JP2019079836A - Liquid-cooled cooler - Google Patents

Abstract

To improve cooling efficiency furthermore with a simple configuration, in a liquid-cooled cooler.SOLUTION: A liquid-cooled cooler 10 has first and second casings 12, 14 dividable vertically, in which fins 16 are housed therein, and first and second guide walls 34, 36 are provided to face one ends and the other ends of the fins 16. The first and second guide walls 34, 36 stand from the bottom wall part 22 of the second casing 14 toward a first casing 12 side, and are formed with a prescribed length in a width direction. Cooling medium supplied from the supply port 28 of the second casing 14 is deflected to the width direction outside by the first guide wall 34 and is diverted suitably, and cools an electronic component E provided in the top wall part 18 of the first casing 12 by heat exchange, by flowing to the downstream side so as to face the electronic component.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a liquid cooling type cooling device capable of cooling an electronic component by performing heat exchange with a refrigerant flowing through a plurality of flow paths.

  Conventionally, a liquid cooling type cooling device for cooling an electronic component such as a semiconductor has been proposed, and this liquid cooling type cooling device has a wave shape in cross section as disclosed in Patent Document 1, for example. The formed corrugated fins are provided inside the casing, and the cooling fluid inlet protrudes rightward on the circumferential wall of the casing, and the cooling fluid outlet protrudes leftward. Moreover, the semiconductor element which is a heat generating body is mounted on the top wall of the casing via a plate-like insulating member.

  Then, when the coolant supplied from the coolant inlet to the inside of the casing flows between the corrugated fins and flows to the coolant outlet, the heat generated from the semiconductor element causes the insulating member, the casing and the corrugated fins to By passing through to the coolant, heat is exchanged and the semiconductor element is cooled.

Patent No. 5023020

  The present invention is made in connection with the above-mentioned proposal, and it aims at providing a liquid cooling type cooling device which can aim at improvement of the cooling efficiency further by simple composition.

In order to achieve the above object, the present invention comprises a casing having a supply port to which a refrigerant is supplied and a discharge port to which a refrigerant is discharged, and a fin housed in the casing, the casing comprising: In a liquid-cooling type cooling device that cools electronic components with excessive heat by heat exchange with a refrigerant,
The casing is provided at least on the upstream side of the fin and includes a deflection unit that deflects the flow direction of the refrigerant,
The deflection unit is characterized in that it is disposed at a position not overlapping the electronic component in the width direction orthogonal to the flow direction.

  According to the present invention, the casing constituting the liquid-cooling type cooling device is provided with a deflecting unit for deflecting the flow direction of the refrigerant at least upstream of the fins contained therein, and the deflecting unit is used to In the width direction orthogonal to the flow direction, the electronic component mounted on the casing is disposed so as not to overlap.

  Therefore, the refrigerant supplied from the supply port into the casing is deflected in the flow direction in the width direction by the deflector to lead the refrigerant to a position facing the electronic component not overlapping with the deflector and the fins are finned. It can be distributed along the As a result, the cooling efficiency of the electronic component can be further improved with a simple configuration in which a deflection unit that deflects the flow direction of the refrigerant is provided in the casing.

  Further, the deflecting unit is also provided on the downstream side of the fin, and one deflecting unit disposed on the upstream side of the fin and the other deflecting unit disposed on the downstream side of the fin are linearly aligned along the circulation direction. It is good to arrange.

  Furthermore, the deflecting portion may be erected with respect to the casing and integrally formed with the casing, or may be formed by cutting and raising the wall portion of the casing.

  Furthermore, the deflection portion may be formed to have a height substantially equal to that of the fin.

  According to the present invention, the following effects can be obtained.

  That is, in the casing constituting the liquid cooling type cooling device, a deflector for deflecting the flow direction of the refrigerant is provided at least on the upstream side of the fin, and this deflector is attached to the casing in the width direction orthogonal to the flow direction of the refrigerant. By arranging the refrigerant at a position not overlapping with the above electronic components, the refrigerant supplied from the supply port is deflected in the width direction by the deflecting unit, and the refrigerant is moved to a position facing the electronic components not overlapping with the deflecting unit. It can be suitably led and circulated downstream. As a result, the cooling efficiency of the electronic component can be further improved with a simple configuration in which a deflection unit for deflecting the flow direction of the refrigerant is provided in the casing.

FIG. 1 is an overall cross-sectional view of a liquid-cooling type cooling device according to a first embodiment of the present invention. It is a disassembled perspective view of the liquid cooling type cooling device of FIG. FIG. 5 is an overall plan view of a second casing and fins in the liquid-cooling type cooling device shown in FIG. 1. It is whole sectional drawing of the liquid cooling type cooling device which concerns on the 2nd Embodiment of this invention. FIG. 5 is an overall plan view of a second casing and fins in the liquid-cooling type cooling device shown in FIG. 4.

  A preferred embodiment of the liquid cooling type cooling device according to the present invention will be described in detail below with reference to the attached drawings. In FIG. 1, reference numeral 10 denotes a liquid cooling type cooling device according to a first embodiment of the present invention.

  As shown in FIGS. 1 and 2, the liquid-cooling type cooling device 10 includes first and second casings (casings) 12 and 14 which can be divided up and down, and the first and second casings 12 and 14. And a fin 16 housed inside.

  The first and second casings 12 and 14 are formed into substantially the same shape by, for example, forming a plate material made of metal, and the first casing 12 has a flat top wall 18 and the top wall 18. And an electronic component E such as a semiconductor which needs to be cooled is mounted on the top surface of the top wall 18.

  For example, a total of 12 electronic components E are provided so as to be separated from each other in the width direction (direction of arrow B) of the first casing 12 and 6 each along the longitudinal direction (direction of arrows A1 and A2). It is attached. In other words, it is arranged along the longitudinal direction in two rows so as to be spaced apart on the width direction outer side (the arrow B1 direction) with respect to the width direction center of the first casing 12 respectively. In addition, the electronic component E is not limited to the quantity mentioned above, What is necessary is just to set suitably as needed.

  The second casing 14 comprises a flat bottom wall 22 and a second side wall 24 erected on the outer edge of the bottom wall 22, as shown in FIGS. The portion 22 is formed in substantially the same shape as the top wall 18 of the first casing 12, and the end of the second side wall 24 abuts on the end of the first side wall 20 of the first casing 12. In the state, for example, they are connected by brazing or the like. As a result, as shown in FIG. 1, the top wall 18 and the bottom wall 22 become substantially parallel, and the internal space surrounded by the first and second casings 12 and 14 is the flow passage 26 through which the refrigerant flows. Become.

  Further, the bottom wall 22 along the longitudinal direction (arrows A1 and A2 directions) of the second casing 14 has a supply port 28 to which the refrigerant is supplied and an outlet 30 to which the refrigerant having flowed inside is discharged. Each is open. The supply port 28 is formed at the center in the width direction on one end side (the direction of arrow A1) of the second casing 14, and the discharge port 30 is in the width direction on the other end side (the direction of arrow A2) of the second casing 14. It is formed in the position offset to the 2nd side wall part 24 side from the center.

  That is, in the longitudinal direction of the second casing 14, the supply port 28 and the discharge port 30 are not arranged in a straight line, but are offset in the width direction (the arrow B direction).

  The pipes 32a and 32b (see FIG. 1) for supplying and discharging the refrigerant are respectively connected to the supply port 28 and the discharge port 30 so as to be substantially orthogonal to the bottom wall portion 22. In the two casings 12 and 14, the refrigerant flows from the supply port 28 to the discharge port 30 along the longitudinal direction (the direction of the arrow A2 in FIG. 1).

  Furthermore, on the bottom wall portion 22 of the second casing 14, a pair of first and second guide walls (which are erected toward the first casing 12 side and extended along the width direction (arrow B direction)) Deflection units 34, 36 are provided. The first and second guide walls 34, 36 are formed simultaneously with the formation of the second casing 14, and are formed in a substantially U-shaped cross section substantially upright with respect to the bottom wall 22 (see FIG. 1). And the height of the fins 16 is approximately equal to or less than the height of the fins 16. That is, the first and second guide walls 34, 36 are formed to have a plate thickness which is integral with and identical to the second casing 14.

  The first guide wall 34 is provided on the upstream side (in the direction of the arrow A1) of the second casing 14 on the supply port 28 side, and the second guide wall 36 is on the downstream side of the second casing 14 on the discharge port 30 side. While being provided in the side (arrow A2 direction), it is provided in the width direction center of the second casing 14, respectively. That is, they are arranged to be in a straight line with each other in the longitudinal direction (the directions of arrows A1 and A2) of the second casing 14.

  Furthermore, the first guide wall 34 is disposed at a position separated by a predetermined distance from the supply port 28 in the longitudinal direction, and the second guide wall 36 is disposed at a position separated by a predetermined distance from the discharge port 30 in the longitudinal direction. Be done.

  In other words, the first guide wall 34 is disposed to face the supply port 28, and the second guide wall 36 is disposed offset from the discharge port 30 in the width direction (arrow B direction).

  The fins 16 are bent into a corrugated shape in cross section, for example, by forming a thin plate of an aluminum material or the like, and the top wall of the first casing 12 along the width direction (the arrow B direction) of the first and second casings 12, 14. The bottom 18 and the bottom wall 22 of the second casing 14 are arranged alternately in contact with each other, and have a wave-like cross-sectional shape in the longitudinal direction (directions of arrows A1 and A2) of the first and second casings 12 and 14 It is formed to extend along. Then, the refrigerant flows in the flow path 26 in the longitudinal direction (the direction of the arrow A2) along the plurality of fins 16 in the first and second casings 12 and 14.

  In addition, the fins 16 are disposed between the first guide wall 34 and the second guide wall 36 in the first and second casings 12 and 14, and the upstream end thereof is the first guide wall The other end portion on the downstream side is provided so as to face the second guide wall 36.

  Furthermore, at one end of the first and second casings 12 and 14, a supply portion 38 to be a space to which the refrigerant is supplied is formed between the one end of the fins 16 and one of the first and second casings 12 and 14. At the other end, a discharge portion 40 is formed between the other end of the fin 16 and the space where the refrigerant is discharged.

  The liquid-cooling type cooling device 10 according to the embodiment of the present invention is basically configured as described above, and next, its operation and effects will be described.

  First, a refrigerant is supplied from the supply port 28 to the supply section 38 through the pipe 32a from the coolant supply means (not shown), and the refrigerant is supplied to the downstream side at the center in the width direction by the first guide wall 34 (arrow A2 Flow is blocked, and bifurcated along the width direction (arrow B1 direction) to the first and second side wall portions 20 and 24 side which becomes the width direction outer side (arrow B1 direction), After passing the width direction end of the 1 guide wall 34, it circulates to the downstream side (arrow A2 direction).

  Then, the divided refrigerant flows downstream along the first and second side wall portions 20 and 24 in the flow path 26 along the plurality of fins 16 so as to face the flow of the refrigerant. Heat exchange is performed with the electronic component E installed in the top wall 18, and the electronic component E is suitably cooled and the refrigerant is heated.

  Specifically, the heat generated by the electronic component E is transmitted from the top wall 18 of the first casing 12 to the fins 16 and is heat-exchanged with the refrigerant flowing along the fins 16, so that the fins 16 and the first It is cooled by the cold transferred to the electronic component E through the top wall 18 of the casing 12.

  That is, the electronic component E is guided by the refrigerant by guiding the refrigerant to the width direction outer side (direction of arrow B1) of the first casing 12 in which the electronic component E is disposed by the first guide wall 34 and circulating it to the downstream side. Is cooled efficiently.

  Finally, the refrigerant subjected to heat exchange flows along the plurality of fins 16 to the downstream outlet 40 and is discharged to the pipe 32 b through the outlet 30. The refrigerant is supplied to the supply port 28 from the cooling liquid supply means after being cooled again at the outside of the first and second casings 12 and 14.

  Further, since the second guide wall 36 is provided at the center in the width direction on the downstream side of the fin 16, the refrigerant flowing along the fin 16 is the center in the width direction where the first and second guide walls 34, 36 are disposed. It is hard to flow in the vicinity, and it flows positively along the width direction outer side (arrow B1 direction) which becomes the first and second side wall portions 20 and 24 side.

  As described above, in the first embodiment, in the first and second casings 12 and 14 constituting the liquid-cooling type cooling device 10, the first guide wall 34 is provided at the center in the width direction on the upstream side of the fin 16. The first guide wall 34 extends in the width direction (direction of arrow B) so as to be substantially orthogonal to the flow direction of the refrigerant, and is provided at a predetermined height from the bottom wall portion 22 in the center in the width direction. The refrigerant supplied from the opened supply port 28 can be branched from the center in the width direction to the outer side in the width direction (the direction of the arrow B1) and can be circulated to the downstream side.

  As a result, when a plurality of electronic components E are mounted on the first casing 12 in the width direction outer side (arrow B1 direction), the first guide wall 34 is provided at the center in the width direction. Since the refrigerant can be deflected and circulated to face each other, the cooling efficiency of the electronic component E can be further improved.

  In other words, by suppressing the flow of the refrigerant to the center in the width direction of the first casing 12 in which the electronic component E is not arranged, the electronic component E can be suitably cooled by efficiently using the refrigerant. .

  Further, in the first and second casings 12 and 14, the second guide wall 36 is provided at the center in the width direction on the downstream side of the fins 16 and, like the first guide wall 34, substantially orthogonal to the coolant flow direction. In the width direction (arrow B direction) and at a predetermined height with respect to the bottom wall portion 22, compared to the case where only the first guide wall 34 is provided, in the fins 16 of the refrigerant, It is possible to further suppress the flow at the center in the width direction and to more efficiently circulate the refrigerant outward in the width direction (the direction of the arrow B1) to cool the electronic component E.

  Further, by forming the first and second guide walls 34, 36 simultaneously on the bottom wall 22 when forming the second casing 14 from a plate material, the number of manufacturing steps does not increase and the number of parts increases. Is prevented.

  Furthermore, when the liquid-cooling type cooling device 10 is assembled by arranging the one end portion and the other end portion of the fins 16 so as to abut on the first and second guide walls 34, 36, the second casing 14 The positioning of the fins 16 with respect to each other can be easily performed.

  Next, a liquid cooling type cooling device 50 according to a second embodiment is shown in FIG. 4 and FIG. In addition, the same referential mark is attached | subjected to the component same as the liquid cooling type cooling device 10 which concerns on 1st Embodiment mentioned above, and the detailed description is abbreviate | omitted.

  In the liquid-cooling type cooling device 50 according to the second embodiment, the first and second guide walls (deflection portions) 56, 58 are cut and raised with respect to the bottom wall portion 54 of the second casing 52. It differs from the liquid-cooling type cooling device 10 according to the first embodiment in that a cover plate 60 covering the bottom wall portion 54 is provided.

  As shown in FIGS. 4 and 5, the liquid cooling type cooling device 50 is a cover which covers the first and second casings (casings) 12 and 52 which can be divided up and down and a part of the second casing 52. It includes a plate 60 and fins 16 housed inside the first and second casings 12 and 52, and the bottom wall 54 of the second casing 52 faces one end and the other end of the fins 16 First and second guide walls 56, 58 are formed at the respective positions.

  For example, the first and second guide walls 56 and 58 cut out a part of the bottom wall portion 54 of the second casing 52 to be substantially perpendicular to the bottom wall portion 54, and the width direction (arrow B It is formed by bending so as to extend along the direction). Further, by forming the first and second guide walls 56, 58, the bottom wall 54 has an opening 62a having a rectangular cross section which has substantially the same area as the first and second guide walls 56, 58, 62b opens.

  The openings 62a and 62b are covered by mounting the cover plate 60 from below with respect to the bottom wall 54 of the second casing 52, as shown in FIG. The cover plate 60 is fixed to the second casing 52 by brazing, for example.

  In the second casing 52 described above, the first guide wall 56 is cut and raised upstream of the opening 62a (in the direction of the arrow A1) with respect to the bottom wall 54, and the second guide wall 58 is the bottom wall 54. However, the present invention is not limited thereto. For example, both the first and second guide walls 56 and 58 may be openings. The first guide wall 56 may be cut and raised on the upstream side or the downstream side of 62a and 62b, respectively. Conversely, the first guide wall 56 is downstream of the opening 62a (in the direction of arrow A2), the second guide wall 58 may be cut and raised so as to be upstream (in the direction of the arrow A1) with respect to the opening 62b.

  As described above, in the second embodiment, in the first and second casings 12 and 52 constituting the liquid-cooling type cooling device 50, the first guide wall 56 is provided at the center in the width direction on the upstream side of the fin 16. The refrigerant supplied from the supply port 28 is provided by extending the first guide wall 56 in the width direction (direction of arrow B) so as to be substantially orthogonal to the flow direction of the refrigerant and providing the first guide wall 56 at a predetermined height. It can flow from the center in the width direction to the outer side in the width direction (direction of arrow B1) to flow downstream.

  As a result, when a plurality of electronic components E are mounted on the first casing 12 in the width direction outer side (the direction of the arrow B1), the refrigerant is deflected to flow so as to face the electronic component E by the first guide wall 56 As a result, the cooling efficiency of the electronic component E can be further improved. In other words, by suppressing the flow of the refrigerant at the center in the width direction of the first casing 12 in which the electronic component E is not disposed, the electronic component E can be suitably cooled using this refrigerant.

  In addition, by forming the first and second guide walls 56 and 58 by cutting and raising a part of the bottom wall portion 54 of the second casing 52, the number of parts of the liquid cooling type cooling device 50 is increased. There is no

  Furthermore, in the liquid-cooling type cooling devices 10 and 50 according to the first and second embodiments described above, the first and second guide walls 34 (56) and 36 (58) are disposed at the center in the width direction, and the width Although the configuration in which cooling is performed by the refrigerant obtained by dividing the two rows of electronic components E arranged in the direction outside (the direction of arrow B1) has been described, the present invention is not limited thereto. The guide wall may be disposed so as not to overlap with the electronic component E in the width direction (direction of arrow B) of the first and second casings 12, 14 (52). As a result, regardless of the positions of the supply port 28 and the discharge port 30, the refrigerant can be efficiently cooled by suitably deflecting and circulating it to the position facing the electronic component E.

  The liquid cooling type cooling device according to the present invention is not limited to the above embodiment, and it goes without saying that various configurations can be adopted without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 10, 50 ... Liquid cooling type cooling device 12 ... 1st casing 14, 52 ... 2nd casing 16 ... Fin 18 ... Top wall part 22, 54 ... Bottom wall part 28 ... Supply port 30 ... Discharge port 34, 56 ... 1st Guide wall 36, 58 ... second guide wall E ... electronic parts

Claims (5)

A refrigerant provided with a casing having a supply port to which a refrigerant is supplied and an outlet from which the refrigerant is discharged, and a fin housed in the casing, the electronic component with heat generation provided in the casing being the refrigerant Liquid cooled cooling system, which is cooled by heat exchange of
The casing is provided at least on the upstream side of the fin, and includes a deflection unit that deflects the flow direction of the refrigerant.
The liquid-cooling type cooling device characterized in that the deflection unit is disposed at a position not overlapping the electronic component in a width direction orthogonal to the flow direction. In the liquid cooling type cooling device according to claim 1,
The deflection portion is also provided on the downstream side of the fin, and one deflection portion disposed on the upstream side of the fin and the other deflection portion disposed on the downstream side of the fin are along the flow direction. Liquid-cooled cooling device characterized in that it is arranged in a straight line. In the liquid cooling type cooling device according to claim 1 or 2,
The liquid-cooling type cooling device is characterized in that the deflection portion is erected with respect to the casing and integrally formed with the casing. In the liquid cooling type cooling device according to claim 1 or 2,
The liquid-cooling type cooling device is characterized in that the deflecting portion is erected with respect to the casing, and is formed by cutting and raising a wall portion of the casing. In the liquid cooling type cooling device according to any one of claims 1 to 4,
The liquid-cooling type cooling device according to claim 1, wherein the deflection portion is formed to have a height substantially equal to that of the fin.

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