JP5800429B2 - Radiators in liquid cooling systems for electronic equipment - Google Patents

Description

  The present invention relates to a radiator in an electronic device liquid cooling system that flows in a liquid refrigerant flowing in a heat receiving portion disposed on a surface of an electronic device including a heat generating element and discharges heat to the outside.

  In recent electronic devices typified by personal computers and servers, heat generation of semiconductor integrated circuit elements typified by a CPU (Central Processing Unit), which is a heating element, increases as data processing speeds up. For this reason, instead of the conventional air cooling type cooling system, for example, a liquid cooling type cooling system (liquid cooling system) with high cooling efficiency using a refrigerant such as water is used. Has been adopted.

  As a liquid cooling type cooling system used in a conventional electronic device, generally, a heat receiving portion called a cooling jacket mounted on the surface of a CPU as a heating element and a flow path formed inside the heat receiving jacket are provided. A radiator that discharges the flowing liquid refrigerant to the outside; and a circulation pump that is interposed in a circulation path that connects the cooling jacket and the radiator and circulates the liquid refrigerant.

  In addition, as a radiator used in a conventional liquid cooling system for electronic equipment, a first header having a flow passage through which liquid refrigerant flows and a heat exchange tube having fins provided outside and a refrigerant inlet The thing of the structure connected to the 2nd header tank provided with the tank and the refrigerant | coolant outflow port is known (for example, refer patent document 1).

  In addition, as another radiator, a refrigerant inlet and a refrigerant outlet are provided on both ends of one of the pair of header tanks to which the heat exchange tubes are connected, and a partition plate is provided at an intermediate portion thereof to allow refrigerant to flow into the header tank. The structure of dividing into the refrigerant | coolant outflow side and the side is known (for example, refer patent document 2).

  Further, as still another radiator, a flat heat exchange tube provided with fins on the outside includes a first extension part connected to the refrigerant inflow pipe, a curved part continuous with the first extension part, 2. Description of the Related Art A structure having a second extending portion that is continuous with a curved portion and extends to face a first extending portion and is connected to a refrigerant outflow pipe is known (for example, Patent Documents). 3).

JP 2006-234255 A (Claims, FIGS. 1 and 2) JP 2006-235915 A (paragraph 0017, FIG. 2) JP 2010-133642 A (Claims, FIG. 4)

  However, in the structures described in Patent Documents 1 and 2, it is necessary to lengthen the heat exchange tube in order to obtain a desired heat dissipation performance, and therefore there is a problem that the flow resistance increases and the heat dissipation performance decreases. .

  In the structure described in Patent Document 3, the heat exchange tube can be bent to reduce the size and the layout compared to the structures of Patent Documents 1 and 2, but the heat dissipation area is too small. There is a problem that cannot be obtained.

  The present invention has been made in view of the above circumstances, and the liquid cooling system for electronic equipment is capable of shortening the flow path of the entire liquid cooling system to suppress the passage resistance, improving the heat radiation performance and increasing the degree of layout. It aims at providing the radiator in.

To achieve the above object, the present invention provides a heat receiving portion disposed on a surface of an electronic device including a heat generating element, and a radiator that flows in liquid refrigerant flowing through the heat receiving portion and discharges heat to the outside. A liquid-cooling system for electronic equipment that includes a circulation pump that circulates the liquid refrigerant interposed in a circulation path that connects the heat receiving unit and the radiator, wherein the liquid refrigerant flows inside, and the radiator A flat heat exchange tube provided with fins, and a header tank connected to the heat exchange tube, wherein the header tank is provided at the center of the radiator and is a hollow rectangular header tank A main body and a cap member that closes the opening ends at both ends in the longitudinal direction of the header tank main body. Chamber and a refrigerant outlet chamber are partitioned up and down, a coolant inlet that is connected to the circulation path to the coolant inlet chamber provided in the side wall of one side of the short side of the header tank body, the circulation path to the refrigerant outlet chamber It is characterized by providing a refrigerant outlet for connection to (Claim 1). Here, the central portion of the radiator that defines the position of the header tank is not only strictly the center, but also a mode in which a plurality of heat exchange tubes connected to both sides of the header tank are formed. For example, it is meant to include a mode from the center to the end.

  With this configuration, the liquid refrigerant (hereinafter referred to as the refrigerant) flowing in the heat receiving portion to which the heat generated from the heat generating element is transmitted is supplied from the refrigerant inlet of the header tank provided in the central portion of the radiator from the circulation path. After flowing into the inflow chamber and flowing into the refrigerant inflow chamber through the heat exchange tubes connected to both sides of the header tank, the heat is released to the outside, and then flows into the refrigerant outflow chamber of the header tank. Circulation cooling can be repeated by flowing from the outlet to the circulation path.

Further , the refrigerant inlet and the refrigerant outlet can be arranged close to each other, the connection of the circulation path connecting to the heat receiving portion and the circulation pump can be facilitated, and the radiator, the heat receiving portion and the circulation pump are close to each other. Can be arranged.

Further, in the present invention, a plurality of refrigerant inflow side heat exchange tubes and a refrigerant outflow side heat exchange tubes are connected to the refrigerant inflow chamber and the refrigerant outflow chamber in the header tank to form a plurality of flow path paths, respectively. It is preferable (Claim 2 ). In this case, the end of the refrigerant inflow side heat exchange tube and the refrigerant outflow side heat exchange tube opposite to the header tank side are connected to the same auxiliary header tank (Claim 3 ), or the refrigerant It is preferable that the end of the heat exchange tube on the inflow side and the heat exchange tube on the refrigerant outflow side opposite to the header tank side communicate with each other via a bent portion (Claim 4 ).

  By comprising in this way, the contact area with the external air of the refrigerant | coolant which flows through a heat exchange tube can be increased, and heat dissipation performance can be improved.

In the present invention, a plurality of heat exchange tubes connected to both sides of the header tank are formed in a straight line in a symmetrical direction with respect to the header tank (Claim 5 ), or connected to both sides of the header tank. The plurality of heat exchange tubes may be formed at an angle with respect to the header tank (claim 6 ).

  By comprising in this way, the radiator in a liquid cooling system can be arrange | positioned according to installation space.

Further, in the present invention, as well as setting a plurality Hon'nami at appropriate intervals the heat exchange tubes in the vertical direction, it is preferable to interposed fins between adjacent heat exchange tubes (claim 7).

  By comprising in this way, since the fin is interposed between the adjacent heat exchange tubes arranged side by side, the heat of the refrigerant flowing through each heat exchange tube is transferred to the fin to be uniformly dissipated (released). Can do.

Further, in the present invention, a plurality of the heat exchange tubes are arranged in parallel in the vertical direction with an appropriate interval therebetween, and fins are interposed between adjacent heat exchange tubes and fins are interposed between adjacent heat exchange tubes. You may form the part which adjoins, without providing (Claim 8 ).

  By comprising in this way, size reduction can be achieved in the state which suppressed the passage resistance of the refrigerant | coolant.

  (1) According to the first aspect of the present invention, the refrigerant flowing in the heat receiving portion to which the heat generated from the heat generating element has been transmitted is passed from the circulation path to the header tank via the header tank provided in the central portion of the radiator. After flowing through the heat exchange tubes connected to both sides and releasing the heat to the outside, the heat can be recirculated through the header tank to the circulation path to repeat circulation cooling, shortening the flow path of the entire liquid cooling system Thus, passage resistance can be suppressed, heat dissipation performance can be improved, and layout flexibility can be achieved.

(2) According to the invention described in claim 1 , the refrigerant inlet and the refrigerant outlet can be arranged close to each other, and the connection of the circulation path connected to the heat receiving portion and the circulation pump is facilitated. In addition to the above, the radiator, the heat receiving unit, and the circulation pump can be arranged close to each other, so that in addition to the above (1), the liquid cooling system can further save space.

(3) According to the invention described in claims 2 to 4 , in addition to the above (1) and (2), the contact area of the refrigerant flowing through the heat exchange tube with the outside air can be increased, and the heat dissipation performance can be improved. Can be improved.

(4) According to the inventions of claims 5 and 6 , the plurality of heat exchange tubes connected to both sides of the header tank are formed in a straight shape in a symmetrical direction with respect to the header tank, or Thus, the radiator in the liquid cooling system can be arranged according to the installation space. Therefore, in addition to the above (1) to (3), the flexibility of the layout of the radiator can be further increased.

(5) According to the invention described in claim 7 , since the fins are interposed between the adjacent heat exchange tubes arranged in parallel, the heat of the refrigerant flowing through each heat exchange tube is transferred to the fins and evenly dissipated. Therefore, in addition to the above (1) to (4), the heat dissipation performance can be further improved.

(6) According to the invention described in claim 8 , a plurality of heat exchange tubes are arranged in parallel, and a fin is interposed between adjacent heat exchange tubes and a portion where fins are interposed between adjacent heat exchange tubes. In addition to the above (1) to (4), it is possible to further reduce the size of the refrigerant while suppressing the passage resistance of the refrigerant.

It is a schematic plan view which shows a part of example of the liquid cooling system for electronic devices provided with the radiator which concerns on this invention in a cross section. 1 is a schematic front view showing a radiator according to a first embodiment of the invention. It is sectional drawing which expands and shows the principal part of 1st Embodiment. It is a disassembled cross-sectional perspective view which shows the header tank, heat exchange tube, and corrugated fin in this invention. It is a schematic front view which shows the radiator of 2nd Embodiment which concerns on this invention. It is sectional drawing which expands and shows the principal part of 2nd Embodiment. It is a schematic front view which shows the radiator of 3rd Embodiment which concerns on this invention. It is sectional drawing which expands and shows the principal part of 3rd Embodiment. It is a schematic front view which shows the radiator of 4th Embodiment which concerns on this invention. It is sectional drawing which expands and shows the principal part of 4th Embodiment. It is a schematic plan view which shows the radiator of 5th Embodiment which concerns on this invention.

  Embodiments of a radiator according to the present invention will be described below in detail with reference to the accompanying drawings. As shown in FIG. 1, a liquid cooling system for an electronic device to which a radiator according to the present invention is applied, includes a cooling jacket 1 that is a heat receiving portion disposed on the surface of an electronic device (not shown) provided with a heating element. The radiator R according to the present invention flows in a liquid refrigerant (hereinafter referred to as a refrigerant) flowing through the cooling jacket 1 and discharges heat to the outside, and the circulation path 2 connecting the cooling jacket 1 and the radiator R. A circulation pump P that circulates the refrigerant, and a fan F that is disposed opposite to the position near the radiator R and blows air toward the radiator R.

<First Embodiment>
As shown in FIGS. 2 to 4, the radiator R according to the first embodiment is connected to the heat exchange tube 10 and the flat heat exchange tube 10 in which the refrigerant flows inside and the corrugated fins 3 are provided outside. And a header tank 20.

  The header tank 20 is provided in the central portion of the radiator R, and is partitioned into a refrigerant inflow chamber 22 and a refrigerant outflow chamber 23 via a partition plate 21, and a refrigerant inlet 24 connected to the circulation path 2 is connected to the refrigerant inflow chamber 22. The refrigerant outflow chamber 23 is provided with a refrigerant outlet 25 connected to the circulation path 2.

  In this case, the header tank 20 is configured such that, for example, both end openings of a hollow rectangular header tank main body 20a formed of an extruded aluminum member are closed with an aluminum cap member 20b, and the header tank main body 20a is formed in an intermediate portion. A partition plate 21 made of aluminum is provided. A refrigerant inflow chamber 22 and a refrigerant outflow chamber 23 are partitioned above and below the header tank 20 by the partition plate 21. In this case, the refrigerant inflow chamber 22 is formed on the lower side, and the refrigerant outflow chamber 23 is formed on the upper side.

  A refrigerant inlet 24 is provided on the upper side of the refrigerant inflow chamber 22 in the side wall 20c on one side (front) of the short side of the header tank body 20a, and a refrigerant outlet 25 is provided on the upper side of the refrigerant outflow chamber 23. Is provided. The refrigerant inlet 24 and the refrigerant outlet 25 are located on the vertical center line VL of the side wall 20c. Note that the positions of the refrigerant inlet 24 and the refrigerant outlet 25 do not necessarily need to be on the vertical center line VL, and need not necessarily be on the same line.

  In addition, a plurality of slits 20f (six cases are shown in the drawing) 20f are provided in parallel with each other on the side walls 20d and 20e on the long side of the header tank body 20a with appropriate intervals in the vertical direction. One end of the heat exchange tube 10 is inserted into these slits 20f.

  As shown in FIG. 4, the heat exchange tube 10 is formed of a flat elliptical aluminum extruded profile provided with a plurality of refrigerant flow passages 12 by partition walls 11. The other end of the heat exchange tube 10 formed in this way is inserted into a slit 20h provided in parallel with one side wall 20g of the hollow rectangular auxiliary header tank 20A.

  The auxiliary header tank 20A is formed in a hollow rectangular shape in which an aluminum plate-like member 26 provided with slits 20h and a box-like main body 28 having bent pieces 27 on four sides are joined by brazing.

  In the heat exchange tube 10 having both ends inserted into the slit 20f of the header tank 20 and the slit 20h of the auxiliary header tank 20A as described above, an aluminum corrugated fin 3 is interposed between the adjacent heat exchange tubes 10. It is installed.

  The header tank 20, the auxiliary header tank 20A, the heat exchange tube 10 and the corrugated fins 3 are assembled to each other and integrally brazed in a state of being fixed by a fixing jig (not shown) to form the radiator R. In this case, in the radiator R, the first flow path 30A is formed by the six heat exchange tubes 10 on the refrigerant inflow side, that is, three on the left and right sides connected to the refrigerant inflow chamber 22 provided on the lower side of the header tank 20, The second flow path 30 </ b> B is formed by the six heat exchange tubes 10 on the refrigerant outflow side, three on the left and right sides connected to the refrigerant outflow chamber 23 provided on the upper side of the header tank 20.

  When the circulation pump 2 is driven in a state where the circulation path 2 is connected to the refrigerant inlet 24 and the refrigerant outlet 25 of the radiator R formed as described above, a heating element (not shown) of an electronic device The refrigerant flowing in the cooling jacket 1 to which heat is transmitted flows from the circulation path 2 into the refrigerant inflow chamber 22 through the refrigerant inlet 24 of the header tank 20 provided in the central portion of the radiator R. The refrigerant flowing into the refrigerant inflow chamber 22 flows through the first flow path 30A formed by the heat exchange tube 10 connected to the refrigerant inflow chamber 22 of the header tank 20, and releases heat to the outside through the corrugated fins 3. Then, it flows into the auxiliary header tank 20A. The refrigerant flowing into the auxiliary header tank 20A flows through the second flow path 30B formed by the heat exchange tube 10 connected to the refrigerant outflow chamber 23 of the header tank 20, and releases heat to the outside through the corrugated fins 3. Thereafter, the refrigerant flows into the refrigerant outflow chamber 23. The refrigerant that has flowed into the refrigerant outflow chamber 23 flows into the cooling jacket 1 from the refrigerant outlet 25 via the circulation path 2. Thereafter, similarly, circulation cooling can be repeated to release heat generated from the electronic device to the outside.

  According to the radiator R of the first embodiment, the refrigerant flowing in the cooling jacket 1 to which the heat generated from the heat generating element is transmitted is passed through the header tank 20 provided in the central portion of the radiator R from the circulation path 2 to the header. After flowing through the first flow path 30A and the second flow path 30B formed by the heat exchange tubes 10 connected to both sides of the tank 20 to release the heat to the outside, the circulation path is again passed through the header tank 20 Since the circulation cooling can be repeated, the flow path of the entire liquid cooling system can be shortened to suppress the passage resistance, thereby improving the heat dissipation performance and the degree of freedom in layout.

Second Embodiment
The radiator RA of the second embodiment is a case where the whole is reduced in size without changing the passage resistance of the radiator R of the first embodiment.

  That is, as shown in FIGS. 5 and 6, the three heat exchange tubes 10 on the left and right sides connected to the refrigerant inflow chamber 22 provided on the lower side of the header tank 20 {here, for ease of explanation, 10a, 10b, and 10c in this order. }, The corrugated fin 3 is interposed between the heat exchange tube 10a on the lower end side and the second heat exchange tube 10b adjacent thereto, and the second heat exchange tube 10b. And the third heat exchanging tube 10c adjacent thereto are close to each other without interposing the corrugated fins 3.

  In addition, the three heat exchange tubes 10 on the left and right sides connected to the refrigerant outflow chamber 23 provided on the upper side of the header tank 20 {here, in order to facilitate explanation, they are 10d, 10e, and 10f in order from the top. }, The corrugated fin 3 is interposed between the heat exchange tube 10d on the upper end side and the second heat exchange tube 10e adjacent thereto, and the second heat exchange tube 10e. And the third heat exchanging tube 10f adjacent thereto are close to each other without the corrugated fins 3 interposed therebetween.

  In addition, since the corrugated fin 3 is interposed between the heat exchange tube 10c that forms the first flow path 30A and the heat exchange tube 10f that forms the second flow path 30B, all the heat exchange tubes 10a to 10f. The heat of the refrigerant flowing through 20 f is radiated (released) to the outside through the corrugated fins 3.

  In the second embodiment, the other parts are the same as those in the first embodiment, so the same parts are denoted by the same reference numerals and description thereof is omitted.

  According to the radiator RA of the second embodiment, the first flow path 30A and the second flow path 30B are separated by the heat exchange tubes 10 (10a to 10f) having the same shape and number as the heat exchange tubes 10 of the first embodiment. Since it forms, passage resistance can be made the same as that of 1st Embodiment. Further, by removing the corrugated fins 3 between the adjacent heat exchange tubes 10b, 10c; 10e, 10f and arranging them closely, the volume of the radiator RA can be reduced, and the size can be reduced.

<Third Embodiment>
The radiator RB of the third embodiment is a case where the passage resistance can be further suppressed without changing the volume of the radiator R of the first embodiment.

  That is, as shown in FIGS. 7 and 8, four heat exchange tubes 10 on the left and right sides connected to the refrigerant inflow chamber 22 provided on the lower side of the header tank 20 {here, for ease of explanation, 10g, 10h, 10i, and 10j in this order. }, The corrugated fin 3 is interposed between the heat exchange tube 10g on the lower end side and the second heat exchange tube 10h adjacent thereto, and the second heat exchange tube 10h. And the third heat exchange tube 10i adjacent to the first heat exchange tube 10i without interposing the corrugated fin 3, and the corrugated fin between the third heat exchange tube 10i and the fourth heat exchange tube 10j. 3 is installed.

  Further, four heat exchange tubes 10 on the left and right sides connected to the refrigerant outflow chamber 23 provided on the upper side of the header tank 20 {here, in order to facilitate the explanation, 10k, 10l, 10m, and 10n in order from the top. To do. }, The corrugated fin 3 is interposed between the heat exchange tube 10k on the upper end side and the second heat exchange tube 10l adjacent thereto, and the second heat exchange tube 10l. And the third heat exchange tube 10m adjacent to the first heat exchange tube 10m without interposing the corrugated fin 3, and the corrugated fin between the third heat exchange tube 10m and the fourth heat exchange tube 10n. 3 is installed.

  The corrugated fins 3 are not interposed between the heat exchange tube 10j that forms the first flow path 30A and the heat exchange tube 10n that forms the second flow path 30B, and are close to each other.

  Since the corrugated fins 3 are in contact with the outside of the heat exchange tubes 10g to 10n, the heat of the refrigerant flowing through all the heat exchange tubes 10g to 10n is radiated (released) to the outside through the corrugated fins 3.

  In the third embodiment, the other parts are the same as those in the first embodiment, so the same parts are denoted by the same reference numerals and description thereof is omitted.

  According to the radiator RB of the third embodiment, by increasing the number of the heat exchange tubes 10 forming the first flow path 30A and the second flow path 30B without increasing the size of the radiator R of the first embodiment, Since the flow path resistance can be suppressed, the heat exchange performance can be improved.

<Fourth embodiment>
The radiator RC of the fourth embodiment is a case where the end of the heat exchange tube 10 on the side opposite to the header tank 20 side is communicated via the bent portion 40 instead of the auxiliary header tank 20.

  That is, as shown in FIGS. 9 and 10, the three heat exchange tubes 10 on the left and right sides connected to the refrigerant inflow chamber 22 provided on the lower side of the header tank 20 {here, for ease of explanation, 10a, 10b, and 10c in this order. } On the opposite side of the header tank 20 side and the left and right heat exchange tubes 10 connected to the refrigerant outflow chamber 23 provided on the upper side of the header tank 20 {here, for ease of explanation. In addition, they are 10d, 10e, and 10f in order from the top. } On the opposite side of the header tank 20 side through the bent portion 40. In this case, the heat exchange tubes symmetrical to the horizontal center line HL of the radiator RC, that is, the ends of 10a and 10d, 10b and 10e, and 10c and 10f are communicated with each other through the bent portion 40. The end portions of the heat exchange tubes 10a to 10f are held by the holding plate 50.

  In the radiator RC formed as described above, when the circulation pump P is driven in a state where the circulation path 2 is connected to the refrigerant inlet 24 and the refrigerant outlet 25 of the radiator RC, the refrigerant flowing in the cooling jacket 1 is Heat exchange tubes 10a to 10c that flow from the circulation path 2 into the refrigerant inflow chamber 22 through the refrigerant inlet 24 of the header tank 20 provided in the central portion of the radiator RC and connect to both sides of the refrigerant inflow chamber 22 of the header tank 20. Flows through the first flow path 30 </ b> A formed by, and releases heat to the outside through the corrugated fins 3. The refrigerant flowing through the first flow path 30A flows through the second flow path 30B formed by the heat exchange tubes 10d to 10f connected to both sides of the refrigerant outflow chamber 23 of the header tank 20 and passes through the corrugated fins 3. After releasing the heat to the outside, it flows into the refrigerant outflow chamber 23. The refrigerant that has flowed into the refrigerant outflow chamber 23 flows into the cooling jacket 1 from the refrigerant outlet 25 via the circulation path 2. Thereafter, similarly, circulation cooling can be repeated to release heat generated from the electronic device to the outside.

  In the fourth embodiment, the other parts are the same as those in the first embodiment, and therefore the same parts are denoted by the same reference numerals and description thereof is omitted.

  According to the radiator RC of the fourth embodiment, since the end portions of the heat exchange tubes 10a to 10f are communicated via the bent portion 40 without using the auxiliary header tank 20A, the radiator RC can be reduced in size.

<Fifth Embodiment>
The radiator RD of the fifth embodiment is a case where a degree of freedom that can be arranged according to the installation space is provided.

  That is, as shown in FIG. 11, the side walls 20d and 20e on the long side of the header tank 20B are formed not at parallel but at an angle, and the heat exchange tubes 10 are connected orthogonally to the side walls 20d and 20e. In this case, the left and right heat exchange tubes 10 connected to both sides of the header tank 20B are provided with an angle θ, and the radiator RD is arranged according to the installation space.

  In addition, although FIG. 11 demonstrated the case where the angle θ of the left and right heat exchange tubes 10 is about 160 °, the left and right heat exchange tubes 10 are set to an arbitrary angle, for example, 120 °, 90 °, or the like as necessary. can do.

  In addition, although FIG. 11 demonstrated the case where the edge part on the opposite side to the header tank 20B side of the heat exchange tube 10 was connected to the auxiliary header tank 20A, it is the edge on the opposite side to the header tank 20B side like 4th Embodiment. The portions may be communicated with each other through the bent portion 40.

  According to the radiator RD of the fifth embodiment, the first flow path 30A and the second flow path 30B formed by the plurality of heat exchange tubes 10 connected to the left and right sides of the header tank 20B are angled with respect to the header tank 20B. Since it forms with (theta), the radiator RD in a liquid cooling system can be arrange | positioned according to installation space. Therefore, it is possible to give a degree of freedom to the arrangement of the radiator RD.

1 Cooling jacket (heat receiving part)
2 Circulation path P Circulation pump F Fan 3 Corrugated fins R, RA to RD Radiators 10, 10a to 10n Heat exchange tubes 20, 20B Header tank 20A Auxiliary header tank 21 Partition plate 22 Refrigerant inflow chamber 23 Refrigerant outflow chamber 24 Refrigerant inflow port 25 Refrigerant outlet 30A 1st flow path 30B 2nd flow path 40 Bending part

Claims (8)

A heat receiving portion disposed on the surface of the electronic device including the heat generating element, a radiator that flows in liquid refrigerant flowing through the heat receiving portion and discharges heat to the outside, and a circulation path that connects the heat receiving portion and the radiator. In a liquid cooling system for electronic equipment comprising a circulation pump that is interposed and circulates the liquid refrigerant,
The radiator includes a flat heat exchange tube in which the liquid refrigerant flows and fins are provided on the outside, and a header tank connected to the heat exchange tube.
The header tank is provided at a central portion of the radiator, and includes a hollow rectangular header tank body and a cap member that closes both ends of the header tank body in the longitudinal direction. A refrigerant inflow chamber and a refrigerant outflow chamber are vertically partitioned through a partition plate, and a refrigerant inflow port connected to the circulation path is provided in the refrigerant inflow chamber on one side wall of the short side of the header tank body. The refrigerant outflow chamber is provided with a refrigerant outlet connected to the circulation path.
The radiator in the liquid cooling system for electronic devices characterized by the above-mentioned. In the radiator in the liquid cooling system for electronic equipment according to claim 1 ,
A plurality of refrigerant inflow-side heat exchange tubes and refrigerant outflow-side heat exchange tubes are connected to the refrigerant inflow chamber and the refrigerant outflow chamber in the header tank to form a plurality of flow path paths, respectively. A radiator in a liquid cooling system for electronic equipment. In the radiator in the liquid cooling system for electronic equipment according to claim 2 ,
A liquid cooling system for electronic equipment, characterized in that ends of the heat exchange tube on the refrigerant inflow side and the heat exchange tube on the refrigerant outflow side opposite to the header tank side are connected to the same auxiliary header tank. In the radiator. In the radiator in the liquid cooling system for electronic equipment according to claim 2 ,
In the liquid cooling system for electronic equipment, characterized in that the end portion on the opposite side of the header tank side of the heat exchange tube on the refrigerant inflow side and the heat exchange tube on the refrigerant outflow side is communicated via a bent portion. Radiator. In the radiator in the liquid cooling system for electronic devices according to any one of claims 2 to 4 ,
A radiator in an electronic apparatus liquid cooling system, wherein a plurality of heat exchange tubes connected to both sides of the header tank are formed in a straight line in a symmetrical direction with respect to the header tank. In the radiator in the liquid cooling system for electronic devices according to any one of claims 2 to 4 ,
A radiator in an electronic device liquid cooling system, wherein a plurality of heat exchange tubes connected to both sides of the header tank are formed at an angle to the header tank. In the radiator in the liquid cooling system for electronic devices according to any one of claims 1 to 6 ,
A radiator in an electronic apparatus liquid cooling system, wherein a plurality of the heat exchange tubes are arranged side by side in the vertical direction at appropriate intervals, and fins are interposed between adjacent heat exchange tubes. In the radiator in the liquid cooling system for electronic devices according to any one of claims 1 to 6 ,
A plurality of the heat exchange tubes are arranged side by side in the vertical direction at an appropriate interval, and a portion in which fins are interposed between adjacent heat exchange tubes and an adjacent heat exchange tube are adjacent to each other without fins. And a radiator in an electronic device liquid cooling system.

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