of the other cooling pipes are communicated with a second waterway, and the second through holes of a plurality of cooling pipes are communicated with a connecting waterway. And performing water cooling/liquid cooling heat dissipation on the memory strip to improve the performance of the memory strip.
Description
Technical Field
The utility model relates to the technical field of radiators, in particular to a memory radiator.
Background
Part of high-end hosts can radiate heat of parts such as a CPU, a display card and the like in a water cooling radiating mode. However, in the prior art, there is no radiator for performing water cooling heat dissipation on a memory bank of a computer host.
Disclosure of Invention
The utility model aims to solve the technical problems that: a memory radiator is provided to solve one or more technical problems existing in the prior art, and at least provides a beneficial choice or creation condition.
The utility model solves the technical problems as follows:
a memory radiator is provided with a first direction and a second direction which are mutually perpendicular; the radiator includes a plurality of through-flow components, the through-flow components includes:
the water-cooling connecting block is provided with a first waterway and a second waterway;
the circulating connecting block is provided with a connecting waterway;
the cooling tube, the cooling tube is equipped with a plurality ofly, the both ends of cooling tube are equipped with first through-flow mouth and second through-flow mouth respectively, the both ends of cooling tube respectively with the water-cooling connecting block reaches the circulation connecting block is connected, wherein a plurality of the first through-flow mouth of cooling tube with first water route is linked together, remaining the first through-flow mouth of cooling tube with the second water route is linked together, a plurality of the second through-flow mouth of cooling tube all with connect the water route intercommunication.
Through the technical scheme, the cooling liquid sequentially flows through the first waterway, the first through hole, the second through hole, the connecting waterway, the second through hole, the first through hole and the second waterway, the cooling liquid continuously flows through the cooling pipe according to the paths, heat of the memory strip is transferred into the cooling pipe through the heat conducting fin connected with the peripheral, and the heat is taken away through the cooling liquid, so that water cooling/liquid cooling heat dissipation is carried out on the memory strip, and the performance of the memory strip is improved.
As a further improvement of the above technical solution, the number of the through-flow components is two, and the two through-flow components are arranged along the first direction.
As a further improvement of the above technical solution, the two flow connection blocks of the two flow assemblies are the same member.
As a further improvement of the technical scheme, two ends of the cooling pipe are fixedly connected with the water-cooling connecting block and the circulating connecting block through high-temperature brazing respectively.
As a further improvement of the technical scheme, the side wall of the cooling pipe is provided with a limit groove.
As a further improvement of the technical scheme, the number of the limiting grooves is at least two, and the at least two limiting grooves are respectively arranged at two ends of the cooling pipe.
As a further improvement of the technical scheme, the number of the limiting grooves is four, the four limiting grooves are uniformly arranged at two ends of the cooling pipe, and the two limiting grooves at the same end of the cooling pipe are respectively arranged at two side walls of the cooling pipe.
As a further improvement of the above technical solution, the cooling tube is of a straight tubular structure.
As a further improvement of the above technical solution, the cooling tube is of a flat tubular structure.
As a further improvement of the above technical solution, the number of cooling pipes communicating with the first waterway is equal to the number of cooling pipes communicating with the second waterway.
The beneficial effects of the utility model are as follows: the cooling liquid sequentially flows through the first waterway, the first through hole, the second through hole, the connecting waterway, the second through hole, the first through hole and the second waterway, the cooling liquid continuously flows according to the paths, the heat of the memory strip is transferred into the cooling pipe through the heat conducting fin connected with the peripheral equipment, and the heat is taken away through the cooling liquid, so that water cooling heat dissipation/liquid cooling heat dissipation is carried out on the memory strip, and the performance of the memory strip is improved.
The utility model is used in the technical field of heat radiators.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the drawings described are only some embodiments of the utility model, but not all embodiments, and that other designs and drawings can be obtained from these drawings by a person skilled in the art without inventive effort.
FIG. 1 is a schematic overall structure of an embodiment of the present utility model;
fig. 2 is a schematic cross-sectional view of an embodiment of the present utility model.
In the figure, 100, a water-cooled connecting block; 110. a first waterway; 120. a second waterway; 200. a flow-through connection block; 210. the water way is connected; 300. a cooling tube; 310. a first vent; 320. a second vent; 330. and a limit groove.
Detailed Description
The conception, specific structure, and technical effects produced by the present utility model will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, features, and effects of the present utility model. It is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and that other embodiments obtained by those skilled in the art without inventive effort are within the scope of the present utility model based on the embodiments of the present utility model. In addition, all coupling/connection relationships mentioned herein do not refer to direct connection of the components, but rather, refer to the fact that a more optimal coupling structure may be formed by adding or subtracting coupling aids depending on the particular implementation. The technical features in the utility model can be interactively combined on the premise of no contradiction and conflict.
In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
Referring to fig. 1 and 2, a memory radiator is provided with a second direction and a first direction, the second direction and the first direction are perpendicular to each other, and the second direction and the first direction are parallel to a horizontal plane. The first direction is set as the length direction of the memory radiator, and the second direction is set as the width direction of the memory radiator.
The memory radiator comprises a plurality of through-flow components, and the through-flow components are used for providing a flowing space for cooling liquid. Specifically, in this embodiment, the number of through-flow components is set to two (in other embodiments, the number of through-flow components may be set to one or more than two, and the design is performed according to the actual memory slot layout of the computer motherboard or the server motherboard). Two flow-through components are arranged along a first direction (in other embodiments, a plurality of flow-through components are arranged along the first direction).
The through-flow assembly includes a through-flow connection block 200, a water-cooled connection block 100, and a cooling tube 300.
The water-cooled connection block 100 is provided with a second waterway 120 and a first waterway 110. Specifically, in the present embodiment, the first waterway 110 is communicated with the water inlet pipe, and the second waterway 120 is communicated with the water outlet pipe. In other embodiments, the first waterway 110 may be provided in communication with a water outlet pipe and the second waterway 120 may be provided in communication with a water inlet pipe.
In order to facilitate the processing, the second waterway 120 and the first waterway 110 are arranged to be a runner structure formed by a plurality of round blind holes, and the second waterway 120 and the first waterway 110 only need to be processed by a drill bit during the processing.
The flow connection block 200 is provided with a connection waterway 210 extending along the second direction, the connection waterway being used to connect the plurality of second waterways 120 and the first waterway 110, so that the cooling liquid can flow from the first waterway 110 to the second waterway 120.
In this embodiment, the flow connection blocks 200 of the two flow components are arranged as the same component, and the connection waterways 210 of the two flow components are arranged along the up-down direction, so that the two connection waterways 210 do not interfere with each other, and the two connection waterways 210 respectively play a role in maintaining normal operation of the two flow components.
By providing the flow connection block 200 as the same component, the number of components can be reduced, materials can be saved, and cost can be reduced; the assembly steps can be reduced, thereby improving the processing efficiency. In other embodiments, the flow-through connection block 200 of the two flow-through assemblies may be provided as two separate components.
The number of cooling pipes 300 is plural, in this embodiment, the number of cooling pipes 300 is four (in other embodiments, the number and positions of the cooling pipes 300 may be designed according to the situation of the memory slots of the motherboard), and the four cooling pipes 300 are respectively arranged corresponding to the four memory banks.
The cooling pipe 300 is provided with a second through-flow opening 320 and a first through-flow opening 310, the second through-flow opening 320 and the first through-flow opening 310 are respectively arranged at two ends of the cooling pipe 300, and the second through-flow opening 320 and the first through-flow opening 310 are mutually communicated.
Both ends of the cooling pipe 300 are connected to the flow connection block 200 and the water-cooled connection block 100, respectively. Specifically, in the present embodiment, one end of the cooling pipe 300 is fixedly connected to the water-cooled connection block 100 by a high-frequency brazing process, and the other end of the cooling pipe 300 is fixedly connected to the flow connection block 200 by a high-frequency brazing process. The first through-flow ports 310 of two cooling pipes 300 are communicated with the first water channel 110, the second water channel 120 of the other two cooling pipes 300 are communicated with the first through-flow ports 310, and the second through-flow ports 320 of a plurality of cooling pipes 300 are communicated with the connecting water channel 210.
The cooling liquid is driven by the external circulation device to sequentially flow through the first waterway 110, the first through hole 310, the second through hole 320, the connecting waterway 210, the second through hole 320, the first through hole 310 and the second waterway 120, and finally flows from the second waterway 120 to the first waterway 110 through the circulation device, the cooling liquid continuously flows according to the paths, the heat of the memory bank is transferred into the cooling tube 300 through the external heat conducting fin and is taken away through the cooling liquid, so that the water cooling heat dissipation/liquid cooling heat dissipation is carried out on the memory bank, the temperature of the memory bank is reduced, the performance of the memory bank is improved, and the overall performance of a server or a computer is further improved.
The cooling tube 300 is provided with a limit groove 330, specifically, in the present embodiment, the limit groove 330 is configured as a rectangular groove structure, and in other embodiments, the limit groove 330 may be configured as a trapezoid groove structure or specifically designed according to other components of the computer.
The limiting groove 330 is disposed on a sidewall of the cooling tube 300. The number of the limiting grooves 330 is at least two, and the at least two limiting grooves 330 are respectively arranged at two ends of the cooling pipe 300.
Specifically, in the present embodiment, the number of the limiting grooves 330 is four (in other embodiments, the number of the limiting grooves 330 may be six, and the number of the limiting grooves 330 is designed according to the actual needs), and the plurality of limiting grooves 330 are uniformly arranged at two ends of the cooling tube 300.
Specifically, in the present embodiment, two of the limiting grooves 330 are located at one end of the cooling tube 300, and the other two limiting grooves 330 are located at the other end of the cooling tube 300. Two limiting grooves 330 located at the same end of the cooling tube 300 are respectively disposed at two sidewalls of the cooling tube 300.
The limiting groove 330 is used for limiting the peripheral heat-conducting fin, so that the radiator and the peripheral heat-conducting fin can be better positioned when assembled.
The cooling tube 300 has a flat tubular structure, specifically, in this embodiment, the cooling tube 300 has a flat tubular structure, and the cross section of the cooling tube 300 has a bar-shaped hole structure with two semicircular ends, so as to reduce the sharp angle of the cooling tube 300, and reduce the probability that the sharp angle of the cooling tube 300 touches the motherboard or the computer component when being installed, so as to reduce the damage to the computer component when the memory radiator is installed. The cooling tube 300 with a flat tubular structure can increase the contact area between the external cooling fins and the cooling tube 300, and can avoid the disadvantage that the circular tubular structure occupies the space in the case.
In other embodiments, the cooling tube 300 may be configured as a tubular member having a rounded rectangular cross-section.
While the preferred embodiment of the present utility model has been described in detail, the utility model is not limited to the embodiments, and various equivalent modifications and substitutions can be made by those skilled in the art without departing from the spirit of the utility model, and these modifications and substitutions are intended to be included in the scope of the present utility model as defined in the appended claims.
Claims (10)
1. A memory radiator, characterized in that: the first direction and the second direction which are perpendicular to each other are arranged; the radiator includes a plurality of through-flow components, the through-flow components includes:
the water-cooling connecting block is provided with a first waterway and a second waterway;
the circulating connecting block is provided with a connecting waterway;
the cooling tube, the cooling tube is equipped with a plurality ofly, the both ends of cooling tube are equipped with first through-flow mouth and second through-flow mouth respectively, the both ends of cooling tube respectively with the water-cooling connecting block reaches the circulation connecting block is connected, wherein a plurality of the first through-flow mouth of cooling tube with first water route is linked together, remaining the first through-flow mouth of cooling tube with the second water route is linked together, a plurality of the second through-flow mouth of cooling tube all with connect the water route intercommunication.
2. A memory heatsink as set forth in claim 1, wherein: the number of the through-flow components is two, and the two through-flow components are distributed along the first direction.
3. A memory heatsink as set forth in claim 2, wherein: the two flow connection blocks of the two flow components are the same component.
4. A memory heatsink as set forth in claim 1, wherein: and two ends of the cooling pipe are fixedly connected with the water-cooling connecting block and the circulating connecting block through high-temperature brazing respectively.
5. A memory heatsink as set forth in claim 1, wherein: and a limit groove is formed in the side wall of the cooling pipe.
6. A memory heatsink as set forth in claim 5, wherein: the number of the limiting grooves is at least two, and the limiting grooves are respectively arranged at two ends of the cooling pipe.
7. The memory heatsink of claim 6, wherein: the number of the limiting grooves is four, the four limiting grooves are uniformly arranged at two ends of the cooling pipe, and the two limiting grooves at the same end of the cooling pipe are respectively arranged on two side walls of the cooling pipe.
8. A memory heatsink as set forth in claim 1, wherein: the cooling pipe is of a straight tubular structure.
9. A memory heatsink as set forth in claim 8, wherein: the cooling pipe is of a flat tubular structure.
10. A memory heatsink as set forth in claim 1, wherein: the number of the cooling pipes communicated with the first waterway is equal to the number of the cooling pipes communicated with the second waterway.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320926945.0U CN219872306U (en) | 2023-04-21 | 2023-04-21 | Memory radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320926945.0U CN219872306U (en) | 2023-04-21 | 2023-04-21 | Memory radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219872306U true CN219872306U (en) | 2023-10-20 |
Family
ID=88333906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320926945.0U Active CN219872306U (en) | 2023-04-21 | 2023-04-21 | Memory radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219872306U (en) |
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2023
- 2023-04-21 CN CN202320926945.0U patent/CN219872306U/en active Active
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